Semiconductor device cleaning jig
By designing a cleaning fixture with matrix-type plate holes and high-strength corrosion-resistant materials, the problems of friction scratches and cleaning dead corners in the semiconductor device cleaning process were solved, achieving efficient and stable cleaning results and device protection.
Patent Information
- Application Number
- CN202522578671.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-04
- Publication Date
- 2026-11-03
- Estimated Expiration
- 2035-12-04
AI Technical Summary
In the current semiconductor device cleaning process, friction between the semiconductor device and the cleaning plate causes scratches, the cleaning fluid has poor flowability and is difficult to clean thoroughly, resulting in cleaning dead zones and affecting the cleaning effect.
A semiconductor device cleaning fixture is designed, which adopts a matrix-distributed plate hole combined with the cleaning fixture body structure, combined with the regular polygonal cross section of the positioning rod and the gap of 0.1mm-0.3mm, uses high-strength corrosion-resistant materials, optimizes the flow channel of the cleaning fluid, and protects the critical connection parts by rounding the corners.
It enables stable batch clamping of semiconductor devices, improves the penetration and coverage of cleaning fluid, reduces the risk of device damage, improves cleaning efficiency and quality stability, and extends the service life of cleaning fixtures.
Smart Images
Figure CN224936039U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor manufacturing equipment technology, and in particular to a semiconductor device cleaning fixture. Background Technology
[0002] In the semiconductor device manufacturing process, the cleaning quality of the semiconductor body's sealing components directly affects the device's sealing performance and lifespan. It is essential to thoroughly remove oil, dust, and chemical residues that adhere to the components during production. Currently, semiconductor devices are typically cleaned by directly inserting them into holes in a cleaning board. However, friction occurs between the semiconductor device and the inner wall of these holes, leading to scratches. Furthermore, the cleaning fluid has poor flow within the holes, making it difficult to thoroughly clean the bottom and sidewalls of the semiconductor device, resulting in cleaning dead zones and affecting the cleaning effect.
[0003] Therefore, this utility model proposes a semiconductor device cleaning fixture to solve the above problems.
[0004] The information disclosed in this background section is intended only to enhance the understanding of the overall background of this utility model and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content
[0005] The purpose of this invention is to address the shortcomings mentioned in the background section by providing a semiconductor device cleaning fixture.
[0006] The above-mentioned technical objective of this utility model is achieved through the following technical solution: a semiconductor device cleaning fixture, comprising a cleaning plate, a cleaning fixture body, and a semiconductor body sealing accessory;
[0007] The cleaning plate has multiple equally spaced holes.
[0008] The cleaning fixture body includes a support base, a cylindrical block, a positioning pin, a positioning rod, and a guide block. The positioning pin is fixed at the bottom center of the support base and inserted into the corresponding plate hole. The cylindrical block is fixed at the top center of the support base. The top of the positioning rod is fixedly installed with a guide block, and the bottom of the positioning rod is fixed at the top center of the cylindrical block. The support base, cylindrical block, positioning pin, positioning rod, and guide block are integrally formed.
[0009] The semiconductor body sealing fitting is inserted into the outside of the positioning rod, and the bottom end of the semiconductor body sealing fitting abuts against the top side of the cylindrical block.
[0010] Preferably, the plurality of the plate holes are distributed in a matrix on the cleaning plate.
[0011] Preferably, the top side of the support base is provided with a first inclined surface, and the first inclined surface transitions from the top edge of the support base to the bottom of the cylindrical block in an inclined manner with an inclination angle of 30°-45°.
[0012] Preferably, the top of the cylindrical block is provided with a second inclined surface, which transitions in an arc shape from the top edge of the cylindrical block to the bottom end of the positioning rod.
[0013] Preferably, the bottom end of the positioning pin is rounded.
[0014] Preferably, the cross-section of the positioning rod is a regular polygon, and the side connection of the positioning rod is rounded.
