Test equipment

Abstract

This application discloses a testing apparatus for testing an object under test at a preset temperature. The object under test includes a substrate and one or more chips disposed on the substrate. The one or more chips include at least one of single-chip and multi-chip. The testing apparatus includes a clamp, a heating tray, a probe card, a heating module, and a constant temperature chamber. The clamp, heating tray, probe card, and heating module are disposed inside the constant temperature chamber. The clamp is disposed on the heating tray for clamping and encasing the object under test. The heating tray includes an electric heating plate and a heat-conducting plate disposed above the electric heating plate, with the heat-conducting plate in contact with the bottom surface of the clamp. The probe card is disposed above the clamp and has multiple probes, each corresponding to a pin of one or more chips. The top of the clamp has through holes for the probes to pass through. The heating module is used to heat the multiple probes. This application reduces the temperature difference inside the chip, improves testing accuracy and precision, and increases testing efficiency.

Description

Technical Field

[0001] This application relates to the field of chip testing technology, and more specifically, to a testing machine. Background Technology

[0002] With the rapid development of the semiconductor industry, people have increasingly higher requirements for the stability and reliability of chips.

[0003] Test equipment is the core equipment in the final test (FT) stage after chip manufacturing. It is mainly used to simulate specific temperature environments to test the performance, function and stability of chips under specific temperature conditions, and to screen out chips that fail under specific temperature conditions.

[0004] In current testing equipment, the trays used to support the chips are heated by heating wires. The uneven heat distribution causes temperature differences inside the chips. Because the chips are highly precise, they are particularly sensitive to temperature differences. If the temperature difference exceeds a certain value, the chip's performance will not meet the standards, and accurate testing will not be possible.

[0005] The above situation is even more pronounced for multi-in-one chips, which are chips that combine multiple individual chips to achieve a specific function. For example, a color temperature chip includes a photodiode and a main chip. The main chip includes a stacked temperature sensor and a processing chip. The processing chip is used to receive and process data from the photodiode and the temperature sensor. Essentially, a color temperature chip is a three-in-one chip. The photodiode and the main chip are laid flat on the substrate. Due to the positional differences between the photodiode and the main chip, and the positional differences between the temperature sensor and the processing chip within the main chip, there are temperature differences between the three individual chips. When the temperature difference reaches a certain value, the performance of the color temperature chip will fail to meet the standards, making accurate Fourier Transmission (FT) testing impossible. Utility Model Content

[0006] To address the shortcomings of existing technologies, this application innovatively provides a testing machine that reduces the temperature difference inside the chip, improves testing precision and accuracy, and adopts a full-board substrate testing method, which can test multiple chips simultaneously, thereby improving testing efficiency.

[0007] To achieve the aforementioned technical objectives, this application discloses a testing machine for testing an object under test at a preset temperature. The object under test includes a substrate and one or more chips disposed on the substrate. The one or more chips include at least one of single-chip and multi-chip technologies. The testing equipment includes a clamp, a heating tray, probe cards, a heating module, and a constant temperature chamber. The clamp, the heating tray, the probe cards, and the heating module are disposed inside the constant temperature chamber. The clamping plate is mounted on the heating tray and is used to clamp and wrap the object to be tested. The heating tray includes an electric heating plate and a heat-conducting plate disposed above the electric heating plate, the heat-conducting plate being in contact with the bottom surface of the clamping plate. The probe card is disposed above the clamp, and the probe card is provided with multiple probes, each corresponding to a pin of one or more chips. The top of the clamp has a through-hole for the probes to pass through. The heating module is used to heat the plurality of probes.

[0008] Furthermore, the clamp includes an upper heat-conducting plate and a lower heat-conducting plate. The lower heat-conducting plate includes a heat-conducting substrate and an elastic heat-conducting pad disposed on the upper surface of the heat-conducting substrate. The upper heat-conducting plate and the lower heat-conducting plate are connected to clamp and wrap the object to be tested.

[0009] Furthermore, the elastic thermal pad is a silicone pad or a rubber pad.

[0010] Furthermore, the electric heating plate includes multiple heating zones. The testing machine also includes a first temperature detection module and a controller. The first temperature detection module is used to detect the temperature of each area of ​​the clamp corresponding to the plurality of heating areas. The first temperature detection module is electrically connected to the controller. The controller is used to control the heating temperature of the plurality of heating areas according to the temperature of each area of ​​the clamp, so that the temperature difference of each area of ​​the clamp is within a preset range.

[0011] Furthermore, the testing machine also includes a sliding assembly, the heating tray is connected to the sliding assembly, the sliding assembly is used to realize the movement of the heating tray in the constant temperature chamber, the first temperature detection module is disposed above the movement path of the heating tray, and the first temperature detection module is used to detect the temperature of each area of ​​the clamping plate when the heating tray, the clamping plate and the test object move in the constant temperature chamber.

