A fixing device for through-hole reflow soldering pins on a thick copper PCB

Abstract

The utility model belongs to the field of electronic manufacturing technology provides a kind of thick copper PCB printed board upper through reflow soldering pin's fixing device, the device includes fixed plate and sliding adjustment mechanism.The front of fixed plate is equipped with at least one clamping thick copper PCB printed board's circuit board clamping mechanism.The back of fixed plate is detachably equipped with the pin fixing mechanism corresponding with each circuit board clamping mechanism, and the pin fixing mechanism is clamped the pin to be welded to thick copper PCB printed board on it.Sliding adjustment mechanism is arranged on the back of fixed plate, and the position of pin in pin hole is adjusted along the vertical direction by relative motion drive pin fixing mechanism, so that pin protrudes or sinks into pin hole.The fixing device of the utility model hides pin completely in PCB inside in the stage of printing tin paste, and reliably exposes in subsequent process, which can solve the problems of unstable pin positioning, tin paste printing pollution, poor welding quality and inability to realize full-line automation in the prior art.

Description

Technical Field

[0001] This utility model belongs to the field of electronic manufacturing technology and relates to a fixing device for through-hole reflow soldering pins on a thick copper PCB printed circuit board. Background Technology

[0002] As electronic products evolve towards miniaturization, multifunctionality, and modularity, PCB (Printed Circuit Board) designs are trending towards high density, multi-layering, and thicker copper. Due to the powerful functions of products and the limited PCB area, components are densely arranged on each PCB layer. Among these, pins, as key components for connectors or power interfaces, directly affect the electrical performance and reliability of the product through their soldering quality.

[0003] Traditional manual soldering methods struggle to meet the requirements for solder penetration, void ratio, and perpendicularity of pins on thick copper PCBs, especially in automated production where they are inefficient and inconsistent. In recent years, pin-in-paste (PiP) reflow soldering technology has been applied to these applications, enabling pins and surface-mount components on the PCB to be soldered in the same reflow process, improving production efficiency and soldering consistency.

[0004] However, in the PiP process, the pins need to be precisely positioned and kept stable before solder paste printing to prevent them from shifting or falling off during transport and printing. Existing fixtures are mostly rigid, fixed structures that cannot accommodate pins of different heights and are difficult to use continuously throughout the entire SMT production line (board mounter → printer → pick and place → reflow oven → unmounter). Furthermore, if the pins are exposed on the PCB surface during solder paste printing, it can easily cause solder paste contamination or scratches, affecting printing quality.

[0005] Therefore, there is an urgent need to develop a dedicated fixing device for through-hole reflow soldering pins on thick copper PCBs, which can be used throughout the entire SMT production line to ensure the verticality, solder penetration, and void ratio of the pins, while avoiding solder paste contamination during the printing stage, and improving production efficiency and product consistency. Utility Model Content

[0006] To address the technical problems of inaccurate pin positioning, unstable soldering quality, and inability to adapt to automated continuous production on existing PCBs, this utility model discloses a fixing device for through-hole reflow soldering of pins on thick copper PCBs. This device enables fully automated through-hole reflow soldering of pins on SMT production lines, ensuring that pin perpendicularity, solder penetration, and void ratio meet customer requirements, and significantly improving production efficiency. This device is suitable for automated pin positioning and soldering processes on multilayer, high-density, small-size thick copper PCBs in SMT production lines, and includes a fixing plate and a sliding adjustment mechanism.

[0007] The fixing plate is provided with at least one circuit board clamping mechanism on the front side for clamping a thick copper PCB printed circuit board. The back of the fixing plate is detachably provided with a pin fixing mechanism corresponding to each of the circuit board clamping mechanisms, and the pin fixing mechanism clamps the pins to be soldered to the thick copper PCB printed circuit board. The sliding adjustment mechanism is located on the back of the fixed plate. Through relative movement, the pin fixing mechanism is driven to adjust the position of the pin in the pin hole on the thick copper PCB in the vertical direction, so that the pin protrudes out of or sinks into the pin hole.

