An integrated circuit patch processing and production drying device

Abstract

The utility model discloses a kind of integrated circuit patch processing production is dried with drying device, including first conveyor and second conveyor, the outside of the first conveyor is provided with second conveyor, the top end lateral wall of the second conveyor is equipped with drying cabinet, the top end of the drying cabinet is equipped with hollow box, the top end of the hollow box is equipped with two groups of conveying pipeline, the lateral wall of the drying cabinet is equipped with screen display control panel, the side of the drying cabinet lateral wall close to screen display control panel is equipped with processor. The utility model not only realizes that integrated circuit patch is conveniently dried multiple times by patch processing production drying device, improves the convenience of integrated circuit patch to be dried multiple times by patch processing production drying device, and conveniently realizes that integrated circuit patch is dried by patch processing production drying device flip angle, improves the efficiency of integrated circuit patch to be dried by patch processing production drying device flip angle.

Description

Technical Field

[0001] This utility model relates to the technical field of drying devices for chip mounting production, specifically a drying device for integrated circuit chip mounting production. Background Technology

[0002] Surface Mount Technology (SMT) is a key circuit packaging technology in modern electronics. This technology mounts circuit chips onto small plastic or ceramic packages and fixes them to printed circuit boards using soldering techniques to achieve circuit functions. Its significant features are small size, low power consumption, and high reliability, which make it widely used in many fields such as electronics, communications, and computers.

[0003] As disclosed in the authorization announcement number CN214637957U, a drying device for surface mount integrated circuit processing includes a drying box and a cooling box: an electric heating plate is installed on the top of the inner wall of the drying box, a first through groove and a second through groove are respectively opened on the front and back of the drying box, a placement plate is slidably connected to the inner wall of the first through groove, and slide rails are installed on both sides of the inner wall of the drying box, with the placement plate slidably connected to the inner wall of the slide rail; Although it achieves the effect of conveniently placing integrated circuits in the curing oven when the temperature is high, by setting up a placement plate, a locking strip, a locking mechanism and a pull rod, the placement plate is set with a long slot that matches the integrated circuit board. After the integrated circuit is placed, the placement plate is pushed into the drying oven for drying. The placement plate is fixedly connected to the locking mechanism by the locking strip. After drying, the placement plate is pulled out by the pull rod. The operation does not require contact with the inside of the drying oven. This achieves the effect of conveniently placing integrated circuits in the curing oven when the temperature is high. It solves the problem that it is not easy to put integrated circuits in the curing oven when the curing oven is preheated and then placed. However, this does not solve the problem that existing drying devices for surface mount technology (SMT) processing are generally not suitable for multiple drying of integrated circuit SMT components, which affects the convenience of multiple drying of integrated circuit SMT components and makes it difficult for the drying device to easily rotate at different angles for drying, thus affecting the efficiency of the drying device to rotate at different angles for drying. Utility Model Content

[0004] The purpose of this utility model is to provide a drying device for integrated circuit chip mounting production, so as to solve the problems mentioned in the background art, which are that the drying device for chip mounting production is not convenient for drying integrated circuit chips multiple times, which affects the convenience of drying integrated circuit chips multiple times, and is not convenient for the drying device to easily flip the angle for drying, which affects the efficiency of the drying device to flip the angle for drying.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a drying device for integrated circuit chip mounting production, comprising a first conveyor and a second conveyor. The second conveyor is disposed outside the first conveyor. A drying chamber is installed on the top side wall of the second conveyor. A hollow box is installed on the top of the drying chamber. Two sets of conveying pipes are installed on the top of the hollow box. A display control panel is installed on the side wall of the drying chamber. A processor is installed on the side wall of the drying chamber near the display control panel. Bases are placed on the surfaces of both the first and second conveyors. An equal-spaced... The system comprises multiple chambers, each equipped with an electric pump on its sidewall. The output end of each pump is fitted with a first flexible hose, the side of which extends away from the chamber into the interior of a delivery pipe. Each chamber has an air supply duct at its top, and protective covers are symmetrically installed on the top of the outer chambers of each air supply duct. Each air supply duct is connected to a hollow box. Second flexible hoses are installed on both sides of each air supply duct, and these second hoses are connected to the protective covers. Heating elements are installed at the bottom of the inner interior of each protective cover. Temperature sensors are symmetrically installed on the inner walls of each chamber, and an axial flow fan is installed inside each air supply duct.

