Holding portion of holding ring for semiconductor wafer polishing

Abstract

1. Name of the designed product: holding part of holding ring for semiconductor wafer polishing. 2. Use of the designed product: the designed product as a whole is a holding ring for semiconductor wafer polishing, which is used to hold a wafer or the like in a ring and polish one side of the wafer in a substrate polishing process for manufacturing a semiconductor or the like. The claimed part is used as a holding part of a holding ring for semiconductor wafer polishing. 3. Design points of the designed product: the shape of the claimed part. 4. Picture or photograph best indicating the design points: Design 1, perspective view 1. 5. Design 1, Design 2 rear view, right view and left view and its front view are the same, omit the rear view, right view and left view of Design 1, Design 2. 6. Design 1 is designated as the basic design. 7. Other circumstances needing to be explained Other explanations: the designed product is a partial design. The part represented by a solid line is claimed as a partial design. The part represented by a dashed line is not claimed.

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