Dual semiconductor heat dissipation mobile phone live broadcast bracket (JCHF-F04)
CN309043844SActive Publication Date: 2024-12-31JINGCHUANGFU ELECTRONIC TECH (SHENZHEN) CO LTD
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Patent Information
- Application Number
- CN202430295032.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-17
- Publication Date
- 2024-12-31
- Estimated Expiration
- 2039-05-17
Smart Images
Figure 000007_ABST
Abstract
1. The name of the product of this design: Dual semiconductor heat dissipation mobile phone live broadcast bracket (JCHF‑F04). 2. The purpose of this design product: to dissipate heat and cool down mobile phones when they generate heat after long-term use. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the design points: Stereoscopic diagram 1.
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