Main body of semiconductor packaging equipment

Abstract

1. Name of the product of this design: Main body of semiconductor packaging equipment. 2. Purpose of the product of this design: The overall product is used as a semiconductor packaging device, and the part for which protection is requested is used as the main body of the semiconductor packaging device. 3. The key design feature of this design product lies in the shape of the part of the product for which protection is sought. 4. The picture or photo that best illustrates the key points of the design: Design 1 3D drawing. 5. Designate Design 1 as the base design. 6. Other circumstances that require explanation: The dotted lines do not constitute part of the design for which protection is sought.

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