Optical module heat dissipation structure

Abstract

The utility model discloses a kind of optical module heat dissipation structures, optical module has with the assembling face of heat dissipation module assembly, assembling face is equipped with mounting groove, heat conduction component is equipped in mounting groove, heat conduction component is limited between heat dissipation module and optical module, and abuts on the side of heat dissipation module towards optical module, in vertical to the vertical direction of horizontal plane, heat conduction component has the top surface higher than the upper surface of mounting groove, and at least one end portion located in mounting groove.Compared with prior art, the utility model can solve the problem that the heat conduction efficiency between optical module and heat dissipation module is poor, the heat of optical module cannot be efficiently transmitted to heat dissipation module, affecting the service life of optical module and energy waste.

Description

Technical Field

[0001] This utility model relates to a heat dissipation structure for an optical module, belonging to the field of heat dissipation. Background Technology

[0002] Optical modules are core components of optical communication equipment, and they generate a lot of heat during operation. To ensure the normal operation of optical modules and extend their service life, the heat they generate must be efficiently conducted to an external heat dissipation module.

[0003] Currently, the conventional heat dissipation method involves direct contact between the metal casing of the optical module (such as aluminum or zinc alloy) and the metal surface of the heat dissipation module (such as aluminum, copper, or liquid cooling plates) for heat conduction. However, this method has inherent drawbacks: due to limitations in manufacturing and assembly processes, the contact surfaces of both the optical module casing and the heat dissipation module exhibit varying degrees of deformation, resulting in an unstable "point contact" rather than an ideal "surface contact" after assembly. This significantly increases the interfacial thermal resistance and severely reduces heat transfer efficiency.

[0004] In view of this, it is indeed necessary to improve the existing heat dissipation structure of optical modules in order to solve the above problems. Utility Model Content

[0005] To address the aforementioned technical problems, this utility model provides a heat dissipation structure for an optical module. This structure can solve the problem of poor heat conduction efficiency between the optical module and the heat dissipation module, which prevents the heat from the optical module from being efficiently transferred to the heat dissipation module, thus affecting the lifespan of the optical module and causing energy waste.

[0006] The technical solution of this utility model is:

[0007] A heat dissipation structure for an optical module, wherein the optical module has an assembly surface for assembling with a heat dissipation module, the assembly surface is provided with a mounting groove, a heat-conducting component is provided in the mounting groove, the heat-conducting component is constrained between the heat dissipation module and the optical module, and abuts against the side of the heat dissipation module facing the optical module, and in a vertical direction perpendicular to the horizontal plane, the heat-conducting component has a top surface higher than the upper surface of the mounting groove, and at least one end located in the mounting groove.

[0008] As a further improvement of this utility model, the heat-conducting component includes a heat-conducting part that abuts against the heat dissipation module and a guide part located on at least one side of the heat-conducting part. The side of the guide part away from the heat-conducting part is located in the mounting groove, and the guide part is an inclined surface extending toward the optical module.

[0009] As a further improvement of this utility model, a gap is provided between one end of the guide portion relative to the heat-conducting portion and the upper surface of the mounting groove, and the gap is between 0-0.2mm.

[0010] As a further improvement of this utility model, there are two guide portions, which are respectively located on opposite sides of the heat-conducting portion. The mounting groove is provided with a mounting surface corresponding to the heat-conducting component, and the heat-conducting component is attached to the mounting surface.

[0011] As a further improvement of this utility model, the heat-conducting component includes a heat-conducting film fixed in the mounting groove and a metal sheet formed on the side of the heat-conducting film opposite to the mounting groove, the metal sheet abutting against the heat dissipation module.

[0012] As a further improvement of this utility model, the metal sheet is provided with slots, and the thermally conductive film abuts against the heat dissipation module through the slots.

[0013] As a further improvement of this utility model, the slots are provided in multiple ways and arranged in an array on the metal sheet.

[0014] As a further improvement of this utility model, the thermally conductive film has a groove on the side facing the metal sheet, and an adhesive is provided in the groove. The groove and the slot are misaligned with each other.