[0015] Preferably, the top side of the guide block is hemispherical, and the gap between the outer side of the guide block and the inner wall of the semiconductor body sealing fitting is 0.1mm-0.3mm.
[0016] Preferably, the outer edge of the support base, the connection between the support base and the cylindrical block, and the connection between the cylindrical block and the positioning rod are all rounded.
[0017] Preferably, the cleaning fixture body is made of a high-strength corrosion-resistant material, and the high-strength corrosion-resistant material is a polytetrafluoroethylene composite material.
[0018] Preferably, the cleaning plate is made of modified polyetheretherketone.
[0019] The beneficial effects of this utility model are:
[0020] This invention achieves stable batch clamping of multiple semiconductor devices through a combination structure of matrix-distributed plate holes and the cleaning fixture body. Combined with the regular polygonal cross-section design of the positioning rod and a gap control of 0.1mm-0.3mm, it ensures the installation accuracy of the semiconductor device sealing components while creating an efficient cleaning fluid flow channel. This allows the cleaning fluid to fully penetrate the inner wall of the semiconductor device sealing components and all connection gaps, effectively removing adhering impurities. Furthermore, the rounded corners of key connection parts and the selection of high-strength, corrosion-resistant materials not only improve the structural strength and corrosion resistance of the cleaning fixture body and extend its service life, but also significantly reduce the risk of damage during the assembly and disassembly of the semiconductor device sealing components. This effectively improves the efficiency and quality stability of semiconductor device cleaning operations, meeting the application requirements of high-precision, high-reliability cleaning fixtures in industrial production. Attached Figure Description
[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0022] Figure 1 This is a three-dimensional structural diagram of a semiconductor device cleaning fixture proposed in this utility model;
[0023] Figure 2 for Figure 1 A schematic diagram of the three-dimensional structure from another perspective;
[0024] Figure 3 for Figure 1 Front view structural diagram;
[0025] Figure 4 This is a three-dimensional structural diagram of the main body of the cleaning fixture proposed in this utility model;
[0026] Figure 5 for Figure 4 A schematic diagram of the three-dimensional structure from another perspective;
[0027] Figure 6 for Figure 4 Front view structural diagram;
[0028] Figure 7 for Figure 6 A schematic diagram of the cross-sectional structure from the perspective of the middle AA.
[0029] In the figure: 1. Cleaning plate; 11. Plate hole; 2. Cleaning fixture body; 21. Support base; 211. First inclined surface; 22. Positioning pin; 23. Column block; 231. Second inclined surface; 24. Positioning rod; 25. Guide block; 3. Semiconductor body sealing accessories. Detailed Implementation
[0030] The technical solution of this utility model will now be clearly and completely described with reference to specific embodiments. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.
[0031] Reference Figure 1-7 A semiconductor device cleaning fixture includes a cleaning plate 1, a cleaning fixture body 2, and a semiconductor body sealing fitting 3.
[0032] The cleaning plate 1 has multiple equally spaced holes 11 arranged in a matrix on the cleaning plate 1. This matrix arrangement provides effective support and positioning for multiple cleaning fixture bodies 2, preventing incomplete cleaning or damage to the semiconductor body sealing components 3 due to positional displacement during the cleaning process. This matrix design also maximizes the effective area of the cleaning plate 1, accommodating multiple semiconductor devices for batch cleaning within a limited space, significantly improving cleaning efficiency and meeting the throughput requirements of industrial production. Furthermore, the equal spacing between the holes 11 ensures uniform flow of the cleaning fluid between adjacent semiconductor body sealing components 3, guaranteeing consistent cleaning results and reducing cleaning quality deviations caused by differences in local cleaning fluid concentration or flow rate. The cleaning plate 1 is made of modified polyetheretherketone (PEEK), which has excellent chemical properties, is compatible with all semiconductor cleaning fluids, and exhibits advantages such as no corrosion and no deformation during long-term use. It also boasts a balance of hardness and wear resistance, excellent heat resistance, high rigidity, and ease of processing.
