A sputter target

Abstract

The utility model belongs to magnetron sputtering technical field discloses a kind of sputtering target material.Including target material main part, the upper surface of target material main part is formed with working plane, electrode is set in the just above working plane, along perpendicular with upper surface projection, the area of electrode just below is electrode area, working plane is sputtering area except electrode area, electrode area is higher than sputtering area;Solve the problem of lower utilization rate of copper target material under prior art.

Description

Technical Field

[0001] This utility model relates to the field of magnetron sputtering technology, and in particular to a sputtering target. Background Technology

[0002] Copper planar sputtering targets are high-purity, flat copper materials. In a vacuum environment, through the physical process of sputtering, copper atoms on the surface are excited by high-speed ion bombardment and deposited onto the opposite substrate (such as silicon wafers or glass panels) like a spray, thus forming a uniform, dense, and high-performance copper thin film.

[0003] The lifespan of existing copper sputtering targets is typically around 9000 kWh, with a utilization rate of 70%. The sides of the copper plate are closer to the electrodes, resulting in faster and shorter wear on the sides of the copper sputtering target, while the targets further away from the electrodes are worn out more slowly and over a longer period. If the copper targets near the electrodes at both ends are exhausted, the sputtering process needs to be terminated. At this point, the copper targets far from the electrodes will be wasted, reducing the utilization rate of the copper sputtering target and increasing production costs. Utility Model Content

[0004] The purpose of this invention is to provide a sputtering target that solves the problem of low utilization rate of copper targets under the existing technology.

[0005] To achieve this objective, the present invention adopts the following technical solution: The present invention provides a sputtering target, including a target body, a working plane formed on the upper surface of the target body, an electrode disposed directly above the working plane and projected perpendicularly to the upper surface, the area directly below the electrode being an electrode area, and the working plane excluding the electrode area being a sputtering area, the electrode area being higher than the sputtering area.

[0006] Preferably, the working plane is rectangular, the electrodes are disposed at both ends along the length of the working plane, and electrode areas are respectively disposed on both sides of the sputtering area.

[0007] Preferably, the electrode region and the sputtering region are connected by an inclined plane.

[0008] Preferably, the beveled surface has an arc-shaped chamfer at the junction with the electrode area.

[0009] Preferably, the inclined surface and the sputtering area are connected by an arc-shaped surface.

[0010] Preferably, the electrode region is trapezoidal, and the edges of the electrode region are provided with arc-shaped chamfers.

[0011] Preferably, the electrode region is 1.5 mm higher than the sputtering region.

[0012] Preferably, the inclined surface is arc-shaped or planar.

[0013] Preferably, the sputtering target is made of copper.

[0014] Preferably, the inclined surface has arc-shaped chamfers on both sides in the width direction.

[0015] Beneficial effects: By increasing the thickness of the target material in the electrode area, the consumption time of the target material in the electrode area can be extended during the sputtering target consumption process, making the consumption time of the target material in the electrode area close to that of the sputtering area, thereby improving the utilization rate of the sputtering target and reducing the processing cost of the sputtering target. Attached Figure Description

[0016] Figure 1 This is a top view of the sputtering target of this utility model.

[0017] In the figure: 1. Target body; 11. Electrode area; 12. Sputtering area; 13. Inclined surface. Detailed Implementation

[0018] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0019] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0020] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0021] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0022] In the current technology, the two ends of the target material are close to the electrode, which leads to faster consumption. Since the consumption surface of the existing target material is a flat plane, the two ends of the target material close to the electrode will be consumed faster. If the target material is consumed to a certain thickness, it needs to be stopped, resulting in waste in the middle section of the target material and shortening the life of the target material.

[0023] To solve the above problems, such as Figure 1 As shown, this utility model provides a sputtering target, including a target body 1. A working plane is formed on the upper surface of the target body 1. An electrode is disposed directly above the working plane and projected perpendicularly to the upper surface. The area directly below the electrode is the electrode area 11. The working plane, excluding the electrode area 11, is the sputtering area 12. The electrode area 11 is higher than the sputtering area 12.