[0008] Furthermore, the circuit board clamping mechanism includes a retaining slot, a retaining spring slot, and an elastic retaining spring; The slot hole is provided on the fixing plate for placing the thick copper PCB printed circuit board; The retaining ring groove is provided on the front side of the fixing plate, and one end is connected to the top corner of the retaining ring hole; The elastic retaining ring is disposed in the retaining ring groove, and a retaining groove is provided at one end of the elastic retaining ring near the retaining groove hole. The retaining groove cooperates with the edge of the thick copper PCB printed circuit board to achieve stress-free clamping.

[0009] Furthermore, the pin fixing mechanism includes a pin fixing block, the side of the pin fixing block facing the thick copper PCB printed circuit board is provided with a plurality of pin positioning holes, the pin positioning holes are gapped with the back of the fixing plate; the two ends of the pin fixing block are respectively provided with a plurality of inclined step surfaces, the inclined step surfaces are used to slide with the upper slide bar and the lower slide bar of the sliding adjustment mechanism.

[0010] Furthermore, the pin fixing mechanism also includes a baffle, which is detachably fixed to the open end of the pin fixing block by screws; A boss is provided on the side of the baffle near the pin fixing block. The boss is used to cover the end of the pin positioning hole to prevent the pin from falling off during assembly or transportation.

[0011] Furthermore, the pin fixing block and the fixing plate are connected by magnetic attraction. The fixing plate is provided with a plurality of first blind holes, and the pin fixing block is provided with a second blind hole corresponding to each of the first blind holes. High-temperature resistant magnets are fitted into the first blind holes and the second blind holes to form a magnetic attraction pair.

[0012] Furthermore, the fixing plate is provided with positioning holes, and the pin fixing block is provided with positioning pins that are inserted and engaged with the positioning holes, which are used to guide assembly and assist in positioning the magnetic connection.

[0013] Furthermore, the adjustment mechanism includes an upper slide bar, a lower slide bar, and at least two fixed bars; The fixing strips are symmetrically fixed to the back of the fixing plate, and all the fixing strips are parallel to each other; A sliding gap is formed between the fixing strip and the back of the fixing plate; The upper slide bar and the lower slide bar are disposed within the sliding gap, and are relatively close to or far apart in the horizontal direction to drive the pin fixing block of the pin fixing mechanism to adjust its position in the vertical direction.

[0014] Furthermore, the upper slider and the lower slider each have a stepped inclined surface on their opposite sides; When the upper slide bar and the lower slide bar are closed relative to each other, the stepped inclined surface slides in conjunction with the inclined step surfaces at both ends of the pin fixing block, forcing the pin fixing block to move outward, thereby causing the pin to sink into the pin hole; When the upper slide bar and the lower slide bar are separated, the pin fixing block is reset under the action of magnetic attraction, and the pin protrudes out of the pin hole, entering the reflow soldering preparation state.

[0015] Furthermore, the upper slide bar and the lower slide bar are provided with elongated limiting holes, and the back of the fixing plate is provided with limiting posts. The limiting posts pass through the elongated limiting holes to limit the sliding path and sliding stroke of the upper slide bar and the lower slide bar.

[0016] Furthermore, both ends of the upper slider and the lower slider are provided with L-shaped corner structures. The vertical section of the L-shaped corner structure is provided with an operation through hole, which allows the operator to insert their finger to apply pushing or pulling force to drive the upper slider and the lower slider to slide relative to each other.

[0017] Compared with the prior art, the beneficial effects that at least one technical solution adopted in the embodiments of this specification can achieve include at least: 1. The pins are completely hidden during the printing stage by a sliding adjustment mechanism to avoid solder paste contamination; they are reliably exposed before soldering to ensure soldering quality.

[0018] 2. The pins have high verticality, which, combined with the through-hole reflow soldering (Pin-in-Paste, PiP) process, ensures a solder penetration rate of >95% and a void rate of <5%, guaranteeing soldering quality.

[0019] 3. It can be used continuously in the entire SMT production line from board loading machine to printer to pick and place machine to reflow oven to unloading machine without disassembly.

[0020] 4. A composite positioning system of "magnetic suction + positioning pin" is adopted, combined with Mark points, to achieve high-precision assembly.

[0021] 5. Modular design allows for adaptation to different pin specifications by replacing the pin retaining block, making it highly versatile.

