A heat sink

Abstract

The application relates to a radiator, and relates to the technical field of electronic equipment heat dissipation, which comprises an evaporation cavity filled with a working medium; a condensation cavity arranged on the upper side of the evaporation cavity and communicated with the evaporation cavity; a converging cavity arranged on the side of the condensation cavity away from the evaporation cavity and communicated with the condensation cavity; and a liquid return pipe, one end of which is connected to the converging cavity, and the other end of which is connected to the evaporation cavity. The application realizes complete separation of gas and liquid flow channels by constructing independent steam rising paths and liquid return paths, solves the problem of gas and liquid in the same path in a traditional thermosyphon radiator, enables steam to enter the condensation cavity for condensation without obstruction, and enables condensate to return smoothly through a dedicated channel; the structure effectively reduces the circulating flow resistance, and significantly improves the heat transfer limit and the heat dissipation efficiency of the radiator.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology for electronic devices, and in particular to a heat sink. Background Technology

[0002] With the rapid development of electronic technology, the power density of electronic components, especially high-power processors and power modules, continues to rise, and the heat generated is also increasing dramatically, making heat dissipation a more and more serious problem. Efficient heat dissipation has become a key technical element to ensure the reliability of electronic equipment, maintain its operational stability, and extend its service life.

[0003] Among existing heat dissipation solutions, thermosiphon radiators are widely used due to their high heat transfer efficiency. These radiators typically employ an integrated evaporation and condensation section design, forming a closed circulation system through internally connected cavities or pipes. Their working principle is based on phase change heat transfer of the working fluid: the liquid working fluid absorbs heat in the evaporation section and vaporizes; the resulting vapor flows to the condensation section under pressure difference, is cooled, and then re-condenses into a liquid, ultimately flowing back to the evaporation section to complete the cycle through gravity or capillary action.

[0004] However, traditional radiators of this type have significant limitations in their structural design. Their steam rise channel and liquid return channel typically share the same flow path. This shared gas-liquid layout causes the rapidly rising steam flow to significantly impede and carry away the downward-flowing liquid, limiting both the steam's rising speed and slowing down the condensate's return efficiency. Furthermore, the shared flow path causes some condensate to adhere to the inner wall of the flow path, making it difficult to drain effectively. This not only reduces the effective heat dissipation area but also increases additional thermal resistance. Utility Model Content

[0005] To address the problem of limited heat transfer efficiency caused by the mutual interference between rising steam and reflux of liquid in existing thermosiphon radiators due to the co-flow of gas and liquid, this application provides a radiator.

[0006] The radiator provided in this application adopts the following technical solution: A radiator, comprising: The evaporation chamber is filled with working fluid; A condensation chamber is located on the upper side of the evaporation chamber and is connected to the evaporation chamber; The manifold is located on the side of the condensation chamber away from the evaporation chamber and is connected to the condensation chamber; A return pipe, one end of which is connected to the manifold and the other end of which is connected to the evaporation chamber.

[0007] By adopting the above technical solution, and by constructing a steam rising path between the evaporation chamber and the condensation chamber, and a liquid return path between the manifold, return pipe, and evaporation chamber, the gas and liquid flow channels are completely separated from each other in the system architecture. This solution solves the problem of gas and liquid sharing the same path in traditional thermosiphon radiators, allowing steam to enter the condensation chamber for condensation without obstruction, while the condensate can also flow back smoothly through a dedicated channel, thereby reducing circulation flow resistance and improving the heat transfer limit and heat dissipation efficiency of the radiator, laying the foundation for achieving high power density heat dissipation.

[0008] In one specific implementation, the angle between the condensation chamber and the evaporation chamber is set as A, where A is greater than 0° and less than 90°.

[0009] By adopting the above technical solution, this layout not only optimizes the overall space utilization of the radiator, but also makes the flow path of steam from the evaporation chamber to the condensation chamber more direct and shorter, reducing pressure loss and heat loss during the flow process; at the same time, this angle design also facilitates the smooth flow of condensate by gravity, further optimizing the thermal cycle performance.