[0024] Electrode regions 11 are provided at both ends of the target body 1. The electrode regions 11 are higher than the sputtering regions 12. During the magnetron sputtering process, the electrode regions 11 are consumed faster, while the target material in the sputtering regions 12 is consumed slower. However, since the target material in the electrode regions 11 is thicker, the electrode regions 11 and sputtering regions 12 can be consumed together to the critical thickness of the target material, thereby extending the service life of the target material and making the material utilization rate on the target material higher.

[0025] The working plane of this invention is rectangular, with electrodes positioned at both ends along the length of the working plane. Electrode regions 11 are respectively provided on both sides of the sputtering area 12. Since the electrodes are positioned on both sides, the thickness of the target material on both sides needs to be increased, so that the target material can be consumed evenly at both ends and in the middle, and will not be consumed rapidly due to its proximity to the electrodes, thus extending the service life of the target material.

[0026] The electrode region 11 and the sputtering region 12 are connected by a ramp 13. The farther the target material is from the electrode, the slower the target material is consumed. In order to adapt to the consumption rate of different positions on the target material, a ramp 13 is provided in the region between the electrode region 11 and the sputtering region 12. The lower part of the ramp 13 is farther from the electrode, and the target material is consumed more slowly. The higher part of the ramp 13 is closer to the electrode, and the target material is consumed more quickly, so that all positions on the target material can be consumed to the critical thickness at the same time.

[0027] The beveled surface 13 and the electrode region 11 are connected by an arc-shaped chamfer, which can prevent tip discharge. At the same time, the beveled surface 13 and the sputtering region 12 are connected by an arc-shaped transition, which can also prevent tip discharge.

[0028] The electrode region 11 is trapezoidal, and the edge of the electrode region 11 is provided with an arc chamfer. This can avoid the problem of tip discharge in the electrode region 11. The electrode region 11 is 1.5 mm higher than the sputtering region 12, so that the final electrode region 11 and sputtering region 12 can reach the same critical thickness at the same time, further improving the utilization rate of the target material and avoiding waste.

[0029] The surface of the inclined surface 13 can be either arc-shaped or flat. The orientation of the inclined surface 13 can be designed according to its distance from the electrode. If the rate of target material consumption decreases more significantly with increasing distance from the electrode, the inclined surface 13 can be concave to reduce the amount of target material used and lower costs. If the rate of target material consumption decreases less significantly with increasing distance from the electrode, the inclined surface 13 can be convex to ensure uniform target material consumption. If the rate of target material consumption remains consistent with increasing distance from the electrode, the inclined surface 13 can be flat. The sputtering target is typically made of copper, but other materials are also acceptable, not limited to copper.

[0030] The inclined plane 13 has rounded chamfers on both sides in the width direction to avoid the problem of intermittent discharge.

[0031] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A sputtering target, characterized in that, The device includes a target body (1), the upper surface of which has a working plane, an electrode is disposed directly above the working plane and projected perpendicularly to the upper surface, the area directly below the electrode is the electrode area (11), and the working plane, excluding the electrode area (11), is the sputtering area (12), the electrode area (11) is higher than the sputtering area (12).

2. The sputtering target according to claim 1, characterized in that, The working plane is rectangular, the electrodes are disposed at both ends of the working plane along its length, and electrode areas (11) are respectively disposed on both sides of the sputtering area (12).

3. The sputtering target according to claim 2, characterized in that, The electrode region (11) and the sputtering region (12) are connected by a ramp (13).

4. The sputtering target according to claim 3, characterized in that, The inclined surface (13) has an arc-shaped chamfer at the junction with the electrode area (11).

5. The sputtering target according to claim 3, characterized in that, The inclined surface (13) and the sputtering area (12) are connected by an arc-shaped surface.

6. The sputtering target according to claim 1, characterized in that, The electrode area (11) is trapezoidal, and the edge of the electrode area (11) is provided with an arc-shaped chamfer.

7. The sputtering target according to claim 1, characterized in that, The electrode region (11) is 1.5 mm higher than the sputtering region (12).

8. The sputtering target according to claim 3, characterized in that, The inclined surface (13) is either arc-shaped or flat.

9. The sputtering target according to claim 1, characterized in that, The sputtering target is made of copper.

10. The sputtering target according to claim 3, characterized in that, The inclined surface (13) has arc-shaped chamfers on both sides in the width direction.

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