[0022] 6. The L-shaped corner structure on the slider facilitates manual operation. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a front view of the fixing device; Figure 2 This is a frontal perspective view of the fixing device; Figure 3 This is a schematic diagram of the back of the fixing device; Figure 4 This is a three-dimensional view of the rear of the fixing device; Figure 5 This is a schematic diagram of the baffle. Among them, 100 is a thick copper PCB printed circuit board; 1 is a fixing plate; 2 is a first blind hole; 3 is a second blind hole; 4 is an upper slide bar; 5 is a lower slide bar; 6 is a positioning pin; 7 is a baffle; 8 is a fixing bar; 9 is an operating through hole; 10 is a pin fixing block; 11 is a slot hole; 12 is a circlip slot; 13 is an elastic circlip; 131 is a slot; 61 is a long strip-shaped limiting hole; 62 is a limiting post. Detailed Implementation

[0025] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0026] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. This application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, in the absence of conflict, the following embodiments and features of the embodiments can be combined with each other. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0027] This utility model provides a fixing device for through-hole reflow soldering pins on a thick copper PCB. This device enables a series of production processes, including pin soldering, printing, mounting, and reflow soldering, all while surface-mount components are being installed. The pins are positioned with their pins facing downwards during reflow soldering. This method ensures high solder penetration and low void ratios, meeting customer-required soldering quality standards. In production, it can be used on a single production line connecting the board mounting machine, printer, placement machine, reflow oven, and unmount machine. This ensures pin verticality, meets soldering quality standards, and improves production efficiency.

[0028] Specifically, see Figures 1 to 4 As shown, the fixing device includes a fixing plate 1 and a sliding adjustment mechanism. The front of the fixing plate 1 has at least one circuit board clamping mechanism for holding the thick copper PCB printed circuit board 100. The back of the fixing plate 1 is detachably provided with a pin fixing mechanism corresponding to each of the circuit board clamping mechanisms, and the pin fixing mechanism clamps pins to be soldered onto the thick copper PCB printed circuit board 100. The sliding adjustment mechanism is located on the back of the fixing plate 1, and through relative movement, drives the pin fixing mechanism to adjust the position of the pins in the pin holes on the thick copper PCB printed circuit board 100 in the vertical direction, so that the pins protrude out of or sink into the pin holes.

[0029] In one embodiment, see Figure 1 and Figure 2 As shown, three circuit board clamping mechanisms can be arranged at equal intervals. The circuit board clamping mechanism includes a card slot 11, a card spring slot 12, and an elastic card spring 13.

[0030] The slot 11 is disposed on the fixing plate 1 for placing the thick copper PCB printed circuit board 100; the retaining spring groove 12 is disposed on the front side of the fixing plate 1, with one end communicating with the top corner of the slot 11; the elastic retaining spring 13 is disposed in the retaining spring groove 12, and the end of the elastic retaining spring 13 near the slot 11 is provided with a retaining groove 131, which cooperates with the edge of the thick copper PCB printed circuit board 100 to achieve stress-free clamping, so as to prevent deformation or jumping of the thick copper PCB printed circuit board 100.

[0031] In addition, multiple weight-reducing holes can be provided on the fixing plate 1 to reduce heat absorption of the fixing device. Optical positioning marks (Mark points) can also be provided on the fixing plate 1 for the SMT equipment's vision system to perform whole-board positioning, thereby achieving automatic alignment for solder paste printing, SPI inspection, component placement, and AOI inspection.

[0032] In one embodiment, see Figure 3 and Figure 4As shown, the pin fixing mechanism includes a pin fixing block 10, and the side of the pin fixing block 10 facing the thick copper PCB printed circuit board 100 is provided with multiple pin positioning holes. The pin positioning holes have a gap with the back of the fixing plate 1. This gap is designed to facilitate the evaporation of flux in the solder paste, prevent the evaporating flux from sticking to the pins, and facilitate the removal of the soldered parts.

[0033] The pin fixing block 10 has multiple inclined step surfaces at both ends, which are used to slide with the upper slide bar 4 and the lower slide bar 5 of the sliding adjustment mechanism.

[0034] Specifically, see Figure 4 As shown, the pin fixing block 10 can be designed as U-shaped, and the corresponding baffle 7 set on it is also U-shaped, both of which are provided with weight reduction holes.

[0035] In one embodiment, the pin positioning hole can be a blind hole or a through hole, with a diameter 0.05mm to 0.15mm larger than the outer diameter of the pin, and the tolerance is controlled within ±0.05mm to ensure smooth insertion of the pin and that the axis is perpendicular.

