Wafer Nitrogen Filling and Debonding Machine
CN309324809SActive Publication Date: 2025-06-06FUTANS (SHANGHAI) ELECTRONIC TECH CO LTD
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Patent Information
- Application Number
- CN202430661413.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-21
- Publication Date
- 2025-06-06
- Estimated Expiration
- 2039-10-21
Smart Images
Figure 000007_ABST
Abstract
1. The name of the product of this design: Wafer nitrogen filling and disassembly machine. 2. Purpose of the product with this appearance design: The product with this appearance design is used for nitrogen filling and dissolving machine. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the design points: three-dimensional picture.
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