Two-stage molded sensor and manufacturing process

Abstract

Electronic component comprising a first circuit carrier (1), at least one electronic element (7, 8, 9) connected to the first circuit carrier (1), and at least one first housing (3), wherein the electronic component has at least one Dambar residual structure (6) for fastening, characterized in that it has a fixing / shielding element (5) designed for positioning in a tool for manufacturing the electronic component and / or for shielding the at least one electronic element from electromagnetic radiation.

Description

[0001] The invention relates to an electronic component, in particular designed as a sensor and / or actuator arrangement or sensor or actuator, a method for manufacturing the electronic component and the use of the electronic component in motor vehicles.

[0002] Up to now, magnetic sensors molded with thermoset as a first housing are usually overmolded with a thermoplastic material as a second housing using a carrier or preform.

[0003] Additional circuitry is either mounted in the carrier / pre-molded part or molded together with the sensor transfer.

[0004] Sensors for acceleration or rotation rate are pre-molded or transfer-molded. These components are mounted onto an intermediate substrate, e.g., a printed circuit board, and then installed in a pre-molded housing.

[0005] US 6541311 B1 describes a method for positioning a component mounted on a conductor frame in a test socket, wherein the positioning of the component in the test socket is performed using the parting surface as a reference.

[0006] DE 10 2004 022 808 A1 relates to a sensor system in which the measuring sensor element is connected to the carrier by means of a force-fit and / or largely form-fit connection, which is preferably designed as an adhesive joint or contact point, and the signal coupling and / or the signal transmission of the longitudinal body waves between the measuring sensor element and the vehicle structure is carried out by means of an elastic coupling layer / viscoelastic coupling layer.

[0007] The invention is based on the objective of proposing an electronic component and a method for manufacturing such an electronic component that is relatively inexpensive and / or easy to manufacture and / or in particular makes it possible to do without a carrier or support element for manufacturing the second housing in an injection molding tool.

[0008] This problem is solved according to the invention by the electronic component according to claim 1 and the method according to claim 11.

[0009] The electronic component has a fixing / shielding element, in particular comprising a fixing surface or a fixing plate, wherein the fixing / shielding element is designed for positioning or fixing in a tool or injection mold for manufacturing the electronic component and / or for shielding the at least one electronic element from electromagnetic radiation. The fixing / shielding element is particularly preferably made of metal or sheet metal. The fixing / shielding element is expediently designed as a shield.

[0010] It is preferred that the electronic component is designed as a sensor and comprises at least one sensor element as an electronic element. Alternatively, preferably, the sensor component is designed as an actuator or as a combined sensor-actuator.

[0011] A circuit carrier is preferably understood to be a leadframe or ladder frame.

[0012] The fixing / shielding element is preferably connected to the at least one Dambar residual structure, this connection being particularly mechanical and optionally also electrical. If the fixing / shielding element is used as a shielding element, it is particularly preferably electrically connected to a ground connection.

[0013] It is advantageous that at least one Dambar residual structure is attached to the first housing and, in particular, is not connected to the first circuit carrier, wherein this at least one Dambar residual structure is particularly preferably anchored in the first housing and is electrically insulated within the first housing.

[0014] The phrases "at least partially surrounded" or "at least partially embedded" preferably express that something is partially or completely surrounded or embedded.

[0015] It is preferred that the first housing and the fixing / shielding element are at least partially embedded in a second housing, in particular formed from injection molding.

[0016] The electronic component preferably comprises, particularly in its first housing, at least one yaw rate sensor element and at least one two- or multi-axis acceleration sensor element, or at least two single-axis acceleration sensor elements, wherein the one or more acceleration sensor elements are configured such that they have a measuring range, at least with respect to a first sensitive acceleration measurement axis, that is designed for an airbag sensor element, and at least with respect to a second sensitive acceleration measurement axis, a measuring range that is designed for a vehicle dynamics control system sensor element. The first and the second acceleration measurement axes are particularly preferably aligned orthogonally to each other.

[0017] The electronic component is expediently designed such that the measuring range with respect to the first sensitive acceleration measurement axis is greater than or equal to 25g or greater than or equal to 8g, and that the measuring range with respect to the second sensitive acceleration measurement axis is less than or equal to 10g or less than or equal to 20g.