[0036] In one embodiment, see Figure 4 As shown, the pin fixing mechanism also includes a baffle 7, which is detachably fixed to the open end of the pin fixing block 10 by screws. A boss is provided on the side of the baffle 7 near the pin fixing block 10, which is used to cover the end of the pin positioning hole to prevent the pin from falling off during assembly or transportation.

[0037] In one embodiment, see Figure 5 As shown, the pin fixing block 10 and the fixing plate 1 are connected by magnetic adsorption. The fixing plate 1 is provided with a plurality of first blind holes 2, and the pin fixing block 10 is provided with second blind holes 3 corresponding to each of the first blind holes 2. High-temperature resistant magnets are assembled in the first blind holes 2 and the second blind holes 3 to form a magnetic adsorption pair.

[0038] In one embodiment, see Figure 2 As shown, the fixing plate 1 is provided with a positioning hole, and the pin fixing block 10 is provided with a positioning pin 6 that is inserted and cooperates with the positioning hole, which is used to guide the assembly and assist in positioning the magnetic connection.

[0039] In one embodiment, see Figure 3 and Figure 4As shown, the adjustment mechanism includes an upper slide bar 4, a lower slide bar 5, and at least two fixing bars 8. The fixing bars 8 are symmetrically fixed to the back of the fixing plate 1, and all the fixing bars 8 are parallel to each other; a sliding gap is formed between the fixing bars 8 and the back of the fixing plate 1; the upper slide bar 4 and the lower slide bar 5 are disposed within the sliding gap, moving closer or further apart in the horizontal direction to drive the pin fixing block 10 of the pin fixing mechanism to perform vertical position adjustment.

[0040] In one embodiment, the upper slider 4 and the lower slider 5 each have a stepped slope on opposite sides, which can also be referred to as a hill-shaped stepped groove. The inclination of the stepped slope can be set to 30°~60°.

[0041] When the upper slide bar 4 and the lower slide bar 5 are closed relative to each other, the stepped inclined surface slides and engages with the inclined step surfaces at both ends of the pin fixing block 10, forcing the pin fixing block 10 to move outward, thereby causing the pin to sink into the pin hole. When the upper slide bar 4 and the lower slide bar 5 are separated relative to each other, the pin fixing block 10 is reset under the action of magnetic attraction, and the pin protrudes outward from the pin hole, entering the reflow soldering preparation state.

[0042] Specifically, when the upper and lower slide bars are closed, they act like a pair of sharp scissors, separating the pin fixing block 10 that is attracted to the fixing plate 1 by the magnet. This allows the upper and lower slide bars to be positioned between the fixing plate 1 and the pin fixing block 10, thus causing the pin to be inserted into the pin hole without protruding from the upper surface of the circuit board, which facilitates the printing of solder paste on the circuit board. After printing, the upper and lower slide bars are separated again, allowing the pin to protrude from the pin hole and protrude from the upper surface of the circuit board, which in turn facilitates the reflow soldering of the pin.

[0043] In one embodiment, the upper slider 4 and the lower slider 5 are provided with elongated limiting holes 61, and the back of the fixing plate is provided with limiting posts 62. The limiting posts 62 pass through the elongated limiting holes 61 to limit the sliding path and sliding stroke of the upper slider 4 and the lower slider 5.

[0044] In one embodiment, both ends of the upper slider 4 and the lower slider 5 are provided with L-shaped corner structures. The vertical section of the L-shaped corner structure is provided with an operation through hole 9, which allows the operator to insert their finger to apply a pushing or pulling force to drive the upper slider 4 and the lower slider 5 to slide relative to each other.

[0045] In one implementation, the fixing plate 1, upper slide bar 4, lower slide bar 5, pin fixing block 10, baffle 7, and fixing bar 8 can all be made of metal material, namely aluminum alloy, which has the characteristics of being resistant to high temperature during reflow soldering, having a low coefficient of thermal expansion, and not reacting chemically with solder paste.