[0010] In one specific implementation, the condensation chamber includes multiple microchannel plates, each having a through microchannel that connects to the evaporation chamber and the manifold chamber respectively.

[0011] By adopting the above technical solution, the condensing chamber is composed of multiple microchannel plates, which use a large number of microchannels inside as condensing heat exchange surfaces, increasing the effective heat exchange area per unit volume. When steam flows through, it can fully and efficiently exchange heat with the channel walls, thereby improving the condensing efficiency.

[0012] In one specific implementation, the microchannel plate is vertically arranged and tilted downwards from the end connected to the evaporation chamber to the end connected to the manifold.

[0013] By adopting the above technical solution, the microchannel plate is set vertically and tilted downwards from the evaporation chamber to the manifold. This structure uses gravity as an auxiliary driving force. When the working fluid vapor condenses into liquid in the microchannel, gravity will automatically guide and accelerate the liquid film to flow to the lower manifold, thereby avoiding the stagnation and accumulation of condensate in the flow channel, reducing the condensation thermal resistance, and ensuring the automaticity, smoothness and efficiency of the reflux process.

[0014] In one specific implementation, multiple microchannel plates are arranged parallel to each other and spaced apart, with heat dissipation fins provided between adjacent microchannel plates.

[0015] By adopting the above technical solution, multiple microchannel plates are arranged in a parallel and spaced manner, and heat dissipation fins are installed between them. This is equivalent to constructing a secondary heat exchange surface in addition to the microchannel plates, which serve as the primary heat exchange surface. The heat dissipation fins can quickly dissipate the heat concentrated from the condensation chamber to the surrounding environment through efficient heat exchange with the convective air, thereby enhancing the overall heat dissipation capacity.

[0016] In one specific implementation, the heat dissipation fins are stamped and formed continuous bent fins with a bending angle of 90°-170°.

[0017] By adopting the above technical solution, the continuous bending structure creates appropriate disturbance in the airflow channel, destroys the air boundary layer, and enhances the heat exchange effect. At the same time, this angle range ensures that when the fins are arranged vertically or at a large angle, dust accumulation can be effectively prevented, thus combining efficient heat exchange with dust prevention capabilities for long-term stable operation.

[0018] In one specific implementation scheme, the manifold includes a manifold cover plate and a manifold bottom plate. The manifold cover plate is connected to the microchannel plate and has a manifold hole communicating with the microchannel. The manifold bottom plate has a first reflux hole, and one end of the return pipe is connected to the first reflux hole.

[0019] By adopting the above technical solution and setting a dedicated manifold structure, the condensate flowing out of all microchannel plates can be effectively collected and guided, and stably transported to the return pipe through the lower return hole, thereby ensuring the uniformity and reliability of the return flow of each parallel flow path and avoiding the risk of local liquid accumulation or poor return flow.

[0020] In one specific implementation, the evaporation chamber includes an evaporation chamber bottom plate and an evaporation chamber cover plate. The evaporation chamber cover plate is connected to the microchannel plate, and its upper part is provided with an evaporation hole communicating with the microchannel. The lower part of the evaporation chamber cover plate is provided with a second reflux hole, and the other end of the return pipe is connected to the second reflux hole.

[0021] By adopting the above technical solution, the evaporation chamber structure achieves an integrated design of heat absorption, steam output and liquid reflux; the upper evaporation hole ensures a direct connection between the vaporization and condensation chambers with the shortest path; the lower reflux hole is dedicated to receiving the coolant from the return pipe. This functional partitioning design makes the heat and mass transfer process efficient and non-interfering, with a rapid response.

[0022] In one specific implementation, the manifold bottom plate and / or the evaporation chamber bottom plate are provided with connecting posts, and are connected to the corresponding manifold cover plate and / or evaporation chamber cover plate through the connecting posts.

[0023] By adopting the above technical solution and designing protruding connecting columns, the welding area can be effectively increased and the solder can be guided to fill evenly, thereby ensuring the strength and airtightness of the sealing connection between the manifold cavity and / or the evaporation cavity, and improving the product's process reliability and long-term durability.

