Holding portion of holding ring for semiconductor wafer polishing

Abstract

1. Name of the designed product: holding part of holding ring for semiconductor wafer grinding 2. Use of the designed product: the designed product as a whole is a holding ring for semiconductor wafer grinding used for holding a substrate such as a semiconductor wafer during a substrate grinding process for manufacturing a substrate such as a semiconductor, and grinding a single surface of the substrate. The claimed part is used as a holding part of a holding ring for semiconductor wafer grinding. 3. Design points of the designed product: the shape of the claimed part. 4. Picture or photograph best indicating the design points: Design 1, perspective view 1. 5. The rear view, right view and left view are the same as the front view, and the rear view, right view and left view are omitted. 6. Design 1 is designated as the basic design. 7. Other matters to be stated Other statements: the designed product is a partial design. The part represented by a solid line is claimed as a partial design. The part represented by a dashed line is not claimed.

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