Flip-chip LED chip mounting structure

Abstract

The utility model discloses a kind of flip LED chip mounting structures, including substrate, pressing plate and multiple flip LED chip bodies, multiple mounting grooves are equipped on the substrate, multiple installation ports that pass through the substrate are equipped on the bottom surface of mounting groove, the conductive block that is connected with the internal wiring layer of substrate is installed in installation port, one end of conductive block is flush with the bottom surface of mounting groove and set, the other end is set out of the bottom surface of substrate, flip LED chip body is inserted into mounting groove, and it is all welded and fixed with conductive block, pressing plate is parallelly arranged with substrate, and it is set to press flip LED chip body. The utility model structure is simple, the synchronous positioning and compression of multiple chips are realized by pressing plate, and by the way of heating from the bottom of substrate uniformly, the solder on all chip pins is simultaneously melted, so that batch soldering installation of multiple flip LED chips is completed at one time, production efficiency and welding consistency are significantly improved.

Description

Technical Field

[0001] This utility model relates to the field of flip-chip technology, and specifically to a flip-chip mounting structure. Background Technology

[0002] Flip-chip LEDs are an advanced LED chip packaging technology. Unlike traditional upright LED chip structures, the light-emitting surface of the light-emitting layer faces the substrate, and the electrodes are directly connected to the circuitry on the substrate via bumps.

[0003] However, current flip-chip LEDs are generally soldered directly onto the substrate, but it is not possible to solder multiple flip-chip LEDs at the same time. They can only be soldered and disassembled one by one. Furthermore, the small size of the pins on the flip-chip LEDs makes soldering inconvenient. Utility Model Content

[0004] The technical problem to be solved by this utility model is to provide a flip-chip LED chip mounting structure that can melt the solder block by heating from the bottom, thereby completing the mounting operation in one go, thus solving the problems mentioned in the background art.

[0005] This utility model is achieved through the following technical solution: a flip-chip LED mounting structure, including a substrate, a pressure plate, and multiple flip-chip bodies. The substrate is provided with multiple mounting slots, and the bottom surface of each mounting slot is provided with multiple mounting openings penetrating the substrate. Each mounting opening is equipped with a conductive block connected to the internal wiring layer of the substrate. One end of each conductive block is flush with the bottom surface of the mounting slot, and the other end protrudes from the bottom surface of the substrate. Each flip-chip body is inserted into the mounting slot and welded to the conductive block. The pressure plate is arranged parallel to the substrate and presses down on the flip-chip bodies.

[0006] As a preferred technical solution, conductive shells are installed on both the positive and negative poles of the flip-chip body. The conductive shells are provided with grooves on the side facing the conductive block, and solder blocks are provided in the grooves. The solder blocks and conductive shells are both set to abut against the conductive block.

[0007] As a preferred technical solution, the width of the conductive shell matches the width of the mounting groove, the combined length of the two conductive shells matches the length of the mounting groove, and a heat dissipation gap is formed between the side of the flip-chip body and the inner side of the mounting groove.

[0008] As a preferred technical solution, the substrate surface is provided with multiple positioning grooves, and positioning strips are installed at both ends of the pressure plate. The positioning strips are all slidably disposed in the positioning grooves. The cross-sections of the positioning strips and the positioning grooves are all arranged in a "T" shape, and the positioning strips and the positioning grooves are all frictionally positioned.

[0009] As a preferred technical solution, a fixing post is installed at each of the four corners of the substrate. Each fixing post has a screw hole that penetrates the fixing post and the substrate. The end of the fixing post away from the substrate is set lower than the bottom surface of the conductive block.

[0010] As a preferred technical solution, both the conductive block and the conductive shell are made of brass.

[0011] As a preferred technical solution, the top surface of the flip-chip body protrudes from the surface of the substrate.

[0012] The beneficial effects of this utility model are: This utility model has a simple structure. After the flip-chip body is inserted into the mounting slot, the pressure plate can be pressed on the outside of multiple flip-chip bodies to press the flip-chip bodies simultaneously. The conductive block protruding from the bottom of the substrate can be placed directly on the heating platform. The solder block in the conductive shell is melted by heat conduction, and the welding operation is completed in one go, which greatly increases efficiency. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0015] Figure 2 This is a schematic diagram of the structure of this utility model after the pressure plate is removed;

[0016] Figure 3 This is a bottom view of the present invention;

[0017] Figure 4 This is a schematic diagram of the structure of the flip-chip LED body of this utility model.

