Circuit board, battery and electric appliance

Abstract

The utility model relates to circuit field discloses circuit board, battery and electric appliance. Circuit board includes: board body, connector, connector sets up at the surface of board body, circuit module, circuit module includes support layer and electronic component, support layer and electronic component link to each other, support layer connects in the surface of board body away from connector, and in the thickness direction of board body, at least part of support layer is opposite to the setting of connector. Through arranging circuit module at the side of board body away from connector, can release the thickness of the coincident part of circuit board and battery, avoids the encroachment of circuit module to battery main body space to provide condition for battery capacity promotion. The support layer of circuit board sets up at the back of connector, forms the interlayer structure with connector and board body, that is, the rigidity of connector can be improved through the cooperation of three, reduces the warping deformation when connector is plugged in and unplugged, and does not need to set up additional metal sheet, thereby can reduce the cost and weight of circuit board.

Description

Technical Field

[0001] This utility model relates to the field of circuit technology, specifically to circuit boards, batteries, and electrical appliances. Background Technology

[0002] The market is placing increasingly higher demands on the battery life of electronic devices, making it a key technological requirement for the electronic device industry to increase battery capacity to ensure long battery life.

[0003] Currently, the battery protection board, as a crucial component ensuring the safe operation of batteries, has a significant impact on battery performance due to its design. The protection board houses circuit modules, such as anti-counterfeiting IC circuits or protection IC circuits, which occupy a certain amount of thickness space. Given the limited internal space of electronic devices, these circuit modules directly reduce the usable space for the battery, thus sacrificing battery capacity and limiting the improvement of the electronic device's battery life. Utility Model Content

[0004] In view of this, the present invention provides a circuit board, a battery, and an electrical appliance to solve or improve the problem of circuit modules encroaching on battery space.

[0005] In a first aspect, this utility model provides a circuit board, comprising:

[0006] plate body;

[0007] A connector, wherein the connector is disposed on the surface of the plate;

[0008] A circuit module comprising a support layer and electronic components connected to each other, the support layer being connected to the surface of the board body facing away from the connector, and at least a portion of the support layer being disposed opposite to the connector in the thickness direction of the board body.

[0009] In one alternative embodiment, the support layer includes a substrate connected to the plate body, and the electronic components are disposed on the surface of the substrate opposite to the plate body.

[0010] In one alternative embodiment, the support layer further includes a first encapsulation layer disposed on the surface of the substrate opposite to the plate body and covering the electronic components.

[0011] In one alternative embodiment, the support layer includes a second encapsulation layer, the electronic component is connected to the board body, and the second encapsulation layer is disposed on the surface of the board body opposite to the connector and covers the electronic component.

[0012] In one optional implementation, the circuit module is an anti-counterfeiting IC circuit module.

[0013] In one alternative embodiment, the circuit board further includes:

[0014] Connecting pieces, wherein there are at least two connecting pieces, and the at least two connecting pieces are arranged sequentially at intervals on the plate body;

[0015] A temperature sensing element is connected to the surface of the board where the connector is located, and the temperature sensing element is arranged between two adjacent connecting pieces.

[0016] In one alternative embodiment, the connecting piece is connected to the surface of the plate where the connector is located.

[0017] In one alternative embodiment, the plate includes a main body and a bent portion;

[0018] The main body and the bent portion are coplanar and connected, and the main body and the bent portion are set at an angle. The circuit module and the connector are both located at the end of the bent portion away from the main body.

[0019] Secondly, this utility model also provides a battery, including the circuit board described above.

[0020] Thirdly, this utility model also provides an electrical appliance, including the circuit board as described above or the battery as described above.

[0021] The circuit board provided in this invention, by arranging the circuit module on the side of the board away from the connector, can free up the thickness of the overlapping part of the circuit board and the battery, avoiding the encroachment of the circuit module on the battery body space, thereby providing conditions for increasing battery capacity. The support layer of the circuit board is set on the back of the connector, forming a sandwich structure together with the connector and the board body, namely the connector on the surface, the board body in the middle, and the support layer on the back. The cooperation of the three can improve the rigidity of the connector, reduce the warping deformation during connector insertion and removal, and eliminate the need for an additional metal plate, thereby reducing the cost and weight of the circuit board.

