Semiconductor heat spreader (diamond texture)

CN309786702SActive Publication Date: 2026-02-10曾银平
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Patent Information

Application Number
CN202530431256.7
Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
Filing Date
2025-07-23
Publication Date
2026-02-10
Estimated Expiration
2040-07-23

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Abstract

1. Name of the design product: semiconductor heat sink (diamond pattern). 2. Use of the design product: heat dissipation product for cooling mobile phones. 3. Design points of the design product: in shape. 4. Picture or photo best indicating the design points: perspective view 1.
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