[0006] Preferably, limit plates are symmetrically installed on both sides of the drying box, and support frames are installed on both sides of the drying box outside the limit plates.

[0007] Preferably, each of the support frames is equipped with a first electric push rod at its top, and each of the first electric push rods is equipped with a push plate at its output end, and each of the push plates is equipped with a baffle on its side wall.

[0008] Preferably, all the baffles are slidably connected to the limiting plate, all the side walls of the base are equipped with connecting plates, and all the top of the base is equipped with a left L-shaped frame.

[0009] Preferably, a right L-shaped frame is installed on the side of the base away from the left L-shaped frame, a servo motor is installed on the side wall of the connecting plate, and a rotating shaft is installed on the output end of the servo motor.

[0010] Preferably, all the rotating shafts extend through the left L-shaped frame to its outside, and a left clamping plate is installed on the side of each rotating shaft away from the servo motor.

[0011] Preferably, a second electric push rod is installed on the side wall of the right L-shaped frame, and an adapter sleeve is installed on the output end of the second electric push rod.

[0012] Preferably, a right clamping plate is movably installed on the side wall of the adapter sleeve, and the output end of the display control panel is electrically connected to the input ends of the first conveyor, the second conveyor, the processor, the electric heating tube, the temperature sensor, the axial flow fan, the first electric push rod, the servo motor, the second electric push rod, and the electric pump.

[0013] Compared with the prior art, the beneficial effects of this utility model are: the drying device for chip processing production not only realizes the convenient multiple drying of integrated circuit chips, improving the convenience of multiple drying of integrated circuit chips, but also realizes the convenient rotation angle drying of the drying device, improving the efficiency of rotation angle drying. (1) The second conveyor drives the base and integrated circuit chips to move into the drying chamber. The axial flow fan draws the air from the hollow box into the air supply duct and then delivers it to the protective cover through the second hose. The heated air enters the chamber to dry the integrated circuit chips. Multiple electric pumps are turned on to draw the air from the chamber into the first hose and then deliver it to the hollow box for reuse. The base is manually moved to the surface of the first conveyor and the first conveyor is turned on to deliver the chips. This cycle is repeated, which realizes the drying device for chip processing production to dry integrated circuit chips multiple times. This increases the degree of drying of integrated circuit chips and improves the convenience of the drying device for chip processing production to dry integrated circuit chips multiple times. (2) The integrated circuit chip is placed on the surface of the left clamping plate above the base. The second electric push rod drives the adapter sleeve and the right clamping plate to move. With the support of the left clamping plate, the right clamping plate presses the integrated circuit chip tightly. The servo motor drives the rotating shaft to rotate. The rotating shaft drives the left clamping plate, the integrated circuit chip, and the right clamping plate to rotate, so that the integrated circuit chip is rotated at a certain angle for drying. When the base enters the interior of the drying chamber, the first electric push rod drives the push plate to move downward. With the sliding support of the baffle and the limiting plate, the push plate drives the baffle to move downward, closing the drying chamber. This realizes the convenient rotation angle drying of the drying device for chip processing production, increases the drying range, and improves the efficiency of the rotation angle drying of the drying device for chip processing production. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a front view structural diagram of the present utility model; Figure 3 This is a three-dimensional structural diagram of the drying oven of this utility model; Figure 4 This is a three-dimensional structural diagram of the first flexible tube of this utility model; Figure 5 This is a three-dimensional structural diagram of the air supply duct of this utility model; Figure 6 This is a three-dimensional structural diagram of the electric heating tube of this utility model; Figure 7 This is a three-dimensional structural diagram of the axial flow fan of this utility model; Figure 8 This is a three-dimensional structural diagram of the baffle of this utility model; Figure 9 This is a three-dimensional structural diagram of the base of this utility model.