[0018] The electronic component is preferably designed such that the measuring range with respect to the first sensitive acceleration measurement axis is less than or equal to 8g or less than or equal to 20g or greater than or equal to 8g, and that the measuring range with respect to the second sensitive acceleration measurement axis is in each case less than or equal to 8g.

[0019] The second housing or common housing of the electronic component is preferably made of thermoset, elastomer or thermoplastic.

[0020] The electronic component expediently comprises at least one magnetic field sensor element, wherein the electronic component is configured in particular as a speed sensor, especially preferably as a wheel speed sensor, or as a displacement sensor.

[0021] The electronic component preferably does not have a carrier element designed for positioning in an injection mold and for receiving a raw electronic component. Such a carrier element is specifically referred to as a carrier or carrier element.

[0022] It is preferred that at least the first housing is at least partially surrounded by a decoupling shell or protective cover, which is at least partially surrounded by the second housing.

[0023] It is advantageous for the fixing / shielding element to have at least one positioning aid designed for positioning in an injection molding tool, in particular in the positioning aid as a recess and / or anchor hole and / or tab for being held, in particular by means of one or more positioning pins of the injection molding tool.

[0024] The method for manufacturing an electronic component is preferably based on the idea that at least one electronic element is connected to a first circuit carrier, wherein the first circuit carrier is designed as a leadframe which includes a dambar, after which the at least one electronic element and the first circuit carrier are at least partially embedded, cast, or injected into a first housing, after which the dambar is partially removed and at least one residual dambar structure remains.

[0025] The raw electronic component is positioned and / or fixed in an injection molding tool using the fixing / shielding element, after which a second housing is formed from injection molding, which at least partially encloses the first circuit carrier, the first housing and the fixing / shielding element.

[0026] It is preferred that a fixing / shielding element is then attached to at least one residual dambar structure.

[0027] It is advantageous that at least one positioning pin of the injection mold is positively connected to a positioning aid of the fixing / shielding element in the injection mold and / or that the fixing / shielding element is clamped or fixed by at least two positioning pins, in particular opposing positioning pins that move in opposite directions towards each other, of the injection mold, after which, during or after the injection molding process to produce the second housing, the at least one positioning pin or all positioning pins are withdrawn and / or released from the fixing / shielding element.

[0028] The electronic component preferably comprises, particularly in its first housing, at least one sensor element or sensor for rotation rate, acceleration, magnetic fields and in particular an ASIC as a signal processing circuit.

[0029] Furthermore, the electronic component expediently includes additional electronic elements, in particular auxiliary circuit elements, such as resistors, capacitors, inductors, circuits / components, varistors, diodes, and protective circuits. These additional electronic elements are preferably attached to or connected to the first circuit carrier or first leadframe, particularly mechanically and electrically, and are preferably arranged in a single- or multi-element housing as the first housing or in an additional third housing.

[0030] The first and optional third housings are preferably made of thermoset plastic or "premold" or "transfermold", i.e., in particular, of injection-molded plastic.

[0031] The second housing or overall housing is preferably made of "overmold" injection-molded plastic.

[0032] The first housing, hereinafter sometimes also referred to as the IC body, is preferably connected to / on the fixing / shielding element or the fixing surface, or mechanically and / or electrically connected / arranged.

[0033] The fixing / shielding element or fixing surface preferably serves both as a shield against electromagnetic fields and electrostatic fields, as well as a positioning aid during the subsequent overmolding in the injection molding tool, whereby the second housing is formed.

[0034] It is advantageous for additional components, such as a permanent magnet, to be attached to this fixing plate, preferably on the side of the first leadframe, i.e., "hanging" above the at least one electronic component, i.e., on the inside of the electronic component, or alternatively preferably on the other side of the fixing surface facing away from the leadframe.

[0035] Instead of the first leadframe, a substrate, such as a printed circuit board or a ceramic substrate, is preferably used as a circuit carrier. This is then transfer-molded to form the first housing.

[0036] The electronic component preferably does not include a carrier which is directly or indirectly attached to the first leadframe and is inserted into an injection mold for overmolding and forming the second housing according to the prior art.

[0037] Preferably, the electronic component comprises a first and a second interconnected leadframe. In particular, at least one sensor element and an ASIC, as a signal processing circuit, are arranged on the first leadframe and are jointly injection-molded into a first housing. Additionally, the electronic component has a fixing surface with which it is positioned in an injection mold for manufacturing the second housing.