[0046] In this utility model, the principle and method of using the fixing device are as follows: an elastic snap ring 13 is installed in the snap ring groove 12 on the fixing plate 1, a magnet is glued in the first blind hole 2 on the fixing plate 1, a limiting post 62 is inserted into the elongated limiting hole of the upper and lower slide bars, and the fixing strip 8 is fastened to the fixing plate 1 by bolts M3×6. At the same time, the upper and lower slide bars are installed between the fixing plate 1 and the fixing strip 8 to form a sliding gap. A magnet is glued in the second blind hole 3 on the pin fixing block 10, and the baffle 7 is fastened to the pin fixing block 10 by M2×4 screws. A set of pin welding fixing devices is assembled.

[0047] The method of use is as follows: Position the upper and lower slides to their maximum travel position, and insert the pins into the pin fixing block 10; align the positioning holes of the fixing plate 1 holding the thick copper PCB 100 with the positioning pins 6 of the pin fixing block 10; then, use the magnetic force to attract the pin fixing block 10 to the back of the fixing plate 1, and use the elastic spring clip 13 to hold the thick copper PCB 100 in the slot hole 11 of the fixing plate 1, while the pins pass through the pin holes on the thick copper PCB 100 and protrude from the top surface of the thick copper PCB 100; insert your fingers into the through holes on both sides of the upper and lower slides, and use your fingers to close the upper and lower slides together, causing the pins to sink into the pin holes. The top surface of the thick copper PCB 100 is not exposed; the pin soldering fixing device is placed on the upper board machine of the SMT production line. Through the conveyor of the connecting table, the printer prints solder paste on the thick copper PCB 100, including the pin pads. The opening of the stencil ensures the amount of solder on the pins. SPI detection printing is performed. On the connecting table in front of the pick and place machine, the upper and lower slide bars are separated by the force of the fingers, so that the pins pass through the pin holes and are exposed on the top surface of the thick copper PCB 100. The components are placed in the pick and place machine, the AOI inspection is performed, and finally the components are placed in the reflow oven for reflow soldering. The soldered thick copper PCB 100 and fixing plate 1 are returned to the lower board machine frame.

[0048] The fixing device and welding method designed in this utility model can be used on a production line consisting of a board mounting machine, a printing machine, a chip mounter, a reflow oven, and a board unmounter. It can ensure the verticality of the pins, meet the welding quality requirements of the pins, and improve production efficiency.

[0049] In summary, the fixing device designed in this utility model can achieve at least the following beneficial effects: 1. The pins are completely hidden during the printing stage by a sliding adjustment mechanism to avoid solder paste contamination; they are reliably exposed before soldering to ensure soldering quality.

[0050] 2. The pins have high verticality, which, combined with the through-hole reflow soldering (Pin-in-Paste, PiP) process, ensures a solder penetration rate of >95% and a void rate of <5%, guaranteeing soldering quality.

[0051] 3. It can be used continuously in the entire SMT production line from board loading machine to printer to pick and place machine to reflow oven to unloading machine without disassembly.

[0052] 4. A composite positioning system of "magnetic suction + positioning pin" is adopted, combined with Mark points, to achieve high-precision assembly.

[0053] 5. Modular design allows for adaptation to different pin specifications by replacing the pin retaining block, making it highly versatile.

[0054] 6. The L-shaped corner structure on the slider facilitates manual operation.

[0055] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model. For those skilled in the art, various modifications and variations can be made to the embodiments of the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A fixing device for reflow soldering pins in through-holes on a thick copper PCB, characterized in that, Includes a fixed plate (1) and a sliding adjustment mechanism; The fixing plate (1) has at least one circuit board clamping mechanism on its front side for clamping a thick copper PCB printed circuit board (100). The back of the fixing plate (1) is detachably provided with a pin fixing mechanism corresponding to each of the circuit board clamping mechanisms, and the pin fixing mechanism clamps the pins to be soldered to the thick copper PCB printed circuit board (100); The sliding adjustment mechanism is located on the back of the fixed plate (1). Through relative motion, the pin fixing mechanism is driven to adjust the position of the pin in the pin hole on the thick copper PCB printed circuit board (100) in the vertical direction, so that the pin protrudes out or sinks into the pin hole.

2. The fixing device for through-hole reflow soldering pins on a thick copper PCB as described in claim 1, characterized in that, The circuit board clamping mechanism includes a slot hole (11), a spring clip slot (12), and an elastic spring clip (13). The slot hole (11) is provided on the fixing plate (1) for placing the thick copper PCB printed circuit board (100). The retaining ring groove (12) is provided on the front of the fixing plate (1), and one end is connected to the top corner of the retaining ring hole (11); The elastic retaining ring (13) is disposed in the retaining ring groove (12). A retaining groove (131) is provided at one end of the elastic retaining ring (13) near the retaining groove hole (11). The retaining groove (131) cooperates with the edge of the thick copper PCB printed circuit board (100) to achieve stress-free clamping.

