Dispensing seal housing

Abstract

The utility model relates to the technical field of sealed shell, more specifically, relate to a kind of point glue sealing shell, including upper shell, lower shell and sealing point glue, the upper shell can be installed in the lower shell and form the inner chamber of shell, the upper shell is equipped with point glue hole, the inner chamber is equipped with the boss that can limit sealing point glue, the sealing point glue is located in the inner chamber and plugs the point glue hole.The utility model discloses a point glue sealing shell by the setting of point glue hole can make upper shell and lower shell avoid the phenomenon of air shock in the pressing process, so that the upper shell and lower shell of pressing can guarantee good air tightness at pressing place, the setting of boss can make in the process of forming sealing point glue by glue injection to point glue hole, avoid the hardening of colloid after plugging point glue hole, so that sealing point glue can smoothly plug point glue hole, guarantee that inner chamber is fully sealed, ensure the air tightness of shell.

Description

Technical Field

[0001] This utility model relates to the technical field of sealing housings, and more specifically, to an adhesive-sealed housing. Background Technology

[0002] In automotive smart cockpits and smart mobility, digital key solutions are used for keyless entry and start. Radar, cameras, and other media are used to capture and calibrate the external environment of the vehicle. These digital key, radar, and camera modules installed in the vehicle, either on the door handle or on the exterior, require extremely high waterproof and dustproof performance under different climatic conditions (high temperature and humidity, extreme cold, vibration, etc.). Typical car manufacturers require IP67 or higher, while demanding manufacturers even require boiling at 85℃ for 30 days.

[0003] This type of product typically uses a dispensing method for assembling the upper and lower shells: first, the upper and lower structural components undergo plasma cleaning, then adhesive is applied to the shell, and the circuit board is placed inside. Figure 1 As shown, the upper and lower shells are finally assembled by high-precision pressing equipment. During the pressing process, the height of the adhesive layer changes from high to low, causing the shell volume to change from large to small. This results in an increase in internal pressure, causing the adhesive to be squeezed outwards. When the adhesive is squeezed outwards, the resistance of the adhesive and the gas pressure are an action-reaction pair. When the adhesive resistance is less than the gas pressure (this problem occurs when the local line width of the adhesive is too small), gas will leak, causing air leakage and resulting in poor airtightness of the product. Figure 2 As shown.

[0004] Specifically, during the compression process inside the closed cavity, if the gas fails to break through the adhesive path, a partial burst phenomenon will occur. The airtightness test will be OK, but due to the reduced bonding area, airtightness will be downgraded or even fail when used in different environments. Furthermore, after the upper and lower shells are bonded together but before they are cured, the internal cavity volume will change again due to the stress exerted on the product during operation, causing air bursts. Utility Model Content

[0005] The purpose of this invention is to overcome the shortcomings of the prior art, which is that air blasting is easy to occur during the pressing and assembly of the upper and lower shells, resulting in poor air tightness of the product. This invention provides a glue-sealed shell, which can effectively avoid air blasting during the pressing process and ensure the air tightness of the shell.

[0006] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows: A dispensing sealing housing is provided, comprising an upper housing, a lower housing, and a sealing dispensing device. The upper housing is installable on the lower housing to form an inner cavity of the housing. The upper housing is provided with a dispensing hole. The inner cavity is provided with a boss that can limit the sealing dispensing device. The sealing dispensing device is located in the inner cavity and blocks the dispensing hole.

[0007] During installation, the upper and lower housings of this invention undergo plasma cleaning. First, adhesive is applied to the edges of the lower housing, and the circuit board is placed inside. Next, the upper housing is placed on top of the lower housing, aligning their edges. The sequence from top to bottom is: upper housing, adhesive layer, and lower housing. Finally, the upper and lower housings are pressed together using a pressing device to secure them. During pressing, gas inside the cavity can escape through the adhesive dispensing holes, connecting the cavity to the outside and maintaining consistent air pressure. After pressing, adhesive is injected into the dispensing holes using a dispensing machine. Once the adhesive hardens, it becomes a sealing adhesive, completely blocking the dispensing holes and separating the inner cavity from the outside, maintaining a sealed interior. Simultaneously, a boss limits the amount of adhesive injected through the dispensing holes, preventing it from overflowing before hardening and filling the holes completely. The principle of the boss limiting the sealing dispensing is to shorten the height of the sealing dispensing as it overflows from the dispensing hole. Since the adhesive itself has poor fluidity, shortening the height of its flow space can further reduce the speed at which the adhesive overflows to the surroundings due to gravity without the action of external force, so that after the adhesive solidifies and forms the sealing dispensing, it can completely block the dispensing hole.