[0015] In the diagram: 1. First conveyor; 2. Second conveyor; 3. Drying oven; 4. Hollow box; 5. Conveying pipe; 6. Display control panel; 7. Processor; 8. Base; 9. First hose; 10. Chamber; 11. Protective cover; 12. Air supply duct; 13. Second hose; 14. Heating element; 15. Temperature sensor; 16. Axial flow fan; 17. Limiting plate; 18. Support frame; 19. First electric push rod; 20. Push plate; 21. Baffle; 22. Left L-shaped frame; 23. Right L-shaped frame; 24. Connecting plate; 25. Servo motor; 26. Rotating shaft; 27. Left clamping plate; 28. Second electric push rod; 29. ​​Right clamping plate; 30. Adapter sleeve; 31. Electric pump. Detailed Implementation

[0016] To further illustrate the technical means and effects adopted by this utility model in order to achieve the intended utility model purpose, the following detailed description of the specific implementation methods, structure, features and effects of this utility model is provided in conjunction with the accompanying drawings and preferred embodiments.

[0017] Please see Figure 1-9This utility model provides an embodiment of a drying device for integrated circuit chip mounting production, comprising a first conveyor 1 and a second conveyor 2. The second conveyor 2 is disposed outside the first conveyor 1. A drying chamber 3 is installed on the top side wall of the second conveyor 2. A hollow box 4 is installed on the top of the drying chamber 3. Two sets of conveying pipes 5 are installed on the top of the hollow box 4. A display control panel 6 is installed on the side wall of the drying chamber 3. A processor 7 is installed on the side wall of the drying chamber 3 near the display control panel 6. Bases 8 are placed on the surfaces of both the first conveyor 1 and the second conveyor 2. Multiple sets of equally spaced chambers 10 are installed inside the drying chamber 3. Electric pumps 31 are installed on the side walls. The output end of each electric pump 31 is equipped with a first hose 9. The side of the first hose 9 away from the chamber 10 extends into the interior of the delivery pipe 5. An air supply pipe 12 is installed at the top of each chamber 10. A protective cover 11 is symmetrically installed at the top of each chamber 10 outside the air supply pipe 12. The air supply pipe 12 is connected to the hollow box 4. A second hose 13 is installed on both sides of the air supply pipe 12. The second hose 13 is connected to the protective cover 11. An electric heating tube 14 is installed at the bottom of the interior of the protective cover 11. Temperature sensors 15 are symmetrically installed on the inner wall of each chamber 10. An axial flow fan 16 is installed inside the air supply pipe 12. When using the drying device for integrated circuit surface mount processing, the integrated circuit surface mount is placed on top of the base 8 and clamped. The control panel 6 is operated to turn on the second conveyor 2, which moves the base 8 and the integrated circuit surface mount into the drying chamber 3. Multiple axial flow fans 16 are turned on, drawing air from the hollow chamber 4 into the air supply duct 12, which then delivers it through the second hose 13 to the protective cover 11. The heating element 14 inside the protective cover 11 is turned on to heat the air. The heated air enters the chamber 10 to dry the integrated circuit surface mount. Multiple electric pumps 31 are turned on to pump air from the chamber 10. The material is drawn into the first hose 9 and transported to the hollow box 4 for reuse. It is monitored by the temperature sensor 15, processed by the processor 7, and then displayed on the surface of the display control panel 6. When the temperature exceeds the range, the temperature of the heating element 14 is adjusted by operating the display control panel 6. After drying, the base 8 is manually moved to the surface of the first conveyor 1 and the first conveyor 1 is turned on for conveying. This cycle is repeated, which realizes the convenient multiple drying of integrated circuit chips in the chip processing production drying device, increases the degree of drying of integrated circuit chips, and improves the convenience of multiple drying of integrated circuit chips in the chip processing production drying device. Limiting plates 17 are symmetrically installed on both sides of the drying oven 3, and support frames 18 are installed on both sides of the drying oven 3 outside the limiting plates 17. The top of each support frame 18 is equipped with a first electric push rod 19, the output end of