Circuit board package module and inverter

Abstract

The application relates to the technical field of circuit boards, and provides a circuit board packaging module and an inverter. The circuit board packaging module comprises a circuit board and a cooler arranged on the back surface of the circuit board, and the cooler comprises: a shunt plate, which separates a cooling cavity of the cooler into a first layer flow channel and a second layer flow channel which are sequentially arranged on the back surface of the circuit board; a flow channel inlet and a flow channel outlet which are communicated with the cooling cavity; and at least one flow guide branch, which is arranged on the shunt plate and has a flow guide surface, the flow guide surface extends from the second layer flow channel to the first layer flow channel along the flow direction of the flow channel inlet to the flow channel outlet. Through the synergistic effect of the double-layer flow channel and the flow guide branch, the application optimizes the distribution of the cooling liquid, compensates the flow in the first layer flow channel, reduces the temperature in the first layer flow channel, solves the problem of poor cooling effect in the rear section of the first layer flow channel, and enhances the heat management performance and reliability of the circuit board.

Description

Technical Field

[0001] This application relates to the field of circuit board technology, and more specifically, to circuit board packaging modules and inverters. Background Technology

[0002] In existing circuit board cooling designs, as the coolant flows, the cooling effect deteriorates due to increased temperature and decreased flow rate, thus affecting the reliability and lifespan of the circuit board.

[0003] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to those skilled in the art. Utility Model Content

[0004] This application provides a circuit board packaging module and an inverter, which effectively guides fluid acceleration and compensates for flow rate through the design of a double-layer flow channel and a flow diversion port, thereby optimizing the cooling efficiency of the circuit board.

[0005] According to one aspect of this application, a circuit board packaging module is provided, including a circuit board and a cooler disposed on the back side of the circuit board. The cooler includes: a flow divider plate that divides the cooling cavity of the cooler into a first layer of flow channels and a second layer of flow channels sequentially distributed on the back side of the circuit board; a flow channel inlet and a flow channel outlet communicating with the cooling cavity; and at least one flow guide branch disposed on the flow divider plate, the flow guide branch having a flow guide surface that extends obliquely from the second layer of flow channels toward the first layer of flow channels in a flow direction from the flow channel inlet to the flow channel outlet.

[0006] In some embodiments, the included angle θ between the drainage surface and the diverting plate satisfies: 120°≤θ≤150°.

[0007] In some embodiments, the diversion branch is formed by slotting the diversion plate, and the diversion surface is formed by bending the edge of the diversion branch.

[0008] In some embodiments, the width of the diversion branch along the flow direction is greater than or equal to the height of the second layer flow channel.

[0009] In some embodiments, the drainage branch is disposed in the inlet region of the cooling chamber and is distributed at intervals in the main region between the inlet region and the outlet region of the cooling chamber.

[0010] In some embodiments, the height of the first flow channel is less than the height of the second flow channel, and the sum of the heights of the first flow channel and the second flow channel is less than or equal to the height of the flow channel inlet.

[0011] In some embodiments, a chip element is embedded in the circuit board, and a fin is provided on the back of the chip element. The fin extends into the first layer flow channel and is in clearance fit with the flow divider plate.

[0012] In some embodiments, the cooling cavity is formed by a cooling plate and a housing, wherein the cooling plate is sealed to the back of the circuit board and has a through hole for the fins to pass through, a pair of sides of the flow divider plate are connected to the housing or the cooling plate, and the other pair of sides of the flow divider plate are spaced apart from the flow channel inlet and the flow channel outlet.

[0013] In some embodiments, the flow channel inlet and the flow channel outlet are formed by liquid conduits that are sealed between the cooling plate and the housing.

[0014] According to another aspect of this application, an inverter is provided, the inverter being configured with a circuit board packaging module as described in any of the above embodiments, wherein: the inverter includes three bridge arm units, and the flow branch is provided at the entrance positions of the three bridge arm units and between adjacent bridge arm units.

[0015] The beneficial effects of this application compared to the prior art include at least the following:

[0016] The manifold divides the cooling chamber into a first-layer flow channel and a second-layer flow channel, allowing the coolant to flow in stratified layers. The coolant in the first-layer flow channel directly cools the circuit board, while the coolant in the second-layer flow channel cools the coolant in the first-layer flow channel. A flow branch allows for coolant exchange between the first and second-layer flow channels, and a flow guide surface directs coolant from the second-layer flow channel into the first-layer flow channel to compensate for the coolant flow rate in the first-layer flow channel, reducing its temperature and preventing the cooling effect from being affected by increased coolant temperature and decreased flow rate in the latter part of the first-layer flow channel. This enhances the thermal management performance and reliability of the circuit board.

