A heat dissipation module for power supply

Abstract

The utility model relates to power supply heat dissipation technical field especially a heat dissipation module for power supply, including heat dissipation fin, heat dissipation fin is fixedly connected on the base of the case through the base hole, the back of heat dissipation fin is fixed with the PCB board through the mounting hole, a plurality of power tubes are connected on the PCB board, the power tube is installed between heat dissipation fin with the PCB board, wherein, the back of heat dissipation fin still is connected with fixed structure through the connecting hole, the fixed structure is used for fixing power tube, heat dissipation fin can effectively heat that power tube generates is conducted through the mode of air and carries out heat dissipation, prevents power tube heat accumulation and influences power supply component normal use, the elastic sheet cooperation fixing piece can stop the fixed of multiple power tubes simultaneously, is favorable to improve the dismounting efficiency of power tube, and the elastic sheet and the fixed piece are still convenient to dismount through the mode of resistance touch deformation.

Description

Technical Field

[0001] This utility model relates to the field of power supply heat dissipation technology, and in particular to a heat dissipation module for power supplies. Background Technology

[0002] By utilizing the switching or linear amplification characteristics of power transistors, along with control circuits and feedback loops, a complete power supply system can be constructed. In this system, whether it is the voltage difference loss in linear mode or the switching loss in switching mode, the power transistor will convert electrical energy into heat energy. Over time, the heat accumulation needs to be dissipated through a heat dissipation module.

[0003] Power supplies can transfer heat through heat dissipation structures such as heat sinks. For example, Chinese Patent Publication No. CN203872500U discloses a heat dissipation module for a light box power supply, including a heat sink housing and a power circuit board. The heat sink housing has an inner surface and an outer surface. The inner surface has a bottom surface, a left side surface, a right side surface, and a top surface. A protrusion is provided at the center of the bottom of the bottom surface, and a first heat sink is provided above the protrusion. The first heat sink is fixed to the left and right sides by a heat sink plate. A second heat sink is provided on the top surface facing the first heat sink. The power circuit board includes a circuit board body and an integrated IC. The circuit board body has a front end and a rear end. The front end has a slot, and the pins of the integrated IC are inserted into the circuit board body on both sides of the slot.

[0004] It is also necessary to fix the power transistor using a fixing structure to prevent it from moving and disconnecting from the circuit board. For example, the prior art Chinese patent announcement number "CN212367615U" discloses a power transistor heat dissipation structure, including a PCB board with heat dissipation holes, a power transistor soldered to the opening of the heat dissipation hole on the top surface of the PCB board, and a heat dissipation metal block soldered from the bottom surface of the PCB board to the heat dissipation surface of the power transistor by soldering through the heat dissipation hole. This utility model, by opening heat dissipation holes in the PCB board, reflow soldering the heat dissipation surface of the power transistor to the opening of the heat dissipation hole on the top surface of the PCB board, and reflow soldering through the soldering through the heat dissipation hole to the heat dissipation surface of the power transistor and the heat dissipation metal block, and combining copper plating on the inner wall of the heat dissipation hole and the opening of the heat dissipation hole on the top and bottom surfaces of the PCB board.

[0005] In practice, the power transistors are fixed to the back of the heat sink fins with screws. However, considering that multiple power transistors are connected to the PCB board, it is not convenient or quick to disassemble and install the power transistors one by one, and it is easy to affect the subsequent installation efficiency, so the practicality is poor. Utility Model Content

[0006] The purpose of this utility model is to solve the shortcomings of the existing technology, which is not convenient and quick enough in the method of disassembling and assembling power transistors one by one, and to propose a heat dissipation module for power supplies.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: Design a heat dissipation module for a power supply, including heat dissipation fins. The heat dissipation fins are fixedly connected to the base of the chassis through base holes. A PCB board is fixed to the back of the heat dissipation fins through mounting holes. Several power transistors are connected to the PCB board and the power transistors are installed between the heat dissipation fins and the PCB board. The back of the heat sink fins is also connected to a fixing structure via a connection hole, which is used to fix the power transistor.

[0008] Furthermore, the heat dissipation fins are integrally formed with several fins on their end faces, and the fins are provided with clearance grooves at the base holes, which are used to avoid fasteners.

[0009] Furthermore, a copper pillar is fixedly connected inside the mounting hole, and the copper pillar is used to fix the PCB board.

