Semiconductor heat sink (rectangular finned aluminum)

CN309860682SActive Publication Date: 2026-03-20曾银平
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
Filing Date
2025-08-28
Publication Date
2026-03-20

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Abstract

1. Name of the design product: semiconductor heat sink (oblong fin aluminum). 2. Use of the design product: heat dissipation product for cooling mobile phones and tablets. 3. Design points of the design product: in shape. 4. Picture or photo best indicating the design points: perspective view 1.
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