[0018] The components include: 1. substrate; 2. pressure plate; 3. positioning strip; 4. fixing post; 5. mounting groove; 6. flip-chip LED chip body; 7. solder block; 8. positioning groove; 9. screw hole; 10. conductive block; 11. conductive shell. Detailed Implementation

[0019] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0020] All features disclosed in this specification, or all steps in all disclosed methods or processes, may be combined in any way, except for mutually exclusive features and / or steps.

[0021] Any feature disclosed in this specification (including any appended claims, abstract, and drawings) may be replaced by other equivalent or similar features for a similar purpose, unless specifically stated otherwise. That is, unless specifically stated otherwise, each feature is merely one example of a series of equivalent or similar features.

[0022] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the present invention discloses a flip-chip LED mounting structure, comprising a substrate 1, a pressure plate 2, and multiple flip-chip LED bodies 6. The substrate 1 is provided with multiple mounting grooves 5, and the bottom surface of each mounting groove 5 is provided with multiple mounting openings penetrating the substrate 1. Each mounting opening is equipped with a conductive block 10 connected to the internal wiring layer of the substrate 1. One end of each conductive block 10 is flush with the bottom surface of the mounting groove 5, and the other end protrudes from the bottom surface of the substrate 1. The flip-chip LED bodies 6 are all inserted into the mounting grooves 5 and are all welded and fixed to the conductive blocks 10. The pressure plate 2 is arranged parallel to the substrate 1 and presses down on the flip-chip LED bodies 6.

[0023] In this embodiment, conductive shells 11 are installed on both the positive and negative poles of the flip-chip body 6. The conductive shells 11 are provided with grooves on the side facing the conductive block 10, and solder blocks 7 are provided in the grooves. The solder blocks 7 and the conductive shells 11 are both in contact with the conductive block 10.

[0024] In this embodiment, the width of the conductive shell 11 is matched with the width of the mounting groove 5, and the length of the two conductive shells 11 combined is matched with the length of the mounting groove 5. A heat dissipation gap is formed between the side of the flip-chip body 6 and the inner side of the mounting groove 5.

[0025] In this embodiment, multiple positioning grooves 8 are provided on the surface of the substrate 1, and positioning strips 3 are installed at both ends of the pressure plate 2. The positioning strips 3 are slidably disposed in the positioning grooves 8. The cross sections of the positioning strips 3 and the positioning grooves 8 are both arranged in a "T" shape, and the positioning strips 3 and the positioning grooves 8 are both frictionally positioned.

[0026] In this embodiment, a fixing post 4 is installed on each of the four corners of the substrate 1. Each fixing post 4 is provided with a screw hole 9 that penetrates the fixing post 4 and the substrate 1. The end of the fixing post 4 away from the substrate 1 is set lower than the bottom surface of the conductive block 10. The bottom surface of the fixing post 4 is lower than the bottom surface of the conductive block 10, which can avoid squeezing or short-circuiting the conductive block during installation.

[0027] In this embodiment, both the conductive block 10 and the conductive shell 11 are made of brass to ensure conductivity.

[0028] In this embodiment, the top surface of the flip-chip body 6 protrudes from the surface of the substrate 1; the top surface of the chip protrudes from the substrate surface, which is beneficial for light emission.

[0029] Working principle:

[0030] First, multiple flip-chip bodies 6 are inserted into corresponding mounting slots 5 on the substrate 1. During insertion, the conductive shells 11 on the positive and negative terminals of the flip-chip bodies 6 and the pre-placed solder blocks 7 inside them come into contact with the upper surface of the conductive blocks 10 at the bottom of the mounting slot. The size of the conductive shells 11 matches the mounting slots 5, ensuring that the chips are initially positioned within the slots.

