Wafer cleaning mechanism and wafer cutting machine

Abstract

This application provides a wafer cleaning mechanism and a wafer dicing machine. The wafer cleaning mechanism includes a cleaning tank, a mounting base, and a cleaning assembly. Specifically, the mounting base is installed inside the cleaning tank and has a turntable that can rotate around its own axis. The cleaning assembly includes a swing arm, a mounting block, a first liquid delivery pipe, and a first gas delivery pipe. The first end of the swing arm is rotatably mounted inside the cleaning tank and close to the inner wall of the tank, while the second end of the swing arm is suspended above the turntable. The mounting block is located at the second end of the swing arm and contains a gas-liquid mixing chamber and a spray nozzle communicating with the gas-liquid mixing chamber. Both the first liquid delivery pipe and the first gas delivery pipe are connected to the gas-liquid mixing chamber. The wafer cleaning mechanism and wafer dicing machine of this application can at least solve the problems of poor cleaning effect and low cleaning efficiency of the wafer dicing mechanisms in existing wafer cleaning machines.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing technology, and more specifically, to a wafer cleaning mechanism and a wafer dicing machine. Background Technology

[0002] After wafer dicing, the wafers need to be cleaned. To achieve this, some wafer dicing machines are equipped with a wafer cleaning mechanism, which typically uses cleaning nozzles to spray water onto the wafers. However, this method of cleaning wafers using water spray nozzles is not very effective and has low efficiency, making it difficult to effectively clean the wafers. Utility Model Content

[0003] The main objective of this application is to provide a wafer cleaning mechanism and a wafer dicing machine to solve the problems of poor cleaning effect and low cleaning efficiency of the wafer dicing mechanism in the prior art wafer cleaning machine.

[0004] According to one aspect of this application, a wafer cleaning mechanism is provided, comprising:

[0005] Cleaning bucket;

[0006] Mounting base, which is installed inside the cleaning tank, and the mounting base is provided with a turntable that can rotate around its own axis;

[0007] A cleaning assembly includes a swing arm, a mounting block, a first liquid delivery pipe, and a first gas delivery pipe. The first end of the swing arm is rotatably mounted inside the cleaning tank and located near the inner wall of the cleaning tank. The second end of the swing arm is suspended above the turntable. The mounting block is located at the second end of the swing arm. The mounting block has a gas-liquid mixing chamber and a spray nozzle communicating with the gas-liquid mixing chamber. Both the first liquid delivery pipe and the first gas delivery pipe are communicating with the gas-liquid mixing chamber.

[0008] Furthermore, the cleaning assembly also includes a second gas delivery pipe and a gas nozzle, the gas nozzle being installed on the side of the swing arm near the second end, and the second gas delivery pipe being connected to the gas nozzle.

[0009] Furthermore, both the second gas delivery pipe and the gas nozzle include multiple components, with each of the multiple second gas delivery pipes corresponding to one of the multiple gas nozzles, and the ejection ends of the multiple gas nozzles arranged sequentially along the length direction of the swing arm.

[0010] Furthermore, at least one positioning part is provided on the swing arm, and the first liquid delivery pipe, the first gas delivery pipe and the second gas delivery pipe are all limited to the swing arm by the positioning part.

[0011] Furthermore, the cleaning assembly also includes a drive assembly, which includes a drive motor and a rotating shaft. The rotating shaft is disposed at the bottom of the cleaning tub and extends into the interior of the cleaning tub, and is located close to the inner wall of the cleaning tub. The first end of the swing arm is fixedly connected to the rotating shaft, and the drive motor is drivenly connected to the rotating shaft.

[0012] Furthermore, the wafer cleaning mechanism also includes a base frame, on which the cleaning tank and the cleaning assembly are mounted. A position sensor is provided on the base frame, and a sensing element is provided on the rotating shaft to detect the position of the swing arm in cooperation with the position sensor.

[0013] Furthermore, within the projection of the washing tub in the height direction, the swing arm is arranged in a V-shape, and the swing arm includes a first swing arm segment and a second swing arm segment, with a reinforcing rib connecting the first swing arm segment and the second swing arm segment.