[0017] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0018] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the specification, serve to explain the principles of this application. It is obvious that the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0019] Figure 1 This illustration shows a schematic diagram of the circuit board packaging module in an embodiment of this application.

[0020] Figure 2 This document shows a schematic diagram illustrating the parameter design of the circuit board packaging module in an embodiment of this application. Detailed Implementation

[0021] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to those described herein. Rather, these embodiments are provided to make this application more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art.

[0022] The accompanying drawings are merely illustrative of this application and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and therefore, repeated descriptions of them will be omitted.

[0023] The use of terms such as "first," "second," and similar words in the specific description does not indicate any order, quantity, or importance, but is merely used to distinguish different components. The terms "upper," "lower," "front," "back," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, in the description of this application, unless otherwise expressly specified and limited, the term "connection" should be interpreted broadly, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be a connection within two components.

[0024] It should be noted that, unless otherwise specified, the embodiments of this application and the features in different embodiments can be combined with each other. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0025] Figure 1 The diagram illustrates the structure of the circuit board packaging module in an embodiment of this application, with arrows indicating the flow path of the coolant. (Refer to...) Figure 1 As shown, the circuit board packaging module provided in this application embodiment includes a circuit board 100 and a cooler disposed on the back side of the circuit board 100, wherein the cooler includes:

[0026] The flow divider 300 divides the cooling chamber of the cooler into a first flow channel 210 and a second flow channel 220 that are sequentially distributed on the back of the circuit board 100.

[0027] The flow channel inlet 410 and the flow channel outlet 420 are connected to the cooling chamber (including the first layer flow channel 210 and the second layer flow channel 220);

[0028] At least one diversion branch 310 is provided on the diversion plate 300. The diversion branch 310 has a diversion surface 311, which extends obliquely from the second layer flow channel 220 to the first layer flow channel 210 along the flow direction X from the flow channel inlet 410 to the flow channel outlet 420.

[0029] The flow channel inlet 410 and flow channel outlet 420 connect to the cooling chamber to ensure coolant circulation and maintain the pressure balance and flow stability of the overall cooling system. The coolant can be lubricating oil, but is not limited to this. The manifold 300 divides the cooling chamber into a first flow channel 210 and a second flow channel 220, allowing the coolant to flow in layers. The coolant in the first flow channel 210 directly cools the circuit board 100, while the coolant in the second flow channel 220 can cool the coolant in the first flow channel 210. The flow branch 310 allows for coolant exchange between the first and second flow channels 210, and the flow surface 311 guides coolant from the second flow channel 220 into the first flow channel 210 to compensate for the coolant flow rate in the first flow channel 210, reducing the coolant temperature in the first flow channel 210 and preventing the cooling effect from being affected by increased coolant temperature and decreased flow rate in the latter part of the first flow channel 210.

[0030] This application optimizes the coolant distribution, compensates for the flow rate in the first flow channel 210, and reduces the temperature in the first flow channel 210 through the synergistic effect of the dual-layer flow channel (first flow channel 210 and second flow channel 220) and the diversion branch 310, thereby solving the problem of poor cooling effect in the rear section of the first flow channel 210 and enhancing the thermal management performance and reliability of the circuit board 100.

[0031] Figure 2 The diagram illustrates the parameter design of the circuit board packaging module, combined with... Figure 1 and Figure 2 As shown, in some embodiments, the included angle θ between the guide surface 311 and the distributor plate 300 satisfies: 120°≤θ≤150°. This ensures that the guide surface 311 guides the coolant at the optimal angle, reducing coolant pressure loss, improving guide efficiency, enhancing the dynamic performance of the coolant in the first flow channel 210, and thus improving the overall cooling effect.

[0032] In some embodiments, the flow branch 310 is formed by slotting the manifold 300, and the flow surface 311 is formed by bending the edge of the flow branch 310, which can provide a precise flow angle and surface smoothness, reduce coolant resistance, and improve the reliability of the flow surface 311. The manifold 300 can be made of plastic or aluminum alloy.

[0033] In some embodiments, the width w of the diversion branch 310 along the flow direction X is greater than or equal to the height h2 of the second layer flow channel 220, so as to guide the coolant in the second layer flow channel 220 into the first layer flow channel 210 as much as possible, effectively compensate the flow rate in the first layer flow channel 210, and improve acceleration efficiency and reduce pressure drop.

