Probe test socket and test device

CN224803119UActive Publication Date: 2026-09-25FOUNDER MICROELECTRONICS INT
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Patent Information

Application Number
CN202521927296.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-05
Publication Date
2026-09-25
Estimated Expiration
2035-09-05

AI Technical Summary

Technical Problem

[0004]本申请实施例的目的在于提供一种探针测试座及测试装置,旨在解决相关技术中在探针测试座受损时只能通过打磨或整体更换来修复,维护复杂,更换成本较高的技术问题

Benefits of technology

[0022]本申请承载台与基座之间可拆卸连接的模块化设计,使得在承载台受损时,只需更换承载台而无需更换整个探针测试座;与相关技术中的整体更换方案相比,本申请可以显著降低维护成本。另外,由于承载台直接接触芯片,因此其容易因芯片击穿而受损,而承载台与基座之间可拆卸连接允许快速替换受损的承载台;并且对于更换下来的受损的承载台也便于修复,这样只对承载台进行修复,便不会对基座造成伤害。而通过只更换承载台,也可以确保承载面始终保持平整和清洁,从而降低合格芯片受损的风险,提升测试良率。承载台与基座之间设计成可拆卸连接后,可以根据不同芯片测试需求更换不同规格的承载台(如不同材质的承载台或不同面积大小的第一承载面),从而提高了探针测试座对不同功率器件的适应性。

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Abstract

The application relates to the chip testing technical field, in particular to a probe test seat and a testing device. The probe test seat comprises a base, a bearing table and a probe structure, the probe structure is installed on the base, and the bearing table is detachably fixedly connected with the base; the bearing table is provided with a first through hole and a first bearing surface, the probe structure is arranged in the first through hole, and at least part of the probe structure extends out of the first bearing surface. The testing device comprises the probe test seat. The application can reduce the maintenance cost and facilitates the maintenance.
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Description

Technical Field

[0001] This application relates to the field of chip testing technology, and more specifically, to a probe test socket and testing device. Background Technology

[0002] In the semiconductor manufacturing process, to ensure the reliability of chips in practical applications, power devices typically undergo rigorous electrical and reliability testing during the KGD (Known Good Die) process. Common tests include UIS (Unclamped Inductive Switching) and ISC (Short Circuit Test). These tests simulate the operating conditions of power devices under high stress and high current, allowing for the timely detection of potential defects and ensuring high consistency and stability of chips entering the packaging stage. During testing, the chip needs to be electrically connected to external testing equipment via a probe test socket. When the chip under test has defects, it is prone to breakdown and damage under high current impact. This not only renders the chip unusable but may also damage the bearing surface of the probe test socket, further causing indentations on the back of subsequent qualified chips, leading to yield losses. Currently, when the probe test socket is damaged, it can only be repaired by grinding or complete replacement, which is complex and costly.

[0003] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to those skilled in the art. Utility Model Content

[0004] The purpose of this application is to provide a probe test holder and a testing device, which aims to solve the technical problem in the related art that when the probe test holder is damaged, it can only be repaired by grinding or replacing the whole thing, which is complicated to maintain and has a high replacement cost.

[0005] To achieve the above objectives, the technical solution adopted in this application is as follows:

[0006] This application provides a probe test holder, including: a base, a support platform, and a probe structure. The probe structure is mounted on the base, and the support platform is detachably and fixedly connected to the base. The support platform has a first through hole and a first bearing surface. The probe structure passes through the first through hole, and at least a portion of the probe structure extends out of the first bearing surface.

[0007] In some implementations, the support platform and the base are detachably and fixedly connected by fasteners.

[0008] In some implementations, the fastener is a screw, the support platform has a plurality of first mounting holes, and the base has a plurality of second mounting holes;

[0009] The first mounting hole is a smooth hole, or the first mounting hole has internal threads, and the second mounting hole has internal threads.

[0010] The screw passes through the first mounting hole to engage with the internal thread of the second mounting hole.

[0011] In some implementations, the base has a positioning groove, and the support platform is located in the positioning groove.

[0012] In some implementations, the base also has a relief groove that communicates with the positioning groove and is located at the edge of the opening of the positioning groove.

[0013] In some implementations, there are multiple relief grooves, which are distributed circumferentially along the positioning groove.

