Adhesive layer portion of an adhesive tape for semiconductor device manufacturing

Abstract

1. Name of the product in this design: Adhesive layer of adhesive tape for semiconductor device manufacturing. 2. Application of this design: Used as an adhesive tape in processes such as semiconductor wafer dicing or chip bonding of semiconductor chips obtained from dicing; Application of partial design: Used as the adhesive layer in the adhesive tape. When using, after removing the PET separator, the wafer ring is attached to the adhesive layer, and the semiconductor wafer is attached to the adhesive layer. 3. The key design features of this product are the shapes shown in the partial designs of each part of the design. 4. The image or photograph that best illustrates the key design points: Design 1 3D view. 5. Design 1 is designated as the basic design. 6. Other situations requiring explanation: In Designs 1 to 10, the substrate, adhesive layer, and PET separation layer are transparent. In Designs 1 to 10, the numbers 1 to 4 in Figures 1 and 2 represent the substrate, adhesive layer, adhesive layer, and PET separation section, respectively; and the numbers 1 to 4 in Figure 3 represent the semiconductor wafer, substrate, adhesive layer, and adhesive layer, respectively.

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