[0034] In some embodiments, the flow diversion branch 310 is disposed in the inlet region of the cooling chamber, allowing the coolant to fully enter the first layer flow channel 210 and avoiding insufficient cooling in the initial section of the first layer flow channel 210. Furthermore, the flow diversion branch 310 is spaced apart in the main region between the inlet and outlet regions of the cooling chamber to ensure that the coolant is continuously and uniformly accelerated in the first layer flow channel 210, preventing localized hot spots from appearing in the first layer flow channel 210, especially in the later section, thereby improving the heat exchange efficiency between the first layer flow channel 210 and the circuit board 100.

[0035] In some embodiments, the height h1 of the first flow channel 210 is less than the height h2 of the second flow channel 220, allowing the coolant to enter the first flow channel 210 more rapidly. The first flow channel 210 forms an acceleration zone, improving the heat exchange efficiency between the first flow channel 210 and the circuit board 100. The second flow channel 220 forms a horizontal flow zone, ensuring stable coolant flow. Furthermore, the sum of the heights of the first and second flow channels 210 (h1 + h2) is less than or equal to the height h3 of the flow channel inlet 410, allowing the coolant to enter the cooling chamber more rapidly overall, reducing pressure loss and thus improving cooling efficiency.

[0036] In some embodiments, a chip element 110 is embedded in the circuit board 100, and a fin 120 is provided on the back side of the chip element 110, which can increase the heat conduction area and improve heat dissipation efficiency. Furthermore, the fin 120 extends into the first layer flow channel 210 and is in clearance fit with the flow divider 300, which can force the coolant to pass through the fin 120, ensuring sufficient contact between the coolant and the fin 120 for heat exchange.

[0037] In a structure where fins 120 are provided on the back of the circuit board 100, the fins 120 have a significant impact on the resistance and temperature of the coolant. Without the flow diversion port 310 to facilitate coolant exchange between the first flow channel 210 and the second flow channel 220, the heat dissipation performance of the downstream chip element 110 would drastically decrease as the coolant flows. This application optimizes coolant distribution through the synergistic effect of the dual flow channels (first flow channel 210 and second flow channel 220) and the flow diversion port 310, effectively compensating for the flow rate in the first flow channel 210, reducing the temperature in the first flow channel 210, solving the problem of poor cooling effect in the downstream section of the first flow channel 210, and enhancing the thermal management performance and reliability of the circuit board 100.

[0038] Furthermore, in some embodiments, the cooling chamber is formed by the cooling plate 201 and the housing 202 to provide a sealed environment, prevent coolant leakage, and ensure system reliability. The cooling plate 201 is sealed to the back of the circuit board 100 and has through holes for the fins 120 to pass through, allowing the fins 120 to exchange heat with the coolant while maintaining a seal to prevent short circuits. One pair of sides of the diverter plate 300 is connected to the housing 202 or the cooling plate 201 to fix the position of the diverter plate 300 and prevent displacement or vibration. The other pair of sides of the diverter plate 300 are spaced apart from the flow channel inlet 410 and the flow channel outlet 420, allowing the coolant entering the cooling chamber to flow smoothly into each flow channel, and allowing the coolant in each flow channel to flow out through the flow channel outlet 420 for circulation.

[0039] In some embodiments, the flow channel inlet 410 and flow channel outlet 420 are formed by liquid piping to provide a standard interface for easy connection to an external cooling system. The liquid piping is sealed between the cooling plate 201 and the housing 202 to ensure a leak-free cooling chamber and enhance reliability.

[0040] In a specific example, according to the description of the above embodiments, the cooler of the circuit board packaging module has the following design parameters: the height h1 of the first layer flow channel 210 is 5mm to 10mm, the height h2 of the second layer flow channel 220 is 5mm to 10mm, the width w of the flow branch 310 along the flow direction X is 5mm to 10mm, the height h3 of the flow channel inlet 410 and the flow channel outlet 420 is 8mm to 15mm, the gap e between the fin 120 and the flow divider plate 300 is 0.5mm to 1.0mm, the inlet width f of the second layer flow channel 220 is 1mm to 3mm, and the included angle θ between the flow guide surface 311 and the flow divider plate 300 is 120° to 150°.

