Wafer drying apparatus

Abstract

The utility model provides a kind of wafer drying device. Wafer carrier for carrying wafer is arranged in drying guide groove, and sensor assembly for detecting whether wafer carrier is dumped is arranged in drying guide groove. Through the wafer drying device disclosed above, whether wafer carrier is dumped can be detected in real time through sensor assembly, and then when wafer carrier is tilted, wafer can be taken out in time, to avoid wafer carrier from being seriously dumped, and then to avoid wafer from being damaged.

Description

Technical Field

[0001] This utility model relates to the semiconductor field, specifically to a wafer drying device. Background Technology

[0002] A fully automatic RCA cleaning machine is a wafer cleaning equipment that uses the RCA cleaning method, which uses chemical agents such as solvents, acids, surfactants and water to spray, purify, oxidize, etch and dissolve contaminants, organic matter and metal ion contaminants on the wafer surface without damaging the wafer surface features. After each use of chemicals, it is necessary to thoroughly clean the wafer in ultrapure water and then use a wafer drying device to dry the wafer.

[0003] However, the support device used to carry the wafer in the wafer drying equipment is prone to deformation. After the deformed support device is introduced into the drying guide groove, the top knife will cause the support device to tip over under the drive of the cam mechanism, which will eventually lead to wafer damage. Utility Model Content

[0004] In view of this, the present invention provides a wafer drying apparatus to solve the problem in existing wafer drying apparatuses where the support device is prone to deformation, which in turn causes the support device to tip over after the top knife is introduced, ultimately leading to damage to the supported wafer.

[0005] To achieve the above objectives, the present invention provides the following technical solutions:

[0006] A wafer drying apparatus includes: a drying guide groove, a wafer carrier, and a sensor assembly;

[0007] The wafer carrier is placed inside the drying guide groove and is used to support the wafer.

[0008] The sensor assembly is located in the drying guide groove and is used to detect whether the wafer carrier is tilted.

[0009] Preferably, the sensor assembly includes: a transmitter and a receiver;

[0010] The transmitter and receiver are respectively located at both ends of the drying guide trough. The transmitter is used to transmit optical signals to the receiver, and the receiver is used to receive optical signals.

[0011] Preferably, the transmitter is fixed to the first end of the drying guide groove by a mounting plate, and the transmitter emits a light signal toward the highest point of the wafer.

[0012] Preferably, the mounting plate has multiple vertical slotted holes for bolts to pass through;

[0013] The mounting plate is fixed to the first end of the drying guide groove with bolts.

[0014] Preferably, transmitters are provided on both sides of the first end of the drying guide groove, and the path of the light signal emitted by the transmitter is tangent to the wafer;

[0015] Both sides of the second end of the drying guide channel are equipped with receivers corresponding to the transmitters on both sides of the first end of the drying guide channel.

[0016] Preferably, the transmitter is fixed to the first end of the drying guide groove by a mounting plate and a movable plate;

[0017] The mounting plate has multiple vertical slotted holes for bolts to pass through, and the mounting plate is fixed to the movable plate by bolts;

[0018] The movable plate has multiple transverse waist-shaped holes for bolts to pass through, and the movable plate is fixed to the first end of the drying guide groove by bolts.

[0019] Preferably, both the first and second ends of the drying guide groove are provided with light-transmitting windows for the passage of light signals;

[0020] Both the transmitter and receiver are located on the outside of the light-transmitting window.

[0021] Preferably, the wafer carrier includes: a first carrier plate, a second carrier plate, a first connecting plate, and a second connecting plate;

[0022] The first end of the first bearing plate is connected to the first end of the second bearing plate through the first connecting plate;

[0023] The second end of the second carrier plate is connected to the second end of the second carrier plate through the second connecting plate. The distance between the upper end of the first carrier plate and the upper end of the second carrier plate is greater than the diameter of the wafer, and the distance between the lower end of the first carrier plate and the lower end of the second carrier plate is less than the diameter of the wafer.

[0024] Both the inner side of the first carrier plate and the inner side of the second carrier plate are provided with slots for inserting the wafer.

