Lead frame for power module
CN309858011SActive Publication Date: 2026-03-20HANGZHOU SILAN MICROELECTRONICS CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-25
- Publication Date
- 2026-03-20
Smart Images
Figure 000001_ABST
Abstract
1. The name of the design product: lead frame of power module. 2. The use of the design product: for power module. 3. The design points of the design product: in the partial design shape claimed. 4. The picture or photograph that best shows the design points: front view. 5. Other circumstances that need to be explained: the solid line part is the partial part claimed.
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