Substrate support tool for semiconductor manufacturing apparatuses
CN309536346SActive Publication Date: 2025-10-10KOKUSAI DENKI KK
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Patent Information
- Application Number
- CN202230092082.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Priority Date
- 2021-08-27
- Filing Date
- 2022-02-25
- Publication Date
- 2025-10-10
- Estimated Expiration
- 2037-02-25
Smart Images
Figure 000007_ABST
Abstract
1. Name of the designed product: substrate support tool for semiconductor manufacturing apparatus. 2. Use of the designed product: the product is a substrate support tool which is arranged in a substrate processing apparatus for processing a plurality of wafers to surround a substrate in a processing chamber and to support each wafer on a pin. 3. Design points of the designed product: in shape. 4. Picture or photograph best indicating the design points: perspective view.
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