[0015] As a further improvement of this utility model, the grooves are provided in multiple ways and arranged in an array on the thermally conductive film, and the slots are provided between two adjacent rows of grooves.

[0016] As a further improvement of this utility model, the metal sheet is fixed in the mounting groove by adhesive.

[0017] The beneficial technical effects of this utility model are as follows: By providing a mounting groove on the assembly surface of the optical module and the heat dissipation module, and placing a heat-conducting component within the mounting groove, the heat-conducting component is confined between the heat dissipation module and the optical module, and abuts against the side of the heat dissipation module facing the optical module. In the vertical direction perpendicular to the horizontal plane, the heat-conducting component has a top surface higher than the upper surface of the mounting groove, and at least one end located within the mounting groove. Thus, the direct contact between the heat-conducting component and the heat dissipation module increases the heat dissipation effect of the optical module, and by placing at least one end of the heat-conducting component within the mounting groove, the risk of the heat-conducting component detaching during the assembly process of the optical module and the heat dissipation module is avoided, making it more practical. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the heat dissipation structure of the optical module conforming to this utility model.

[0019] Figure 2 yes Figure 1 A schematic diagram of the optical module.

[0020] Figure 3 This is a schematic diagram of Embodiment 2 of the optical module heat dissipation structure conforming to this utility model.

[0021] Figure 4 This is a schematic diagram of Embodiment 2 of the optical module heat dissipation structure conforming to this utility model.

[0022] Figure 5 yes Figure 1 Exploded view of the structure of the heat-conducting component.

[0023] Figure 6 yes Figure 1 An exploded view of the structure of the second embodiment of the thermally conductive component.

[0024] Figure 7 yes Figure 1 A schematic diagram of the structure of the heat-conducting component in Embodiment 3. Detailed Implementation

[0025] In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit the scope of this utility model.

[0026] Please see Figures 1 to 7 As shown, this utility model discloses a heat dissipation structure 100 for an optical module, including an optical module 1 and a heat dissipation module (not shown) assembled with the optical module 1. The optical module 1 has an assembly surface 11 for assembly with the heat dissipation module. The assembly surface 11 is provided with a mounting groove 10, and a heat-conducting component 2 is provided in the mounting groove 10. The heat-conducting component 2 is constrained between the heat dissipation module and the optical module 1 and abuts against the side of the heat dissipation module facing the optical module 1. Thus, by providing a heat-conducting component 2 that is in direct contact with the heat dissipation module, the heat-conducting component 2 can directly conduct the heat of the optical module 1 to the heat dissipation module, further increasing the heat dissipation efficiency of the optical module 1. Preferably, the heat-conducting component 2 can be provided on both opposite sides of the optical module 1 to further improve the heat dissipation efficiency.

[0027] In this embodiment, the heat-conducting component 2 is elastic to further ensure full contact with the heat dissipation module and expand the heat dissipation surface. The heat-conducting module component 2 is disposed on the outer shell 12 of the optical module 1, avoiding the risk of the heat-conducting component 2 falling off, making it plug-and-play, easy to replace, and ensuring stable heat dissipation. The heat dissipation module is preferably a cage heat sink, but other heat sinks are also possible and there are no restrictions.

[0028] Preferably, in the vertical direction perpendicular to the horizontal plane, the heat-conducting component 2 has a top surface higher than the upper surface of the mounting groove 10, and at least one end located within the mounting groove 10. That is, the top surface is used to contact the heat dissipation module and conduct heat, and the upper surface of the end is lower than the upper surface of the mounting groove 10. This is because, in this embodiment, the heat dissipation module is inserted into the optical module 1 along the extending direction of the heat-conducting component 2 to assemble with the optical module. Therefore, when the upper surface of the end is lower than the upper surface of the mounting groove 10, it is possible to prevent the heat-conducting component 2 from detaching during the assembly of the optical module 1 and the heat dissipation module.

[0029] The heat-conducting component 2 includes a heat-conducting portion 21 that abuts against the heat dissipation module and a guide portion 22 located on at least one side of the heat-conducting portion 21. The side of the guide portion 22 away from the heat-conducting portion 21 is located within the mounting groove 10, and the guide portion 22 is an inclined surface extending towards the optical module 1. Preferably, there are two guide portions 22, located on opposite sides of the heat-conducting portion 21. The mounting groove 10 has a mounting surface 101 corresponding to the heat-conducting component 2, and the heat-conducting component 2 is attached to the mounting surface 101.