[0041] Based on experimental simulations and actual measurements, under various operating conditions, the flow velocity in the first-layer flow channel 210 (acceleration zone) is generally greater than that in the second-layer flow channel 220 (horizontal flow zone). Furthermore, as the coolant flows in the first-layer flow channel 210, its flow velocity gradually decreases while its temperature gradually increases. When it reaches the diversion branch 310, the flow rate in the first-layer flow channel 210 is compensated, resulting in an increase in flow velocity and a decrease in temperature, thus restoring the cooling effect. Therefore, by utilizing the design of a dual-layer flow channel (the first-layer flow channel 210 configured as the coolant acceleration zone and the second-layer flow channel 220 configured as the coolant horizontal flow zone) and the diversion branch 310, the problem of poor cooling effect in the latter part of the first-layer flow channel 210 is effectively solved, enhancing the thermal management performance and reliability of the circuit board 100.

[0042] This application also provides an inverter configured with a circuit board packaging module as described in any of the above embodiments. The inverter includes three bridge arm units for connecting the U, V, and W phase circuits respectively; each bridge arm unit includes an upper bridge arm and a lower bridge arm, each including a set of chip elements 110. Drainage branches 310 are provided at the entrance positions of the three bridge arm units and between adjacent bridge arm units to effectively cool the concentrated heat-generating areas of the inverter, preventing overheating of the bridge arm units, especially preventing insufficient cooling of downstream bridge arm units from affecting performance, thereby improving the overall heat dissipation capacity of the inverter and increasing its power density and operational stability.

[0043] Besides inverters, the circuit board packaging module of this application can also be applied to other scenarios requiring efficient heat dissipation. Utilizing a dual-layer flow channel design (a first-layer flow channel 210 configured as a coolant acceleration zone and a second-layer flow channel 220 configured as a coolant horizontal flow zone) and a flow branch 310, efficient and uniform heat dissipation of high-power-density electronic components can be achieved within a compact space. For example, the circuit board packaging module of this application can also be used in on-board chargers and drive controllers for new energy vehicles, industrial automation frequency converters, servo drives, and other high-heat-dissipation power electronic equipment, effectively improving the power density, reliability, and lifespan of various devices.

[0044] Finally, it should be noted that the above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of this application and should not be construed as limiting the specific implementation of this application to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of this application, and all such modifications or substitutions should be considered within the scope of protection of this application.

Claims

1. A circuit board packaging module, comprising a circuit board and a cooler disposed on the back side of the circuit board, characterized in that, The cooler includes: The flow divider plate divides the cooling chamber of the cooler into a first layer of flow channels and a second layer of flow channels that are sequentially distributed on the back of the circuit board. The flow channel inlet and flow channel outlet are connected to the cooling chamber; At least one diversion branch is provided on the flow divider plate, the diversion branch having a diversion surface that extends obliquely from the second layer flow channel to the first layer flow channel along the flow direction from the inlet of the flow channel to the outlet of the flow channel.

2. The circuit board packaging module as described in claim 1, characterized in that, The included angle θ between the drainage surface and the diverting plate satisfies: 120°≤θ≤150°.

3. The circuit board packaging module as described in claim 1, characterized in that, The diversion branch is formed by slotting the diversion plate, and the diversion surface is formed by bending the edge of the diversion branch.

4. The circuit board packaging module as described in claim 1, characterized in that, The width of the diversion branch along the flow direction is greater than or equal to the height of the second layer flow channel.

5. The circuit board packaging module as described in any one of claims 1 to 4, characterized in that, The diversion branch is located in the inlet area of ​​the cooling chamber and is distributed at intervals in the main area between the inlet area and the outlet area of ​​the cooling chamber.

6. The circuit board packaging module as described in claim 1, characterized in that, The height of the first flow channel is less than the height of the second flow channel, and the sum of the heights of the first and second flow channels is less than or equal to the height of the flow channel inlet.

7. The circuit board packaging module as described in claim 1, characterized in that, The circuit board contains embedded chip components, and the back of the chip components is provided with fins that extend into the first layer of flow channels and are in clearance fit with the flow divider plate.

8. The circuit board packaging module as described in claim 7, characterized in that, The cooling chamber is formed by a cooling plate and a housing, wherein the cooling plate is sealed to the back of the circuit board and has a through hole for the fins to pass through. A pair of sides of the flow divider are connected to the housing or the cooling plate, and the other pair of sides of the flow divider are spaced apart from the flow channel inlet and the flow channel outlet.

9. The circuit board packaging module as described in claim 8, characterized in that, The flow channel inlet and the flow channel outlet are formed by liquid pipelines, which are sealed between the cooling plate and the housing.

10. An inverter, characterized in that, The inverter is configured with a circuit board package module as described in any one of claims 1 to 9, wherein: The inverter includes three bridge arm units, and the flow branch is provided at the entrance position of the three bridge arm units and between adjacent bridge arm units.

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