[0012] Furthermore, the first temperature detection module includes non-contact temperature sensors, the number and distribution of which correspond one-to-one with the heating areas in the direction perpendicular to the movement path of the heating tray.

[0013] Furthermore, the testing machine also includes a second temperature detection module and a controller. The second temperature detection module is used to detect the temperature of the probe. The second temperature detection module is electrically connected to the controller. The controller is used to control the heating temperature of the heating module according to the temperature of the probe, so that the temperature difference between the probe and the clamp is within a preset range.

[0014] Furthermore, the electric heating plate is a ceramic plate or a carbon crystal plate.

[0015] Furthermore, the heating module includes multiple electric heating wires, and the multiple electric heating wires are arranged in a one-to-one correspondence with the multiple probes.

[0016] Furthermore, the upper heat-conducting plate is engaged with the heat-conducting substrate.

[0017] Furthermore, the upper heat-conducting plate is hinged to the first side of the heat-conducting substrate, and the upper heat-conducting plate is locked to the second side of the heat-conducting substrate by a locking assembly, with the first side and the second side being arranged opposite to each other.

[0018] Furthermore, the top of the heat-conducting plate is provided with a first groove for accommodating the clamping plate.

[0019] The beneficial effects of this application are as follows: The testing equipment described in this application reduces the temperature difference inside the chip, improves testing accuracy and precision, and adopts a full-board substrate testing method, which can test multiple chips simultaneously, thereby improving testing efficiency. Attached Figure Description

[0020] Figure 1 This is a longitudinal cross-sectional view of the all-in-one chip according to an embodiment of this application.

[0021] Figure 2 This is a longitudinal sectional view of the object to be tested in an embodiment of this application.

[0022] Figure 3 This is a bottom view of the object to be tested in an embodiment of this application.

[0023] Figure 4 This is a longitudinal sectional view of the test equipment of this application.

[0024] Figure 5 This is a top view of the clamping plate according to an embodiment of this application.

[0025] Figure 6 This is a schematic diagram of the clamping disc according to another embodiment of this application.

[0026] Figure 7 This is a top view of the heating tray according to an embodiment of this application.

[0027] Figure 8 This is a longitudinal sectional view of the heating tray according to an embodiment of this application.

[0028] Figure 9 This is a circuit connection block diagram of an embodiment of this application.

[0029] Figure 10 This is a schematic diagram of the structure of the electric heating plate according to an embodiment of this application.

[0030] Figure 11 This is a verification diagram of the "temperature-signal response" of the test object being tested using the test equipment described in this application.

[0031] In the picture, 1. Test object; 11. Substrate; 12. Chip; 121. First chip; 122. Second chip; 123. Third chip; 124. Fourth chip; 125. Fifth chip; 2. Clamping plate; 21. Upper heat-conducting plate; 211. Through hole; 22. Lower heat-conducting plate; 221. Heat-conducting substrate; 222. Elastic heat-conducting pad; 223. Second groove; 3. Heating tray; 31. Electric heating plate; 311. Heating area; 32. Heat-conducting plate; 321. First groove; 4. Probe card; 41. Probe; 5. Heating module; 51. Electric heating wire; 6. Constant temperature chamber; 7. First temperature detection module; 8. Controller; 9. Sliding assembly; 91. Slide rail; 92. Slider; 10. Second temperature detection module; 20. Locking assembly; 201. First locking component; 202. Second locking component. Detailed Implementation

[0032] The testing equipment provided in this application will be explained and described in detail below with reference to the accompanying drawings.

[0033] In this embodiment, an all-in-one chip refers to a chip that combines multiple individual chips to achieve a specific function, and it contains at least two individual chips. The following example illustrates the arrangement of the individual chips inside an all-in-one chip. Figure 1 This is a longitudinal sectional view of the all-in-one chip according to an embodiment of this application. Figure 1 The chip 12 shown in a includes two single chips, namely a first chip 121 and a second chip 122, which are laid flat on the substrate 11. Figure 1 The chip 12 shown in b includes two single chips, namely a first chip 121 and a second chip 122, which are stacked on the substrate 11. Figure 1 The chip 12 shown in a and b can be an ambient light detection chip. The first chip 121 is a photodiode, and the second chip 122 is a processing chip. The second chip 122 is used to receive and process the data from the first chip 121. Figure 1 The chip 12 shown in C includes three single chips, namely the third chip 123, the fourth chip 124 and the fifth chip 125. The third chip 123 and the fourth chip 124 can be laid flat on the substrate 11, and the fifth chip 125 can be disposed on the third chip 123. The third chip 123 can be used to receive and process the data of the fourth chip 124 and the fifth chip 125. Figure 1Chip 12, shown in Figure 'c', can be a color temperature chip; chip 123 is a processing chip; chip 124 is a photosensitive chip, such as a photodiode; and chip 125 is a temperature sensor. When heating with a heating wire, there will be a temperature difference between the first chip 121 and the second chip 122. There will also be a temperature difference between the third chip 123, the fourth chip 124, and the fifth chip 125 due to their different positions. If the temperature difference exceeds a certain value, the multi-chip will fail.

