Wafer edge finding device

Abstract

The utility model relate to a wafer edge finding device, which is provided with a first driving mechanism, a second driving mechanism, a third driving mechanism and a wafer carrier platform. The first driving mechanism is provided with a first sliding seat, a first driver and a first screw rod. The first driver can drive the first screw rod to rotate and move the first sliding seat in the first axial direction. The second driving mechanism is provided on the first sliding seat and is provided with a second sliding seat, a second driver and a second screw rod. The second driver can drive the second screw rod to rotate and move the second sliding seat in the second axial direction. The third driving mechanism is provided on the second sliding seat. Thus, the wafer carrier platform can be accurately moved to a preset position.

Description

Technical Field

[0001] This utility model relates to an edge-finding device, and more particularly to a wafer edge-finding device for finding the edges of a wafer. Background Technology

[0002] In the manufacturing or processing of semiconductors, wafer edge finding devices are often used to locate the notch or center of the wafer to facilitate subsequent processes. In the process of finding the notch or center, the wafer needs to be placed on a wafer stage, and a multi-axis drive mechanism drives the wafer stage to rotate or translate the wafer. Currently, the multi-axis drive mechanism in wafer edge finding devices usually uses a motor driver as the power source and a belt as the transmission medium.

[0003] However, using a belt as the transmission medium has the problem of inaccurate movement, which makes it impossible to move the wafer to the preset position accurately. It may be preset to move the wafer by 10 mm, but in reality it is only moved by 9 mm. The problem of inaccurate positioning will also cause the edge finding results to be inaccurate. It is clear that the previous technology still needs to be improved. Utility Model Content

[0004] Therefore, the purpose of this invention is to provide a wafer edge finding device that can improve upon at least one of the shortcomings of prior art.

[0005] According to the present invention, a wafer edge-finding device comprises: a body; a first driving mechanism disposed on the body; a second driving mechanism disposed on the first driving mechanism and driven by the first driving mechanism to move along a first axis; a third driving mechanism disposed on the second driving mechanism and driven by the second driving mechanism to move along a second axis; a wafer stage disposed on the third driving mechanism and driven by the third driving mechanism to rotate around a rotation axis parallel to the third axis as a rotation center; the first axis, the second axis, and the third axis are perpendicular to each other, the first axis and the second axis are horizontal axes, and the third axis is a vertical axis; a sensing module disposed on the body and located on one side of the wafer stage; the first driving mechanism comprises a first translation component and a first driving component; the first translation... The assembly includes two first guide rails and a first slide block disposed on the two guide rails; the two guide rails extend along the first axis and are parallel to each other; the first drive assembly includes a first driver and a first screw driven by the first driver; the first driver can drive the first screw block to rotate and drive the first slide block to move along the first axis; the second drive mechanism is disposed on the first slide block and includes a second translation assembly and a second drive assembly; the second translation assembly includes two second guide rails and a second slide block disposed on the two guide rails; the two guide rails extend along the second axis and are parallel to each other; the second drive assembly includes a second driver and a second screw driven by the second driver; the second driver can drive the second screw block to rotate and drive the second slide block to move along the second axis; the third drive mechanism is disposed on the second slide block.

[0006] The wafer edge-finding device of this utility model, since the first driving mechanism and the second driving mechanism use the first screw and the second screw as the medium for transmission power, can accurately move the wafer stage to a preset position compared with the belt drive of the prior art. Attached Figure Description

[0007] Figure 1 This is a three-dimensional diagram illustrating the wafer edge-finding device and wafer in an embodiment of this utility model.

[0008] Figure 2 This is a front view illustrating the wafer edge finding device.

[0009] Figure 3 It is a 3D diagram illustrating the first drive mechanism, second drive mechanism, third drive mechanism, and wafer stage of the wafer edge finding device.

[0010] Figure 4 It is a 3D diagram illustrating the first drive mechanism.

[0011] Figure 5 It is a 3D diagram illustrating the second drive mechanism.

[0012] Figure 6 It is a 3D diagram illustrating the third drive mechanism.