[0022] The battery and electrical appliance provided in this utility model include all the advantages of the circuit board mentioned above, since they incorporate the circuit board provided in this utility model. Attached Figure Description

[0023] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0024] Figure 1 A schematic diagram of the structure of a protective plate provided in an embodiment of this utility model;

[0025] Figure 2 An isometric view of a protective plate provided for an embodiment of this utility model;

[0026] Figure 3 A schematic diagram of the structure of a circuit module provided in an embodiment of this utility model;

[0027] Figure 4 for Figure 3 The diagram shows the structure of the circuit module after removing the first encapsulation layer.

[0028] Figure 5 This is a schematic diagram of another circuit module provided in an embodiment of the present utility model;

[0029] Figure 6 for Figure 5 The diagram shows the structure of the circuit module after the second encapsulation layer has been removed.

[0030] Explanation of reference numerals in the attached figures:

[0031] 1. Board body; 101. Main body; 102. Bending part; 2. Connector; 3. Circuit module; 301. Support layer; 3011. Substrate; 3012. First encapsulation layer; 3013. Second encapsulation layer; 302. Electronic component; 4. Connecting piece; 5. Temperature detection element. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0033] As a crucial component ensuring safe battery operation, the design of the battery protection board significantly impacts battery performance. The protection board houses circuit modules, such as anti-counterfeiting IC circuits or protection IC circuits, which occupy a certain amount of thickness. Given the limited internal space of electronic devices, these circuit modules directly reduce the usable space for the battery, thus sacrificing battery capacity and limiting the improvement of the electronic device's battery life.

[0034] To address or improve the problem of circuit modules consuming battery power, this utility model provides a circuit board, a battery, and an electrical appliance.

[0035] The following is combined with Figures 1-6 The circuit board provided in the embodiments of this utility model is described.

[0036] Specifically, the circuit board can be a battery protection board. For example, the circuit board includes a board body 1, a connector 2, and a circuit module 3.

[0037] The plate 1 can be a flexible circuit board; however, in other embodiments, the plate 1 can also be a rigid plate.

[0038] Connector 2 is disposed on the surface of board 1. Optionally, connector 2 is disposed on the edge of board 1, or in other words, connector 2 is disposed on the portion of board 1 that extends beyond the edge of the battery. Optionally, connector 2 can be soldered, glued, or riveted to board 1. It is understood that in scenarios where the circuit board is used in electronic devices such as mobile phones and tablets, connector 2 is used to connect to the motherboard of the electronic device to transmit power and data between the circuit board and the motherboard.

[0039] The circuit module 3 includes a support layer 301 and electronic components 302. The support layer 301 and electronic components 302 are connected to each other. The support layer 301 is connected to the surface of the board 1 opposite to the connector 2, that is, the support layer 301 and the connector 2 are distributed on two opposite surfaces of the board 1. Furthermore, in the thickness direction of the board 1, at least a portion of the support layer 301 is disposed opposite to the connector 2, that is, the projections of the support layer 301 and the connector 2 on the surface of the board 1 at least partially overlap.

[0040] In related technologies, the circuit module 3 of the protection board is located in the area where the protection board overlaps with the battery, which can easily directly compress the battery space. In order to avoid the connector 2 occupying the main battery space (affecting the cell capacity), the protection board is usually designed to "extend beyond the battery boundary", and the connector 2 is located on the part of the protection board that extends beyond the battery boundary.

[0041] In this embodiment, since the connector 2 is located on the part of the circuit board that extends beyond the edge of the battery, by arranging the circuit module 3 on the side of the board 1 away from the connector 2, the thickness of the part of the circuit board that overlaps with the battery can be released, and the encroachment of the circuit module 3 on the battery body space can be avoided, thereby providing conditions for increasing battery capacity.