[0034] Taking the color temperature chip, which is most sensitive to temperature, as an example, a color temperature chip consists of a photodiode and a main chip. The main chip includes a stacked temperature sensor and a processing chip. The processing chip receives and processes data from the photodiode and the temperature sensor; therefore, the color temperature chip is essentially a three-in-one chip. The photodiode is a single chip, not designed on the same wafer as the main chip. The photodiode and the main chip are laid flat, allowing for process modifications to meet performance requirements based on the photodiode's characteristics, thus optimizing its performance. For example, parameters such as light sensitivity and chip dark current can be adjusted individually according to chip needs. For instance, if color temperature accuracy can reach ±5% error, and illuminance can achieve ±1 Lux accuracy in a darkroom environment, the temperature drift calibration accuracy of the color temperature chip must be at least within ±1% of the actual photoresponse signal of the photodiode at high temperatures, and the actual temperature difference between the main chip and the photodiode must be within ±0.1℃ to ensure performance requirements and high measurement accuracy.

[0035] Even though chip 12 is a single chip, due to the uneven distribution of heating temperature by the heating wire, there will still be temperature differences inside the single chip, which will cause chip 12 to fail.

[0036] In view of this, this application specifically discloses a testing machine for testing the object to be tested 1 at a preset temperature, such as... Figure 2 and 3 As shown, the object to be tested 1 includes a substrate 11 and one or more chips 12 disposed on the substrate 11. The one or more chips 12 include at least one of single-chip and multi-chip. That is, when one chip 12 is disposed on the substrate 11, the chip 12 can be a single-chip or a multi-chip; when multiple chips 12 are disposed on the substrate 11, all chips 12 on the substrate 11 can be single-chip, all chips can be multi-chip, or some can be single-chip and some can be multi-chip. The embodiments of this application use the form of a whole substrate 11 for testing, which can realize the testing of all chips 12 on the substrate 11 at one time, and can test multiple chips 12 simultaneously, improving testing efficiency and production capacity. After the test is completed, the chips 12 on the whole substrate 11 can be cut into single chips 12.

[0037] Figure 4This is a longitudinal sectional view of the testing machine of this application, as shown below. Figure 4 As shown, the testing machine includes a clamping plate 2, a heating tray 3, a probe card 4, a heating module 5, and a constant temperature chamber 6. The clamping plate 2, heating tray 3, probe card 4, and heating module 5 are arranged inside the constant temperature chamber 6. The test object 1 is tested inside the constant temperature chamber 6. The temperature inside the constant temperature chamber 6 is relatively uniform, which reduces the contact between the clamping plate 2, heating tray 3, probe card 4, and heating module 5 and the room temperature air inside the constant temperature chamber 6, reduces the heat loss of the clamping plate 2, heating tray 3, probe card 4, and heating module 5, improves the temperature consistency of the clamping plate 2, heating tray 3, and probe card 4, and thus improves the temperature consistency of the test object 1.

[0038] The clamp 2 is mounted on the heating tray 3 and is used to clamp and wrap the object to be tested 1. The object to be tested 1 is placed inside the clamp 2. Preferably, the object to be tested 1 can be placed upside down inside the clamp 2, that is, during testing, the chip 12 is below the substrate 11, and the chip 12 is closer to the heating tray 3 relative to the substrate, so that heat is transferred to the chip 12 more quickly. The clamp 2 reduces the contact between the object to be tested 1 and the air, and evenly transfers heat to the object to be tested 1, improving the temperature consistency of the object to be tested 1.

[0039] The heating tray 3 is used to support and heat the clamp 2 and the test object 1 inside the clamp 2. The heating tray 3 includes an electric heating plate 31 and a heat-conducting plate 32 disposed above the electric heating plate 31. The heat-conducting plate 32 is in contact with the bottom surface of the clamp 2. The heating temperature of the electric heating plate 31 is uniformly distributed. The heat-conducting plate 32 is in contact with the bottom surface of the clamp 2, and the heat is uniformly transferred to the test object 1. When the test object 1 is placed upright in the clamp 2, the substrate 11 is in contact with the inner bottom surface of the clamp 2, and the heat is uniformly transferred to the substrate 11 and the chip 12 on the substrate. When the test object 1 is placed upside down in the clamp 2, one or more chips 12 of the test object 1 are in contact with the inner bottom surface of the clamp 2, and the heat is uniformly transferred to one or more chips 12. In this embodiment, the chip 12 can be a packaged chip. The surface of the packaged chip 12 is a flat plane that can be in contact with the inner bottom surface of the clamp 2, and the heat is uniformly transferred to one or more chips 12, improving the temperature uniformity of all chips 12 on the substrate 11 and reducing the temperature difference inside the chip 12.

