A punch press die chip removal mechanism

Abstract

The utility model discloses a stamping die chip removal mechanism relates to stamping die technical field. Include: mould body, mould body is by bottom plate, two support blocks and mould body and is composed, and the bottom of mould body is provided with the chip removal hole, chip removal mechanism sets up in the below of mould body, chip removal mechanism includes: transfer drum, transfer drum sets up in the back of bottom plate, chip removal cloth pipe, chip removal cloth pipe fixedly connected in the bottom of transfer drum, chip removal square tube, chip removal square tube fixedly inserts and connects in the outer wall of transfer drum, and chip removal square tube is fixedly connected between two support blocks, and the material receiving plate is set up in the front of chip removal square tube. The utility model discloses the setting of chip removal mechanism, through the cooperation between transfer drum, chip removal cloth pipe, chip removal square tube, material receiving plate, leakproof plate and counterweight ring, can gather and discharge the chip that mould produces, avoided the condition that chip splashes everywhere, reduced the difficulty of manual cleaning collection.

Description

Technical Field

[0001] This utility model relates to the field of stamping die technology, and in particular to a chip removal mechanism for stamping dies. Background Technology

[0002] Stamping dies are precision tools used in presses to form or separate sheet metal to produce parts in batches. Among them, punching dies are specifically used for the punching process. Their core consists of a punch and a die. During operation, the punch is driven by pressure to punch through the sheet metal and enter the die. Through shearing action, a hole is formed, resulting in a workpiece with a hole and a separated scrap. It is characterized by high efficiency and precision and is widely used in the hole processing of various metal plates and shells.

[0003] When punching dies are in operation, the shearing of materials will simultaneously produce debris. Currently, the conventional method of chip removal mostly relies on the chip removal holes built into the die to directly discharge the debris. However, this method may cause the debris to fly everywhere and scatter in the gaps between equipment, on the workbench and the ground, which greatly increases the workload and difficulty of subsequent manual cleaning and collection. Utility Model Content

[0004] Therefore, it is necessary to provide a stamping die chip removal mechanism to address the problem that the chips discharged directly through the die chip removal hole are not easy to clean and collect.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a stamping die chip removal mechanism, comprising:

[0006] The mold body consists of a base plate, two support blocks and a mold body, and the bottom of the mold body is provided with a chip removal hole;

[0007] A chip removal mechanism is provided below the mold body and is used to collect and discharge the chips generated during mold operation.

[0008] Preferably, the chip removal mechanism includes:

[0009] A transfer cylinder, wherein the transfer cylinder is disposed on the back side of the base plate;

[0010] Chip removal pipe, which is fixedly connected to the bottom of the transfer cylinder;

[0011] A chip removal square tube is fixedly inserted into the outer wall of the transfer cylinder, and the chip removal square tube is fixedly connected between two support blocks;

[0012] A receiving plate is disposed on the front side of the chip removal square tube;

[0013] A leak-proof plate is fixedly connected between the chip discharge square tube and the mold body, and the leak-proof plate is fixedly connected between two support blocks;

[0014] The disassembly and assembly component is used to replace the receiving plate.

[0015] Preferably, the chip removal mechanism further includes:

[0016] The L-shaped support rod is fixedly connected to the back of the mold body, and the bottom end of the L-shaped support rod is fixedly connected to the top of the intermediate transfer cylinder. The L-shaped support rod provides auxiliary support for the intermediate transfer cylinder.

[0017] Preferably, the chip removal mechanism further includes:

[0018] A counterweight ring is fixedly connected to the bottom of the chip removal pipe. The counterweight ring is used to prevent the chip removal pipe from detaching from the chip collection frame during the chip removal process.

[0019] Preferably, the disassembly / assembly assembly includes:

[0020] Two U-shaped guide rails are symmetrically fixedly connected to the opposite sides of two support blocks, and the outer walls on both sides of the receiving plate are slidably sleeved with the inner cavity of the corresponding U-shaped guide rail.

[0021] Two fixing blocks are fixedly connected to the front of one of the support blocks;

[0022] A sealing plate, which is rotatably connected between two fixed blocks;

[0023] A cylindrical block, which is fixedly inserted and connected to the front of the closed plate;

[0024] T-shaped holes are formed on the back side of the cylindrical block;

[0025] A threaded hole, wherein the threaded hole is formed on the front side of another support block;

[0026] The positioning bolt has its outer wall movably fitted into the inner cavity of the T-shaped hole, and its outer wall is threadedly connected to the inner wall of the threaded hole.