[0031] Next, the pressure plate 2 is slid along the positioning groove 8 on the surface of the substrate by the positioning strips 3 at both ends, so that the pressure plate 2 covers the top of multiple flip-chip bodies 6. Since the positioning strips 3 and the positioning groove 8 adopt a "T" shaped cross section and have a friction positioning function, the pressure plate 2 can maintain its position after sliding into place, apply uniform pressure to the multiple chips below, keep them stable in the mounting groove, and keep the conductive shell 11 and solder block 7 in good contact with the conductive block 10.

[0032] Then, the soldering operation is performed. The bottom of the substrate 1 (i.e. the side of the protruding conductive block 10) is placed on the heating platform (such as a hot plate). The heat of the heating platform is conducted upward through the conductive block 10, causing the solder block 7 in contact with it to melt. Since both the conductive block 10 and the conductive shell 11 are made of brass material with good thermal conductivity, the heat transfer efficiency is high, which can ensure that the solder block 7 melts evenly and quickly.

[0033] After the solder melts, under the pressure and surface tension of the pressure plate 2, the liquid solder fills and wets the contact surface between the conductive shell 11 and the conductive block 10. After heating is stopped, the solder cools and solidifies, forming a reliable solder connection, which electrically connects the electrodes of the flip-chip body 6 to the wiring layer inside the substrate 1 through the conductive shell 11 and the conductive block 10.

[0034] After soldering, the flip-chip body 6 is securely fixed in the mounting slot 5. The heat dissipation gap between its side and the inner wall of the mounting slot helps dissipate heat during chip operation.

[0035] Finally, the entire mounting structure can be fixed to the corresponding position of the heat sink or the light fixture using screws through the screw holes 9 on the four corner fixing posts 4 of the base plate.

[0036] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any changes or substitutions conceived without inventive effort should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope defined in the claims.

Claims

1. A flip-chip LED mounting structure, characterized in that: The system includes a substrate (1), a pressure plate (2), and multiple flip-chip LED bodies (6). The substrate (1) is provided with multiple mounting grooves (5). The bottom surface of each mounting groove (5) is provided with multiple mounting ports that penetrate the substrate (1). Each mounting port is equipped with a conductive block (10) that is connected to the internal wiring layer of the substrate (1). One end of each conductive block (10) is flush with the bottom surface of the mounting groove (5), and the other end protrudes from the bottom surface of the substrate (1). Each flip-chip LED body (6) is inserted into the mounting groove (5) and welded to the conductive block (10). The pressure plate (2) is parallel to the substrate (1) and presses down on the flip-chip LED body (6).

2. The flip-chip LED mounting structure according to claim 1, characterized in that: A conductive shell (11) is installed on both the positive and negative poles of the flip-chip body (6). The conductive shell (11) has a groove on the side facing the conductive block (10). A solder block (7) is provided in the groove. The solder block (7) and the conductive shell (11) are both in contact with the conductive block (10).

3. The flip-chip LED mounting structure according to claim 1, characterized in that: The width of the conductive shell (11) matches the width of the mounting groove (5), and the length of the two conductive shells (11) combined matches the length of the mounting groove (5). A heat dissipation gap is formed between the side of the flip-chip body (6) and the inner side of the mounting groove (5).

4. The flip-chip LED mounting structure according to claim 1, characterized in that: The substrate (1) has multiple positioning grooves (8) on its surface. Positioning strips (3) are installed at both ends of the pressure plate (2). The positioning strips (3) are all slidably disposed in the positioning grooves (8). The cross sections of the positioning strips (3) and the positioning grooves (8) are all arranged in a "T" shape, and the positioning strips (3) and the positioning grooves (8) are both frictionally positioned.

5. The flip-chip LED mounting structure according to claim 1, characterized in that: Fixing posts (4) are installed at the four corners of the substrate (1). Each fixing post (4) has a screw hole (9) that penetrates the fixing post (4) and the substrate (1) vertically. The end of the fixing post (4) away from the substrate (1) is lower than the bottom surface of the conductive block (10).

6. The flip-chip LED mounting structure according to claim 1, characterized in that: Both the conductive block (10) and the conductive shell (11) are made of brass.

7. The flip-chip LED mounting structure according to claim 1, characterized in that: The top surface of the flip-chip body (6) protrudes from the surface of the substrate (1).

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