[0008] The present invention, through the setting of the dispensing hole, can prevent air blasting during the pressing process of the upper and lower shells, ensuring good airtightness at the pressing point. The setting of the boss can prevent the glue from failing to block the dispensing hole after hardening during the process of injecting glue into the dispensing hole to form a seal, so that the sealant can successfully block the dispensing hole, ensuring that the inner cavity is fully sealed and ensuring the airtightness of the shell.

[0009] Furthermore, the sealing adhesive includes a first portion located in the inner cavity and a second portion located within the dispensing hole. The diameter of the first portion is larger than the diameter of the second portion, and the sidewall of the second portion is tightly fitted to the sidewall of the dispensing hole. The first portion of the sealing adhesive is located between the boss and the upper housing, and the second portion is located within the dispensing hole. The diameter of the first portion is larger than the diameter of the second portion, meaning the overall cross-section of the sealing adhesive is inverted "T" shape, which prevents the shaped sealing adhesive from falling out of the dispensing hole.

[0010] Furthermore, the boss is fixedly installed on the lower housing, and the bottom surface of the sealing adhesive is in close contact with the top surface of the boss. The distance between the top surface of the boss and the bottom surface of the dispensing hole is 1mm-3mm. The boss is fixedly installed on the lower housing, and when adhesive is injected into the dispensing hole, the boss can support the adhesive until it hardens into a sealing adhesive. When the adhesive flows into the top surface of the boss and outwards, due to the poor fluidity of the adhesive, when the distance between the top surface of the boss and the bottom surface of the dispensing hole is 1mm-3mm, that is, the maximum thickness of the injected adhesive is 1mm-3mm. After the injection stops, under the action of the surface tension of the adhesive, the shape of the adhesive between the top surface of the boss and the bottom surface of the dispensing hole is an outwardly convex arc, and it is difficult to flow outwards until the adhesive is completely cured into a sealing adhesive.

[0011] Furthermore, the top surface of the boss is provided with a groove, and the sealing adhesive is located within the groove, with the bottom surface of the sealing adhesive tightly adhering to the bottom surface of the groove. The groove further limits the injected adhesive. The principle is as follows: when the adhesive flows into the groove, the injection stops when or before the groove is full. The adhesive first fills the groove, but since injection stops, the adhesive lacks the force to overflow. Upon encountering the sidewall of the groove, under the influence of surface tension and intermolecular forces of the viscous adhesive, it is difficult to flow across the groove to the surface of the boss, thus limiting the flow of the adhesive. The groove is located directly below the dispensing hole, and the cross-section of the groove is larger than that of the dispensing hole. Experiments have shown that the depth of the groove is generally 1mm-2mm.

[0012] Furthermore, the boss is fixedly installed on the upper housing, the dispensing hole penetrates the boss, and the bottom surface of the boss is tightly fitted with the top surface of the first part. The distance between the bottom surface of the boss and the bottom surface of the inner cavity is 0.5mm-1.5mm. When the boss is fixedly installed on the upper housing, after dispensing glue through the dispensing hole, a portion of the glue remains between the boss and the lower housing. The surface tension and intermolecular forces of the glue itself can prevent the glue from continuing to flow outwards. Experiments have shown that when the distance between the bottom surface of the boss and the bottom surface of the inner cavity is 0.5mm-1.5mm, that is, when the maximum thickness of the glue between the boss and the lower housing is 0.5mm-1.5mm, it can effectively prevent the glue from flowing outwards.

[0013] Furthermore, the bottom surface of the boss is provided with a groove to accommodate the top surface of the sealing adhesive. The groove further increases the volume of the first part of the cured adhesive, further preventing the separation of the first and second parts of the sealing adhesive. This is because the first part is prone to breakage when its thickness is small; the cured adhesive contained in the groove further increases the thickness of the first part. Similarly, the groove is located directly below the dispensing hole, and the area of ​​the groove is larger than the area of ​​the dispensing hole. The depth of the groove is generally 3mm-5mm, effectively preventing the separation of the first and second parts of the adhesive after curing.

[0014] Furthermore, the upper housing is provided with a positioning groove, which is located on the surface of the upper housing, and the dispensing hole passes through the bottom surface of the positioning groove. The positioning groove can further accommodate the adhesive located above the upper housing, so that the adhesive, after curing, forms an overall "I" shape, further enhancing the seal of the dispensing hole. The radius of the positioning groove is slightly larger than the radius of the dispensing hole, generally 2mm-3mm larger.