[0027] Preferably, the disassembly / assembly assembly further includes:

[0028] An anti-loosening ring is located inside the T-shaped hole and is fixedly sleeved on the outer wall of the positioning bolt. The anti-loosening ring is used to prevent the positioning bolt from being lost.

[0029] In summary, this utility model has at least one of the following beneficial technical effects:

[0030] (1) This utility model utilizes the chip removal mechanism. Through the cooperation between the transfer cylinder, chip removal pipe, chip removal square pipe, receiving plate, anti-leakage plate and counterweight ring, the chips produced by the mold can be concentrated and collected, avoiding the situation of chips flying everywhere and reducing the difficulty of manual cleaning and collection.

[0031] (2) This utility model utilizes the assembly and disassembly components. Through the cooperation between the U-shaped guide rail, the fixing block, the closing plate, the column block and the positioning bolt, the receiving plate damaged by impact can be quickly replaced. Attached Figure Description

[0032] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0033] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0034] Figure 2 For the present utility model Figure 1 A magnified view of the structure at point A in the middle;

[0035] Figure 3 This is a side sectional view of the chip removal square tube of this utility model;

[0036] Figure 4 This is a schematic diagram of the side cross-sectional structure of the cylindrical block of this utility model.

[0037] In the attached image:

[0038] 1. Mold body; 11. Base plate; 12. Support block; 13. Mold body; 14. Chip removal hole; 2. Chip removal mechanism; 21. Transfer cylinder; 22. Chip removal pipe; 23. Chip removal square tube; 24. Receiving plate; 25. Leakage prevention plate; 26. Assembly / disassembly components; 261. U-shaped guide rail; 262. Fixing block; 263. Sealing plate; 264. Columnar block; 265. Positioning bolt; 266. Anti-detachment ring; 27. L-shaped support rod; 28. Counterweight ring. Detailed Implementation

[0039] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0040] exist Figure 1-4In the embodiment shown, the present invention provides a technical solution: a stamping die chip removal mechanism, comprising: a die body 1, which is composed of a base plate 11, two support blocks 12 and a die body 13, wherein a chip removal hole 14 is provided at the bottom of the die body 13; and a chip removal mechanism 2, which is disposed below the die body 13 and is used to collect and discharge the chips generated by the die operation.

[0041] The chip removal mechanism 2 includes: a central transfer cylinder 21, which is located on the back of the base plate 11 with its opening facing downwards; an L-shaped support rod 27, which is fixedly connected to the back of the mold body 13, with its bottom end fixedly connected to the top of the central transfer cylinder 21, providing auxiliary support for the central transfer cylinder 21; a chip removal pipe 22, which is fixedly connected to the bottom of the central transfer cylinder 21, and the material and length of the chip removal pipe 22 can be changed according to actual needs; and a counterweight ring 28, which is fixedly connected to the bottom of the chip removal pipe 22, used to prevent chip discharge. The chip removal tube 22 detaches from the chip collection frame during the chip removal process; the chip removal square tube 23 is fixedly inserted and connected to the outer wall of the transfer cylinder 21, and is fixedly connected between the two support blocks 12; the receiving plate 24 is set on the front of the chip removal square tube 23; the leak-proof plate 25 is fixedly connected between the chip removal square tube 23 and the mold body 13, and is fixedly connected between the two support blocks 12. The leak-proof plate 25 is used to guide the chips that have passed over the opening above the chip removal square tube 23 back to the opening; the disassembly and assembly component 26 is used to replace the receiving plate 24.

[0042] Specifically, the assembly / disassembly component 26 includes: two U-shaped guide rails 261, which are symmetrically and fixedly connected to the opposite sides of the two support blocks 12, with the outer walls of the receiving plate 24 slidingly sleeved with the inner cavities of the corresponding U-shaped guide rails 261; two fixing blocks 262, which are fixedly connected to the front of one of the support blocks 12; a closing plate 263, which is rotatably connected between the two fixing blocks 262; a cylindrical block 264, which is fixedly inserted into the front of the closing plate 263; and a T-shaped hole, which is formed in the cylindrical block 264. The back side; threaded hole, the threaded hole is opened on the front side of another support block 12; positioning bolt 265, the outer wall of positioning bolt 265 is movably sleeved with the inner cavity of T-shaped hole, the outer wall of positioning bolt 265 is threadedly connected with the inner wall of threaded hole, when positioning bolt 265 is fully screwed into threaded hole, the sealing plate 263 cannot rotate, so receiving plate 24 cannot be separated from two U-shaped guide rails 261; anti-detachment ring 266, anti-detachment ring 266 is located in the inner cavity of T-shaped hole, anti-detachment ring 266 is fixedly sleeved on the outer wall of positioning bolt 265, anti-detachment ring 266 is used to prevent positioning bolt 265 from being lost.