[0038] The electronic component expediently includes an additional second leadframe, from which in particular the contact connections or pins of a plug or terminal are formed.

[0039] Preferably, the first and second leadframes are joined together before the second housing is manufactured.

[0040] It is advantageous for the first housing to be designed and the fixing surface to be designed and arranged in such a way that the first housing does not touch the fixing / shielding element or the fixing surface, or that they do not touch each other.

[0041] It is preferred that, during the overmolding process for producing the second housing, the injection mold clamps or grips the retaining plate with at least two pins, after which the overmold process is initiated. At the end of the overmold process, these at least two pins are retracted and release the retaining plate. Particularly preferably, the mold pins of the injection mold grip the retaining plate at at least one point, and most preferably at two points, for which at least four mold pins, each in pairs, are used. Such a point on the retaining plate can also be designed as a tab, which is formed in particular together with a residual Dambar structure.

[0042] It is advantageous for the fixing / shielding element to have a fixing surface, in particular designed as a shield-shaped body with at least one base surface, wherein the fixing surface is arranged above the at least one electronic component or wherein the fixing surface is arranged opposite a component placement surface of the first leadframe, so that the at least one electronic component that is attached to this component placement surface is arranged between this component placement surface and the fixing surface.

[0043] The fixing / shielding element or fixing surface is preferably electrically conductive and serves in particular as an EMC shielding surface. This ensures that the at least one electronic component is electromagnetically shielded on one side by the component placement area of ​​the first leadframe and on the opposite side by the fixing surface.

[0044] The fixing / shielding element or fixing surface is preferably connected at least at one point to a residual structure of the dambar. Connecting or fastening the fixing surface to one or more residual structures of the dambar has the advantage that these do not perform any electrical circuitry function, unlike most parts of the first leadframe, which would be short-circuited by fastening the fixing surface. Particularly preferably, the fixing surface is connected to a residual structure of the dambar or dambar residual structure that is not directly electrically connected to the first or second leadframe, but is held by the first plastic housing.

[0045] A dambar is preferably understood to be a component or element that, during the manufacture of the electronic component, particularly before the formation of the first housing, connects all legs or strands of at least the first leadframe and has a frame that serves for sealing during the injection molding process, especially a transfer molding process, in which the first housing is formed. This frame of the dambar, or the dambar itself, is particularly preferably at least partially inserted into or at least partially enclosed in the injection molded housing / injection mold as a sealing ring. Normally, in the further manufacturing process, according to the prior art, the dambar is completely removed so that the finished electronic component no longer has any residual structures of the dambar, but only of the first and / or second leadframe.

[0046] It is preferred that at least one Dambar residual structure is and remains directly connected to the first and / or second leadframe or the first and / or second circuit carrier. In particular, or alternatively, at least one Dambar residual structure is not connected to any of the circuit carriers or leadframes, but only to the fixing shielding element and one or more housings, optionally also to a protective cover.

[0047] The electronic component preferably includes an acceleration sensor element, in particular 1-axis, for relatively low accelerations, up to 5g, as a chassis acceleration sensor element or vehicle dynamics control acceleration sensor element. and / or an acceleration sensor element, in particular single-axis, for relatively large accelerations, at least up to 100g, as an airbag acceleration sensor element.

[0048] The connection between the fixing / shielding element or fixing plate and at least one residual structure of the dambar or dambar residual structure is preferably made by means of welding.

[0049] Preferably, the first leadframe, together with the first housing and the fixing plate, is arranged in a trough-shaped, prefabricated housing filled with a potting compound, whereby this potting compound and the trough-shaped housing together form the second housing, which in this embodiment is then not produced by injection molding or overmolding, see here. Fig. 4. The trough-shaped premold housing features, in particular, an integrated connector whose contact points or pins are formed by the second leadframe, which is connected to the first leadframe. Furthermore, the trough-shaped premold housing expediently includes a connector collar from which the contact points or pins protrude from the second housing.

[0050] It is preferred that the fixing / shielding element or the fixing plate has side skirts, these serve to shield against electromagnetic radiation from the side and, if necessary, to dissipate heat during the overmolding or overmolding process of the second housing.