[0014] In some implementations, the support platform includes a central portion and an annular edge portion surrounding the central portion; the first through hole and the first bearing surface are disposed on the central portion, and the annular edge portion has a first mounting surface;

[0015] The first bearing surface and the first mounting surface have a height difference in the thickness direction of the bearing platform.

[0016] In some implementations, the support platform further has a first mating surface, which is disposed opposite to the first bearing surface, and the base has a second mating surface, which is in contact with the first mating surface and the second mating surface;

[0017] The support platform also has a first vent hole, the opening of which is located on the first support surface;

[0018] The base has a second vent hole and an air intake channel connected to the second vent hole, and the first vent hole is connected to the second vent hole.

[0019] In some implementations, the support platform is made of copper or stainless steel; the base is made of copper or stainless steel.

[0020] This application provides a testing apparatus, including: the probe test holder described in any of the above implementations.

[0021] The main advantages of the probe test holder and test device provided in this application are:

[0022] The modular design of the detachable connection between the platform and the base in this application allows for replacement of only the platform when it is damaged, without replacing the entire probe test socket. Compared to the overall replacement solution in related technologies, this application significantly reduces maintenance costs. Furthermore, since the platform directly contacts the chip, it is easily damaged by chip breakdown. The detachable connection between the platform and the base allows for quick replacement of the damaged platform; the replaced damaged platform is also easy to repair, thus only repairing the platform avoids damage to the base. Replacing only the platform also ensures that the bearing surface remains flat and clean, reducing the risk of damage to qualified chips and improving test yield. The detachable connection between the platform and the base allows for the replacement of different specifications of the platform (such as a platform of different materials or a first bearing surface of different sizes) according to different chip testing requirements, thereby improving the adaptability of the probe test socket to different power devices. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the probe test socket provided in an embodiment of this application;

[0025] Figure 2 yes Figure 1 A magnified schematic diagram of the partial structure at point A in the middle;

[0026] Figure 3 This is a top view of the probe test holder provided in the embodiments of this application;

[0027] Figure 4 This is a schematic diagram of the structure of the base provided in the embodiments of this application;

[0028] Figure 5 yes Figure 4 A magnified view of the structure at point B in the middle;

[0029] Figure 6 This is a top view of the base provided in the embodiment of this application;

[0030] Figure 7 This is a schematic diagram of the structure of the support platform provided in the embodiments of this application;

[0031] Figure 8 yes Figure 7 A magnified schematic diagram of the local structure at point C;

[0032] Figure 9 This is a structural schematic diagram of the support platform provided in another embodiment of this application;

[0033] Figure 10 This is a top view of the support platform provided in the embodiment of this application.

[0034] Explanation of key figure labels:

[0035] 101. Base; 102. Support platform; 103. Probe structure; 104. First through hole; 105. First bearing surface; 106. First mounting hole; 107. Second mounting hole; 108. Positioning groove; 109. Relief groove; 110. Center part; 111. Annular edge part; 112. First mounting surface; 113. First mating surface; 114. Second mating surface; 115. First vent hole; 116. Second vent hole; 117. Vent groove; 118. Conductive needle; 119. Insulating sleeve; 120. Suction channel; 121. Insulating plate. Detailed Implementation

[0036] In related technologies, during chip testing, the chip needs to be electrically connected to external testing equipment via a probe test socket. When the chip under test has defects, it is prone to breakdown and damage under high current surges. This not only renders the chip unusable but may also damage the bearing surface of the probe test socket, further causing indentations on the back of subsequent qualified chips, thus resulting in yield loss. Currently, when the probe test socket is damaged, it can only be repaired by polishing or replacing the entire socket, which is complex to maintain and has high replacement costs.

[0037] Therefore, this application provides a probe test holder and a test device to solve the problems in the related art.

[0038] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0039] Combination Figures 1 to 3 As shown, this application embodiment provides a probe test holder, including: a base 101, a support platform 102, and a probe structure 103. The probe structure 103 is mounted on the base 101, and the support platform 102 is detachably and fixedly connected to the base 101. The support platform 102 has a first through hole 104 and a first support surface 105. The probe structure 103 passes through the first through hole 104, and at least a portion of the probe structure 103 extends out of the first support surface 105.