[0033] The cleaning fixture body 2 includes a support base 21, a cylindrical block 23, a positioning pin 22, a positioning rod 24, and a guide block 25. The cleaning fixture body 2 is made of high-strength corrosion-resistant material, which is a polytetrafluoroethylene composite material. It not only has excellent mechanical strength and can withstand various external impacts during the cleaning process and wear from long-term use, but also has extremely strong corrosion resistance. It can effectively resist the erosion of various acidic and alkaline cleaning solutions, preventing the material itself from generating impurities that contaminate semiconductor devices due to corrosion. At the same time, its surface has high smoothness and is not easy to adhere to contaminants, which facilitates the cleaning and maintenance of the cleaning fixture body 2 itself after cleaning. This ensures that it maintains good performance stability and structural integrity during long-term use, meeting the stringent requirements of high-precision cleaning of semiconductor devices for the material of the cleaning fixture body 2.
[0034] The positioning pin 22 is fixed at the bottom center of the support base 21 and inserted into the corresponding plate hole 11. The cylindrical block 23 is fixed at the top center of the support base 21. The top of the positioning rod 24 is fixedly installed with a guide block 25, and the bottom of the positioning rod 24 is fixed at the top center of the cylindrical block 23. The support base 21, cylindrical block 23, positioning pin 22, positioning rod 24 and guide block 25 are integrally formed.
[0035] The semiconductor body sealing accessory 3 is inserted into the outside of the positioning rod 24, and the bottom end of the semiconductor body sealing accessory 3 abuts against the top side of the cylindrical block 23.
[0036] The top side of the support base 21 is provided with a first inclined surface 211, and the first inclined surface 211 transitions from the top edge of the support base 21 to the bottom of the cylindrical block 23 in an inclined manner with an inclination angle of 30°-45°. This can effectively guide the liquid dripping during the cleaning process to flow along the inclined surface, avoid the liquid accumulating on the top of the support base 21 and affecting the installation stability of the semiconductor body sealing accessory 3. At the same time, it can also accelerate the sliding speed of the residual liquid after the cleaning plate 1 is removed from the cleaning solution, reduce the residual time of the liquid on the surface of the support base 21, and reduce the risk of corrosion of the support base 21 or the semiconductor body sealing accessory 3 due to liquid residue.
[0037] The top of the cylindrical block 23 is provided with a second inclined surface 231. The second inclined surface 231 transitions from the top edge of the cylindrical block 23 to the bottom of the positioning rod 24 in an arc shape. It can play a good guiding and supporting role when the semiconductor body sealing accessory 3 is inserted into the outside of the positioning rod 24, making the insertion process smoother and avoiding damage to the semiconductor body sealing accessory 3 or the positioning rod 24 due to the insertion position deviation. At the same time, the arc-shaped transition structure can also reduce the contact stress between the semiconductor body sealing accessory 3 and the guide block 25, and play a certain protective role on the surface of the semiconductor body sealing accessory 3.
[0038] The bottom end of the positioning pin 22 is rounded, which facilitates quick alignment and insertion of the positioning pin 22 with the plate hole 11 on the cleaning plate 1, reducing the difficulty of alignment during installation. At the same time, the rounded corner structure can prevent scratch damage to the inner wall of the plate hole 11 during insertion and removal, extending the service life of the cleaning plate 1. In addition, it can reduce the resistance when the positioning pin 22 is inserted into the plate hole 11, making the installation and removal of the cleaning fixture body 2 on the cleaning plate 1 more convenient and labor-saving, and improving the overall operating efficiency.
