Heating plate (semiconductor wafer)

CN309252342SActive Publication Date: 2025-04-22爱利彼半导体设备(上海)有限公司
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Patent Information

Application Number
CN202430442143.2
Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
Filing Date
2024-07-16
Publication Date
2025-04-22
Estimated Expiration
2039-07-16

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Abstract

1. The name of the product of this design: heating plate (semiconductor wafer). 2. Purpose of the product of this design: heating plate for electric water boiler. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the design points: Stereoscopic diagram 1.
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Citation Information

Cited By

  • Semiconductor wafer heater

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