[0051] The fixing / shielding element or fixing plate preferably has mechanical stiffening means, such as stiffening ribs or webs. This design is particularly preferred for arrangements with several electronic components that are connected by a common fixing / shielding element or fixing plate for the manufacturing process.

[0052] Advantageously, the fixing / shielding element or fixing plate includes one or more tabs. These serve in particular for transport during the manufacturing process and / or heat dissipation during overmolding and, if applicable, heat dissipation during operation of the finished electronic component, and are designed accordingly.

[0053] The electronic component preferably or additionally preferably comprises at least one actuator element, for example a piezoelectric oscillator or an ultrasonic transducer, as an electronic element.

[0054] It is preferred that the fixing / shielding element or fixing surface is designed as part of the second leadframe.

[0055] The fixing / shielding element or fixing surface expediently has one or more of the following features: - Perforated surface with slotted, oval, or round openings to improve mold flow and for more secure anchoring in the mold. Non-perforated or continuous surfaces, as well as partial openings, are also possible. - Planar or shaped surface. Shaped such that the side surfaces are shielded at least on one side, or deep-drawn pockets are formed over the individual ICs. The fixing surface lies over at least one member of the mold body, covering / shielding in particular at least the ASIC and the at least one sensor element. The shaped surface of the fixing surface is particularly preferably trough-shaped. - Coating with magnetic and / or electrically conductive material to improve the EMC and / or ESD behavior of the IC, for example coating with nickel. - Connected to the IC body's leadframe at least at one point. Suitable connection techniques include soldering, gluing, sintering, crimping, and welding. - Exposed partial areas serve to fix and position the surface during the molding process, so that positioning or gripping tools do not touch the IC body or the first housing during the molding process. - The mounting surface can be fitted with screw-on tabs. Electrically insulated or contacting. - The fixing surface is part of the connector pins or the second leadframe, which has the connector pins of the electronic component. - The fixing surface is pre-assembled in the connector body pre-molded part. The IC body is contacted with this pre-molded part and then molded. - The first leadframe is mounted in such a way that the electronic components mounted on it, such as an IC or sensor elements, are physically located between the first leadframe, especially its component placement area, and the mounting surface. This serves to improve EMC performance. The fixing surface can be made of metal or plastic, with the plastic optionally having an electrically conductive coating. - The fixing surface serves to mechanically stiffen the mold body. - The fixing surface can be flat or curved within the fixing surface. In particular, the fixing surface and the first leadframe are curved uniformly or to match each other. - The fixing surface serves as a mounting surface for additional components, such as magnets.

[0056] Preferably, the first package is treated with plasma before molding to remove contaminants and improve the adhesion of the overmold material to the IC body / first package.

[0057] The first leadframe is preferably bent in the area of ​​the connection pins at a freely selectable angle relative to the first housing and its orientation and thus molded / overmolded.

[0058] The molding process, in particular overmolding, is preferably carried out as an injection mold, transfer mold, RIM, hot melt, compression mold or casting process.

[0059] The fixing / shielding element or fixing surface is preferably positioned in the injection mold via at least one movable positioning pin or hold-down device. During the molding process, these hold-down devices are retracted and the resulting cavities are filled with molding material.

[0060] The fixing / shielding element or shielding plate / fixing surface preferably contains holes and / or cutouts and / or slots for transport, adjustment, and fixing. This is advantageous for the overmold equipment and / or for alignment, fastening, and / or positioning in the injection mold.

[0061] The fixing / shielding element or the shielding plate / fixing surface is preferably designed with side skirts for better EMC protection and as additional heat dissipation (mold flow guide plate).

[0062] The fixing / shielding element or shielding plate / fixing surface can also be used to attach multiple sensors or a common network / bundle / module / cluster of electronic components that share a common fixing / shielding element. This allows the sensors to be positioned very precisely relative to each other.

[0063] By means of special stiffening ribs or shapes of the fixing / shielding element or the fixing surface, increased stiffness can preferably be achieved and a curvature of the network / bundle / module / cluster of electronic components as a result of the overmold process can be prevented.

[0064] The fixing / shielding element or shielding plate / fixing surface preferably includes features that act as a clamping device. This secures the first package or IC so that it remains in place on the fixing plate or fixing surface during subsequent process steps. Additionally, the clamp serves as a heat sink / heat conductor during the overmold process and during operation.