3. The fixing device for through-hole reflow soldering pins on a thick copper PCB as described in claim 1, characterized in that, The pin fixing mechanism includes a pin fixing block (10), and the pin fixing block (10) has a plurality of pin positioning holes on the side facing the thick copper PCB printed circuit board (100), and the pin positioning holes have a gap with the back of the fixing plate (1). The pin fixing block (10) has multiple inclined step surfaces at both ends, which are used to slide with the upper slide bar (4) and lower slide bar (5) of the sliding adjustment mechanism.

4. The fixing device for through-hole reflow soldering pins on a thick copper PCB as described in claim 3, characterized in that, The pin fixing mechanism also includes a baffle (7), which is detachably fixed to the open end of the pin fixing block (10) by screws; The baffle (7) has a boss on the side near the pin fixing block (10). The boss is used to cover the end of the pin positioning hole to prevent the pin from falling off during assembly or transportation.

5. The fixing device for through-hole reflow soldering pins on a thick copper PCB as described in claim 3 or 4, characterized in that, The pin fixing block (10) and the fixing plate (1) are connected by magnetic adsorption. The fixing plate (1) is provided with a plurality of first blind holes (2), and the pin fixing block (10) is provided with second blind holes (3) corresponding to each of the first blind holes (2). The first blind holes (2) and the second blind holes (3) are equipped with mutually cooperating high-temperature resistant magnets to form a magnetic adsorption pair.

6. The fixing device for through-hole reflow soldering pins on a thick copper PCB as described in claim 5, characterized in that, The fixing plate (1) is provided with a positioning hole, and the pin fixing block (10) is provided with a positioning pin (6) that is inserted into the positioning hole, which is used to guide the assembly and assist in positioning the magnetic connection.

7. The thick copper PCB printed board on through-hole reflow soldering pin fixing device according to claim 1, characterized in that, The adjustment mechanism includes an upper slide bar (4), a lower slide bar (5), and at least two fixing bars (8); The fixing strips (8) are symmetrically fixed to the back of the fixing plate (1), and all the fixing strips (8) are parallel to each other; A sliding gap is formed between the fixing strip (8) and the back of the fixing plate (1); The upper slide bar (4) and the lower slide bar (5) are arranged within the sliding gap, moving closer or further apart in the horizontal direction to drive the upper pin fixing block (10) of the pin fixing mechanism to adjust its position in the vertical direction.

8. The fixing device for through-hole reflow soldering pins on a thick copper PCB as described in claim 7, characterized in that, The upper slide bar (4) and the lower slide bar (5) are respectively provided with stepped inclined surfaces on opposite sides; When the upper slide bar (4) and the lower slide bar (5) are closed relative to each other, the stepped inclined surface slides and engages with the inclined step surfaces at both ends of the pin fixing block (10), forcing the pin fixing block (10) to move outward, thereby causing the pin to sink into the pin hole; When the upper slide bar (4) and the lower slide bar (5) are separated, the pin fixing block (10) is reset under the action of magnetic attraction, and the pin protrudes out of the pin hole and enters the reflow soldering preparation state.

9. The fixing device for through-hole reflow soldering pins on a thick copper PCB printed circuit board according to claim 7, characterized in that, The upper slide bar (4) and the lower slide bar (5) are provided with elongated limiting holes (61), and the back of the fixing plate is provided with limiting posts (62). The limiting posts (62) are inserted into the elongated limiting holes (61) to limit the sliding path and sliding stroke of the upper slide bar (4) and the lower slide bar (5).

10. The fixing device for through-hole reflow soldering pins on a thick copper PCB printed circuit board according to claim 7, characterized in that, Both ends of the upper slider (4) and the lower slider (5) are provided with L-shaped corner structures. The vertical section of the L-shaped corner structure is provided with an operation through hole (9) for the operator to insert his / her finger to apply a pushing or pulling force to drive the upper slider (4) and the lower slider (5) to slide relative to each other.

Images