Chip adsorption device and chip testing equipment

Abstract

The utility model provides a kind of chip adsorption device and chip testing equipment, it is related to chip testing technical field.The utility model discloses multiple suction accessories are rotatably connected with first support, multiple suction accessories are used for adsorbing measured chip, a group of synchronous wheel groups is sleeved on each suction accessory, each group of synchronous wheel groups includes multiple synchronous wheels, a synchronous belt is sleeved on the synchronous wheel of adjacent two suction accessories, to drive connection adjacent two suction accessories.The first driving part is drivingly connected with any synchronous wheel, to pass through the transmission mode of synchronous wheel and synchronous belt, drive multiple suction accessories synchronous rotation, to drive multiple measured chip synchronous rotation.The above-mentioned technical scheme is by a first driving part, with synchronous wheel and synchronous belt, can drive multiple suction accessories rotation simultaneously, to adjust the position of multiple measured chip simultaneously, reduce the quantity of first driving part, reduce the volume of chip adsorption device, and reduce the cost of chip adsorption device.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and in particular to a chip adsorption device and chip testing equipment. Background Technology

[0002] In the field of chip testing technology, nozzles are typically used to pick up the chips under test (DUTs) for transport or repositioning. To improve the speed of transporting or repositioning DUTs, existing technologies generally use multiple nozzles to simultaneously pick up multiple DUTs, then assign a drive source to each DUT, and each drive source individually drives a single suction element to rotate, thereby adjusting the DUT's position. However, this approach suffers from the problem of a large number of drive sources leading to a bulky and costly chip suction device. Therefore, a further design is needed to create a chip suction device that, while maintaining the required transport or repositioning speed, can reduce the size and cost of the chip suction device. Utility Model Content

[0003] One objective of this invention is to provide a chip adsorption device that solves the technical problems of large size and high cost of existing chip adsorption devices.

[0004] A further objective of this invention is to avoid damaging the chip under test.

[0005] Another objective of this invention is to provide a chip testing device having the aforementioned chip adsorption device.

[0006] Specifically, this utility model provides a chip adsorption device, comprising: First support; Multiple adsorption elements are rotatably connected to the first support, and each of the multiple adsorption elements is used to adsorb the chip under test; The synchronous transmission assembly includes multiple synchronous pulley sets and multiple synchronous belts. Each of the adsorption elements is fitted with a set of synchronous pulley sets, and each synchronous pulley set includes multiple synchronous pulleys. A synchronous belt is fitted on the synchronous pulleys of two adjacent adsorption elements to drive and connect the two adjacent adsorption elements. The first driving component is connected to any of the synchronous pulleys in the synchronous transmission assembly to drive multiple adsorption components to rotate synchronously via the synchronous pulleys and the synchronous belt, thereby driving multiple tested chips to rotate synchronously.

[0007] Optionally, the plurality of adsorption elements are arranged at intervals along a preset direction; Each of the synchronous pulley groups includes two synchronous pulleys arranged vertically adjacent to each other, and the two synchronous pulleys are defined as a first synchronous pulley and a second synchronous pulley, respectively. The plurality of synchronous belts include a plurality of first synchronous belts and a plurality of second synchronous belts; the first synchronous belts are used to connect with adjacent first synchronous pulleys, and the second synchronous belts are used to connect with adjacent second synchronous pulleys. The plurality of first synchronous belts and the plurality of second synchronous belts are arranged alternately along the preset direction, and the first synchronous belts and second synchronous belts that are adjacent in the vertical direction partially overlap.

[0008] Optionally, the first driving member is connected to the synchronous wheel on any of the outermost adsorption members.

[0009] Optionally, it also includes: Multiple tensioning elements are installed on the first bracket, each tensioning element corresponding to one of the timing belts and abutting against the timing belts to adjust the tension of the timing belts.

[0010] Optionally, it also includes: Multiple second driving elements are connected one-to-one with the adsorption elements to controllably drive the corresponding adsorption elements to move vertically.