[0065] The fixing / shielding element or shielding plate preferably has additional plastic clips applied to secure the first package or IC. These clips also provide thermal insulation during the overmold process. They can be molded, glued, or mechanically attached (e.g., riveted) to the fixing plate.

[0066] Preferably, in addition to or as an alternative to the sensor elements for the rotation rate and acceleration, other sensor elements, at least one other sensor element, for physical measured quantities, such as pressure, magnetic fields, temperature, sound, structure-borne sound, can also be used in the IC or first package.

[0067] The decoupling sleeve or protective cover is advantageously formed partially or completely. This sleeve serves in particular to stress-decouple the first housing and is designed accordingly, with this stress arising from temperature changes between the first housing and the overmold material. Additionally, it acts as a heat shield during the overmold process by preventing direct contact between the first housing and the overmold material. The encapsulation material is most preferably a soft, elastic material, e.g., silicone or polyurethane, especially silicone gel.

[0068] The invention also preferably relates to an arrangement in which a common fixing / shielding element or a common fixing surface connects several electronic components. The fixing surface particularly includes retaining elements, such as holes / index holes or slots, with which the entire arrangement can be moved or transported during production, especially on a common conveyor belt. The fixing surface particularly preferably ensures defined relative positions between the electronic components of the arrangement and / or serves for adjustment. For an exemplary embodiment of such an arrangement, see [reference to relevant section]. Fig. 6.

[0069] The invention also relates to the use of the electronic component in motor vehicles.

[0070] Further preferred embodiments are described in the dependent claims and in the following descriptions of exemplary embodiments with reference to figures.

[0071] They show in a schematic, exemplary representation Fig. 1 An embodiment of the electronic component without a second overmolding / overmold from the side view and top view; the Dambar residual structures that remain and are further used in the electronic component, for example for attaching the fixing surface, are marked in grey, Fig. 2 An exemplary electronic component with a second overmold package, shown in side and top views, with the top view showing tabs of the fixing surface for attachment, which are connected to the remaining dambar structures. These tabs are shown on the far left in the top view, and one is shown at the top and one at the bottom in the area of ​​the first package. Fig. 3 an embodiment in which the first housing is surrounded by a decoupling sleeve or protective cover, which is then embedded in the overmold of the second housing, Fig. 4. An exemplary embodiment in which, instead of an overmold housing as the second housing, a premold housing is used, into which the assembly consisting of the first leadframe, the first housing with an additional protective cover (e.g., made of silicone gel), and the fixing surface is placed and potted with potting compound. The second leadframe or connector leadframe is integrated into the premold housing. Fig. 5 an electronic component designed as an example as a pressure sensor, as well as Fig. 6 an arrangement of several pressure sensors according to Fig. 5, which are connected and positioned relative to each other via a common fixing surface and form a cluster or array.

[0072] The exemplary embodiment of the electronic component from Fig. The electronic component comprises a first leadframe 1 on which a sensor element 7 and a signal processing circuit / ASIC 8 are arranged on a component placement island (not shown) and embedded in a first housing 3 made of thermoset plastic. The electronic component includes a dambar 13 of the first leadframe 1 or is associated with it. The areas marked in gray will remain as dambar remnants 6 after removal of the other dambar parts. Connection points 16, marked as small squares, are located on the dambar remnants 6, at which the dambar remnants are connected to a fixing / shielding element 5 or a fixing plate by means of connecting bridges. The electronic component also has an additional third housing 4 made of thermoset plastic, which is also connected to the first leadframe 1 and into which additional circuit elements or protection circuit elements 14 are integrated.The ends 15 of the first leadframe 1 are designed as contact connections or pins of the electronic component.

[0073] Starting from Fig. 1 is in Fig. Figure 2 shows an embodiment of the electronic component, which has a second housing 10 as the overall housing made of overmold material, into which the first leadframe 1, except for its ends which serve as contact terminals, the first and second housings 3, 4, and the fixing / shielding element 5 are embedded. The remaining Dambar structures are also embedded in the second housing 10. A magnet or permanent magnet 17 is arranged on the inside of the electronic component on the fixing / shielding element 5, by way of example.