[0014] Furthermore, the inner wall surface of the cleaning tub is provided with an adsorption layer; and / or,

[0015] The bottom of the cleaning tub is provided with a drainage channel; and / or,

[0016] The outer peripheral sidewall of the cleaning tub is provided with a suction channel, and the extension direction of the suction channel is tangent to the outer peripheral sidewall of the cleaning tub.

[0017] Furthermore, within the projection range along the height direction of the wafer cleaning mechanism, the turntable includes a circular turntable, the distance from the first end to the second end of the swing arm is not less than the distance from the first end of the swing arm to the center of the circular turntable, and the distance from the first end to the second end of the swing arm is less than the maximum distance between the first end of the swing arm and the circular turntable.

[0018] On the other hand, this application also provides a wafer dicing machine, which includes the aforementioned wafer cleaning mechanism.

[0019] In this application, by setting a first liquid delivery pipe and a first gas delivery pipe, and both the first liquid delivery pipe and the first gas delivery pipe are connected to the gas-liquid mixing chamber, the cleaning effect and cleaning efficiency of the wafer cleaning mechanism can be improved by using a gas-liquid mixing jet method to clean the wafer. Attached Figure Description

[0020] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, are illustrative and descriptive, serving to explain this application and do not constitute an undue limitation thereof. In the drawings:

[0021] Figure 1This is a schematic diagram of the overall structure of the wafer cleaning mechanism disclosed in the embodiments of this application;

[0022] Figure 2 This is a schematic diagram of the wafer cleaning mechanism (without the cleaning tank) disclosed in the embodiments of this application from a first-view perspective;

[0023] Figure 3 This is a schematic diagram of the wafer cleaning mechanism (without the cleaning tank) disclosed in the embodiments of this application from a second perspective.

[0024] Figure 4 This is a schematic diagram of the wafer cleaning mechanism (without the cleaning tank) disclosed in the embodiments of this application from a third-person perspective.

[0025] The above figures include the following reference numerals:

[0026] 41. Cleaning tank; 42. Mounting base; 421. Turntable; 422. Rotary motor; 43. Cleaning assembly; 431. Swing arm; 4311. First swing arm section; 4312. Second swing arm section; 4313. Reinforcing rib; 432. Mounting block; 4321. Spray nozzle; 433. First liquid delivery pipe; 434. First gas delivery pipe; 435. Second gas delivery pipe; 436. Gas nozzle; 437. Drive assembly; 4371. Drive motor; 4372. Rotating shaft; 44. Positioning part; 45. Base frame; 46. Drainage channel; 47. Suction channel; 48. Position sensor; 49. Sensing element. Detailed Implementation

[0027] It should be noted that, where there is no conflict, the embodiments and features in the embodiments of this utility model can be combined with each other. The present utility model will now be described in detail with reference to the accompanying drawings and embodiments.

[0028] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to the present invention. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0029] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0030] As described in the background section, after wafer dicing, the wafers need to be cleaned. To achieve this, some wafer dicing machines are equipped with wafer cleaning mechanisms, which typically use cleaning nozzles to spray water onto the wafers. However, this method of cleaning wafers using water spray nozzles is ineffective and inefficient, making it difficult to effectively clean the wafers. Therefore, this application provides a novel wafer cleaning mechanism that solves the problems of poor cleaning effect and low cleaning efficiency in the existing wafer dicing mechanisms of wafer cleaning machines. A detailed description will follow with reference to the accompanying drawings.

[0031] like Figures 1 to 4 As shown, according to an embodiment of this application, a wafer cleaning mechanism is provided, which includes a cleaning tank 41, a mounting base 42, and a cleaning assembly 43.

[0032] Specifically, the mounting base 42 is installed inside the cleaning tank 41, and the mounting base 42 is provided with a turntable 421 that can rotate around its own axis; the cleaning assembly 43 includes a swing arm 431, a mounting block 432, a first liquid delivery pipe 433 and a first gas delivery pipe 434. The first end of the swing arm 431 is rotatably installed inside the cleaning tank 41 and is located close to the inner wall of the cleaning tank 41. The second end of the swing arm 431 is suspended above the turntable 421. The mounting block 432 is located at the second end of the swing arm 431. The mounting block 432 is provided with a gas-liquid mixing chamber (not shown in the figure) and a spray port 4321 that communicates with the gas-liquid mixing chamber. The first liquid delivery pipe 433 and the first gas delivery pipe 434 are both connected to the gas-liquid mixing chamber.