[0025] Based on the wafer drying apparatus provided by this utility model, a wafer carrier for supporting the wafer is disposed in a drying guide groove, and a sensor assembly for detecting whether the wafer carrier is tilting is disposed in the drying guide groove. Through the disclosed wafer drying apparatus, the sensor assembly can detect in real time whether the wafer carrier is tilting, and thus, when the wafer carrier tilts, the wafer can be removed promptly, preventing serious tilting of the wafer carrier and thus avoiding wafer damage. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the structure of a wafer drying apparatus provided in an embodiment of the present invention;

[0028] Figure 2 This is a schematic diagram of the sensor assembly setup provided in an embodiment of the present utility model;

[0029] Figure 3 An enlarged view of point A provided for an embodiment of this utility model;

[0030] Figure 4 This is a schematic diagram of the structure of the wafer carrier provided in an embodiment of the present utility model;

[0031] Figure 5 A schematic diagram illustrating the principle of a sensor assembly configuration provided in an embodiment of this utility model;

[0032] Figure 6 This is a schematic diagram illustrating the setting principle of another sensor component provided in an embodiment of the present utility model.

[0033] The components include a drying guide 1, a light-transmitting window 11, a wafer carrier 2, a first carrier plate 21, a second carrier plate 22, a first connecting plate 23, a second connecting plate 24, a transmitter 31, a receiver 32, a mounting plate 4, and a movable plate 5. Detailed Implementation

[0034] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0035] This utility model embodiment provides a wafer drying apparatus, see [link to relevant documentation] Figure 1 and combined Figures 2 to 6 The wafer drying apparatus includes: a drying guide groove 1, a wafer carrier 2, and a sensor assembly;

[0036] The wafer carrier 2 is disposed in the drying guide groove 1, and the wafer carrier 2 is used to carry the wafer;

[0037] The sensor assembly is located in the drying guide 1 and is used to detect whether the wafer carrier 2 is tilted.

[0038] In this embodiment of the invention, a wafer carrier 2 for supporting the wafer is disposed within a drying guide groove 1, and a sensor assembly for detecting whether the wafer carrier 2 is tilted is disposed within the drying guide groove 1. Through the wafer drying apparatus disclosed above, the sensor assembly can detect in real time whether the wafer carrier 2 is tilting, and thus, when the wafer carrier 2 tilts, the wafer can be removed promptly, preventing serious tilting of the wafer carrier 2 and thus avoiding wafer damage.

[0039] Specifically, the sensor assembly includes: a transmitter 31 and a receiver 32;

[0040] The transmitter 31 and receiver 32 are respectively disposed at both ends of the drying guide trough 1. The transmitter 31 is used to transmit optical signals to the receiver 32, and the receiver 32 is used to receive optical signals.

[0041] It should be noted that the transmitter 31 and receiver 32 are respectively set at both ends of the drying guide groove 1, and the transmitter 31 transmits light signals to the receiver 32 and the receiver 32 receives light signals. Therefore, whether the wafer carrier 2 is tilted can be determined by whether the receiver 32 receives light signals.

[0042] For details, please refer to Figure 5 The transmitter 31 is fixed to the first end of the drying guide groove 1 by the mounting plate 4, and the transmitter 31 emits light signals to the highest point of the wafer.

[0043] It should be noted that after the wafer is placed on the wafer carrier 2, its overall height is constant. The transmitter 31 is fixed to the first end of the drying guide groove 1 by the mounting plate 4, and the transmitter 31 emits a light signal towards the highest point of the wafer. If the wafer carrier 2 is not tilted, the wafer will block the light signal emitted by the transmitter 31, and the receiver 32 will not be able to receive the light signal. However, when the wafer carrier 2 is tilted, the highest point of the wafer cannot block the light signal emitted by the transmitter 31, and the receiver 32 can receive the light signal emitted by the transmitter 31. Therefore, this application can determine whether the wafer carrier 2 has tilted by whether the receiver 32 receives the light signal emitted by the transmitter 31.

[0044] Furthermore, the mounting plate 4 has multiple vertical slotted holes for bolts to pass through;

[0045] Mounting plate 4 is fixed to the first end of drying guide groove 1 by bolts.

[0046] It should be noted that by opening multiple vertical waist-shaped holes for bolts to pass through in the mounting plate 4, and fixing the mounting plate 4 to the first end of the drying guide groove 1 with bolts, the position of the transmitter 31 can be adjusted according to the wafers of different sizes, so as to ensure that the wafer carrier 2 can block the light signal emitted by the transmitter 31 at the highest point of the wafer when it is not tilted.

