Wafer epitaxial layer film thickness measurement equipment (M08X)
CN309019563SActive Publication Date: 2024-12-20GEZE SILICON SEMICON TECH (SUZHOU) CO LTD
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Patent Information
- Application Number
- CN202430304071.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-22
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2039-05-22
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Figure 000001_ABST
Abstract
1. The name of the product of this design: Wafer epitaxial layer thickness measurement equipment (M08X). 2. Purpose of this design product: Equipment used to measure the thickness of epitaxial film on 8-inch wafers. 3. The design key points of this appearance design product are: the main view. 4. The picture or photo that best illustrates the key points of the design: main view.
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