[0039] The cross-section of the positioning rod 24 is a regular polygon, and the side connection of the positioning rod 24 is rounded. This reduces the contact area with the inner wall of the semiconductor body sealing accessory 3 and automatically reserves a channel for the flow of cleaning fluid. This not only reduces the flow resistance of the cleaning fluid between the positioning rod 24 and the semiconductor body sealing accessory 3, allowing the cleaning fluid to penetrate into the gap between the two more fully, but also ensures that all corners of the inner wall of the semiconductor body sealing accessory 3 can be effectively cleaned, avoiding the generation of dead corners due to excessive contact area. The rounded corner design at the side connection can effectively reduce the scratches on the inner wall of the semiconductor body sealing accessory 3 when installing or removing it, further improving the protection effect on the semiconductor device.
[0040] The top side of the guide block 25 is hemispherical, and the gap between the outer side of the guide block 25 and the inner wall of the semiconductor body sealing accessory 3 is 0.1mm-0.3mm. This ensures that the semiconductor body sealing accessory 3 has sufficient room for movement during insertion, avoiding insertion jamming or squeezing damage to the inner wall of the accessory due to excessively small gaps. It also ensures that the cleaning fluid forms a stable flow and flushing effect within the gap, allowing the cleaning fluid to fully cover the inner wall surface of the semiconductor body sealing accessory 3, effectively removing impurities and contaminants attached to the surface. At the same time, it reduces the positioning difficulty of the semiconductor body sealing accessory 3 during installation, allowing operators to complete the initial positioning with the help of the hemispherical guide without precise angle alignment, improving installation efficiency and reducing the risk of device damage due to operational errors.
[0041] In this embodiment, in order to effectively eliminate structural stress concentration, improve the mechanical strength and durability of the overall structure, and avoid cracks or breaks at the joints due to stress concentration during long-term use, the outer edge of the support base 21, the connection between the support base 21 and the cylindrical block 23, and the connection between the cylindrical block 23 and the positioning rod 24 are all rounded. At the same time, the rounded corner design can also reduce the residue of cleaning fluid at the joints during the cleaning process, reducing the risk of corrosion caused by liquid residue. In addition, the smooth transition structure also facilitates the cleaning of the surfaces of the support base 21, the cylindrical block 23, and the positioning rod 24 after cleaning, reducing the adhesion and accumulation of impurities at the joints, ensuring the cleanliness of the cleaning fixture body 2, and further improving the protection effect on semiconductor devices.
[0042] Working principle: In use, first place the cleaning plate 1 horizontally, ensuring that the position of the plate hole 11 is clearly visible. Then, the operator holds the cleaning fixture body 2 and aligns the positioning pin 22 at the bottom of its support base 21 with the corresponding plate hole 11 on the cleaning plate 1. The initial insertion is easily completed by utilizing the rounded corner design at the bottom of the positioning pin 22. At this time, the support base 21 is stably fixed on the cleaning plate 1 by the positioning pin 22. Next, pick up the semiconductor body sealing accessory 3 and align its open end with the guide block 25 at the top of the positioning rod 24. With the guidance of the hemispherical surface on the top side of the guide block 25, the accessory can slide down along the surface of the guide block 25 without precise alignment. Then, the inner wall of the semiconductor body sealing accessory 3 slowly moves down along the outside of the positioning rod 24 until its bottom end abuts against the top side of the cylindrical block 23, completing the clamping of a single semiconductor device. Following the above steps, multiple cleaning fixture bodies 2 and corresponding semiconductor body sealing accessories 3 can be installed sequentially in the matrix plate holes 11 of the cleaning plate 1 to achieve batch clamping operations.
[0043] After installation, the cleaning plate 1 containing the semiconductor body sealing accessory 3 is immersed in the cleaning solution for cleaning. During this process, some of the cleaning solution flows through the 0.1mm-0.3mm gap between the positioning rod 24 and the inner wall of the semiconductor body sealing accessory 3, forming a stable flushing flow. This allows the cleaning solution to fully cover the inner and outer surfaces of the semiconductor body sealing accessory 3. At the same time, the first inclined surface 211 on the top side of the support 21 guides the cleaning solution to flow smoothly, preventing accumulation on the top of the support 21. The rounded corner structure at each connection effectively reduces cleaning solution residue, ensuring that impurities are completely removed.