[0010] Furthermore, the power transistors are arranged in several groups at equal intervals and are all attached to the back of the heat sink fins, and the heat sink fins are provided with connection holes between two adjacent power transistors.

[0011] Furthermore, the fixing structure includes a spring sheet, the two ends of which are bent to form a first limiting part, and the middle part of the spring sheet is bent along the interval between two adjacent power tubes to form a plurality of second limiting parts; The spring sheet is pressed against the periphery of the power tube by the first limiting part and the second limiting part, and the spring sheet is also provided with heat dissipation grooves and through holes.

[0012] Furthermore, the fixing structure also includes a fixing member with a T-shaped cross-section. The rod-shaped part at the bottom of the fixing member is fixedly connected to the connecting hole, and the annular protrusion at the top is provided with guide slopes on the upper and lower sides.

[0013] Furthermore, the spring piece is provided with a communicating deformation groove on the outside of the through hole, and the spring piece slides against the guide inclined surface through the deformation groove, and the upper surface of the spring piece stops the annular protrusion of the fixing member.

[0014] The present invention provides a heat dissipation module for a power supply, which has the following advantages: The present invention fixes the power transistor and the PCB board to the back of the heat dissipation fins through multiple sets of connection holes. The heat dissipation fins can effectively dissipate the heat generated by the power transistor through air conduction, preventing the heat accumulation of the power transistor from affecting the normal use of the power supply components. The spring clip, together with the fixing component, can simultaneously stop and fix multiple power transistors, which helps to improve the efficiency of power transistor assembly and disassembly. Furthermore, the spring clip and the fixing component can be easily disassembled through the contact deformation. The structure is simple and highly practical. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a schematic diagram of the base hole, mounting hole, and connecting hole of this utility model; Figure 3 This is a schematic diagram of the clearance groove of this utility model; Figure 4 This is a schematic diagram of the fixing structure of this utility model; Figure 5 for Figure 4 A magnified structural diagram of area A.

[0016] In the diagram: 1. Heat sink fins; 11. Fins; 12. Relief groove; 2. Base hole; 3. Mounting hole; 4. PCB board; 5. Power transistor; 6. Connection hole; 7. Fixing structure; 71. Spring; 72. First limiting part; 73. Second limiting part; 74. Heat sink groove; 75. Through hole; 76. Fixing component; 761. Guide slope; 77. Deformation groove. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0018] Reference Figure 1-5 A heat dissipation module for a power supply includes heat dissipation fins 1, which are fixedly connected to the base of a chassis through base holes 2. A PCB board 4 is fixed to the back of the heat dissipation fins 1 through mounting holes 3. A plurality of power transistors 5 are connected to the PCB board 4, and the power transistors 5 are installed between the heat dissipation fins 1 and the PCB board 4. The back of the heat sink 1 is also connected to a fixing structure 7 through a connecting hole 6, and the fixing structure 7 is used to fix the power tube 5.

[0019] In some embodiments, such as Figure 2 As shown, the back of the heat sink 1 has four base holes 2 marked with 1, 2, 3 and 4 on opposite sides. Fasteners, i.e. screws, are inserted into the four base holes 2 to fix the entire heat sink module to the base of the chassis. Specifically, holes 7, 8, 9, and 10 are connection holes 6. Connection holes 6 are used to fix fasteners 76, and fasteners 76 are used to fix power tubes 5 in conjunction with spring clips 71. More specifically, holes 11, 12, 13, 14, and 15 are mounting holes 3. Mounting holes 3 are used for fixing or threaded connection of copper pillars. In the prior art, copper pillars are used to fix the PCB board. The specific fixing method and function will not be elaborated here.

[0020] Furthermore, the heat dissipation fin 1 has several fins 11 integrally formed on its end face, and the fins 11 are provided with relief grooves 12 at the base hole 2. The relief grooves 12 are used to avoid fasteners.

[0021] Furthermore, a copper pillar is fixedly connected inside the mounting hole 3, and the copper pillar is used to fix the PCB board 4.

[0022] More specifically, the power transistors 5 are arranged in several groups at equal intervals and are all attached to the back of the heat sink fins 1. The heat sink fins 1 are provided with the connection holes 6 between two adjacent power transistors 5.

[0023] In general, the fixing structure 7 includes a spring sheet 71, the two ends of the spring sheet 71 are bent to form a first limiting part 72, and the middle part of the spring sheet 71 is bent along the interval between two adjacent power tubes 5 to form a plurality of second limiting parts 73. The spring piece 71 is pressed against the periphery of the power tube 5 by the first limiting part 72 and the second limiting part 73. The spring piece 71 is also provided with a heat dissipation groove 74 and a through hole 75.