[0011] Optionally, it also includes: Multiple connectors, each connector corresponding to one adsorption element and one second driving element, and respectively connected to the corresponding adsorption element and the second driving element; Multiple tension springs, each tension spring corresponding to one of the connectors, with one end connected to the connector and the other end connected to the first bracket.

[0012] Optionally, it also includes: The second bracket is connected to the first bracket; A third driving component is mounted on the second bracket. The third driving component is configured to controllably drive the second bracket to move in the horizontal direction, thereby causing the plurality of adsorption components to move synchronously in the horizontal direction.

[0013] Optionally, it also includes: The third bracket is connected to the third driving component and is arranged vertically; A fourth driving component is mounted on the third bracket. The fourth driving component is configured to controllably drive the third bracket to move vertically, thereby causing multiple adsorption components to move vertically synchronously.

[0014] Optionally, the second bracket has a plurality of mounting plates extending vertically and connected to the first bracket, and the chip adsorption device further includes: A plurality of first limiting members, each of the first limiting members being mounted on one of the connecting members; Multiple second limiting members are respectively installed on each of the mounting plates; When the second driving member drives the adsorption member to move vertically a preset distance, the first limiting member abuts against the corresponding second limiting member, thereby limiting the adsorption member.

[0015] This invention also provides a chip testing device, which includes the chip adsorption device described above.

[0016] In this invention, multiple adsorption elements are rotatably connected to a first support. Each adsorption element is used to adsorb the chip under test. Each adsorption element is fitted with a set of synchronous pulleys, and each synchronous pulley set includes multiple synchronous pulleys. A synchronous belt is fitted onto the synchronous pulleys of adjacent adsorption elements to drive them together. A first driving element is driven by any one of the synchronous pulleys, driving the multiple adsorption elements to rotate synchronously via the synchronous pulleys and synchronous belt, thereby driving the multiple chips under test to rotate synchronously. This technical solution, using a single first driving element in conjunction with synchronous pulleys and a synchronous belt, can synchronously drive the rotation of multiple adsorption elements, thereby simultaneously adjusting the position of multiple chips under test. This reduces the number of first driving elements, decreases the size of the chip adsorption device, and lowers the cost of the chip adsorption device.

[0017] Furthermore, the chip adsorption device of this utility model also includes multiple connectors and multiple tension springs. Each connector corresponds to one adsorption element and one second driving element, and its two ends are respectively connected to the corresponding adsorption element and the second driving element. Each tension spring corresponds to one connector, with one end connected to the connector and the other end connected to the first support. In the above technical solution, when the second driving element is at the lower limit position, the second driving element exerts no force on the connector, and the second driving element and the connector are in a gap relationship in the vertical direction. At this time, the adsorption element picks up the chip to be tested. Then, the second driving element drives the adsorption element to move upward, which will cause the connector to stretch the tension spring, thereby achieving the purpose of material picking force control and avoiding excessive pressure that could damage the chip to be tested.

[0018] The above and other objects, advantages and features of this utility model will become more apparent to those skilled in the art from the following detailed description of specific embodiments of this utility model in conjunction with the accompanying drawings. Attached Figure Description

[0019] The following sections will describe some specific embodiments of the present invention in a detailed manner by way of example and not limitation, with reference to the accompanying drawings. The same reference numerals in the drawings denote the same or similar parts or components. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings: Figure 1 This is a schematic structural diagram of a chip adsorption device according to an embodiment of the present invention; Figure 2 This is a schematic structural diagram of a tension spring and a tensioning member according to an embodiment of the present invention; Figure 3 This is a schematic structural diagram of a chip adsorption device according to another embodiment of the present invention; Figure 4 yes Figure 3 A schematic enlarged view of part A in the middle; Figure 5 This is a schematic connection diagram of the second bracket and the first bracket according to an embodiment of the present utility model; Figure 6 This is a schematic cross-sectional view of a chip adsorption device according to an embodiment of the present invention.