[0040] The probe card 4 is positioned above the clamping plate 2. The probe card 4 can be mounted on the inner top wall of the constant temperature chamber 6. The probe card 4 has multiple probes 41, each corresponding to a pin of one or more chips 12. Figure 5As shown, the top of the clamp 2 has a through hole 211 for the probe 41 to pass through. When the object to be tested 1 is placed upright in the clamp 2, the pins of the chip 12 are on the top surface of the object to be tested 1. After the probe 41 passes through the through hole 211 at the top of the clamp 2, it directly contacts the pins of the chip 12 for testing. When the object to be tested 1 is inverted in the clamp 2, the chip 12 is below the substrate 11, and the pins of the chip 12 are located on the lower surface of the chip 12. The bonding wires of the chip 12 lead the pins of the chip 12 to the upper surface of the chip 12. The substrate 11 can be a PCB board, and the trace pins of the substrate 11 are located on the upper surface of the substrate 11. The traces of the substrate 11 are electrically connected to the bonding wires of the chip 12, thereby realizing the electrical connection between the pins of the chip 12 and the trace pins of the substrate 11. After the probe 41 passes through the through hole 211 at the top of the clamp 2 and contacts the trace pins of the substrate 11, the probe 41 and the pins of the chip 12 can be electrically connected, and testing can be performed.

[0041] The probe card 4 can be driven to rise and fall by a lifting mechanism. The lifting mechanism drives the probe 41 to descend and contact the pins of the chip 12 or the trace pins of the substrate 11 for testing. The lifting mechanism can be a commonly used lifting device in the prior art, such as an electric telescopic rod or a lifting mechanism composed of a motor and a lead screw.

[0042] The heating module 5 is used to heat multiple probes 41, so that the temperature of the probes 41 is close to the temperature of the clamp 2 and the test object 1, so as to avoid the large temperature difference between the probes 41 and the test object 1 causing heat transfer and increasing the internal temperature difference of the test object 1.

[0043] In summary, this application improves the temperature consistency of the test object 1 and reduces the internal temperature difference of the chip 12 by configuring the electric heating plate 31, clamping plate 2, and heating module 5, thereby improving test accuracy and precision. Furthermore, the reduced internal temperature difference of the test object 1 allows the testing equipment to test more types of chips 12, improving its applicability. The use of a full-board substrate 11 for testing allows for the simultaneous testing of multiple chips 12, improving testing efficiency.

[0044] In some alternative embodiments, the electric heating plate 31 is a ceramic plate or a carbon crystal plate, which has a fast heating speed, high thermal conductivity, and uniform heat transfer.

[0045] In some alternative implementations, the heat conduction plate 32 can be made of metal, specifically aluminum or copper, which has high thermal conductivity and uniform heat conduction.

[0046] In some alternative implementations, such as Figure 4-6As shown, the clamp 2 includes an upper heat-conducting plate 21 and a lower heat-conducting plate 22. The lower heat-conducting plate 22 includes a heat-conducting substrate 221 and an elastic heat-conducting pad 222 disposed on the upper surface of the heat-conducting substrate 221. The upper heat-conducting plate 21 and the lower heat-conducting plate 22 are connected to clamp and wrap the test object 1. When the test object 1 is placed upright in the clamp, the elastic heat-conducting pad 222 is in contact with the substrate 11. When the test object 1 is placed upside down in the clamp 2, the elastic heat-conducting pad 222 is in contact with one or more chips 12. The chips 12 on the substrate 11 are of different types, and there are height differences and gaps between the chips 12. Through the setting of the elastic heat-conducting pad 222, the elastic heat-conducting pad 222 can be in contact with the lower surface of all the chips 12 by utilizing the elastic deformation of the elastic heat-conducting pad 222, and can even fill the gaps between the chips 12, so that the heat is transferred to the chips 12 more evenly, improving the temperature consistency of the test object 1 and reducing the temperature difference inside the chips 12.