[0047] It is worth noting that when the mounting plate 4 is fixed to the drying guide 1 by bolts, the mounting plate 4 can be fixed to the drying guide 1 by the bolts and nuts, or the bolt holes that mate with the bolts can be opened in the drying guide 1 to achieve fixation. Those skilled in the art can choose according to their needs.

[0048] Further, refer to Figure 2 and Figure 3 and combined Figure 6 Both sides of the first end of the drying guide groove 1 are provided with transmitters 31, and the path of the light signal emitted by the transmitters 31 is tangent to the wafer.

[0049] Both sides of the second end of the drying guide trough 1 are provided with receivers 32 corresponding to the transmitters 31 on both sides of the first end of the drying guide trough 1.

[0050] It should be noted that by setting transmitters 31 on both sides of the first end of the drying guide groove 1, and making the path of the light signal emitted by the transmitters 31 tangent to the wafer, and by setting receivers 32 on both sides of the second end of the drying guide groove 1 corresponding to the transmitters 31 on both sides of the first end of the drying guide groove 1, when the wafer carrier 2 is not tilted, the light signals emitted by the two transmitters 31 at the first end of the drying guide groove 1 can be received by the two receivers 32 at the second end. When the wafer carrier 2 is tilted, the wafer will block the light signal emitted by one of the transmitters 31. Therefore, whether the wafer carrier 2 is tilted can be determined by whether the two receivers 32 receive the light signal.

[0051] Specifically, the transmitter 31 is fixed to the first end of the drying guide trough 1 by the mounting plate 4 and the movable plate 5;

[0052] Mounting plate 4 has multiple vertical slotted holes for bolts to pass through, and mounting plate 4 is fixed to movable plate 5 by bolts;

[0053] The movable plate 5 has multiple transverse waist-shaped holes for bolts to pass through, and the movable plate 5 is fixed to the first end of the drying guide groove 1 by bolts.

[0054] It should be noted that by opening multiple vertical oblong holes for bolts to pass through in the mounting plate 4, and fixing the mounting plate 4 to the movable plate 5 with bolts, and opening multiple horizontal oblong holes for bolts to pass through in the movable plate 5, and fixing the movable plate 5 to the first end of the drying guide groove 1 with bolts, the transmitter 31 can not only be adjusted left and right, but also adjusted in the height direction. Thus, the position of the transmitter 31 can be adjusted by bolts according to the wafer size, so as to ensure that when the wafer carrier 2 is not tilted, both receivers 32 can receive the light signal emitted by the corresponding transmitter 31. When the wafer carrier 2 is tilted, the wafer can block the light signal emitted by one of the transmitters 31.

[0055] Specifically, both the first and second ends of the drying guide trough 1 are provided with light-transmitting windows 11 for the passage of light signals;

[0056] Both the transmitter 31 and the receiver 32 are located on the outside of the light-transmitting window 11.

[0057] It should be noted that by setting light-transmitting windows 11 for light signals to pass through at the first and second ends of the drying guide groove 1, and by placing both the transmitter 31 and the receiver 32 outside the light-transmitting windows 11, damage to the wafer carrier 2 caused by tipping over and hitting the transmitter 31 or the receiver 32 is avoided.

[0058] Specifically, the chip carrier 2 includes: a first carrier plate 21, a second carrier plate, a first connecting plate 23, and a second connecting plate 24;

[0059] The first end of the first bearing plate 21 is connected to the first end of the second bearing plate via the first connecting plate 23;

[0060] The second end of the second carrier plate is connected to the second end of the second carrier plate via the second connecting plate 24. The distance between the upper end of the first carrier plate 21 and the upper end of the second carrier plate is greater than the diameter of the wafer, and the distance between the lower end of the first carrier plate 21 and the lower end of the second carrier plate is less than the diameter of the wafer.

[0061] Both the inner side of the first carrier plate 21 and the inner side of the second carrier plate are provided with slots for inserting the wafer.