[0020] Figure label: 100-Chip adsorption device, 200-Chip under test, 10-Adsorption element, 11-Air passage, 20-First support, 30-Transmission assembly, 31-Synchronous pulley, 311-First synchronous pulley, 312-Second synchronous pulley, 32-Synchronous belt, 321-First synchronous belt, 322-Second synchronous belt, 40-First driving element, 51-Second driving element, 52-Connecting element, 53-Tension spring, 54-Tensioning element, 55-Base, 60-Fourth driving element, 70-Third driving element, 80-Third support, 90-Second support, 91-Mounting plate, 92-Second limiting element, 93-First limiting element, 95-Ball spline structure. Detailed Implementation

[0021] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0022] In the description of this utility model, it should be understood that the terms "upper" and "lower" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0023] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature, that is, include one or more of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified. When a feature "includes or contains" one or more of the features it encompasses, unless otherwise specifically described, this indicates that other features are not excluded and may be further included.

[0024] Unless otherwise expressly specified and limited, the terms "connection," "installation," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art should be able to understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0025] Unless otherwise specified, all terms (including technical and scientific terms) used in the description of this embodiment have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. Figure 1 This is a schematic structural diagram of a chip adsorption device 100 according to an embodiment of the present invention. Figure 2 This is a schematic structural diagram of a tension spring 53 and a tensioning member 54 according to an embodiment of the present invention. Figure 1 and Figure 2 As shown, in some embodiments, this utility model provides a chip adsorption device 100, which includes a first support 20, a plurality of adsorption elements 10, a synchronous transmission assembly 30, and a first driving element 40. The plurality of adsorption elements 10 are rotatably connected to the first support 20, and each adsorption element 10 is used to adsorb the chip 200 to be tested. The synchronous transmission assembly 30 includes a plurality of synchronous pulley sets and a plurality of synchronous belts 32. Each adsorption element 10 is fitted with a set of synchronous pulley sets, and each synchronous pulley set includes a plurality of synchronous pulleys 31. A synchronous belt 32 is fitted onto the synchronous pulleys 31 of two adjacent adsorption elements 10 to drive the two adjacent adsorption elements 10 to rotate synchronously. The first driving element 40 is driven by any one of the synchronous pulleys 31 to drive the plurality of adsorption elements 10 to rotate synchronously through the synchronous pulleys 31 and the synchronous belts 32, thereby driving the plurality of chips 200 to rotate synchronously. Here, the first driving element 40 is mounted on the first support 20.

[0026] This embodiment uses a first driving component 40, in conjunction with a synchronous wheel 31 and a synchronous belt 32, to synchronously drive multiple adsorption components 10 to rotate, thereby simultaneously adjusting the position of multiple tested chips 200. This reduces the number of first driving components 40, decreases the volume of the chip adsorption device 100, and lowers the cost of the chip adsorption device 100.

[0027] In some embodiments, the first drive element 40 is a servo motor, which can improve the rotational accuracy of the chip under test 200 compared to a stepper motor.

[0028] See Figure 1 In some embodiments, multiple adsorption elements 10 are arranged at intervals along a predetermined direction. Here, Figure 1 The arrows in the diagram indicate a preset direction. Each synchronizer assembly includes two adjacent, vertically arranged synchronizer pulleys 31, defined as a first synchronizer pulley 311 and a second synchronizer pulley 312. Multiple synchronizer belts 32 include multiple first synchronizer belts 321 and multiple second synchronizer belts 322. The first synchronizer belts 321 are used to connect with adjacent first synchronizer pulleys 311, and the second synchronizer belts 322 are used to connect with adjacent second synchronizer pulleys 312. The multiple first synchronizer belts 321 and multiple second synchronizer belts 322 are arranged alternately along a preset direction, and portions of adjacent first synchronizer belts 321 and second synchronizer belts 322 overlap vertically. Here, the suction member 10 extends vertically, and the first synchronizer pulley 311 on the same suction member 10 is located above the second synchronizer pulley 312 and rotates synchronously.