[0044] After cleaning, the cleaning plate 1 is removed from the cleaning solution. The structural design of the first inclined surface 211 and the guide block 25 accelerates the sliding of residual liquid, which can effectively reduce the residual time of liquid on the surface. Then, the semiconductor body sealing accessory 3 and the cleaning fixture body 2 can be disassembled in reverse order to complete the entire cleaning process.
[0045] The above provides a detailed description of a semiconductor device cleaning fixture provided by this utility model. Specific embodiments have been used to illustrate the principles and implementation methods of this utility model. The descriptions of these embodiments are merely for the purpose of helping to understand the method and core ideas of this utility model. It should be noted that those skilled in the art can make various improvements and modifications to this utility model without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this utility model.
Claims
1. A semiconductor device cleaning fixture, characterized in that, It includes a cleaning plate (1), a cleaning fixture body (2), and a semiconductor body sealing fitting (3); The cleaning plate (1) has a plurality of plate holes (11) arranged at equal intervals; The cleaning fixture body (2) includes a support base (21), a cylindrical block (23), a positioning pin (22), a positioning rod (24), and a guide block (25). The positioning pin (22) is fixed at the bottom center of the support base (21) and inserted into the corresponding plate hole (11). The cylindrical block (23) is fixed at the top center of the support base (21). The top of the positioning rod (24) is fixedly equipped with the guide block (25), and the bottom of the positioning rod (24) is fixed at the top center of the cylindrical block (23). The support base (21), cylindrical block (23), positioning pin (22), positioning rod (24), and guide block (25) are integrally formed. The semiconductor body sealing fitting (3) is inserted into the outside of the positioning rod (24), and the bottom end of the semiconductor body sealing fitting (3) abuts against the top side of the cylindrical block (23).
2. The semiconductor device cleaning fixture according to claim 1, characterized in that: Multiple holes (11) are distributed in a matrix on the cleaning plate (1).
3. The semiconductor device cleaning fixture according to claim 1, characterized in that: The support base (21) has a first inclined surface (211) on its top side, and the first inclined surface (211) transitions from the top edge of the support base (21) to the bottom of the column block (23) in an inclined manner with an inclination angle of 30°-45°.
4. A semiconductor device cleaning fixture according to claim 1, characterized in that: The top of the cylindrical block (23) is provided with a second inclined surface (231), which transitions in an arc shape from the top edge of the cylindrical block (23) to the bottom end of the positioning rod (24).
5. A semiconductor device cleaning fixture according to claim 1, characterized in that: The bottom end of the positioning pin (22) is rounded.
6. A semiconductor device cleaning fixture according to claim 1, characterized in that: The cross-section of the positioning rod (24) is a regular polygon, and the side connection of the positioning rod (24) is rounded.
7. A semiconductor device cleaning fixture according to claim 1, characterized in that: The top side of the guide block (25) is hemispherical, and the gap between the outer side of the guide block (25) and the inner wall of the semiconductor body sealing fitting (3) is 0.1mm-0.3mm.
8. A semiconductor device cleaning fixture according to claim 1, characterized in that: The outer edge of the support base (21), the connection between the support base (21) and the cylindrical block (23), and the connection between the cylindrical block (23) and the positioning rod (24) are all rounded.
9. A semiconductor device cleaning fixture according to claim 1, characterized in that: The cleaning fixture body (2) is made of high-strength corrosion-resistant material, and the high-strength corrosion-resistant material is polytetrafluoroethylene composite material.
10. A semiconductor device cleaning fixture according to claim 1, characterized in that: The cleaning plate (1) is made of modified polyether ether ketone.