[0042] In addition, since connector 2 needs to undertake the insertion and insertion task, connector 2 needs to have a certain rigidity requirement. In order to improve the rigidity of connector 2, a metal plate is usually provided on the back of connector 2.

[0043] In this embodiment, the support layer 301 of the circuit board is disposed on the back of the connector 2, forming a sandwich structure together with the connector 2 and the board body 1, namely the connector 2 on the surface, the board body 1 in the middle and the support layer 301 on the back. The three together can improve the rigidity of the connector 2, reduce the warping deformation of the connector 2 when it is plugged in and out, and eliminate the need for an additional metal plate, thereby reducing the cost and weight of the circuit board.

[0044] refer to Figure 3 and Figure 4 As shown, in some embodiments of this utility model, the support layer 301 includes a substrate 3011, which optionally is a rigid plate. The substrate 3011 is connected to the plate body 1, and the electronic component 302 is disposed on the surface of the substrate 3011 facing away from the plate body 1. Optionally, the electronic component 302 can be welded, bonded, or riveted to the substrate 3011. The substrate 3011 can be welded, bonded, or riveted to the plate body 1.

[0045] In this embodiment, the electronic component 302 can be mounted on the substrate 3011 first, and then the substrate 3011 can be connected to the board body 1. This integration of the electronic component 302 onto the substrate 3011 before connecting it to the board body 1 reduces assembly difficulty. Furthermore, since the substrate 3011 is an independent module, component mounting and functional testing can be completed in advance before docking with the board body 1, reducing the overall circuit board debugging complexity and improving yield.

[0046] Furthermore, as an independent carrier, the substrate 3011 allows for flexible design of the arrangement of electronic components 302, making it easier to achieve miniaturization and lightweight design, and adapting to the ultra-thin requirements of electronic devices. If an electronic component 302 is damaged, the substrate 3011 module can be directly replaced without disassembling the entire protection board, reducing maintenance complexity and cost.

[0047] refer to Figure 3 and Figure 4 As shown, in some embodiments provided by this utility model, the support layer 301 further includes a first encapsulation layer 3012. The first encapsulation layer 3012 is disposed on the surface of the substrate 3011 facing away from the plate body 1 and covers the electronic component 302. The first encapsulation layer 3012 can be an epoxy resin layer, a polyurethane layer, or a silicone layer. Optionally, the first encapsulation layer 3012 can be formed by 3D printing or molding.

[0048] In this embodiment, after the first encapsulation layer 3012 covers the electronic component 302, it forms a protective layer to prevent the solder joints from falling off or the component from being damaged due to external impacts or vibrations during transportation, installation, or use. Furthermore, the first encapsulation layer 3012 can isolate external moisture, dust, and corrosive gases, preventing oxidation, short circuits, or performance degradation of the electronic component 302's pins. In other words, the encapsulation layer can significantly improve the environmental adaptability of the protection board.

[0049] After the first encapsulation layer 3012 covers the electronic component 302, it forms a more compact and rigid whole with the substrate 3011, further strengthening the support strength on the back of the connector 2, thereby reducing the displacement of the electronic component 302 caused by force and reducing the risk of warping and deformation of the connector 2.

[0050] Optionally, the thickness of the board 1 is 0.2 to 0.3 mm, for example, the thickness of the board 1 is 0.2 mm, 0.25 mm, or 0.3 mm. The sum of the thicknesses of the first encapsulation layer 3012 and the substrate 3011 is 0.3 mm to 0.5 mm, for example, the sum of the thicknesses of the first encapsulation layer 3012 and the substrate 3011 is 0.3 mm, 0.4 mm, or 0.5 mm.

[0051] Of course, electronic component 302 is not limited to being arranged on substrate 3011; for example, see reference. Figure 5 and Figure 6 As shown, in other embodiments provided by this utility model, the support layer 301 includes a second encapsulation layer 3013, the electronic component 302 is connected to the board body 1, and the second encapsulation layer 3013 is disposed on the surface of the board body 1 away from the connector 2 and covers the electronic component 302.