[0013] [Symbol Explanation]

[0014] 1: Wafer edge finding device

[0015] 2: Wafer

[0016] A: Ontology

[0017] A1: Base

[0018] A2: First frame

[0019] A3: Second frame

[0020] A4: Third frame

[0021] B: First drive mechanism

[0022] B1: First translation component

[0023] B2: First Drive Component

[0024] B11: First guide rail

[0025] B12: First slide

[0026] B2: The first driving component

[0027] B21: First Driver

[0028] B22: First screw

[0029] B23: First Coupling

[0030] B24: Pivot

[0031] C: Second drive mechanism

[0032] C1: Second translation component

[0033] C2: Second drive component

[0034] C11: Mounting bracket

[0035] C12: Second guide rail

[0036] C13: Second slide

[0037] C21: Second Driver

[0038] C22: Second screw

[0039] C23: Second coupling

[0040] C24: Pivot

[0041] D: Third drive mechanism

[0042] D1: Third Drive

[0043] D2: Rotary seat

[0044] D3: Gear Set

[0045] D4: Third coupling

[0046] E: Wafer stage

[0047] E1: Platform

[0048] E2: Suction nozzle

[0049] F: Sensing module

[0050] F1: Image Capturer

[0051] F2: Light source

[0052] X: First axis

[0053] Y: Second axis

[0054] Z: Third axis

[0055] L: Axis of rotation Detailed Implementation

[0056] Please see Figure 1 The present invention can be illustrated by taking the wafer edge finding device 1 shown in the figure as an example. The wafer edge finding device 1 is suitable for carrying a wafer 2 and finding the positioning notch or center of the wafer 2 in the process of manufacturing or processing semiconductors.

[0057] Please see Figure 1 The wafer edge finding device 1 is equipped with:

[0058] One body A;

[0059] A first drive mechanism B is located on the main body A;

[0060] A second drive mechanism C is disposed on the first drive mechanism B and can be driven by the first drive mechanism B to move along a first axis X.

[0061] A third drive mechanism D is provided on the second drive mechanism C and can be driven by the second drive mechanism C to move along a second axis Y;

[0062] A wafer stage E is disposed on the third drive mechanism D and can be driven by the third drive mechanism D to rotate parallel to a rotation axis L along a third axis Z. Figure 2 Rotate around the center of rotation;

[0063] A sensing module F is disposed on the body A and located on one side of the wafer stage E. The sensing module F is separated from the wafer stage E by a distance along the first axis X.

[0064] Wherein, the first axis X, the second axis Y, and the third axis Z are perpendicular to each other, the first axis X and the second axis Y are horizontal axes, and the third axis Z is a vertical axis.

[0065] Please see Figure 1 2. The main body A is provided with a first frame A2, a second frame A3 and a third frame A4 on a base A1. The second frame A3 and the third frame A4 are arranged parallel to each other on one side of the first frame A2 and perpendicular to the first frame A2.

[0066] Please see Figure 3 , 4 The first drive mechanism B is disposed on the first frame A2 and includes a first translation component B1 and a first drive component B2. The first translation component B1 includes two first guide rails B11 and a first slide block B12 disposed on the two guide rails B11. The two guide rails B11 are disposed on the first frame A2 and extend along a first axis X and are parallel to each other. The first drive component B2 includes a first driver B21, a first screw B22 driven by the first driver B21, a first coupling B23 connecting the first driver B21 and the first screw B22, and two pivot seats B24 for pivoting the first screw B22. The first driver B21 can drive the first screw B22 to rotate and drive the first slide block B12 to move along the first axis X.

[0067] Please see Figure 3 , 5 The second drive mechanism C is disposed on the first slide B12 and is provided with a second translation component C1 and a second drive component C2; the second translation component C1 is provided with a mounting base C11, two second guide rails C12 and a second slide C13 disposed on the two guide rails C12; the mounting base C11 is disposed on the first slide B12, the two guide rails C12 are disposed on the mounting base C11 and extend along a second axis Y and are parallel to each other; the second drive component C2 is provided with a second driver C21, a second screw C22 driven by the second driver C21, a second coupling C23 connecting the second driver C21 and the second screw C22, and two pivot seats C24 for pivoting the second screw C22; the second driver C21 can drive the second screw C22 to rotate and drive the second slide C13 to move along the second axis Y.

[0068] Please see Figure 3 , 6The third drive mechanism D is mounted on the second slide C13 and includes a third driver D1, a rotary seat D2 driven by the third driver D1, a gear set D3 connecting the third driver D1 and the rotary seat D2, and a third coupling D4 mounted on the rotary seat D2. The third driver D1 can drive the rotary seat D2 via the gear set D3, thereby driving the third coupling D4 to rotate along the axis L. Figure 2 Rotate around the center of rotation.

[0069] Please see Figure 2 , 3 6. The wafer stage E is located on the third coupling D4 and can be driven by the third driver D1 to rotate around the rotation axis L as the rotation center; the wafer stage E is provided with a stage E1 for placing the wafer 2 and multiple suction nozzles E2 located on the stage E1 and capable of adsorbing the wafer 2.

