Heat sink for circuit board
CN309288733SActive Publication Date: 2025-05-13CANAAN CREATIVE CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- CN202430489559.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Priority Date
- 2022-10-20
- Filing Date
- 2023-04-13
- Publication Date
- 2025-05-13
- Estimated Expiration
- 2038-04-13
Smart Images

Figure 000007_ABST
Abstract
1. The name of the product of this design: heat sink for circuit board. 2. Purpose of the product of this design: The overall product is used as a working component in a data processing server, specifically a circuit board with a heat sink, and the partial product for which protection is requested is used as a heat sink of the circuit board. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the design points: three-dimensional picture.
Need to check novelty before this filing date? Find Prior Art