[0024] In one specific implementation, the evaporation chamber, the condensation chamber, the manifold, and the return pipe together constitute a heat dissipation unit; the radiator includes two or more heat dissipation units stacked side by side.

[0025] By adopting the above technical solution, the complete function is integrated into a standard heat dissipation unit, which allows for flexible expansion of heat dissipation capacity through the physical stacking of multiple heat dissipation units. This modular design can improve the adaptability of the product and can be quickly combined and configured according to actual heat dissipation needs, realizing the standardization and serialization of high-performance heat dissipation solutions.

[0026] In summary, the beneficial technical effects of this application are as follows: By constructing separate steam rising paths and liquid return paths, this application enables steam to enter the condensing chamber for condensation without obstruction, while the condensate smoothly returns to the evaporation chamber through a dedicated return channel; this complete separation of gas and liquid flow channels significantly reduces circulation flow resistance and improves the heat transfer limit and heat dissipation efficiency of the radiator; in particular, the downward tilting design of the microchannel plate structure cleverly utilizes gravity to promote liquid return, while the special heat dissipation fin structure enhances heat exchange while also possessing excellent dustproof capabilities; Furthermore, this design achieves flexible expansion of heat dissipation performance and optimization of space layout through a modular approach; it integrates the evaporation chamber, condensation chamber, manifold, and return pipe into a standard heat dissipation unit, supporting the parallel stacking of multiple units, so that the heat dissipation capacity can be linearly expanded according to actual needs; the compact structural layout not only optimizes space utilization, but also ensures the efficiency and reliability of the heat and mass transfer process, providing a reliable solution for achieving high power density heat dissipation. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the heat sink in Embodiment 1 of this application.

[0028] Figure 2 It is a cross-sectional view used to show the structure of the heat sink.

[0029] Figure 3 This is a side view used to show the structure of the heat sink.

[0030] Figure 4 It is a structural diagram used to show the microchannel of a single wide channel.

[0031] Figure 5 It is a structural diagram of a microchannel used to illustrate multiple tiny channels.

[0032] Figure 6 This is a schematic diagram showing the structure of the connecting columns on the bottom plate of the evaporator chamber and the bottom plate of the manifold chamber.

[0033] Figure 7 This is a schematic diagram of the heat sink in Embodiment 2 of this application.

[0034] Explanation of reference numerals in the attached drawings: 1. Evaporation chamber; 11. Evaporation chamber bottom plate; 12. Evaporation chamber cover plate; 121. Evaporation hole; 122. Second reflux hole; 2. Condensation chamber; 21. Microchannel plate; 211. Microchannel; 3. Manifold chamber; 31. Manifold chamber cover plate; 311. Manifold hole; 32. Manifold chamber bottom plate; 321. First reflux hole; 4. Return pipe; 5. Connecting column; 6. Heat dissipation unit; 7. Heating element. Detailed Implementation

[0035] The following is in conjunction with the appendix Figure 1-7 This application will be described in further detail.

[0036] This application discloses a heat sink that can be widely used in various high-power electronic devices that require efficient heat dissipation, including but not limited to high-power processors, power chips, and power modules. The heat sink adopts a gas-liquid separation design, making full use of the heat sink space to ensure that condensate and vapor do not interfere with each other, thereby achieving higher heat transfer performance.

[0037] Reference Figure 1-2 The radiator in this embodiment mainly includes an evaporation chamber 1, a condensation chamber 2, a manifold chamber 3, and a return pipe 4.

[0038] In this example, the evaporation chamber 1 serves as the hot end of the radiator and is formed by the evaporation chamber bottom plate 11 and the evaporation chamber cover plate 12 being sealed together by brazing. Its interior is a sealed vacuum chamber filled with a working fluid, including but not limited to deionized water, ethanol, acetone, or other fluids with suitable saturated vapor pressure. The evaporation chamber 1 can be manufactured by various processes such as die casting, machining, or brazing, and has good structural strength and sealing performance.

