Reflow soldering and high-low temperature cycle tester
CN309734530SActive Publication Date: 2026-01-13RUILAISAISI TESTING TECHNOLOGY (CHANGZHOU) CO LTD
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Patent Information
- Application Number
- CN202530010135.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-08
- Publication Date
- 2026-01-13
- Estimated Expiration
- 2040-01-08
Smart Images
Figure 000001_ABST
Abstract
1. The name of the design product: reflow soldering and high-low temperature cycle tester. 2. The use of the design product: the design product is used for the equipment shell of high acceleration reflow soldering simulation and high-low temperature cycle integrated machine. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view.
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