[0024] Furthermore, the fixing structure 7 also includes a fixing member 76, the fixing member 76 has a T-shaped cross-section, the rod-shaped part at the bottom of the fixing member 76 is fixedly connected to the connecting hole 6, and the annular protrusion at the top is provided with guide slopes 761 on the upper and lower sides.

[0025] Finally, the spring piece 71 is provided with a connecting deformation groove 77 on the outside of the through hole 75. The spring piece 71 slides against the guide inclined surface 761 through the deformation groove 77, and the upper surface of the spring piece 71 stops the annular protrusion of the fixing member 76.

[0026] In this embodiment, the spring sheet 71 is preferably made of a metal with good thermal conductivity and elastic deformation capability, such as copper or aluminum. Figure 4 , 5As shown, the spring piece 71 slides against the guide slope 761 through the deformation groove 77, the upper surface of the spring piece 71 stops the annular protrusion of the fixing member 76, and the lower surface of the spring piece 71 presses against the power tube 5. The fastness of the connection between the power tube 5 and the PCB board 4 is further improved by fixing the spring piece 71.

[0027] Working method: The power transistor 5 is fixed to the PCB board 4 by means of tin plating, etc. The PCB board 4 is fixed to the back of the heat sink 1 by copper pillars and mounting holes 3. At this time, the power transistor 5 is reinforced by the fixing structure 7. The spring piece 71 slides against the guide slope 761 through the deformation groove 77, the upper surface of the spring piece 71 stops the annular protrusion of the fixing member 76, and the lower surface of the spring piece 71 presses against the power tube 5, which can further improve the tightness of the connection between the power tube 5 and the PCB board 4.

[0028] Finally, fasteners are inserted through base holes 2 to fix the entire heat dissipation module to the base of the chassis.

[0029] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A heat dissipation module for a power supply, comprising heat dissipation fins (1), characterized in that: The heat dissipation fins (1) are fixedly connected to the base of the chassis through the base hole (2). A PCB board (4) is fixed on the back of the heat dissipation fins (1) through the mounting hole (3). Several power transistors (5) are connected on the PCB board (4). The power transistors (5) are installed between the heat dissipation fins (1) and the PCB board (4). The back of the heat sink fin (1) is also connected to a fixing structure (7) through a connecting hole (6), and the fixing structure (7) is used to fix the power tube (5).

2. The heat dissipation module for a power supply according to claim 1, characterized in that: The heat dissipation fins (1) are integrally formed with several fins (11) on the end face. The fins (11) are provided with relief grooves (12) at the base hole (2). The relief grooves (12) are used to avoid fasteners.

3. A heat dissipation module for a power supply according to claim 1, characterized in that: A copper pillar is fixedly connected inside the mounting hole (3), and the copper pillar is used to fix the PCB board (4).

4. A heat dissipation module for a power supply according to claim 1, characterized in that: The power transistors (5) are arranged in several groups at equal intervals and are all attached to the back of the heat sink fins (1). The heat sink fins (1) are provided with the connection holes (6) between two adjacent power transistors (5).

5. A heat dissipation module for a power supply according to claim 1, characterized in that: The fixing structure (7) includes a spring (71), the two ends of the spring (71) are bent to form a first limiting part (72), and the middle part of the spring (71) is bent along the interval between two adjacent power tubes (5) to form a plurality of second limiting parts (73). The spring (71) is pressed against the periphery of the power tube (5) by the first limiting part (72) and the second limiting part (73). The spring (71) is also provided with a heat dissipation groove (74) and a through hole (75).

6. A heat dissipation module for a power supply according to claim 5, characterized in that: The fixing structure (7) also includes a fixing member (76), the fixing member (76) has a T-shaped cross-section, the rod-shaped part at the bottom of the fixing member (76) is fixedly connected in the connecting hole (6), and the annular protrusion at the top is provided with guide slopes (761) on the upper and lower sides.

7. A heat dissipation module for a power supply according to claim 6, characterized in that: The spring piece (71) is provided with a connecting deformation groove (77) on the outside of the through hole (75). The spring piece (71) slides against the guide inclined surface (761) through the deformation groove (77). The upper surface of the spring piece (71) stops the annular protrusion of the fixing member (76).

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