[0015] Furthermore, a circuit board is fixedly installed inside the housing cavity.

[0016] Compared with the prior art, the beneficial effects of this utility model are: The adhesive-sealed housing of this invention, through the setting of the adhesive dispensing hole, can prevent air blasting during the pressing process of the upper and lower housings, ensuring good airtightness at the pressing point. The protrusion setting can prevent the adhesive from failing to block the dispensing hole after hardening during the process of injecting adhesive into the dispensing hole to form a seal, ensuring that the sealing adhesive can smoothly block the dispensing hole, ensuring full sealing of the inner cavity, and ensuring the airtightness of the housing. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the working state of the upper and lower shells before they are pressed together in the prior art. The arrows in the diagram indicate the pressing direction. Figure 2 This is a schematic diagram of the working state of the upper and lower shells during the pressing process in the prior art. The direction of the arrows in the diagram indicates the direction of gas flow inside the shell cavity. Figure 3 This is a schematic diagram of the working state of a dispensing sealing housing during pressing. The arrows in the diagram indicate the direction of gas flow inside the housing cavity. Figure 4 This is a schematic diagram of the structure of a dispensing sealing housing; Figure 5 This is a schematic diagram of the sealing dispensing structure of a dispensing sealing housing; Figure 6 This is a schematic diagram of the working state of a third embodiment of an adhesive-sealed housing during pressing; Figure 7 This is a schematic diagram of the structure of a third embodiment of an adhesive-sealed housing; Figure 8 This is a schematic diagram of the sealing dispensing structure of an embodiment three of a dispensing sealing housing.

[0018] In the attached diagram: 100, upper housing; 200, lower housing; 300, adhesive layer; 400, sealing adhesive; 500, inner cavity; 600, boss; 110, adhesive hole; 410, first part; 420, second part; 610, groove; 120, positioning groove. Detailed Implementation

[0019] The present invention will be further described below with reference to specific embodiments. The accompanying drawings are for illustrative purposes only, representing schematic diagrams rather than actual physical objects, and should not be construed as limiting the scope of this patent. To better illustrate the embodiments of the present invention, some components in the drawings may be omitted, enlarged, or reduced, and do not represent the actual dimensions of the product. It is understandable to those skilled in the art that some well-known structures and their descriptions may be omitted in the drawings.

[0020] In the accompanying drawings of this utility model, the same or similar reference numerals correspond to the same or similar components. In the description of this utility model, it should be understood that if terms such as "upper," "lower," "left," and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0021] Example 1 This embodiment is a first embodiment of a dispensing sealing housing, such as... Figure 3 and Figure 4 As shown, the device includes an upper housing 100, a lower housing 200, and a sealing adhesive 400. The upper housing 100 can be installed on the lower housing 200 to form an inner cavity 500 of the housing. The upper housing 100 is provided with an adhesive dispensing hole 110. The inner cavity 500 is provided with a boss 600 that can limit the sealing adhesive 400. The sealing adhesive 400 is located in the inner cavity 500 and blocks the adhesive dispensing hole 110.

[0022] The working principle or process of this embodiment is as follows: In this embodiment, during installation, the upper housing 100 and lower housing 200 are first subjected to plasma cleaning. Then, adhesive is applied to the edges of the lower housing 200, and the circuit board is placed inside the lower housing 200. Next, the upper housing 100 is placed on top of the lower housing 200, aligning their edges. At this point, the sequence from top to bottom is: upper housing 100, adhesive layer 300, and lower housing 200. Finally, the upper housing 100 and lower housing 200 are pressed together using a pressing device to secure them in place. During the pressing process, gas in the inner cavity 500 can escape from the inner cavity 500 through the adhesive hole 110, allowing the inner cavity 500 to communicate with the outside, maintaining consistent air pressure. After pressing, adhesive is injected into the dispensing hole 110 using a dispensing machine. Once the adhesive injected into the dispensing hole 110 hardens, it becomes the sealing adhesive 400. The sealing adhesive 400 completely blocks the dispensing hole 110, separating the inner cavity 500 of the housing from the outside and maintaining the airtightness of the inner cavity 500. Simultaneously, the boss 600 limits the adhesive injected from the dispensing hole 110, preventing it from overflowing before hardening and thus failing to fill the dispensing hole 110 completely. The principle behind the boss 600 limiting the sealing adhesive 400 is to shorten the height at which the sealing adhesive 400 overflows from the dispensing hole 110. Due to the poor fluidity of the adhesive, shortening its flow space further reduces the speed at which the adhesive overflows due to gravity without external force, allowing the adhesive to solidify and completely block the dispensing hole 110 after solidification into the sealing adhesive 400.