[0033] In actual operation, the wafer to be cleaned (not shown in the figure) is placed on the turntable 421. A rotary motor 422 drives the turntable 421 to rotate around its own axis, thus rotating the wafer and ensuring that all areas of the wafer surface are cleaned uniformly. The swing arm 431 in the cleaning assembly 43 is rotatably mounted inside the cleaning tank 41. This arrangement fully utilizes the internal space of the cleaning tank 41, making the entire cleaning mechanism compact. The second end of the swing arm 431 is suspended above the turntable 421, expanding the cleaning range of the wafer and further ensuring the uniformity of cleaning, avoiding cleaning dead zones. During the cleaning process, the first liquid delivery pipe 433 and the first gas delivery pipe 434 respectively deliver liquid and gas. By adjusting parameters such as the flow rate and pressure of the liquid and gas, the gas-liquid mixing ratio and the spray intensity can be controlled, thereby adapting to the cleaning needs of different types of wafers and improving the flexibility and adaptability of the cleaning process. In addition, the mixture of liquid and gas in the gas-liquid mixing chamber is sprayed out from the injection port 4321, which atomizes the water to form a gas-liquid mixed fluid that can generate strong scouring and stripping capabilities, effectively removing particles, impurities and other residues from the wafer surface. Furthermore, the high-speed jet of fluid can enhance the cleaning effect and improve cleaning efficiency by utilizing the gas expansion effect.

[0034] Compared to the existing technology that uses a simple high-pressure liquid injection method, the wafer cleaning mechanism in this application uses a gas-liquid mixed injection method, which can reduce mechanical damage to the wafer surface while ensuring the cleaning effect. In other words, by setting up a first liquid delivery pipe 433 and a first gas delivery pipe 434, both of which are connected to a gas-liquid mixing chamber, the wafer cleaning mechanism can improve its cleaning effect and efficiency by using a gas-liquid mixed injection method.

[0035] like Figure 2 As shown, the cleaning assembly 43 also includes a second gas delivery pipe 435 and a gas nozzle 436. The gas nozzle 436 is mounted on the side of the swing arm 431 near the second end and is integrated with the other parts of the cleaning assembly 43, allowing it to work in conjunction with the cleaning action. The second gas delivery pipe 435 is connected to the gas nozzle 436. After wafer cleaning is completed, gas is delivered to the gas nozzle 436 through the second gas delivery pipe 435. The gas nozzle 436 sprays the gas onto the wafer surface, quickly drying any residual cleaning solution and improving production efficiency. This design also prevents water stains and ensures the cleanliness of the wafer surface.

[0036] See you again Figure 2As shown, multiple second gas delivery pipes 435 and gas nozzles 436 are included, with each second gas delivery pipe 435 corresponding to one gas nozzle 436, and the ejection ends of the gas nozzles 436 arranged sequentially along the length of the swing arm 431. Exemplarily, there can be two, three, four, or more second gas delivery pipes 435, and the number of gas nozzles 436 can be two, three, four, or more; no specific limitation is made in this application. Figure 2 The diagram shows a configuration with two second gas delivery pipes 435 and two gas nozzles 436. In this embodiment, multiple gas nozzles 436 operate simultaneously, increasing the drying coverage area and enabling faster drying of the cleaning fluid on the wafer surface. Compared to a single nozzle, this significantly shortens the drying time and improves overall production efficiency. Furthermore, the gas nozzles 436, arranged sequentially along the length of the swing arm 431, can form a continuous and uniform airflow coverage on the wafer surface. Even when the wafer size changes, the entire wafer surface is ensured to be uniformly blown by gas, preventing incomplete drying in certain areas or inconsistent drying speeds, thereby improving the quality and consistency of wafer drying. Further, in this embodiment, the multiple second gas delivery pipes 435 and gas nozzles 436 are independently configured. If one gas nozzle 436 malfunctions, the others can continue to operate, improving the system's reliability and stability.