[0070] See Figure 1 , 2 The sensing module F is mounted on the second frame A3 and includes an image sensor F1 and a light source F2. The image sensor F1 and the light source F2 are arranged facing each other with a distance between them along a third axis Z. The image sensor F1 is located below the light source F2, and an area is formed between the image sensor F1 and the light source F2 through which the edge of the wafer 2 can move.

[0071] In the implementation of this utility model embodiment, after the wafer 2 is placed on the stage E1 and held by the suction nozzle E2, the third driving mechanism D drives the wafer stage E to rotate the wafer 2 around the rotation axis L as the rotation center, and the sensing module F senses the edge contour of the wafer 2, thereby obtaining the notch orientation of the wafer 2 or the center of the wafer 2.

[0072] If the actual position of the center of the wafer 2 deviates from the preset position, the wafer stage E can be moved along the first axis X or the second axis Y by the first driving mechanism B or the second driving mechanism C to correct the position of the wafer stage E in the horizontal axis.

[0073] The wafer edge-finding device of this utility model embodiment uses the first screw B22 and the second screw C22 as the medium for transmission power, which can accurately move the wafer stage E to a preset position compared with the belt drive of the prior art.

[0074] The above description is only a preferred embodiment of the present utility model and should not be construed as limiting the scope of the present utility model. Any simple equivalent changes and modifications made in accordance with the scope of the present utility model patent application and the description of the utility model shall still fall within the scope of the present utility model patent.

Claims

1. A wafer edge-finding device, comprising: one body; A first drive mechanism is located on this body; A second drive mechanism is disposed on the first drive mechanism and can be driven by the first drive mechanism to move in a first axis; A third drive mechanism is disposed on the second drive mechanism and can be driven by the second drive mechanism to move in a second axis; A wafer stage is disposed on the third driving mechanism and can be driven by the third driving mechanism to rotate around a rotation axis parallel to a third axis as the rotation center; the first axis, the second axis, and the third axis are perpendicular to each other, the first axis and the second axis are horizontal axes, and the third axis is a vertical axis. A sensing module is disposed on the main body and located on one side of the wafer stage; Its features are: The first drive mechanism includes a first translation component and a first drive component; the first translation component includes two first guide rails and a first slide block disposed on the two guide rails; the two guide rails extend along the first axis and are parallel to each other; the first drive component includes a first driver and a first screw driven by the first driver; the first driver can drive the first screw block to rotate and drive the first slide block to move along the first axis. The second drive mechanism is mounted on the first slide and includes a second translation component and a second drive component. The second translation component includes two second guide rails and a second slide mounted on the two guide rails. The two guide rails extend along the second axis and are parallel to each other. The second drive component includes a second driver and a second screw driven by the second driver. The second driver can drive the second screw to rotate and move the second slide along the second axis. The third drive mechanism is located on the second slide.

2. The wafer edge finding device as described in claim 1, characterized in that, The main body has a first frame erected on a base, and the first drive mechanism is located on the first frame; the first drive assembly has a first coupling connecting the first driver and the first screw and two pivot seats for pivoting the first screw.

3. The wafer edge finding device as described in claim 1, characterized in that, The second drive assembly includes a second coupling connecting the second driver and the second screw, and two pivot seats for pivoting the second screw.

4. The wafer edge finding device as described in claim 1, characterized in that, The third drive mechanism includes a third driver, a rotary seat driven by the third driver, and a third coupling disposed on the rotary seat; the third driver can drive the rotary seat to rotate around the rotation axis as the rotation center.

5. The wafer edge finding device as described in claim 4, characterized in that, The wafer stage is located on the third coupling and can be driven by the third driver; the wafer stage has a platform for placing a wafer and a plurality of suction nozzles located on the platform.

6. The wafer edge finding device as described in claim 1, characterized in that, The main body has a second frame erected on a base; the sensing module is located on the second frame and has an image sensor and a light source.

7. The wafer edge finding device as described in claim 6, characterized in that, The image sensor and the light source are positioned opposite each other at a distance along the third axis.

8. The wafer edge finding device as described in claim 7, characterized in that, The image sensor is located below the light source.

9. The wafer edge finding device as described in claim 1, characterized in that, The main body has a first frame and a second frame erected on a base. The first frame and the second frame are perpendicular to each other. The first drive mechanism is located on the first frame, and the sensing module is located on the second frame.

10. The wafer edge finding device as described in claim 9, characterized in that, The sensing module is spaced apart from the wafer stage along the first axis.

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