[0062] It should be noted that the first end of the first carrier plate 21 is connected to the first end of the second carrier plate through the first connecting plate 23, and the second end of the second carrier plate is connected to the second end of the second carrier plate through the second connecting plate 24. The distance between the upper end of the first carrier plate 21 and the upper end of the second carrier plate is greater than the diameter of the wafer, and the distance between the lower end of the first carrier plate 21 and the lower end of the second carrier plate is less than the diameter of the wafer. Thus, after the wafer is inserted into the slot, the lower part of the first carrier plate 21 and the lower part of the second carrier plate simultaneously support the wafer, and the ejector can lift the wafer in the carrier under the rotation of the cam structure.

[0063] Based on the wafer drying apparatus provided in the above embodiments, this utility model also provides a cleaning device, which includes: a feeding area, a chemical solution tank, a drying tank, and a discharging area;

[0064] The feeding area, the liquid medicine tank, the drying tank, and the unloading area are arranged in sequence.

[0065] The drying guide 1, the wafer carrier 2, and the sensor assembly are disposed in the drying tank;

[0066] The wafer carrier 2 is disposed in the drying guide groove 1, and the wafer carrier 2 is used to carry the wafer;

[0067] The sensor assembly is located in the drying guide 1 and is used to detect whether the wafer carrier 2 is tilted.

[0068] In this embodiment of the invention, a wafer carrier 2 for supporting the wafer is disposed within a drying guide groove 1, and a sensor assembly for detecting whether the wafer carrier 2 is tilted is disposed within the drying guide groove 1. Through the wafer drying apparatus disclosed above, the sensor assembly can detect in real time whether the wafer carrier 2 is tilting, and thus, when the wafer carrier 2 tilts, the wafer can be removed promptly, preventing serious tilting of the wafer carrier 2 and thus avoiding wafer damage.

[0069] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A wafer drying apparatus, characterized in that, include: Drying guide channels, wafer carriers, and sensor assemblies; The wafer carrier is disposed in the drying guide groove, and the wafer carrier is used to carry the wafer; The sensor assembly is disposed in the drying guide groove, and the sensor assembly is used to detect whether the wafer carrier is tilted.

2. The wafer drying apparatus according to claim 1, characterized in that, The sensor assembly includes: a transmitter and a receiver; The transmitter and the receiver are respectively disposed at both ends of the drying guide groove. The transmitter is used to transmit optical signals to the receiver, and the receiver is used to receive the optical signals.

3. The wafer drying apparatus according to claim 2, characterized in that, The transmitter is fixed to the first end of the drying guide groove by a mounting plate, and the transmitter emits a light signal toward the highest point of the wafer.

4. The wafer drying apparatus according to claim 3, characterized in that, The mounting plate has multiple vertical slotted holes for bolts to pass through; The mounting plate is fixed to the first end of the drying guide groove by bolts.

5. The wafer drying apparatus according to claim 2, characterized in that, The transmitters are provided on both sides of the first end of the drying guide groove, and the path of the light signal emitted by the transmitters is tangent to the wafer. Both sides of the second end of the drying guide channel are provided with receivers corresponding to the transmitters on both sides of the first end of the drying guide channel.

6. The wafer drying apparatus according to claim 5, characterized in that, The transmitter is fixed to the first end of the drying guide groove by a mounting plate and a movable plate; The mounting plate has multiple vertical slotted holes for bolts to pass through, and the mounting plate is fixed to the movable plate by bolts; The movable plate has multiple transverse waist-shaped holes for bolts to pass through, and the movable plate is fixed to the first end of the drying guide groove by bolts.

7. The wafer drying apparatus according to any one of claims 2 to 6, characterized in that, Both the first and second ends of the drying guide groove are provided with light-transmitting windows for the passage of light signals; Both the transmitter and the receiver are located on the outside of the light-transmitting window.

8. The wafer drying apparatus according to claim 1, characterized in that, The wafer carrier includes: a first carrier plate, a second carrier plate, a first connecting plate, and a second connecting plate; The first end of the first bearing plate is connected to the first end of the second bearing plate via the first connecting plate; The second end of the second carrier plate is connected to the second end of the second carrier plate through the second connecting plate, wherein the distance between the upper end of the first carrier plate and the upper end of the second carrier plate is greater than the diameter of the wafer, and the distance between the lower end of the first carrier plate and the lower end of the second carrier plate is less than the diameter of the wafer. Both the inner side of the first carrier plate and the inner side of the second carrier plate are provided with slots for inserting the wafer.

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