[0047] The upper heat-conducting plate 21 and the lower heat-conducting plate 22 can be made of the same thermally conductive material, such as copper or aluminum, which have excellent thermal conductivity. Through-holes 211 through which the probe 41 passes are provided on the upper heat-conducting plate 21. The number and location of the through-holes 211 are the same as the number and location of the pins of the chip 12. The diameter of the through-holes 211 can be slightly larger than the diameter of the probe 41, ensuring that the probe 41 can pass through the through-holes 211. This reduces the contact area between the test object 1 and the air, allowing the upper heat-conducting plate 21 to transfer heat to the test object 1 more evenly, thus improving the temperature uniformity of the test object 1.

[0048] The elastic thermal pad 222 and the thermal substrate 221 can be bonded together with thermally conductive adhesive.

[0049] Optionally, the elastic thermal pad 222 is a silicone pad or a rubber pad, which has excellent thermal conductivity, high temperature resistance and high elasticity, and improves the uniformity of heat transfer.

[0050] Optionally, such as Figure 5As shown, the upper heat-conducting plate 21 and the heat-conducting substrate 221 are engaged and connected, which is simple and can clamp the object to be tested 1. In one embodiment, a second groove 223 is formed on one of the upper heat-conducting plate 21 and the heat-conducting substrate 221, and the other can be engaged into the second groove 223 to form a closed space, which clamps and wraps the object to be tested 1 in the closed space, and makes the elastic heat-conducting pad 222 fit against the lower surface of the object to be tested 1, and the upper surface of the object to be tested 1 fit against the upper heat-conducting plate 21. In another embodiment, the upper heat-conducting plate 21 and the heat-conducting substrate 221 are engaged and connected by mutually cooperating first engaging members and second engaging members. The upper surface of the heat-conducting substrate 221 is provided with a plurality of first engaging members around the elastic heat-conducting pad 222, and the lower surface of the upper heat-conducting plate 21 is provided with a plurality of second engaging members that cooperate with the first engaging members. The connection between the upper heat-conducting plate 21 and the heat-conducting substrate 221 is achieved by the engagement of the first engaging members and the second engaging members. The first engaging component can be one of a protrusion and a slot, and the second engaging component can be the other of a protrusion and a slot. When the object to be tested 1 is placed, the upper heat-conducting plate 21 and the lower heat-conducting plate 22 are separated. After the object to be tested 1 is placed on the elastic heat-conducting pad 222 of the lower heat-conducting plate 22, the upper heat-conducting plate 21 is engaged and connected to the heat-conducting substrate 221 to achieve clamping and wrapping of the object to be tested 1.

[0051] Optionally, such as Figure 6 As shown, the upper heat-conducting plate 21 is hinged to the first side of the heat-conducting substrate 221, and the upper heat-conducting plate 21 and the second side of the heat-conducting substrate 221 are locked by the locking assembly 20. The first side and the second side are arranged opposite to each other. When the test object 1 is placed, the locking assembly 20 is released from locking the upper heat-conducting plate 21 and the heat-conducting substrate 221, and the clamp 2 is in the open state. Figure 6 As shown in the figure, after the test object 1 is placed on the elastic thermal pad 222 of the lower thermal plate 22, the upper thermal plate 21 is rotated toward the thermal substrate 221 until the upper thermal plate 21 contacts the substrate 11. Then, the upper thermal plate 21 and the thermal substrate 221 are locked by the locking assembly 20 to achieve the clamping and wrapping of the test object 1.

[0052] Optionally, the locking assembly 20 includes a first locking member 201 and a second locking member 202. One of the first locking member 201 and the second locking member 202 is disposed on the upper heat-conducting plate 21, and the other is disposed on the heat-conducting substrate 221. The first locking member 201 and the second locking member 202 can be engaged by snapping, hooking, or magnetic attraction. When the first locking member 201 and the second locking member 202 are engaged, the first locking member 201 is a protrusion, and the second locking member 202 is a groove that mates with the protrusion. When the first locking member 201 and the second locking member 202 are hooked, the first locking member 201 is a hook, and the second locking member 202 is a hook, hanging rod, or hanging ring that mates with the first locking member 201. When the first locking member 201 and the second locking member 202 are magnetically attracted, both the first locking member 201 and the second locking member 202 can be magnetic, or one can be an iron structure and the other a magnet. The first locking member 201 and the second locking member 202 may also adopt other locking methods, and this application does not make any special limitations on them.

[0053] In some alternative implementations, such as Figure 7 and 8 As shown, the top of the heat-conducting plate 32 has a first groove 321 for accommodating the clamping plate 2. The size of the first groove 321 matches the size of the clamping plate 2. The first groove 321 is used to position the clamping plate 2, preventing its position from changing after it is placed on the heating tray 3, thus achieving alignment between the clamping plate 2 and the electric heating plate 31, as well as alignment between the pins of the chip 12 and the probe 41. The bottom of the first groove 321 is flat, and the area of ​​the electric heating plate 31 is at least the same as the area of ​​the bottom of the first groove 321, and their projections coincide. The first groove 321 can be located within the projection of the electric heating plate 31 on the heat-conducting plate 32, increasing the heating area and heating efficiency.