each first electric push rod 19 is equipped with a push plate 20, and the side wall of each push plate 20 is equipped with a baffle 21. All baffles 21 are slidably connected to the limiting plate 17, and all the side walls of the base 8 are equipped with connecting plates 24. All the top of the base 8 is equipped with a left L-shaped frame 22. A right L-shaped frame 23 is installed on the side of the base 8 away from the left L-shaped frame 22. A servo motor 25 is installed on the side wall of the connecting plate 24. A rotating shaft 26 is installed on the output end of the servo motor 25. All rotating shafts 26 extend through the left L-shaped frame 22 to its outside, and a left clamping plate 27 is installed on the side of the rotating shaft 26 away from the servo motor 25. A second electric push rod 28 is installed on the side wall of the right L-shaped frame 23, and an adapter sleeve 30 is installed on the output end of the second electric push rod 28. Right clamping plates 29 are movably installed on the side walls of the adapter sleeve 30. The output end of the screen display control panel 6 is electrically connected to the input end of the first conveyor 1, the second conveyor 2, the processor 7, the electric heating tube 14, the temperature sensor 15, the axial flow fan 16, the first electric push rod 19, the servo motor 25, the second electric push rod 28, and the electric pump 31. When it is necessary to clamp and flip the integrated circuit chip, place the integrated circuit chip on the surface of the left clamping plate 27 above the base 8, open the second electric push rod 28, and with the support of the right L-shaped bracket 23, the second electric push rod 28 drives the adapter sleeve 30 and the right clamping plate 29 to move. With the support of the left clamping plate 27, the right clamping plate 29 clamps the integrated circuit chip tightly. When rotation is required, open the servo motor 25, and with the support of the connecting plate 24, the servo motor 25 drives the rotating shaft 26 to rotate. With the support of the left L-shaped bracket 22 and the movable support of the adapter sleeve 30, the rotating shaft 26 drives the left clamping plate 27. The integrated circuit chip and the right clamping plate 29 rotate, causing the integrated circuit chip to flip at a certain angle for drying. When the base 8 enters the drying chamber 3, the first electric push rod 19 is opened. Under the support of the support frame 18, the first electric push rod 19 drives the push plate 20 to move downward. Under the sliding support of the baffle 21 and the limiting plate 17, the push plate 20 drives the baffle 21 to move downward, closing the drying chamber 3. This realizes the convenient flipping angle drying of the drying device for chip processing production, increases the drying range, and improves the efficiency of the flipping angle drying of the drying device for chip processing production.

[0018] Working principle: The second conveyor 2 moves the base 8 and the integrated circuit chip into the drying chamber 3. The axial flow fan 16 draws air from the hollow chamber 4 into the air supply duct 12, and then transports it through the second hose 13 to the protective cover 11. The heated air enters the chamber 10 to dry the integrated circuit chip. Multiple electric pumps 31 are turned on to draw air from the chamber 10 into the first hose 9, and then transport it back to the hollow chamber 4 for reuse. The base 8 is manually moved to the surface of the first conveyor 1, and the first conveyor 1 is turned on to transport the chips. This process is repeated. The integrated circuit chip is placed on the left clamp above the base 8. On the surface of 27, the second electric push rod 28 drives the adapter sleeve 30 and the right clamping plate 29 to move. With the support of the left clamping plate 27, the right clamping plate 29 clamps the integrated circuit chip. The servo motor 25 drives the rotating shaft 26 to rotate. The rotating shaft 26 drives the left clamping plate 27, the integrated circuit chip, and the right clamping plate 29 to rotate, causing the integrated circuit chip to flip at a certain angle for drying. When the base 8 enters the interior of the drying chamber 3, the first electric push rod 19 drives the push plate 20 to move downward. With the sliding support of the baffle 21 and the limiting plate 17, the push plate 20 drives the baffle 21 to move downward, closing the drying chamber 3, thus completing the use of the drying device for chip processing production.