[0040] In this embodiment, the modular design of the detachable connection between the carrier stage 102 and the base 101 allows for replacement of only the carrier stage 102 when it is damaged, without replacing the entire probe test socket. Compared to the overall replacement scheme in related technologies, this application can significantly reduce maintenance costs. Furthermore, since the carrier stage 102 directly contacts the chip, it is easily damaged by chip breakdown. The detachable connection between the carrier stage 102 and the base 101 allows for quick replacement of the damaged carrier stage 102. The replaced damaged carrier stage 102 is also easy to repair, thus repairing only the carrier stage 102 without damaging the base 101. Replacing only the carrier stage 102 also ensures that the carrier surface remains flat and clean, thereby reducing the risk of damage to qualified chips and improving test yield. The detachable connection between the stage 102 and the base 101 allows for the replacement of different specifications of the stage 102 (such as stage 102 of different materials or first bearing surface 105 of different sizes) according to different chip testing requirements, thereby improving the adaptability of the probe test holder to different power devices.

[0041] In some embodiments, the support platform 102 and the base 101 are detachably and fixedly connected by fasteners. This fastener allows for a quick and easy detachable connection between the support platform 102 and the base 101.

[0042] It should be noted that in some other possible implementations, the support platform 102 and the base 101 can also be detachably and fixedly connected by a snap-fit ​​mechanism. For example, one of the support platform 102 and the base 101 may have a locking platform, and the other may have a locking groove. The locking platform and the locking groove cooperate to achieve a detachable and fixed connection between the two. Alternatively, when the support platform 102 and the base 101 are fixedly connected by a snap-fit ​​mechanism, the support platform 102 can slide relative to the base 101, causing the locking platform to engage with the locking groove. Guide rails and guide grooves can be provided between the support platform 102 and the base 101 to allow for relative sliding between them.

[0043] Combination Figure 3 and Figure 4As shown, in some embodiments, the fastener is a screw (not shown). The support platform 102 has multiple first mounting holes 106, and the base 101 has multiple second mounting holes 107. The first mounting holes 106 are either smooth holes or have internal threads, and the second mounting holes 107 have internal threads. The screw passes through the first mounting hole 106 to engage with the internal thread of the second mounting hole 107. By using a threaded connection between the screw and the base 101, a detachable fixed connection between the support platform 102 and the base 101 is achieved, ensuring that the support platform 102 is not easily loosened during testing, thereby improving testing accuracy. The multiple first mounting holes 106 and multiple second mounting holes 107 can distribute the force, improving the stability of the connection between the support platform 102 and the base 101 and reducing the risk of loosening due to vibration or impact. When the first mounting hole 106 is a smooth hole, the screw directly passes through the smooth hole and engages with the internal thread of the second mounting hole 107 of the base 101, which simplifies the processing technology of the support platform 102 and reduces manufacturing costs. When the first mounting hole 106 has an internal thread, it can form a double-threaded connection with a screw (both the first mounting hole 106 and the second mounting hole 107 mate with screws), which helps to enhance the connection strength between the support platform 102 and the base 101. For example, the support platform 102 can be a plate-like structure, and its edge contour shape can be polygonal, circular, or elliptical; the polygon can be square, pentagonal, or hexagonal, and the square can be rhomboid or rectangular. The first mounting holes 106 can be provided along the edge contour of the support platform 102; the number of first mounting holes 106 is equal to the number of second mounting holes 107, and the number of first mounting holes 106 can be two, three, four, five, six, or eight.

[0044] It should be noted that in some other possible implementations, the fastener can also be a pin hole, and the support platform 102 and the base 101 can also be connected by a pin.

[0045] See Figure 4 As shown, in some embodiments, the base 101 has a positioning groove 108, and the support platform 102 is located in the positioning groove 108. This eliminates the need for additional calibration of the support platform 102 when it is replaced. Furthermore, after the support platform 102 is installed in the positioning groove 108, alignment between the first mounting hole 106 and the second mounting hole 107 can be achieved, preventing the probe structure 103 from shifting in the first through hole 104 due to installation deviations, reducing the complexity of maintenance operations and improving replacement efficiency. For example, the second mounting hole 107 is located at the bottom of the positioning groove 108.

[0046] See Figure 4 and Figure 6As shown, in some embodiments, the base 101 also has a relief groove 109, which communicates with the positioning groove 108 and is located at the edge of the groove opening of the positioning groove 108. The relief groove 109 provides space to allow for the insertion of fingers or tools to remove the support platform 102 from the positioning groove 108.