[0029] This embodiment, through the arrangement of the above-described structure, enables the synchronous rotation of multiple adsorption elements 10, and features a compact structure with a small footprint. Furthermore, the lengths of the first synchronous belt 321 and the second synchronous belt 322 can be designed according to the spacing between adjacent adsorption elements 10; simply replacing the synchronous belts 32 with different lengths can meet the arrangement requirements of adsorption elements 10 with different spacings.

[0030] In some embodiments, the first driving member 40 is connected to the synchronous wheel 31 on any of the outermost adsorption members 10, which can make full use of the unused synchronous wheel 31 and simplify the structure of the chip adsorption device 100. See also Figure 1 The first synchronous pulley 311 on the leftmost adsorption element 10 is connected to the first driving element 40 on the left via a first synchronous belt 321. Here, the first driving element 40 is a motor, and a synchronous pulley 31 is fitted onto the motor's output shaft. When the motor rotates, the cooperation of multiple first synchronous belts 321, multiple second synchronous belts 322, multiple first synchronous pulleys 311, and multiple second synchronous pulleys 312 simultaneously drives multiple adsorption elements 10 to rotate, thereby simultaneously adjusting the position, i.e., the horizontal angle, of multiple tested chips 200. (See also...) Figure 1The first synchronous pulley 311 on the rightmost adsorption component 10 is empty, meaning that the first synchronous belt 321 does not need to be installed.

[0031] In some embodiments, the number of adsorption elements 10 is four, which means that the chip adsorption device 100 can adsorb four test chips 200 at a time, transport the four test chips 200 simultaneously, and adjust the position of the four test chips 200 at the same time. In other embodiments, the number of adsorption elements 10 can be determined according to specific design requirements.

[0032] like Figure 2 As shown, and see Figure 1 In some embodiments, the chip adsorption device 100 further includes a plurality of tensioning members 54, which are mounted on the first support 20. Each tensioning member 54 corresponds to a synchronous belt 32 and abuts against the synchronous belt 32 to adjust the tension of the synchronous belt 32. Here, each tensioning member 54 is provided with a base 55, on which the tensioning member 54 is mounted, and the base 55 is mounted on the first support 20. Here, the tensioning member 54 is a cam bearing follower.

[0033] Specifically, the plurality of tensioning elements 54 includes a plurality of first tensioning elements 541 and a plurality of second tensioning elements 542. Each first tensioning element 541 is installed on the side of a first synchronous belt 321 and abuts against the first synchronous belt 321 to adjust the tension of the first synchronous belt 321. Each second tensioning element 542 is installed on the side of a second synchronous belt 322 and abuts against the second synchronous belt 322 to adjust the tension of the second synchronous belt 322.

[0034] Figure 3 This is a schematic structural diagram of a chip adsorption device 100 according to another embodiment of the present invention. Figure 4 yes Figure 3 A schematic enlarged view of part A in the middle. Figure 5 This is a schematic connection diagram of the second bracket 90 and the first bracket 20 according to an embodiment of the present invention. Figures 3 to 5 As shown, and see Figures 1 to 2 In some embodiments, the chip adsorption device 100 further includes a plurality of second driving elements 51, each connected to a corresponding adsorption element 10 to controllably drive the corresponding adsorption element 10 to move vertically. Here, the plurality of second driving elements 51 are all mounted on the first support 20. The second driving element 51 is a cylinder, which has a piston rod arranged vertically, and the vertical movement of the adsorption element 10 is achieved by the extension and retraction of the piston rod. In other embodiments, the second driving element 51 can also be other driving sources, specifically selected according to design requirements.

[0035] In some embodiments, the chip adsorption device 100 further includes a plurality of connectors 52 and a plurality of tension springs 53. Each connector 52 corresponds to an adsorption element 10 and a second driving element 51, and is connected to the corresponding adsorption element 10 and the second driving element 51, respectively. Each tension spring 53 corresponds to a connector 52, with one end connected to the connector 52 and the other end connected to the first support 20. Here, the connectors 52 are arranged horizontally and are plate-shaped. A bearing is sleeved on the adsorption element 10, and the connectors 52 are sleeved on the outside of the bearing. The bearing design avoids affecting the rotation of the adsorption element 10.

