Memory module heat sink
CN309051829SActive Publication Date: 2025-01-03ESSENCORE LTD
Patent Information
- Application Number
- CN202430312242.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-24
- Publication Date
- 2025-01-03
- Estimated Expiration
- 2039-05-24
Smart Images
Figure 000007_ABST
Abstract
1. The name of the product of this design: heat sink for memory module. 2. Purpose of this product design: This product design is used to dissipate heat from memory modules. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the design points: three-dimensional picture.
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Citation Information
Cited By
Heat sink for memory modules
USD1126931S