[0039] In this embodiment, the bottom plate 11 of the evaporation chamber is made of a metal material with high thermal conductivity (such as aluminum alloy) to fit closely with the heating element 7 (such as CPU, power chip) inside the device to absorb and conduct heat; the upper part of the evaporation chamber cover plate 12 is provided with an evaporation hole 121, which is connected to the condensation chamber 2 for the working fluid vapor to flow out. The evaporation hole 121 can be set with different hole diameters and distribution densities according to actual needs to optimize the vapor flow characteristics; the lower part of the evaporation chamber cover plate 12 is provided with a second return hole 122, which is connected to the return liquid pipe 4 for receiving the return liquid.

[0040] Reference Figure 1-3The condensing chamber 2 is located on the upper side of the evaporating chamber 1, and it is directly connected to the upper part of the evaporating chamber 1 through the evaporation hole 121. In this embodiment, the evaporating chamber 1 can be set vertically or vertically inclined, the condensing chamber 2 is set inclined relative to the evaporating chamber 1, and the included angle between the condensing chamber 2 and the evaporating chamber 1 is set as A, where A is greater than 0° and less than 90°. Specifically, refer to Figure 3 In the side view of the radiator, draw a dashed line Y representing the direction of its main axis extension at the location of evaporator cavity 1 in the side view (vertical projection plane). Similarly, draw a dashed line X representing the direction of its main axis extension at the location of condenser cavity 2 in the side view (vertical projection plane). The angle between the main axis extension direction X of condenser cavity 2 and the main axis extension direction Y of evaporator cavity 1 is A (refer to...). Figure 3 ), 0° < A < 90°; This design allows the condenser chamber 2 to fit snugly against the upper side of the evaporator chamber 1, which not only optimizes the spatial layout but also makes the flow path of steam from the evaporator chamber 1 to the condenser chamber 2 more direct and shorter, reducing flow resistance loss and improving heat transfer efficiency. In addition, this angle design also facilitates the smooth flow of condensate by gravity, further optimizing the thermal cycle performance.

[0041] The condensing cavity 2, serving as the cold end and core heat exchange area of ​​the radiator, is composed of multiple microchannel plates 21. The microchannel plates 21 span between the evaporation cavity 1 and the manifold 3, and are connected to both the evaporation cavity 1 and the manifold 3. In this embodiment, the microchannel plate 21 is preferably an integral structure formed by aluminum extrusion, and has microchannels 211 extending along its width direction inside. The evaporation holes 121 provided on the evaporation cavity 1 are correspondingly provided with the microchannels 211 of the microchannel plate 21. One end of the microchannel 211 is connected to the evaporation cavity 1 through the evaporation hole 121, and the other end is connected to the manifold 3.

[0042] In this embodiment, the microchannel 211 on the microchannel plate 21 can be configured as a single wide channel (see reference). Figure 3 ) or multiple small channels (see Figure 4 The specific number, shape, and size of the microchannels 211 can be optimized according to the heat dissipation power requirements; the cross-sectional shape of the microchannels 211 can be rectangular, trapezoidal, or other polygonal to meet different flow characteristics and heat exchange requirements.

[0043] Reference Figure 1-2The microchannel plate 21 is vertically arranged and tilted downwards from the end connected to the evaporation chamber 1 to the end connected to the manifold 3. Specifically, the microchannel plate 21 forms an acute angle with the horizontal plane. In this embodiment, the tilt angle of the microchannel plate 21 can be adjusted within the acute angle range, usually selected from 5° to 30°, to adapt to different installation spaces and heat dissipation requirements. When space is limited, a larger tilt angle can be used. When pursuing the best recirculation effect, a preferred angle of 10° is used. The inclined layout of the microchannel plate 21 can cleverly utilize gravity to automatically guide and accelerate the flow of the liquid working fluid formed after condensation to the manifold 3, effectively avoiding the stagnation of liquid in the flow channel and significantly reducing the condensation thermal resistance.