[0030] Therefore, in this embodiment, the heat-conducting component 2 has a structure with outward inclined slopes on both sides and a horizontal surface in the middle. That is, the heat-conducting part 21 is actually used for heat dissipation, while the guide parts 22 on both sides ensure that the heat-conducting component 2 will not fall off in either assembly direction, thus making the heat-conducting component 2 more stable.

[0031] A gap, between 0-0.2 mm, is provided between one end of the guide portion 22 relative to the heat-conducting portion 21 and the upper surface of the mounting groove 10. This gap is to prevent the heat-conducting component 2 from falling off when the heat dissipation module is inserted. Of course, the gap may or may not be provided, and its size can be adjusted according to requirements; there are no restrictions on this.

[0032] The thermally conductive component 2 includes a thermally conductive film 23 fixed within the mounting groove 10 and a metal sheet 24 formed on the side of the thermally conductive film 23 opposite to the mounting groove 10. The metal sheet 24 abuts against the heat dissipation module. That is, the thermally conductive film 23 is fixed to the mounting surface 101, while the metal sheet 24 is in direct contact with the heat dissipation module. In this case, the thermally conductive film 23 does not contact the heat dissipation module, and heat is conducted through the metal sheet 24. The processing cost is low, making it suitable for optical modules 1 with low heat dissipation requirements. Preferably, the thermally conductive film 23 is a graphene thermally conductive pad, and the metal sheet 24 is a good thermally conductive material (stainless steel, copper foil, aluminum foil, silver foil, metal plating, etc.) with good resistance to repeated insertion and removal (such as the insertion direction of the preferred cage heat sink in this embodiment), capable of 50-500 insertion and removal cycles.

[0033] Therefore, as Figure 1 , Figure 3 and Figure 4 The optical modules 1 are of different forms, but their combination with the heat-conducting component 2 is the same. Therefore, this utility model does not limit the structure of the optical module 1. It only needs to satisfy that the heat-conducting component 2 is disposed on the outer surface of the optical module 1 and is squeezed and restricted between the optical module 1 and the heat dissipation module during the assembly process of the optical module 1 and the heat dissipation module.

[0034] Optional, such as Figure 6 and Figure 7 As shown, the metal sheet 24 has slots 240, and the thermally conductive film 23 abuts against the heat dissipation module through the slots 240. In this way, a portion of the thermally conductive film 23 directly contacts the heat dissipation module, allowing heat to be dissipated simultaneously through both the metal sheet 24 and the thermally conductive film 23. This is suitable for optical modules that require rapid heat release.

[0035] Preferably, the slots 240 are provided in multiple sizes and arranged in an array on the metal sheet 24. This can further accelerate heat dissipation efficiency.

[0036] The thermally conductive adhesive sheet 23 has a groove 230 on the side facing the metal sheet 24, and an adhesive member 25 is provided in the groove 230. The groove 230 and the slot 240 are staggered. Multiple grooves 230 are provided and arranged in an array on the thermally conductive adhesive sheet 23, and the slots 240 are located between two adjacent rows of grooves 230. Thus, the arrangement of multiple grooves 230 ensures a tighter fixation between the thermally conductive adhesive sheet 23 and the metal sheet 24, and also ensures the utilization rate of the slots 240.

[0037] In this embodiment, the thermally conductive adhesive sheet 23 is fixed to the metal sheet 24 by the adhesive 25, and the metal sheet 24 is also fixed to the outer shell 12 of the optical module 1 by the fixing adhesive 26.

[0038] Optional, such as Figure 6 As shown, both the slot 240 and the groove 230 are circular holes. In order to ensure the largest possible heat dissipation space, the slot 240 can be set between two adjacent rows of four grooves 230 to make full use of their gaps and ensure heat dissipation efficiency.