[0054] In some alternative implementations, such as Figure 9 As shown, the testing equipment of this application also includes a controller 8, which is electrically connected to the electric heating plate 31, the probe card 4 and the heating module 5 respectively. The controller 8 is used to control the heating temperature of the electric heating plate 31 and the heating module 5. The heating temperature can be set to a simulated preset temperature. A testing instrument can be connected between the controller 8 and the probe card 4. The controller 8 controls the testing instrument to send an excitation signal to the probe 41. The excitation signal is transmitted to the chip 12 through the probe 41. The controller 8 receives the feedback signal from the chip 12 to realize the testing of the chip 12. In some alternative implementations, such as Figure 10As shown, the electric heating plate 31 includes multiple heating areas 311, and the heating temperatures of the multiple heating areas 311 may be different. The controller 8 is used to control the heating temperatures of the multiple heating areas 311. The electric heating plate 31 may include multiple heating plate units, which are assembled into the electric heating plate 31. Each heating plate unit corresponds to one heating area 311, and the multiple heating plate units are electrically connected to the controller 8. The testing machine also includes a first temperature detection module 7, which is used to detect the temperature of each area of ​​the clamping plate 2 corresponding to the multiple heating areas 311. The first temperature detection module 7 is electrically connected to the controller 8, and the controller 8 is used to control the heating temperatures of the multiple heating areas 311 according to the temperature of each area of ​​the clamping plate 2, so that the temperature difference between each area of ​​the clamping plate 2 is within a preset range, thereby improving the temperature consistency of the test object 1 and reducing the temperature difference inside the chip 12.

[0055] In this embodiment, the substrate 11 is rectangular, and a plurality of chips 12 on the substrate 11 are arranged in an array. The chips 12 on the substrate 11 can be arranged one-to-one with a plurality of heating areas 311 of the electric heating plate 31, thereby further improving the temperature uniformity of the test object 1 and reducing the temperature difference inside the chip 12.

[0056] For example, the preset range of temperature difference between different areas of the clamping plate 2 is ±0.5℃. If the temperature difference between different areas of the clamping plate 2 measured by the first temperature detection module 7 exceeds this range, the controller 8 controls the heating area 311 of the corresponding area to adjust the heating temperature, increasing the heating temperature of the heating area 311 corresponding to the area with lower temperature of the clamping plate 2 and decreasing the heating temperature of the heating area 311 corresponding to the area with higher temperature of the clamping plate 2, so as to improve the temperature consistency of each area of ​​the clamping plate 2, thereby improving the temperature consistency of each area of ​​the test object 1 and reducing the temperature difference inside the chip 12.

[0057] The controller 8 can also compare the temperature of each area of ​​the clamping plate 2 measured by the first temperature detection module 7 with the preset temperature simulated by the test machine, and then adjust the heating temperature of the heating area 311 according to the comparison result, so that the temperature of each area of ​​the clamping plate 2 is close to the simulated temperature, such as within ±0.5℃ of the simulated temperature, so as to improve the temperature consistency of each area of ​​the clamping plate 2, thereby improving the temperature consistency of each area of ​​the test object 1 and reducing the temperature difference inside the chip 12.

[0058] In some optional embodiments, the testing equipment also includes a sliding assembly 9, on which the heating tray 3 is connected. The sliding assembly 9 is used to enable the movement of the heating tray 3 within the constant temperature chamber 6, for example, from one side inside the constant temperature chamber 6 to below the probe card 4. The first temperature detection module 7 is positioned above the movement path of the heating tray 3. The first temperature detection module 7 is used to detect the temperature of each area of ​​the clamping plate 2 when the heating tray 3, the clamping plate 2, and the test object 1 move within the constant temperature chamber 6, thereby reducing the shaking and vibration generated when the heating tray 3, the clamping plate 2, and the test object 1 move, while simultaneously achieving temperature detection. The first temperature detection module 7 does not affect the installation and lifting of the probe card 4.

[0059] In one embodiment, the first temperature detection module 7 includes non-contact temperature sensors. The number and distribution of these sensors correspond one-to-one with the heating areas 311 along the direction perpendicular to the movement path of the heating tray 3. The first temperature detection module 7 can be installed on the inner top wall of the constant temperature chamber 6. The first temperature detection module 7 detects the temperature of one row of clamping plates 2 directly below it at a time. As the heating tray 3, clamping plates 2, and the object to be tested 1 move within the constant temperature chamber 6, when an area of ​​clamping plate 2 passes the first temperature detection module 7, the first temperature detection module 7 detects the temperature of the clamping plate 2 area directly below it. When the clamping plate 2 moves to below the probe card 4, the temperature of all areas of the clamping plate 2 has been detected. This embodiment reduces the number of non-contact temperature sensors, thus lowering the cost.