[0036] In this embodiment, when the second driving member 51 is at the lower limit position, the second driving member 51 has no force on the connecting member 52. The second driving member 51 and the connecting member 52 are in a gap relationship in the vertical direction. At this time, the adsorption member 10 picks up the chip under test. Then, the second driving member 51 drives the adsorption member 10 to move upward, which will drive the connecting member 52 to stretch the tension spring 53, thereby achieving the purpose of material picking force control and avoiding excessive pressure that could damage the chip under test.

[0037] Figure 6 This is a schematic cross-sectional view of a chip adsorption device 100 according to an embodiment of the present invention. Figure 6 As shown, in some embodiments, the chip adsorption device 100 further includes multiple ball spline structures 95. Each ball spline structure 95 includes a spline sleeve connected to a synchronous wheel 31. The spline sleeve is connected to the adsorption member 10, which is configured to rotate with the spline sleeve and move up and down relative to it. The synchronous wheel 31 is fixed to the spline sleeve by a fixing member. In this embodiment, the ball spline structure 95 enables the synchronous wheel 31 to drive the adsorption member 10 to rotate and allows the adsorption member 10 to move up and down relative to the synchronous wheel 31 under the drive of the second driving member 51. This embodiment, by designing the ball spline structure 95, enables the adsorption member 10 to move in two degrees of freedom.

[0038] In some embodiments, the adsorption member 10 has an air passage 11 inside, through which air is drawn to adsorb the chip 200 to be tested.

[0039] See Figure 3 , Figure 4 and Figure 5In some embodiments, the chip adsorption device 100 further includes a second support 90 and a third drive member 70, with the second support 90 connected to the first support 20. The third drive member 70 is mounted on the second support 90 and is configured to controllably drive the second support 90 to move horizontally, thereby causing multiple adsorption elements 10 to move synchronously horizontally. Here, the third drive member 70 is an electric slide, arranged horizontally and perpendicular to a preset direction, to drive the second support 90 to move in a direction perpendicular to the preset direction, thereby causing all adsorption elements 10 to move in a direction perpendicular to the preset direction.

[0040] In some embodiments, the chip adsorption device 100 further includes a third support 80 and a fourth drive member 60. The third support 80 is connected to the third drive member 70 and is arranged vertically. The fourth drive member 60 is mounted on the third support 80 and is configured to controllably drive the third support 80 to move vertically, thereby causing the plurality of adsorption elements 10 to move synchronously vertically. Here, the fourth drive member 60 is a lead screw mechanism.

[0041] This embodiment can not only realize the individual up-and-down movement and synchronous rotation of each adsorption element 10, but also realize the synchronous up-and-down movement of multiple adsorption elements 10, as well as synchronous movement along a direction perpendicular to the preset direction, which can meet a variety of application scenarios and has a wide range of applications.

[0042] In some embodiments, the second support 90 has a plurality of mounting plates 91 extending vertically and connected to the first support 20. The chip adsorption device 100 further includes a plurality of first limiting members 93 and a plurality of second limiting members 92, each first limiting member 93 being mounted on a connector 52. The plurality of second limiting members 92 are respectively mounted on each mounting plate 91. When the second driving member 51 moves the adsorption member 10 vertically a preset distance, the first limiting member 93 abuts against the corresponding second limiting member 92, thereby limiting the adsorption member 10. Here, the preset distance can be determined according to design requirements.

[0043] This embodiment, through the design of the first limiting member 93 and the second limiting member 92, can limit the vertical movement of each adsorption member 10, preventing the adsorption member 10 from exceeding the maximum movement and damaging the chip 200 under test.

[0044] This embodiment also provides a chip testing device, including the chip adsorption device 100 described above. Details regarding the chip adsorption device 100 are omitted here.