[0039] Optional, such as Figure 7 As shown, the slot 240 can be an annular racetrack hole, and the extension length of the annular racetrack hole is parallel to the two grooves 230 in the same row. In this way, the heat dissipation efficiency can be further accelerated, which is suitable for optical modules with ultra-high heat dissipation requirements.

[0040] like Figures 5-7 As shown, the heat-conducting component 2 is only shown as a plane, but the heat-conducting component 2 is elastic as a whole. Therefore, it can be bent and pasted onto the mounting surface 101 within the mounting groove 10 during fixing. At this time, at least one end of the pasted heat-conducting component 2 is located within the mounting groove 10, that is, the upper surface of at least one end of the heat-conducting component 2 is lower than the upper surface of the mounting groove 10. Therefore, in this embodiment, the mounting surface 101 has an inclined slope, and when the heat-conducting component 2 is pasted onto this slope, it forms an inclined slope.

[0041] In summary, the optical module heat dissipation structure 100 of this utility model provides a mounting groove 10 on the assembly surface 11 where the optical module 1 and the heat dissipation module are assembled, and a heat-conducting component 2 is disposed within the mounting groove 10. The heat-conducting component 2 is confined between the heat dissipation module and the optical module 1, and abuts against the side of the heat dissipation module facing the optical module 1. In the vertical direction perpendicular to the horizontal plane, the heat-conducting component 2 has a top surface higher than the upper surface of the mounting groove 10, and at least one end located within the mounting groove 10. Thus, the direct contact between the heat-conducting component 2 and the heat dissipation module increases the heat dissipation effect of the optical module 1, and by placing at least one end of the heat-conducting component 2 within the mounting groove 10, the risk of the heat-conducting component detaching during the assembly process of the optical module 1 and the heat dissipation module is avoided, making it more practical.

[0042] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A heat dissipation structure for an optical module, characterized in that, The optical module has an assembly surface for assembling with a heat dissipation module. The assembly surface is provided with a mounting groove, and a heat-conducting component is provided in the mounting groove. The heat-conducting component is confined between the heat dissipation module and the optical module and abuts against the side of the heat dissipation module facing the optical module. In a vertical direction perpendicular to the horizontal plane, the heat-conducting component has a top surface higher than the upper surface of the mounting groove and at least one end located in the mounting groove.

2. The optical module heat dissipation structure according to claim 1, characterized in that, The heat-conducting component includes a heat-conducting part that abuts against the heat dissipation module and a guide part located on at least one side of the heat-conducting part. The side of the guide part away from the heat-conducting part is located in the mounting groove, and the guide part is an inclined surface extending toward the optical module.

3. The optical module heat dissipation structure according to claim 2, characterized in that, A gap is provided between one end of the guide portion relative to the heat-conducting portion and the upper surface of the mounting groove, and the gap is between 0 and 0.2 mm.

4. The optical module heat dissipation structure according to claim 2, characterized in that, The guide portion is provided in two parts, which are located on opposite sides of the heat-conducting portion. The mounting groove is provided with a mounting surface corresponding to the heat-conducting component, and the heat-conducting component is attached to the mounting surface.

5. The optical module heat dissipation structure according to claim 2, characterized in that, The thermal conductive component includes a thermally conductive film fixed in the mounting groove and a metal sheet formed on the side of the thermally conductive film opposite to the mounting groove, the metal sheet abutting against the heat dissipation module.

6. The optical module heat dissipation structure according to claim 5, characterized in that, The metal sheet has slots, and the thermally conductive adhesive sheet abuts against the heat dissipation module through the slots.

7. The optical module heat dissipation structure according to claim 6, characterized in that, The slots are provided in multiples and arranged in an array on the metal sheet.

8. The optical module heat dissipation structure according to claim 6, characterized in that, The thermally conductive adhesive sheet has a groove on the side facing the metal sheet, and an adhesive is provided in the groove. The groove and the slot are misaligned.

9. The optical module heat dissipation structure according to claim 8, characterized in that, The grooves are provided in multiples and arranged in an array on the thermally conductive film, and the slots are located between two adjacent rows of grooves.

10. The optical module heat dissipation structure according to claim 5, characterized in that, The metal sheet is fixed in the mounting groove with adhesive.

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