[0060] In another embodiment, the first temperature detection module 7 includes multiple non-contact temperature sensors. The number and arrangement of the multiple non-contact temperature sensors are the same as the number and arrangement of the heating areas 311 of the electric heating plate 31. The temperature of all areas of the clamping plate 2 can be measured at one time. The first temperature detection module 7 can be set on the inner top wall of the constant temperature chamber 6. During the process of the heating tray 3, clamping plate 2 and the test object 1 moving from one side of the constant temperature chamber 6 to below the probe card 4, the first temperature detection module 7 measures the temperature of each area of ​​the clamping plate 2.

[0061] Non-contact temperature sensors detect the surface temperature of an object by measuring the infrared radiation it emits, without direct contact. This measurement method not only avoids thermal conduction errors that can occur with contact, but also ensures that the sensor is not affected by the surface conditions of the object being measured, such as roughness or humidity. Therefore, non-contact temperature sensors can provide more accurate and reliable measurement results.

[0062] In this embodiment, since the heating tray 3 and clamp 2 may vibrate during movement, using a non-contact temperature sensor ensures that temperature measurement can be performed without affecting the normal movement of the heating tray 3, clamp 2, and the object under test 1. This measurement method not only improves the accuracy of the measurement but also ensures the real-time nature and continuity of the measurement.

[0063] Furthermore, non-contact temperature sensors offer advantages such as fast response, wide measurement range, and long service life. These advantages make them an ideal choice for temperature detection in this embodiment, further improving testing efficiency and reliability. In some optional embodiments, the testing equipment further includes a second temperature detection module 10, which is used to detect the temperature of the probe 41. The second temperature detection module 10 is electrically connected to the controller 8. The controller 8 is used to control the heating temperature of the heating module 5 according to the temperature of the probe 41, so that the temperature difference between the probe 41 and the clamp 2 is within a preset range, thereby reducing the temperature difference between the probe 41 and the test object 1, and thus reducing the heat transfer generated when the probe 41 contacts the pins of the chip 12 or the wiring pins of the substrate 11, improving the temperature consistency of the test object 1, and reducing the temperature difference value inside the chip 12.

[0064] The preset range of the temperature difference between probe 41 and clamp 2 can be set according to the actual accuracy requirements of the tested chip 12, such as ±0.5℃. The smaller the temperature difference range, the smaller the temperature difference value of chip 12, and the higher the measurement accuracy.

[0065] In some optional embodiments, the heating module 5 includes a plurality of electric heating wires 51, which are arranged one-to-one with a plurality of probes 41. The electric heating wires 51 can be arranged inside the probe card 4 and near their corresponding probes 41 to heat their corresponding probes 41.

[0066] The second temperature detection module 10 includes the same number of temperature sensors as the probes 41. The temperature sensors can be contact temperature sensors. The temperature sensors are placed near and in contact with the corresponding probes 41. When the temperature difference between a certain probe 41 and the temperature of its corresponding clamping plate 2 area exceeds a preset range, the controller 8 controls the heating temperature of the electric heating wire 51 corresponding to that probe 41 to adjust the temperature difference to the preset range.

[0067] Measurements show that, through the arrangement of the electric heating plate 31, the temperature difference of the heating tray 3 is within ±0.5℃. Through the arrangement of the electric heating plate 31, clamping plate 2, elastic thermal conductive pad 222, and heating module 5, the temperature difference of the entire test object 1 is within ±0.4℃.

[0068] By setting multiple heating areas 311, adjusting the heating temperature of each heating area 311 of the electric heating plate 31 according to the detection results of the first temperature detection module 7, and adjusting the heating temperature of each probe 41 according to the detection results of the second temperature detection module 10, temperature compensation is achieved, so that the temperature difference inside the chip 12 is within ±0.1℃.

[0069] Figure 11 This is a "temperature-signal response" verification diagram of the test instrument used in this application to test the test object 1. The chip 12 in the test object 1 includes a color temperature chip and other single chips and multi-in-one chips. The dark gray dots are the actual measured data of the test instrument. Each dark gray dot represents the measured signal value of the G channel at a specific temperature. The interval between the upper and lower boundaries is the standard interval, which defines the qualified signal range. Figure 11 In the image, all the dark gray dots fall within the range between the upper and lower boundaries, indicating that the signal of the G channel is stable in the range of 49~51℃ and meets the design requirements, and that the temperature difference inside the color temperature chip is within ±0.1℃.