[0044] Multiple microchannel plates 21 are arranged parallel to each other and spaced apart. Heat dissipation fins (not shown in the figure) are provided in the gaps between adjacent microchannel plates 21. The heat dissipation fins are stamped and continuously bent fins with a bending angle of 90°-170°, preferably 90°. The heat dissipation fins are preferably stamped aluminum fins. The two sides of the heat dissipation fins are fixedly connected to the outer surface of the adjacent microchannel plates 21 by brazing. The heat dissipation fins can significantly expand the convective heat exchange area between the condensation cavity 2 and the outside world. At the same time, their specific bending angle and vertical layout form an effective dustproof structure, which can prevent dust accumulation and maintain long-term stable heat dissipation performance.

[0045] It should be noted that the bending angle of the heat sink fins can be optimized according to the specific application scenario. For dusty environments, a 90° vertical bending angle is used to prevent dust accumulation to the greatest extent. For clean environments, a bending angle of 120°-150° can be used to further improve heat exchange efficiency while ensuring dust prevention. For applications requiring extremely high heat dissipation performance, a large bending angle of 150°-170° can be used to enhance heat exchange by increasing airflow turbulence.

[0046] Reference Figure 1-2 The manifold 3 is located at the lower part of the end of the condensing chamber 2 away from the evaporating chamber 1, and is used to collect all the condensate flowing down from the microchannel plate 21. The manifold 3 is formed by brazing and sealing the manifold cover plate 31 and the manifold bottom plate 32. The manifold cover plate 31 is connected to the end of the microchannel plate 21 away from the evaporating chamber 1, and has a plurality of manifold holes 311 communicating with the microchannels 211. The manifold holes 311 are arranged one-to-one with the microchannels 211 so that the condensate can flow in. The manifold bottom plate 32 is provided with a first return hole 321.

[0047] Reference Figure 1-2The return pipe 4 serves as an independent liquid return channel. One end of it is connected to the first return hole 321 on the bottom plate 32 of the manifold, and the other end is connected to the second return hole 122 at the bottom of the evaporation chamber cover plate 12, thus forming a dedicated liquid circuit connecting the manifold 3 and the evaporation chamber 1. In this embodiment, the return pipe 4 can be designed as a pipe with a specific curved shape according to the actual spatial layout needs to ensure a smooth return path.

[0048] Reference Figure 6 To enhance the reliability and sealing of the welding, connecting posts 5 protruding into the cavity are provided on the bottom plate 32 of the manifold and / or the bottom plate 11 of the evaporation cavity. In this embodiment, connecting posts 5 are provided on both the bottom plate 32 of the manifold and the bottom plate 11 of the evaporation cavity. The specific size and arrangement density of the connecting posts 5 can be optimized according to the structural strength requirements. These connecting posts 5 can increase the welding area during the brazing process and guide the solder to fill evenly through capillary action, thereby ensuring the strength and airtightness of the cavity connection and improving the process reliability and long-term durability of the product.

[0049] Working principle: Through the above structure, a steam rising path is constructed between the evaporation chamber 1 and the condensation chamber 2, and a liquid return path is constructed between the manifold 3, the return pipe 4, and the evaporation chamber 1, achieving complete separation of the gas and liquid flow channels. During operation, the working fluid in the evaporation chamber 1 absorbs heat and vaporizes. The steam enters directly into the inclined microchannel plate 21 through the evaporation hole 121, where it condenses and releases heat. The heat is transferred out through the wall of the microchannel plate 21. The condensed droplets flow rapidly along the inclined microchannel 211 to the lower manifold 3 under the action of gravity. After converging, the liquid returns directly to the evaporation chamber 1 through the return pipe 4, completing a highly efficient, smooth, and gas-liquid interference-free cycle.

[0050] This application solves the problem of mutual obstruction between gas and liquid two-phase flows in traditional thermosiphon radiators by physically separating the gas and liquid paths; the microchannel plate 21 structure provides a huge condensation heat exchange area, the inclined design uses gravity to promote liquid reflux, and the vertical bending structure of the heat dissipation fins enhances heat dissipation and achieves dust prevention function, thereby reducing the thermal resistance of the radiator and improving heat dissipation efficiency.