[0037] like Figures 1 to 4 As shown, at least one positioning part 44 is provided on the swing arm 431. The first liquid delivery pipe 433, the first gas delivery pipe 434, and the second gas delivery pipe 435 are all limited to the swing arm 431 by the positioning part 44. Exemplarily, the number of positioning parts 44 can be one, two, three, or more than three, and the specific number is not limited in this application. The positioning part 44 fixes the relative positions of the first liquid delivery pipe 433, the first gas delivery pipe 434, and the second gas delivery pipe 435 on the swing arm 431, preventing the pipes from shaking or shifting during the swing of the swing arm 431, ensuring the stability and reliability of the cleaning and drying operations, and helping to ensure the stability of liquid delivery. In addition, the positioning part 44 facilitates the installation and maintenance of each pipe, and also helps to effectively utilize the space on the swing arm 431, making the structure of the entire cleaning assembly 43 more compact and improving the aesthetics of the wafer cleaning mechanism.

[0038] like Figure 3 and Figure 4As shown, the cleaning assembly 43 also includes a drive assembly 437. Specifically, the drive assembly 437 includes a drive motor 4371 and a rotating shaft 4372. The rotating shaft 4372 is located at the bottom of the cleaning tank 41 and extends into the interior of the cleaning tank 41. The rotating shaft 4372 is positioned close to the inner wall of the cleaning tank 41, which can make full use of the space inside the cleaning tank 41, making the structure of the cleaning assembly 43 more compact, and also avoiding interference from the drive assembly 437 to other components inside the cleaning tank 41. The first end of the swing arm 431 is fixedly connected to the rotating shaft 4372, and the drive motor 4371 is drivenly connected to the rotating shaft 4372. The drive motor 4371 provides power to the swing arm 431 through the rotating shaft 4372, which can precisely control the swing angle and speed of the swing arm 431. It can also flexibly adjust the movement state of the swing arm 431 according to the cleaning requirements of the wafer, ensuring that the cleaning fluid and drying gas can act evenly and accurately on the wafer surface, improving the cleaning and drying effect. In addition, the swing arm 431 is connected to the drive motor 4371 via the rotating shaft 4372, and the rotating shaft 4372 is located close to the inner wall of the washing tub 41, so that the swing arm 431 has good support and stability during movement.

[0039] like Figure 2 As shown, the wafer cleaning mechanism also includes a base frame 45, on which the cleaning tank 41 and cleaning assembly 43 are mounted. The base frame 45 provides a mounting foundation for the cleaning tank 41 and cleaning assembly 43, and ensures the stability of the wafer cleaning mechanism during operation. A position sensor 48 is provided on the base frame 45, and a sensor 49 is provided on the rotating shaft 4372 to detect the position of the swing arm 431 in cooperation with the position sensor 48. Through the cooperation of the position sensor 48 and the sensor 49, the position of the swing arm 431 can be detected in real time and accurately, which helps to ensure that the swing arm 431 accurately reaches the predetermined position during cleaning and drying, ensuring that the cleaning fluid and gas can accurately act on specific areas of the wafer, and improving the cleaning and drying effect and consistency.

[0040] Furthermore, in this embodiment, the position sensor 48 and sensing element 49 are provided to improve the motion control accuracy of the drive assembly 437. For example, when there is a deviation between the actual position of the swing arm 431 and the preset position, the control system can promptly control the drive motor 4371 to make fine adjustments, so that the swing arm 431 accurately returns to the predetermined position, thereby improving the control accuracy of the swing arm 431's movement and avoiding insufficient cleaning or drying caused by inaccurate positioning of the swing arm 431. In addition, the position sensor 48 and sensing element 49 can also protect the wafer cleaning mechanism and the wafer, preventing the swing arm 431 from swinging excessively or exceeding its working range, thereby avoiding collisions with the cleaning tank 41 or other components and protecting the equipment from damage. At the same time, it can also prevent wafer damage caused by improper positioning of the swing arm 431, reducing equipment maintenance costs and wafer scrap rate.