[0070] The testing equipment of this application can perform high-temperature testing on the chip 12 on the packaged substrate 11, ensuring accurate and consistent high-temperature information while greatly improving the automation and efficiency of the test.

[0071] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0072] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0073] In the description of this specification, the references to terms such as "this embodiment," "an embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any at least one embodiment or example. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0074] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0075] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and simple improvements made to the substantive content of this application should be included within the protection scope of this application.

Claims

1. A testing machine, characterized in that, This is used to test an object (1) at a preset temperature. The object (1) includes a substrate (11) and one or more chips (12) disposed on the substrate (11). The one or more chips (12) include at least one of single-chip and multi-chip. The testing machine includes a clamp (2), a heating tray (3), a probe card (4), a heating module (5), and a constant temperature chamber (6). The clamp (2), the heating tray (3), the probe card (4), and the heating module (5) are disposed inside the constant temperature chamber (6). The clamp (2) is disposed on the heating tray (3) and is used to clamp and wrap the object to be tested (1). The heating tray (3) includes an electric heating plate (31) and a heat-conducting plate (32) disposed above the electric heating plate (31). The heat-conducting plate (32) is in contact with the bottom surface of the clamping plate (2). The probe card (4) is disposed above the clamp (2). The probe card (4) is provided with a plurality of probes (41). The plurality of probes (41) correspond one-to-one with the pins of the one or more chips (12). The top of the clamp (2) is provided with a through hole (211) for the probes (41) to pass through. The heating module (5) is used to heat the plurality of probes (41).

2. The testing machine according to claim 1, characterized in that, The clamp (2) includes an upper heat-conducting plate (21) and a lower heat-conducting plate (22). The lower heat-conducting plate (22) includes a heat-conducting substrate (221) and an elastic heat-conducting pad (222) disposed on the upper surface of the heat-conducting substrate (221). The upper heat-conducting plate (21) and the lower heat-conducting plate (22) are connected to clamp and wrap the object to be tested (1).

3. The testing machine according to claim 2, characterized in that, The elastic thermal pad (222) is a silicone pad or a rubber pad.

4. The testing machine according to claim 1, characterized in that, The electric heating plate (31) includes multiple heating zones (311). The testing machine also includes a first temperature detection module (7) and a controller (8). The first temperature detection module (7) is used to detect the temperature of each area of ​​the clamp (2) corresponding to the plurality of heating areas (311). The first temperature detection module (7) is electrically connected to the controller (8). The controller (8) is used to control the heating temperature of the plurality of heating areas (311) according to the temperature of each area of ​​the clamp (2) so that the temperature difference of each area of ​​the clamp (2) is within a preset range.

5. The testing machine according to claim 4, characterized in that, The testing machine also includes a sliding assembly (9), the heating tray (3) is connected to the sliding assembly (9), the sliding assembly (9) is used to realize the movement of the heating tray (3) in the constant temperature chamber (6), the first temperature detection module (7) is set above the movement path of the heating tray (3), and the first temperature detection module (7) is used to detect the temperature of each area of ​​the clamping plate (2) when the heating tray (3), the clamping plate (2) and the test object (1) move in the constant temperature chamber (6).

6. The testing machine according to claim 5, characterized in that, The first temperature detection module (7) includes a non-contact temperature sensor, and the number and distribution of the non-contact temperature sensor correspond one-to-one with the heating area (311) in the direction perpendicular to the movement path of the heating tray (3).

7. The testing machine according to claim 1, characterized in that, The testing machine also includes a second temperature detection module (10) and a controller (8). The second temperature detection module (10) is used to detect the temperature of the probe (41). The second temperature detection module (10) is electrically connected to the controller (8). The controller (8) is used to control the heating temperature of the heating module (5) according to the temperature of the probe (41), so that the temperature difference between the probe (41) and the clamp (2) is within a preset range.

8. The testing machine according to claim 1, characterized in that, The electric heating plate (31) is a ceramic plate or a carbon crystal plate.

9. The testing machine according to claim 1, characterized in that, The heating module (5) includes multiple electric heating wires (51), and the multiple electric heating wires (51) are arranged in a one-to-one correspondence with the multiple probes (41).

10. The testing machine according to claim 2, characterized in that, The upper heat-conducting plate (21) is engaged with the heat-conducting substrate (221).

11. The testing machine according to claim 2, characterized in that, The upper heat-conducting plate (21) is hinged to the first side of the heat-conducting substrate (221), and the upper heat-conducting plate (21) is locked to the second side of the heat-conducting substrate (221) by a locking assembly (20). The first side and the second side are arranged opposite to each other.

12. The testing machine according to claim 1, characterized in that, The top of the heat-conducting plate (32) is provided with a first groove (321) for accommodating the clamp (2).

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