[0052] For example, the second encapsulation layer 3013 can be an epoxy resin layer, a polyurethane layer, or a silicone layer. Optionally, the second encapsulation layer 3013 can be formed by 3D printing or molding. The electronic component 302 can be soldered, bonded, or riveted to the board 1.

[0053] In this embodiment, the electronic component 302 is directly disposed on the surface of the board 1, which can reduce the overall thickness and weight of the protection board. Furthermore, the direct connection between the two eliminates the need for additional connectors, reducing the material cost of the circuit board. Additionally, the direct connection of the electronic component 302 to the board 1 shortens the current transmission path and reduces heat generation.

[0054] Optionally, the encapsulation material of the first encapsulation layer 3012 or the second encapsulation layer 3013 may be a thermally conductive material, such as thermally conductive silicone, alumina-filled resin, or ceramic-filled resin. In this way, the heat generated by the electronic component 302 during operation can be dissipated to the outside through the encapsulation layer, preventing the electronic component 302 from overheating.

[0055] In some embodiments provided by this utility model, circuit module 3 is an anti-counterfeiting IC circuit module.

[0056] In related technologies, the anti-counterfeiting IC circuit is set in the overlapping part of the circuit board and the battery. The thickness of the anti-counterfeiting IC circuit itself is directly added to the thickness of the protection board, which compresses the usable space of the battery cell.

[0057] In this embodiment, the anti-counterfeiting IC circuit module is arranged on the back of the connector 2. This area was originally used to install the connector 2 and does not involve the battery body space, thereby freeing up the thickness space of the overlapping part of the circuit board and the battery, thereby increasing the battery capacity.

[0058] In addition, the anti-counterfeiting IC circuit module is located away from the battery, specifically away from the battery's heat-generating areas, thus preventing the loss of encrypted data or communication failures caused by high temperatures. Furthermore, if the anti-counterfeiting IC circuit malfunctions or fails, only the module on the back of connector 2 needs to be removed; the battery itself does not need to be disassembled, reducing the difficulty of repair.

[0059] In some embodiments not shown, circuit module 3 may also be an overall circuit or a part of a circuit that protects the IC circuit.

[0060] refer to Figure 1 and Figure 2 As shown, in some embodiments provided by this utility model, the circuit board further includes a connecting piece 4 and a temperature sensing element 5.

[0061] The number of connecting pieces 4 is at least two, and the at least two connecting pieces 4 are arranged sequentially at intervals on the plate 1. At least some of the connecting pieces 4 are used for electrical connection with the battery. Optionally, the connecting pieces 4 are metal sheets, such as, but not limited to, nickel sheets, aluminum sheets, or copper sheets.

[0062] The temperature sensing element 5 is connected to the surface of the board 1 where the connector 2 is located, and the temperature sensing element 5 is arranged between two adjacent connecting pieces 4. Optionally, the temperature sensing element 5 is a thermistor, such as, but not limited to, a negative temperature coefficient thermistor.

[0063] In this embodiment, the temperature sensing element 5 is arranged between two adjacent connecting pieces 4, making full use of the space between the two connecting pieces 4 without occupying additional protection board space. At the same time, the temperature sensing element 5 can detect both the temperature of the battery and the temperature of the connecting piece 4. For example, when the current of the connecting piece 4 increases abnormally (such as a short circuit), the temperature sensing element 5 simultaneously monitors the temperature rise, and the protection board control chip can trigger overcurrent protection and overtemperature protection at the same time.

[0064] refer to Figure 1 and Figure 2 As shown, in some embodiments provided by this utility model, the connecting piece 4 is connected to the surface of the plate 1 where the connector 2 is provided.

[0065] In this embodiment, the connecting piece 4 and the connector 2 on the board 1 are located on the same surface and can be directly connected through the copper foil circuitry on the surface of the board 1, without the need for cross-layer vias or flexible cabling bends, thus shortening the current path and reducing impedance. The fact that the connecting piece 4 and the connector 2 are located on the same surface facilitates unified mounting and testing of the connecting piece 4 and the connector 2, improving production efficiency.

