Micro-hemispherical vacuum bond packaging system graphical user interface for electronic devices

Abstract

1. The name of the design product: micro-hemisphere vacuum bonding packaging system graphical user interface for electronic equipment. 2. The use of the design product: for displaying the micro-hemisphere vacuum bonding packaging process on electronic equipment. 3. The design points of the design product: the graphical user interface on electronic equipment. 4. The picture or photo that best shows the design points: front view. 5. The electronic equipment is a conventional design, and the rear view, left view, right view, top view, and bottom view are omitted. 6. The use of the graphical user interface: human-computer interaction mode: when the software is opened, enter the front view, which is the home page of the micro-hemisphere bonding packaging software, including control board port connection, 485 port connection, manual Z-axis stroke control, heating plate temperature control / display, pressure display, temperature and pressure curve display, automatic bonding programming, automatic bonding operation, etc.; select the corresponding serial port to perform serial port connection operation, after successful serial port connection, the system interface jumps to interface change state diagram 1, and a [system started] dialog box appears, after closing the dialog box, the temperature / pressure values on interface change state diagram 1 gradually display normally; after the temperature and pressure are normal, the system interface jumps to interface change state diagram 2, in the [automatic control programming] area of interface change state diagram 2, input the required bonding program name, set the temperature, holding time, pressure value, etc., and click the [new program] button to save the edited program; in interface change state diagram 2, the saved program can also be modified and saved (click the [save program] button), deleted (click the [delete program] button), etc.; in the [automatic control] area of interface change state diagram 2, select the appropriate bonding program, and then click the [automatic start / stop] and [automatic pressure control] buttons in sequence, the system interface jumps to interface change state diagram 3, the system will automatically perform countdown according to the program, and the corresponding temperature / pressure curve will be automatically displayed in the chart below, after the bonding is completed, the system interface jumps to interface change state diagram 4, and a [packaging completed] prompt box appears, and the system completes all bonding processes.

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