[0019] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any indirect modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the scope of the present utility model shall still fall within the scope of the present utility model.

Claims

1. A drying apparatus for integrated circuit surface mount processing, characterized in that: Includes a first conveyor (1) and a second conveyor (2). The second conveyor (2) is installed outside the first conveyor (1). A drying box (3) is installed on the top side wall of the second conveyor (2). A hollow box (4) is installed on the top of the drying box (3). Two sets of conveying pipes (5) are installed on the top of the hollow box (4). A screen display control panel (6) is installed on the side wall of the drying box (3). A processor (7) is installed on the side wall of the drying box (3) near the screen display control panel (6). A base (8) is placed on the surface of both the first conveyor (1) and the second conveyor (2). Multiple sets of equally spaced chambers (10) are installed inside the drying box (3). An electric pump (31) is installed on the side wall of each chamber (10). The output end of each of the 31) is equipped with a first flexible hose (9). The side of the first flexible hose (9) away from the chamber (10) extends into the interior of the delivery pipe (5). The top of each chamber (10) is equipped with an air supply pipe (12). The top of each external chamber (10) of the air supply pipe (12) is symmetrically equipped with a protective cover (11). The air supply pipe (12) is connected to the hollow box (4). The two sides of each air supply pipe (12) are equipped with a second flexible hose (13). The second flexible hose (13) is connected to the protective cover (11). The bottom of the interior of each protective cover (11) is equipped with an electric heating tube (14). Temperature sensors (15) are symmetrically installed on the inner wall of each chamber (10). An axial flow fan (16) is installed inside each air supply pipe (12).

2. The drying apparatus for integrated circuit surface mount processing according to claim 1, characterized in that: Limiting plates (17) are symmetrically installed on both sides of the drying box (3), and support frames (18) are installed on both sides of the drying box (3) outside the limiting plates (17).

3. The drying apparatus for integrated circuit chip mounting production according to claim 2, characterized in that: The top of each support frame (18) is equipped with a first electric push rod (19), the output end of each first electric push rod (19) is equipped with a push plate (20), and the side wall of each push plate (20) is equipped with a baffle (21).

4. The drying apparatus for integrated circuit surface mount processing according to claim 3, characterized in that: All baffles (21) are slidably connected to the limiting plate (17), and all the side walls of the base (8) are equipped with connecting plates (24). All the top of the base (8) are equipped with left L-shaped brackets (22).

5. A drying apparatus for integrated circuit surface mount processing according to claim 4, characterized in that: A right L-shaped frame (23) is installed on the side of the base (8) away from the left L-shaped frame (22). A servo motor (25) is installed on the side wall of the connecting plate (24). A rotating shaft (26) is installed at the output end of the servo motor (25).

6. The drying apparatus for integrated circuit surface mount processing according to claim 5, characterized in that: The rotating shafts (26) all extend through the left L-shaped frame (22) to its outside, and the left clamping plate (27) is installed on the side of the rotating shafts (26) away from the servo motor (25).

7. A drying apparatus for integrated circuit surface mount processing according to claim 6, characterized in that: The right L-shaped frame (23) is equipped with a second electric push rod (28) on its side wall, and the output end of the second electric push rod (28) is equipped with an adapter sleeve (30).

8. The drying apparatus for integrated circuit chip mounting production according to claim 7, characterized in that: The right clamp (29) is movably installed on the side wall of the adapter sleeve (30). The output end of the screen display control panel (6) is electrically connected to the input end of the first conveyor (1), the second conveyor (2), the processor (7), the electric heating tube (14), the temperature sensor (15), the axial flow fan (16), the first electric push rod (19), the servo motor (25), the second electric push rod (28), and the electric pump (31).

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