[0023] The beneficial effects of this embodiment are as follows: The solution in this embodiment, through the setting of the dispensing hole 110, can prevent air blasting between the upper housing 100 and the lower housing 200 during the pressing process, ensuring good airtightness at the pressing point. The setting of the boss 600 can prevent the adhesive from failing to block the dispensing hole 110 after hardening during the process of injecting adhesive into the dispensing hole 110 to form the sealing dispensing 400, so that the sealing dispensing 400 can successfully block the dispensing hole 110, ensuring that the inner cavity 500 is fully sealed and ensuring the airtightness of the housing.

[0024] Example 2 This embodiment is a second embodiment of a dispensing sealing housing. Based on the first embodiment, this embodiment further defines the structure of the housing.

[0025] Specifically, such as Figure 5As shown, the sealing adhesive 400 includes a first part 410 located in the inner cavity 500 of the housing and a second part 420 located in the dispensing hole 110. The diameter of the first part 410 is larger than the diameter of the second part 420, and the sidewall of the second part 420 is tightly fitted with the sidewall of the dispensing hole 110.

[0026] Specifically, such as Figure 3 and Figure 4 As shown, the boss 600 is fixedly installed on the lower housing 200, and the bottom surface of the sealing adhesive 400 is in close contact with the top surface of the boss 600. The distance between the top surface of the boss 600 and the bottom surface of the adhesive dispensing hole 110 is 1mm-3mm.

[0027] Specifically, the top surface of the boss 600 is provided with a groove 610, and the sealing adhesive 400 is located in the groove 610 with the bottom surface of the sealing adhesive 400 tightly fitting the bottom surface of the groove 610. The groove 610 is located directly below the adhesive dispensing hole 110, and the cross-section of the groove 610 is larger than the cross-section of the adhesive dispensing hole 110. The depth of the groove 610 is 1mm-2mm.

[0028] Specifically, the upper housing 100 is provided with a positioning groove 120, which is located on the surface of the upper housing 100, and the dispensing hole 110 passes through the bottom surface of the positioning groove 120. The radius of the positioning groove 120 is 2mm-3mm larger than the radius of the dispensing hole 110.

[0029] Specifically, a circuit board is fixedly installed in the inner cavity 500.

[0030] The working principle or process of this embodiment is as follows: The distance between the top surface of the boss 600 and the bottom surface of the dispensing hole 110 is 1mm-3mm. The boss 600 is fixedly installed on the lower housing 200. When adhesive is injected into the dispensing hole 110, the boss 600 can support the adhesive until it hardens into a sealing dispensing 400. When the adhesive flows into the top surface of the boss 600 and outwards, due to the poor fluidity of the adhesive, when the distance between the top surface of the boss 600 and the bottom surface of the dispensing hole 110 is 1mm-3mm, that is, the maximum thickness of the injected adhesive is 1mm-3mm. After the injection stops, under the action of the surface tension of the adhesive, the shape of the adhesive between the top surface of the boss 600 and the bottom surface of the dispensing hole 110 is an outwardly convex arc, and it is difficult to flow outwards until the adhesive is completely cured into a sealing dispensing 400.

[0031] The beneficial effects of this embodiment are as follows: The first part 410 of the sealing adhesive 400 is located between the boss 600 and the upper housing 100, and the second part 420 is located inside the dispensing hole 110. The diameter of the first part 410 is larger than the diameter of the second part 420, that is, the cross-section of the sealing adhesive 400 is generally inverted "T" shaped, which can prevent the shaped sealing adhesive 400 from falling out of the dispensing hole 110. The groove 610 can further limit the adhesive injected from the dispensing hole 110.

[0032] When the colloid flows into the groove 610, the colloid injection stops either when or before the groove 610 is completely filled. The colloid initially fills the groove 610, but since injection ceases, the colloid lacks sufficient force to overflow. Upon encountering the sidewall of the groove 610, its surface tension and the intermolecular forces of the viscous colloid prevent it from flowing across the groove to the surface of the boss 600, thus limiting the flow of the colloid. The positioning groove 120 further accommodates the colloid located above the upper housing 100, resulting in an "I" shape after curing, further enhancing the seal of the dispensing hole 110.