[0066] In some embodiments provided by this utility model, the plate 1 includes a main body 101 and a bending part 102.

[0067] The main body 101 and the bent portion 102 are coplanar and connected, and the main body 101 and the bent portion 102 are set at an angle. The circuit module 3 and the connector 2 are both located at the end of the bent portion 102 away from the main body 101. It can be understood that the angle of the bent portion 102 can be adjusted according to irregular spaces such as the mobile phone frame and motherboard position.

[0068] In this embodiment, the main body 101 corresponds to the battery body area and is kept flat to fit the battery surface; the bent part 102 is connected to the main body 101 at 90° or other angles to transfer the circuit module 3 and connector 2 from the top of the battery to the side or edge, so as to avoid encroaching on the battery thickness.

[0069] Of course, the features in the various embodiments of this application can be combined with each other to obtain new solutions. For example, in some embodiments provided by this utility model, the circuit board includes a board body 1, a connector 2, a circuit module 3, a connecting piece 4, and a temperature detection element 5.

[0070] The plate 1 can be a flexible circuit board; however, in other embodiments, the plate 1 can also be a rigid plate. The plate 1 includes a main body 101 and a bending portion 102. The main body 101 and the bending portion 102 are coplanar and connected, and the main body 101 and the bending portion 102 are set at an angle.

[0071] Connector 2 is disposed on the surface of board 1, and is located at the end of the bent portion 102 opposite to the main body 101. Optionally, connector 2 is disposed at the edge of board 1, or in other words, connector 2 is disposed at the portion of board 1 extending beyond the edge of the battery. Optionally, connector 2 can be soldered, bonded, or riveted to board 1. It is understood that in scenarios where the circuit board is used in electronic devices such as mobile phones and tablets, connector 2 is used to connect to the motherboard of the electronic device to transmit power and data between the circuit board and the motherboard.

[0072] Circuit module 3 is an anti-counterfeiting IC circuit module, which includes a support layer 301 and electronic components 302. The support layer 301 and electronic components 302 are connected to each other. The support layer 301 is connected to the surface of the board 1 opposite to the connector 2, that is, the support layer 301 and the connector 2 are distributed on two opposite surfaces of the board 1. Furthermore, in the thickness direction of the board 1, at least a portion of the support layer 301 is disposed opposite to the connector 2, that is, the projections of the support layer 301 and the connector 2 on the surface of the board 1 at least partially overlap.

[0073] For example, the support layer 301 includes a substrate 3011 and a first encapsulation layer 3012. Optionally, the substrate 3011 is a rigid plate. The substrate 3011 is connected to the plate body 1, and the electronic component 302 is disposed on the surface of the substrate 3011 facing away from the plate body 1. Optionally, the electronic component 302 can be soldered, bonded, or riveted to the substrate 3011. The substrate 3011 can be soldered, bonded, or riveted to the plate body 1. The first encapsulation layer 3012 is disposed on the surface of the substrate 3011 facing away from the plate body 1 and covers the electronic component 302. The first encapsulation layer 3012 can be an epoxy resin layer, a polyurethane layer, or a silicone layer.

[0074] Alternatively, the support layer 301 may include a second encapsulation layer 3013. The electronic component 302 is connected to the board 1, and the second encapsulation layer 3013 is disposed on the surface of the board 1 opposite to the connector 2, covering the electronic component 302. The second encapsulation layer 3013 may be an epoxy resin layer, a polyurethane layer, or a silicone layer. The electronic component 302 may be soldered, bonded, or riveted to the board 1.

[0075] The encapsulation material of the first encapsulation layer 3012 or the second encapsulation layer 3013 is a thermally conductive material, such as thermally conductive silicone, alumina-filled resin, or ceramic-filled resin. In this way, the heat generated by the electronic component 302 during operation can be dissipated to the outside through the encapsulation layer, preventing the electronic component 302 from overheating.