[0043] The specific working principle of this utility model will be explained in detail below:

[0044] Before using the punching die, first check if the receiving plate 24 is damaged. If it is damaged, turn the positioning bolt 265 counterclockwise. When the positioning bolt 265 is completely disengaged from the threaded hole, turn the closing plate 263 away from the front of the receiving plate 24. Then remove the damaged receiving plate 24 and insert the new receiving plate 24 between the two U-shaped guide rails 261. Then repeat the above steps of operating the closing plate 263 and positioning bolt 265 in reverse to complete the installation of the new receiving plate 24. After the above operations are completed, put the counterweight ring 28 into the collection box for collecting debris.

[0045] When the punching die produces chips, the chips first fall through the chip discharge hole 14 onto the receiving plate 24. Then, the chips on the inclined receiving plate 24 enter the inclined chip discharge square tube 23 under their own gravity, then enter the transfer cylinder 21, and finally fall into the collection frame through the chip discharge distribution pipe 22 for collection. This centralized discharge and collection avoids the chips from splashing everywhere and reduces the difficulty of manual cleaning and collection.

[0046] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A chip removal mechanism for stamping dies, characterized in that, include: The mold body (1) is composed of a base plate (11), two support blocks (12) and a mold body (13). The bottom of the mold body (13) is provided with a chip removal hole (14). Chip removal mechanism (2) is located below the mold body (13) and is used to collect and discharge the chips generated during mold operation.

2. The stamping die chip removal mechanism according to claim 1, characterized in that, The chip removal mechanism (2) includes: A transfer cylinder (21) is disposed on the back side of the base plate (11); Chip removal pipe (22), which is fixedly connected to the bottom of the transfer cylinder (21); Chip removal square tube (23) is fixedly inserted into the outer wall of the transfer cylinder (21) and fixedly connected between two support blocks (12); A receiving plate (24) is disposed on the front side of the chip discharge square tube (23); Leak-proof plate (25), the leak-proof plate (25) is fixedly connected between the chip discharge square tube (23) and the mold body (13), and the leak-proof plate (25) is fixedly connected between two support blocks (12); Disassembly assembly (26) is used to replace the receiving plate (24).

3. The stamping die chip removal mechanism according to claim 2, characterized in that, The chip removal mechanism (2) further includes: L-shaped support rod (27) is fixedly connected to the back of the mold body (13). The bottom end of the L-shaped support rod (27) is fixedly connected to the top of the transfer cylinder (21). The L-shaped support rod (27) plays an auxiliary supporting role for the transfer cylinder (21).

4. The stamping die chip removal mechanism according to claim 2, characterized in that, The chip removal mechanism (2) further includes: The counterweight ring (28) is fixedly connected to the bottom of the chip removal pipe (22). The counterweight ring (28) is used to prevent the chip removal pipe (22) from detaching from the chip collection frame during the chip removal process.

5. The stamping die chip removal mechanism according to claim 2, characterized in that, The disassembly / assembly assembly (26) includes: Two U-shaped guide rails (261) are symmetrically fixedly connected to the opposite sides of two support blocks (12), and the outer walls of the receiving plate (24) on both sides are slidably sleeved with the inner cavity of the corresponding U-shaped guide rails (261). Two fixing blocks (262) are fixedly connected to the front of one of the support blocks (12); A sealing plate (263) is rotatably connected between two fixed blocks (262); A cylindrical block (264) is fixedly inserted into the front of the closed plate (263); T-shaped holes are formed on the back side of the cylindrical block (264); A threaded hole is provided on the front of another support block (12); The positioning bolt (265) is movably sleeved with the inner cavity of the T-shaped hole, and the outer wall of the positioning bolt (265) is threadedly connected to the inner wall of the threaded hole.

6. The stamping die chip removal mechanism according to claim 5, characterized in that, The disassembly / assembly assembly (26) also includes: Anti-detachment ring (266) is located in the inner cavity of the T-shaped hole. The anti-detachment ring (266) is fixedly sleeved on the outer wall of the positioning bolt (265). The anti-detachment ring (266) is used to prevent the positioning bolt (265) from being lost.

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