[0033] Example 3 This embodiment is a third embodiment of a dispensing sealing housing, such as... Figures 6-8 As shown, the difference between this embodiment and Embodiment 2 is that the position of the boss 600 is different.

[0034] Specifically, the boss 600 is fixedly installed on the upper housing 100, and the glue dispensing hole 110 passes through the boss 600. The bottom surface of the boss 600 is in close contact with the top surface of the first part 410. The distance between the bottom surface of the boss 600 and the bottom surface of the inner cavity 500 is 0.5mm-1.5mm.

[0035] Specifically, the bottom surface of the boss 600 is provided with a groove 610 that can accommodate the top surface of the sealing adhesive 400. The groove 610 is located directly below the adhesive dispensing hole 110, the area of ​​the groove 610 is larger than the area of ​​the adhesive dispensing hole 110, and the depth of the groove 610 is 3mm-5mm.

[0036] The working principle or process of this embodiment is as follows: When the boss 600 is fixedly installed on the upper housing 100, after the glue dispensing through the glue hole 110 is stopped, a portion of the glue remains between the boss 600 and the lower housing 200. The surface tension and intermolecular forces of the glue itself prevent it from flowing outwards. When the distance between the bottom surface of the boss 600 and the bottom surface of the inner cavity 500 is 0.5mm-1.5mm, that is, when the maximum thickness of the glue between the boss 600 and the lower housing 200 is 0.5mm-1.5mm, it effectively prevents the glue from flowing outwards.

[0037] The beneficial effects of this embodiment are as follows: The groove 610 can further increase the volume of the first part 410 after the colloid has cured, and can further prevent the separation of the first part 410 and the second part 420 of the sealing dispensing 400.

[0038] The other technical features, working principles, and beneficial effects of this embodiment are the same as those of Embodiment 2.

[0039] In the specific implementation of the above embodiments, the technical features can be combined in any non-contradictory way. For the sake of brevity, not all possible combinations of the above technical features are described. However, as long as the combination of these technical features is not contradictory, it should be considered to be within the scope of this specification.

[0040] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating this utility model, and are not intended to limit the implementation of this utility model. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A dispensing sealing housing, characterized in that, The device includes an upper housing (100), a lower housing (200), and a sealing adhesive (400). The upper housing (100) can be installed on the lower housing (200) to form an inner cavity (500) of the housing. The upper housing (100) is provided with an adhesive dispensing hole (110). The inner cavity (500) is provided with a boss (600) that can limit the sealing adhesive (400). The sealing adhesive (400) is located in the inner cavity (500) and blocks the adhesive dispensing hole (110).

2. The adhesive-sealed housing according to claim 1, characterized in that, The sealing adhesive (400) includes a first part (410) located in the inner cavity (500) and a second part (420) located in the dispensing hole (110). The diameter of the first part (410) is larger than the diameter of the second part (420), and the sidewall of the second part (420) is in close contact with the sidewall of the dispensing hole (110).

3. The adhesive-sealed housing according to claim 2, characterized in that, The boss (600) is fixedly installed on the lower housing (200), and the bottom surface of the sealing adhesive (400) is in close contact with the top surface of the boss (600).

4. The adhesive-sealed housing according to claim 3, characterized in that, The distance between the top surface of the boss (600) and the bottom surface of the dispensing hole (110) is 1mm-3mm.

5. The adhesive-sealed housing according to claim 3, characterized in that, The top surface of the boss (600) is provided with a groove (610), the sealing adhesive (400) is located in the groove (610) and the bottom surface of the sealing adhesive (400) is in close contact with the bottom surface of the groove (610).

6. The adhesive-sealed housing according to claim 2, characterized in that, The boss (600) is fixedly installed on the upper housing (100), the glue dispensing hole (110) passes through the boss (600), and the bottom surface of the boss (600) is closely fitted with the top surface of the first part (410).

7. The adhesive-sealed housing according to claim 6, characterized in that, The distance between the bottom surface of the boss (600) and the bottom surface of the inner cavity (500) is 0.5mm-1.5mm.

8. The adhesive-sealed housing according to claim 6, characterized in that, The bottom surface of the boss (600) is provided with a groove (610) that can accommodate the top surface of the sealing adhesive (400).

9. A dispensing sealing housing according to any one of claims 1-8, characterized in that, The upper housing (100) is provided with a positioning groove (120), the positioning groove (120) is located on the surface of the upper housing (100), and the dispensing hole (110) passes through the bottom surface of the positioning groove (120).

10. The adhesive-sealed housing according to claim 1, characterized in that, A circuit board is fixedly installed in the inner cavity (500).

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