[0076] The number of connecting pieces 4 is at least two, and the at least two connecting pieces 4 are arranged sequentially at intervals on the plate 1. The connecting pieces 4 are connected to the surface of the plate 1 where the connector 2 is provided. At least some of the connecting pieces 4 are used for electrical connection with the battery. Optionally, the connecting pieces 4 are metal sheets, such as including but not limited to nickel sheets, aluminum sheets, or copper sheets.

[0077] The temperature sensing element 5 is connected to the surface of the board 1 where the connector 2 is located, and the temperature sensing element 5 is arranged between two adjacent connecting pieces 4. Optionally, the temperature sensing element 5 is a thermistor, such as, but not limited to, a negative temperature coefficient thermistor.

[0078] It is understood that this embodiment includes the features of the above embodiments, and thus has the corresponding advantages, so it will not be described in detail here.

[0079] This utility model also provides a battery.

[0080] Specifically, the battery includes a circuit board as described above. A portion of the circuit board extends beyond the edge of the battery, and both connector 2 and circuit module 3 are located on the portion of the circuit board that extends beyond the battery edge.

[0081] The battery provided by this utility model incorporates the circuit board provided by this utility model, and therefore includes all the advantages of the circuit board mentioned above.

[0082] This utility model embodiment also provides an electrical appliance, including but not limited to mobile phones and tablets.

[0083] Electrical appliances include circuit boards or batteries as described above.

[0084] The electrical appliance provided by this utility model includes the circuit board provided by this utility model, and therefore also includes all the advantages of the circuit board mentioned above.

[0085] Although embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A circuit board, characterized in that, include: plate(1); Connector (2), the connector (2) being disposed on the surface of the plate (1); The circuit module (3) includes a support layer (301) and an electronic component (302), the support layer (301) and the electronic component (302) being connected to each other, the support layer (301) being connected to the surface of the board (1) facing away from the connector (2), and at least a portion of the support layer (301) being disposed opposite to the connector (2) in the thickness direction of the board (1).

2. The circuit board of claim 1, wherein The support layer (301) includes a substrate (3011), which is connected to the plate (1), and the electronic component (302) is disposed on the surface of the substrate (3011) away from the plate (1).

3. The circuit board of claim 2, wherein, The support layer (301) further includes a first encapsulation layer (3012), which is disposed on the surface of the substrate (3011) away from the plate body (1) and covers the electronic component (302).

4. The circuit board of claim 1, wherein The support layer (301) includes a second encapsulation layer (3013), the electronic component (302) is connected to the board (1), and the second encapsulation layer (3013) is disposed on the surface of the board (1) away from the connector (2) and covers the electronic component (302).

5. The circuit board according to any one of claims 1 to 4, characterized in that, The circuit module (3) is an anti-counterfeiting IC circuit module (3).

6. The circuit board according to any one of claims 1 to 4, characterized in that, The circuit board also includes: Connecting piece (4), the number of connecting pieces (4) is at least two, and at least two connecting pieces (4) are arranged sequentially at intervals on the plate (1); A temperature sensing element (5) is connected to the surface of the plate (1) where the connector (2) is located, and the temperature sensing element (5) is arranged between two adjacent connecting pieces (4).

7. The circuit board of claim 6, wherein The connecting piece (4) is connected to the surface of the plate (1) where the connector (2) is located.

8. The circuit board according to any one of claims 1-4, characterized in that, The plate (1) includes a main body (101) and a bending part (102); The main body (101) and the bent portion (102) are coplanar and connected, and the main body (101) and the bent portion (102) are set at an angle. The circuit module (3) and the connector (2) are both located at the end of the bent portion (102) away from the main body (101).

9. A battery, characterized by Includes the circuit board as described in any one of claims 1-8.

10. An electric appliance characterized by comprising: Includes the circuit board as described in any one of claims 1-8 or the battery as described in claim 9.

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