[0045] In this embodiment, before each adsorption element 10 moves downward to pick up material, the first driving element 40 drives all adsorption elements 10 to rotate by a preset angle in advance. Then, after each adsorption element 10 has picked up material, all adsorption elements 10 are driven back to their original positions. Here, the preset angle is the difference between the incoming angle of the chip under test and the test angle of the chip under test. It can be understood that by rotating the adsorption element 10 by the preset angle in advance, the angle of the adsorption element 10 is matched with the incoming angle of the chip under test, and then returning to its original position, which is equivalent to adjusting the angle of the chip under test 200 to the test angle.

[0046] Therefore, those skilled in the art should recognize that although many exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications conforming to the principles of the present invention can be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and recognized as covering all such other variations or modifications.

Claims

1. A chip adsorption device, characterized in that, include: First support; Multiple adsorption elements are rotatably connected to the first support, and each of the multiple adsorption elements is used to adsorb the chip under test; The synchronous transmission assembly includes multiple synchronous pulley sets and multiple synchronous belts. Each of the adsorption elements is fitted with a set of synchronous pulley sets, and each synchronous pulley set includes multiple synchronous pulleys. A synchronous belt is fitted on the synchronous pulleys of two adjacent adsorption elements to drive and connect the two adjacent adsorption elements. The first driving component is connected to any of the synchronous pulleys in the synchronous transmission assembly to drive multiple adsorption components to rotate synchronously via the synchronous pulleys and the synchronous belt, thereby driving multiple tested chips to rotate synchronously.

2. The chip adsorption device according to claim 1, characterized in that, Multiple adsorption elements are arranged at intervals along a preset direction; Each of the synchronous pulley sets includes two synchronous pulleys arranged vertically adjacent to each other, and the two synchronous pulleys are defined as a first synchronous pulley and a second synchronous pulley, respectively; The multiple synchronous belts include multiple first synchronous belts and multiple second synchronous belts; the first synchronous belts are used to connect with adjacent first synchronous pulleys, and the second synchronous belts are used to connect with adjacent second synchronous pulleys. The multiple first synchronous belts and multiple second synchronous belts are arranged alternately along the preset direction, and the first synchronous belts and second synchronous belts that are adjacent in the vertical direction partially overlap.

3. The chip adsorption device according to claim 2, characterized in that, The first driving member is connected to the synchronous wheel on any of the outermost adsorption members.

4. The chip adsorption device according to claim 3, characterized in that, Also includes: Multiple tensioning elements are installed on the first bracket, each tensioning element corresponding to one of the timing belts and abutting against the timing belts to adjust the tension of the timing belts.

5. The chip adsorption device according to any one of claims 1-4, characterized in that, Also includes: Multiple second driving elements are connected one-to-one with the adsorption elements to controllably drive the corresponding adsorption elements to move vertically.

6. The chip adsorption device according to claim 5, characterized in that, Also includes: Multiple connectors, each connector corresponding to one adsorption element and one second driving element, and respectively connected to the corresponding adsorption element and the second driving element; Multiple tension springs, each tension spring corresponding to one of the connectors, with one end connected to the connector and the other end connected to the first bracket.

7. The chip adsorption device according to claim 6, characterized in that, Also includes: The second bracket is connected to the first bracket; A third driving component is mounted on the second bracket. The third driving component is configured to controllably drive the second bracket to move in the horizontal direction, thereby causing the plurality of adsorption components to move synchronously in the horizontal direction.

8. The chip adsorption device according to claim 7, characterized in that, Also includes: The third bracket is connected to the third driving component and is arranged vertically; A fourth driving component is mounted on the third bracket. The fourth driving component is configured to controllably drive the third bracket to move vertically, thereby causing multiple adsorption components to move vertically synchronously.

9. The chip adsorption device according to claim 7, characterized in that, The second support has a plurality of mounting plates extending vertically and connected to the first support, and the adsorption device further includes: A plurality of first limiting members, each of the first limiting members being mounted on one of the connecting members; Multiple second limiting members are respectively installed on each of the mounting plates; When the second driving member drives the adsorption member to move vertically a preset distance, the first limiting member abuts against the corresponding second limiting member, thereby limiting the adsorption member.

10. A chip testing device, characterized in that, Includes the chip adsorption device as described in any one of claims 1-9.

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