[0047] In some embodiments, there are multiple relief grooves 109, which are distributed circumferentially along the positioning groove 108. This facilitates the removal of the support platform 102 from the positioning groove 108. For example, there may be two relief grooves 109, which may be arranged opposite to each other.

[0048] For ease of description, the thickness direction of the detection test seat is defined as the ZZ direction in this embodiment; while the thickness direction of the support platform 102 and the thickness direction of the base 101 are parallel to the ZZ direction.

[0049] See Figure 7 As shown, in some embodiments, the support platform 102 includes a central portion 110 and an annular edge portion 111 surrounding the central portion 110; a first through hole 104 and a first bearing surface 105 are disposed on the central portion 110, and the annular edge portion 111 has a first mounting surface 112; the first bearing surface 105 and the first mounting surface 112 have a height difference in the thickness direction of the support platform 102. The central portion 110 can be used to support a chip, while the annular edge portion 111 facilitates the connection between the support platform 102 and the base 101. For example, a first mounting hole 106 is formed in the annular edge portion 111, and the first bearing surface 105 can be the top surface of the central portion 110. The distance between the first bearing surface 105 and the bottom of the positioning groove 108 is less than the distance between the first bearing surface 105 and the bottom of the positioning groove 108; there are two first through holes 104 and two probe structures 103, with each probe structure 103 corresponding to one of the two first through holes 104. The central part 110 and the annular edge part 111 can be an integral structure.

[0050] See Figures 4 to 5 ,as well as Figures 8 to 10As shown, in some embodiments, the support platform 102 further has a first mating surface 113, which is disposed opposite to the first support surface 105. The base 101 has a second mating surface 114, and the first mating surface 113 and the second mating surface 114 are in contact. The support platform 102 also has a first vent 115, the opening of which is located on the first support surface 105. The base 101 has a second vent 116 and an air intake channel 120 communicating with the second vent 116. The first vent 115 and the second vent 116 are connected. This reduces air leakage between the first mating surface 113 and the second mating surface 114 after they come into contact. For example, the first mating surface 113 is a plane, and the second mating surface 114 is a plane. The first mating surface 113 is mainly composed of the surface of the annular edge portion 111 and the bottom surface of the center portion 110. The second mating surface 114 is formed on the bottom of the positioning groove 108. The bottom of the positioning groove 108 is also provided with a venting groove 117, which can be located in the middle of the positioning groove 108. The number of second venting holes 116 can be one, two, three, or four, which is not limited in this application. The number of first venting holes 115 can be one, two, three, or four. When the first mating surface 113 and the second mating surface 114 are fitted together, the multiple second venting holes 116 are connected through the venting groove 117, and the venting groove 117 is then connected to the first venting holes 115. The first vent 115 can be located between two adjacent probe structures 103. Each probe structure 103 can include a conductive needle 118 and an insulating sleeve 119, with the conductive needle 118 passing through the insulating sleeve 119. The insulating sleeve 119 can be made of an insulating material, such as phenolic plastic or polyimide. One end of the suction channel 120 is connected to the second vent 116, and the opening at the other end of the suction channel 120 is located on the thickness-direction surface of the base 101, facilitating connection to a vacuum pump or other negative pressure equipment. Thus, when the chip is aligned with the probe structure 103, a vacuum pump or other negative pressure equipment can be used to evacuate the system and fix the chip onto the first bearing surface 105.

[0051] It should be noted that in some other possible embodiments, a sealing ring can be provided on the circumferential edge of the vent groove 117, so that an airtight seal can be guaranteed after the first mating surface 113 and the second mating surface 114 are in contact.

[0052] In some embodiments, the probe test socket further includes an electrical connector (not shown) that is electrically connected to the probe structure 103; the electrical connector may be disposed on the surface of the base 101 in the thickness direction.

[0053] See Figure 4As shown, in some embodiments, the probe test holder further includes an insulating plate 121, which is detachably fixed to the base 101 by screws. The insulating plate 121 has clearance holes to expose the support stage 102 and the positioning groove 108. The insulating plate 121 can be made of phenolic plastic or polyimide.

[0054] In some embodiments, the support platform 102 is made of copper or stainless steel; the base 101 is made of copper or stainless steel.