[0051] Example 2 This embodiment, based on claim 1, demonstrates the modular expansion scheme of this application to meet the heat dissipation requirements of higher power.

[0052] Reference Figure 7 In this embodiment, the evaporation chamber 1, the condensation chamber 2, the manifold 3, and the return pipe 4 together constitute a fully functional heat dissipation unit 6; the heat sink of this embodiment is formed by stacking two or more such heat dissipation units 6 side by side; this stacking design can make full use of the heat sink space and linearly improve the heat dissipation capacity by increasing the number of heat dissipation units 6.

[0053] In the stacked configuration, the evaporation chambers 1 of adjacent heat dissipation units 6 are fixedly connected end to end through their structure, thereby achieving mechanical integration and stability. The connection can be achieved by welding or other methods to achieve rigid connection. However, the working fluid circulation system inside each heat dissipation unit 6 is completely independent and isolated from each other. That is, the evaporation chamber 1, condensation chamber 2, and manifold 3 of each heat dissipation unit 6 constitute an independent and closed circulating heat dissipation unit 6, and there is no fluid exchange with other heat dissipation units 6.

[0054] This design combines integrated compactness with system reliability, allowing for flexible addition or removal of heat dissipation modules based on thermal load, enabling product standardization and serialization. At the same time, it avoids problems such as uneven working fluid distribution and unstable flow that may occur when multiple circulation systems are connected in parallel, ensuring that each heat dissipation unit 6 can work stably, providing a reliable solution for heat dissipation of high power density equipment.

[0055] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A radiator, characterized in that: include: The evaporation chamber is filled with working fluid; A condensation chamber is located on the upper side of the evaporation chamber and is connected to the evaporation chamber; The manifold is located on the side of the condensation chamber away from the evaporation chamber and is connected to the condensation chamber; A return pipe, one end of which is connected to the manifold and the other end of which is connected to the evaporation chamber.

2. The radiator according to claim 1, characterized in that: The angle between the condensation chamber and the evaporation chamber is set as A, where A is greater than 0° and less than 90°.

3. The radiator according to claim 1, characterized in that: The condensation chamber includes multiple microchannel plates, each with a through-channel microchannel that connects to the evaporation chamber and the manifold chamber.

4. The radiator according to claim 3, characterized in that: The microchannel plate is vertically arranged and tilted downwards from the end connected to the evaporation chamber to the end connected to the manifold.

5. The radiator according to claim 3, characterized in that: Multiple microchannel plates are arranged parallel to each other and spaced apart, and heat dissipation fins are provided between adjacent microchannel plates.

6. The radiator according to claim 5, characterized in that: The heat dissipation fins are continuously bent fins formed by stamping, with a bending angle of 90°-170°.

7. The radiator according to claim 3, characterized in that: The manifold includes a manifold cover plate and a manifold bottom plate. The manifold cover plate is connected to the microchannel plate and has a manifold hole communicating with the microchannel. The manifold bottom plate has a first reflux hole, and one end of the return pipe is connected to the first reflux hole.

8. The radiator according to claim 7, characterized in that: The evaporation chamber includes an evaporation chamber bottom plate and an evaporation chamber cover plate. The evaporation chamber cover plate is connected to the microchannel plate, and its upper part is provided with an evaporation hole communicating with the microchannel. The lower part of the evaporation chamber cover plate is provided with a second reflux hole, and the other end of the return pipe is connected to the second reflux hole.

9. The radiator according to claim 8, characterized in that: The bottom plate of the manifold and / or the bottom plate of the evaporation chamber are provided with connecting columns, and are connected to the corresponding cover plate of the manifold and / or the cover plate of the evaporation chamber through the connecting columns.

10. The radiator according to claim 1, characterized in that: The evaporation chamber, the condensation chamber, the manifold, and the return pipe together constitute a heat dissipation unit; the radiator includes two or more heat dissipation units stacked side by side.

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