sop (sop with scalable pin count)
CN309667730SActive Publication Date: 2025-12-1258TH RES INST OF CETC
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Patent Information
- Application Number
- CN202430682995.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-29
- Publication Date
- 2025-12-12
- Estimated Expiration
- 2039-10-29
Smart Images
Figure 000001_ABST
Abstract
1. Name of the designed product: SOP package (SOP package with expandable pin number). 2. Use of the designed product: It can be used in the shape of integrated circuit package. 3. Design points of the designed product: It is in shape. 4. Picture or photo that best shows the design points: front view.
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