[0055] This application provides a testing device, including: a probe test holder provided in any of the above embodiments. The testing device has the same technical effects as the probe test holder provided in the foregoing embodiments, and will not be described again here. Exemplarily, the testing device further includes a vacuum pump connected to the suction channel 120. The vacuum pump can be a vacuum pump or other negative pressure equipment.

[0056] In summary, the probe test holder and test device provided in this application significantly improve the versatility and ease of maintenance for multiple products. Because the support is detachable, grinding after disassembly avoids dead corners and damage to the probe structure 103. Replacement does not require reassembling the heating element and thermocouple, maintaining stable temperature control and preventing parameter drift such as leakage caused by temperature differences. Furthermore, it eliminates the need for readjustment and calibration, significantly reducing maintenance difficulty.

[0057] It should be understood that, in the embodiments of this application, unless otherwise expressly specified and limited, the terms "connection," "fixed connection," "contact," etc., should be interpreted broadly. Those skilled in the art can understand the specific meanings of the various terms in the embodiments of this application according to the specific circumstances.

[0058] For example, the "connection" can be a fixed connection, a rotating connection, a flexible connection, a sliding connection, a one-piece molding, an electrical connection, a contact connection, or other connection methods; it can be a direct connection, or an indirect connection through an intermediate medium, or a connection within two components or an interaction between two components.

[0059] For example, a "fixed connection" can be a component that can be directly or indirectly fixedly connected to another component; a fixed connection can include mechanical connection, welding, bonding or integral molding, etc., wherein mechanical connection can include riveting, bolting, threaded connection, keying, snap-fit ​​connection, locking connection, plugging, etc., and bonding can include adhesive bonding and solvent bonding, etc.

[0060] It should also be understood that the “parallel” or “perpendicular” described in the embodiments of this application can be understood as “approximately parallel” or “approximately perpendicular”.

[0061] It should also be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Features specified as "first" or "second" may explicitly or implicitly include one or more of that feature.

[0062] In the embodiments of this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature and the second feature are in direct contact, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0063] It should also be understood that the terms “length,” “width,” “up,” “down,” “front,” “back,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship (if any) based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0064] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of protection of the claims. In conclusion, the above description is merely a preferred embodiment of the technical solution of this application and is not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A probe test holder, characterized in that, include: The device includes a base, a support platform, and a probe structure. The probe structure is mounted on the base, and the support platform is detachably and fixedly connected to the base. The support platform has a first through hole and a first bearing surface. The probe structure passes through the first through hole, and at least a portion of the probe structure extends out of the first bearing surface.

2. The probe test holder as described in claim 1, characterized in that, The support platform and the base are detachably and fixedly connected by fasteners.

3. The probe test holder as described in claim 2, characterized in that, The fastener is a screw, the support platform has multiple first mounting holes, and the base has multiple second mounting holes; The first mounting hole is a smooth hole or the first mounting hole has internal threads, and the second mounting hole has internal threads. The screw passes through the first mounting hole to engage with the internal thread of the second mounting hole.

4. The probe test holder as described in claim 1, characterized in that, The base has a positioning groove, and the support platform is located in the positioning groove.

5. The probe test holder as described in claim 4, characterized in that, The base also has a relief groove, which is connected to the positioning groove and is located at the edge of the groove of the positioning groove.

6. The probe test holder as described in claim 5, characterized in that, The number of the clearance grooves is multiple, and the multiple clearance grooves are distributed circumferentially along the positioning groove.

7. The probe test holder according to any one of claims 1-6, characterized in that, The support platform includes a central portion and an annular edge portion surrounding the central portion; the first through hole and the first bearing surface are disposed on the central portion, and the annular edge portion has a first mounting surface; The first bearing surface and the first mounting surface have a height difference in the thickness direction of the bearing platform.

8. The probe test holder as described in any one of claims 1-6, characterized in that, The support platform also has a first mating surface, which is disposed opposite to the first bearing surface; the base has a second mating surface, which is in contact with the first mating surface and the second mating surface. The support platform also has a first vent hole, the opening of which is located on the first support surface; The base has a second vent hole and an air intake channel connected to the second vent hole, and the first vent hole is connected to the second vent hole.

9. The probe test holder as described in any one of claims 1-6, characterized in that, The support platform is made of copper or stainless steel; the base is made of copper or stainless steel.

10. A testing apparatus, characterized in that, include: The probe test socket as described in any one of claims 1-9.