Switchable wafer film thickness measurement stage
CN309701478SActive Publication Date: 2025-12-26YONGCHUN SEMICON (WUXI) CO LTD
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Patent Information
- Application Number
- CN202530045513.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-23
- Publication Date
- 2025-12-26
- Estimated Expiration
- 2040-01-23
Smart Images
Figure 000007_ABST
Abstract
1. The name of the design product: switchable wafer film thickness measurement platform. 2. The use of the design product: used as a wafer platform, which can carry and position the wafer during the wafer film thickness measurement process. 3. The design points of the design product: in shape. 4. The picture or photo that best shows the design points: design 1 perspective view. 5. Design 1 is designated as the basic design.
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