[0041] like Figure 1 , Figure 3 and Figure 4 As shown, within the projection along the height of the cleaning tank 41, the swing arm 431 is arranged in a V-shape. Compared to a straight design, setting the swing arm 431 in a V-shape allows for more efficient cleaning within a limited space without increasing the lateral cleaning range or improving the flexibility of the cleaning operation. The V-shape of the swing arm 431 allows it to better adapt to the shape and size of the cleaning tank 41 within a limited space. The swing arm 431 can be closer to the inner wall of the cleaning tank 41, improving the cleaning effect on the wafer. In addition, this shape also helps to optimize the direction and distribution of the jet fluid, allowing the cleaning liquid and gas to act more precisely on the areas of the wafer that need cleaning.

[0042] Furthermore, the swing arm 431 includes a first swing arm segment 4311 and a second swing arm segment 4312, with a reinforcing rib 4313 connecting the first swing arm segment 4311 and the second swing arm segment 4312. By providing the reinforcing rib 4313 between the first swing arm segment 4311 and the second swing arm segment 4312, the overall rigidity and stability of the swing arm 431 can be significantly increased. This helps to reduce the vibration and deformation of the swing arm 431 caused by water flow impact or mechanical movement during operation, ensuring the stability and reliability of the cleaning assembly 43.

[0043] like Figure 1 As shown, the inner wall of the cleaning tank 41 is provided with an absorbent layer (not shown in the figure). For example, the absorbent layer can be an absorbent cotton layer. During the cleaning process, the absorbent layer can effectively absorb splashed liquid caused by jetting water and wafer rotation, reducing the negative impact of the liquid on the cleaning effect.

[0044] Furthermore, a drainage channel 46 is provided at the bottom of the cleaning tank 41. The drainage channel 46 can speed up the drainage after the cleaning process is completed, shorten the cleaning cycle, improve production efficiency, and effectively reduce the water or cleaning solution residue at the bottom of the cleaning tank 41 after cleaning, thereby improving the cleaning quality of the wafers.

[0045] A suction channel 47 is provided on the outer peripheral sidewall of the cleaning tank 41, and the extension direction of the suction channel 47 is tangential to the outer peripheral sidewall of the cleaning tank 41. The tangential arrangement of the suction channel 47 can generate a rotating flow or vortex effect, promoting the circulation of the cleaning fluid near the outer peripheral sidewall. This flow pattern helps to distribute the cleaning fluid more evenly, reduce cleaning dead zones, and ensure that all parts of the wafer surface are fully contacted and cleaned. In addition, the centrifugal force generated by the tangential flow can help push particulate matter suspended in the cleaning fluid to the periphery of the cleaning tank 41 and finally be extracted by the suction channel 47. This not only improves the particulate matter removal efficiency, but also reduces the risk of contamination caused by the redeposition of particles onto the wafer surface. In other words, by providing a suction channel 47 tangential to the outer peripheral sidewall of the cleaning tank 41, this application can not only improve the liquid flow and particulate matter removal efficiency during the cleaning process, but also improve the overall quality of the cleaning environment and improve the cleaning efficiency.

[0046] like Figure 3 and Figure 4 As shown, within the projection of the cleaning tank 41 along its height direction, the turntable 421 includes a circular turntable. The distance from the first end to the second end of the swing arm 431 is not less than the distance from the first end of the swing arm 431 to the center of the circular turntable, and the distance from the first end to the second end of the swing arm 431 is less than the maximum distance between the first end of the swing arm 431 and the circular turntable. This configuration ensures that the spray range of the gas-liquid mixture covers the entire wafer surface, achieving comprehensive and uniform cleaning. Furthermore, the length of the swing arm 431 is less than the distance from its first end to the farthest point of the circular turntable, ensuring that the spray nozzle 4321 does not exceed the cleaning area where the wafer is located, preventing the cleaning fluid from being sprayed into ineffective areas and wasting resources. In addition, when the swing arm 431 and the circular turntable meet the above conditions, the swing arm 431 can complete an effective cleaning action within a limited space, and during the swing of the swing arm 431, the spray nozzle 4321 can form a continuous cleaning trajectory with minimal overlap on the wafer surface, avoiding insufficient or repeated cleaning in certain areas, and improving cleaning efficiency and consistency.

[0047] On the other hand, this application also provides a wafer dicing machine that includes the aforementioned wafer cleaning mechanism. Therefore, the wafer dicing machine in this embodiment incorporates all the technical effects of the aforementioned wafer cleaning mechanism. Since the technical effects of the wafer cleaning mechanism have already been described in detail above, they will not be repeated here.

[0048] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0049] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this utility model.

[0050] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A wafer cleaning mechanism, characterized by, include: Cleaning bucket (41); Mounting base (42), which is installed inside the cleaning tub (41), and the mounting base (42) is provided with a turntable (421) that can rotate around its own axis; The cleaning assembly (43) includes a swing arm (431), a mounting block (432), a first liquid delivery pipe (433), and a first gas delivery pipe (434). The first end of the swing arm (431) is rotatably mounted inside the cleaning tank (41) and close to the inner wall of the cleaning tank (41). The second end of the swing arm (431) is suspended above the turntable (421). The mounting block (432) is located at the second end of the swing arm (431). The mounting block (432) is provided with a gas-liquid mixing chamber and a spray port (4321) communicating with the gas-liquid mixing chamber. The first liquid delivery pipe (433) and the first gas delivery pipe (434) are both communicating with the gas-liquid mixing chamber.

2. The wafer cleaning mechanism according to claim 1, wherein The cleaning assembly (43) further includes a second gas delivery pipe (435) and a gas nozzle (436), the gas nozzle (436) being mounted on the side of the swing arm (431) near the second end, and the second gas delivery pipe (435) being connected to the gas nozzle (436).

3. The wafer cleaning mechanism of claim 2, wherein, The second gas delivery pipe (435) and the gas nozzle (436) are both multiple, and the multiple second gas delivery pipes (435) are arranged one-to-one with the multiple gas nozzles (436), and the ejection ends of the multiple gas nozzles (436) are arranged sequentially along the length direction of the swing arm (431).

4. The wafer cleaning mechanism of claim 2, wherein, At least one positioning part (44) is provided on the swing arm (431), and the first liquid delivery pipe (433), the first gas delivery pipe (434) and the second gas delivery pipe (435) are all limited to the swing arm (431) by the positioning part (44).

5. The wafer cleaning mechanism of claim 1, wherein, The cleaning assembly (43) further includes a drive assembly (437), which includes a drive motor (4371) and a rotating shaft (4372). The rotating shaft (4372) is disposed at the bottom of the cleaning tub (41) and extends into the interior of the cleaning tub (41), and the rotating shaft (4372) is disposed close to the inner wall of the cleaning tub (41). The first end of the swing arm (431) is fixedly connected to the rotating shaft (4372), and the drive motor (4371) is drivenly connected to the rotating shaft (4372).

6. The wafer cleaning mechanism of claim 5, wherein, The wafer cleaning mechanism also includes a base frame (45), the cleaning tank (41) and the cleaning assembly (43) are both mounted on the base frame (45), a position sensor (48) is provided on the base frame (45), and a sensor (49) is provided on the rotating shaft (4372) to cooperate with the position sensor (48) to detect the position of the swing arm (431).

7. The wafer cleaning mechanism of claim 1, wherein Within the projection of the washing tub (41) in the height direction, the swing arm (431) is arranged in a V shape, and the swing arm (431) includes a first swing arm section (4311) and a second swing arm section (4312), with a reinforcing rib (4313) connecting the first swing arm section (4311) and the second swing arm section (4312).

8. The wafer cleaning mechanism according to any one of claims 1 to 7, wherein The inner wall surface of the cleaning tub (41) is provided with an adsorption layer; and / or, The bottom of the cleaning tub (41) is provided with a drainage channel (46); and / or, The outer peripheral sidewall of the cleaning tub (41) is provided with a suction channel (47), and the extension direction of the suction channel (47) is tangent to the outer peripheral sidewall of the cleaning tub (41).

9. The wafer cleaning mechanism according to any one of claims 1 to 7, wherein Within the projection range along the height direction of the wafer cleaning mechanism, the turntable (421) includes a circular turntable, the distance from the first end to the second end of the swing arm (431) is not less than the distance from the first end of the swing arm (431) to the center of the circular turntable, and the distance from the first end to the second end of the swing arm (431) is less than the maximum distance between the first end of the swing arm (431) and the circular turntable.

10. A wafer cutting machine characterized by comprising: The wafer dicing machine includes the wafer cleaning mechanism as described in any one of claims 1 to 9.

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