[0074] Based on the Fig. Figure 3 illustrates an embodiment of the electronic component in which the first housing 3 is surrounded by a decoupling sleeve 11 or protective cover made of Globe Top or a silicone gel. The decoupling sleeve 11 and the fixing / shielding element 5 are jointly enclosed by a second housing 10 made of overmold material. The first leadframe 1 is connected to a second leadframe 2 at a connection point 18, for example by welding. The second leadframe 2 partially protrudes from the second housing 10, which forms a connector collar 21 in which contact connections or connection pins are formed by the second leadframe.

[0075] Fig. Figure 4 shows an embodiment of an electronic component in which the second housing 10 is formed by a prefabricated, trough-shaped body 19, for example made of premold, and potting compound 20. The first leadframe 1, with the first housing 3, which is for example embedded in a decoupling sleeve 11, and the fixing plate 5 are arranged in a trough-shaped, prefabricated housing 19 that is filled with potting compound 20. The trough-shaped premold housing 19 has an integrated connector or connector collar 21, the contact terminals or pins of which are formed by the second leadframe 2, which is connected to the first leadframe 1 in the connection area 18.

[0076] Fig. Figure 5 shows an exemplary electronic component with a first leadframe 1, on which a pressure sensor element 7 and an electronic signal processing circuit 8, together embedded in a first housing 3, as well as additional circuit elements 14, embedded in a third housing 4, are arranged. The electronic component has a Dambar residual structure 6, by means of which, among other things, a fixing / shielding element 5 is attached. Furthermore, a second leadframe 2 is connected to the first leadframe for external contact or for contacting further electronic components. The electronic component has a membrane 24, which is arranged in a channel that leads to the pressure sensor element 7. The electronic component comprises a common overmold housing, as a second housing 10.

[0077] Based on the Fig. Figure 6 is an exemplary arrangement or cluster of several electronic components, for example as shown in Fig.Figure 5 illustrates the electronic components. They share a common fixing / shielding element 5, which includes positioning aids 12a and 12b, for positioning and fixing in an injection mold. First leadframes 1 are connected to the second leadframe 2 at connection points 18. Each of the two electronic components comprises a first and second housing 3, 4 made of thermoset plastic, Dambar residual structures 6 to which the fixing / shielding element 5 is attached, and a common second housing 10. The second, common housing 10, made of overmold material, includes connector collars 21 into which the contact terminals of the second leadframe 2 open, supported by an assembly aid 23.

Claims

[1] Electronic component comprising a first circuit carrier(1), at least one electronic element (7, 8, 9) connected to the first circuit carrier (1), and at least one first housing (3), wherein the electronic component has at least one Dambar residual structure (6) for mounting characterized by , that this has a fixing / shielding element (5) which is designed for positioning in a tool for manufacturing the electronic component and / or for shielding the at least one electronic element from electromagnetic radiation. [2] Electronic component according to claim 1, characterized by , that this is designed as a sensor and has at least one sensor element as an electronic element (7, 8, 9). [3] Electronic component according to at least one of claims 1 and 2, characterized by , that the fixing / shielding element (5) is connected to the at least one Dambar residual structure (6). [4] Electronic component according to at least one of claims 1 to 3, characterized by , that at least one Dambar residual structure (6) is attached to the first housing (3) and, in particular, is not connected to the first circuit carrier (1). [5] Electronic component according to at least one of claims 1 to 4, characterized by , that the first housing (3) and the fixing / shielding element (5) are at least partially embedded by a second housing (10), in particular formed from injection molding. [6] Electronic component according to at least one of claims 1 to 5, characterized by, that this, in particular in its first housing (3), has at least one yaw rate sensor element and at least one two- or multi-axis acceleration sensor element or at least two single-axis acceleration sensor elements, wherein the one or more acceleration sensor elements are designed such that they have a measuring range at least with respect to a first sensitive acceleration measurement axis which is designed for an airbag sensor element, and at least with respect to a second sensitive acceleration measurement axis which is designed for a vehicle dynamics control system sensor element. [7] Electronic component according to claim 6, characterized by , that the measuring range with respect to the first sensitive acceleration measurement axis is designed to be greater than or equal to 25g and that the measuring range with respect to the second sensitive acceleration measurement axis is designed to be less than or equal to 10g. [8] Electronic component according to at least one of claims 1 to 7, characterized by that it does not have a support element designed for positioning in an injection mold and for receiving a raw electronic component. [9] Electronic component according to at least one of claims 1 to 8, characterized by , that the at least first housing (3) is at least partially surrounded by a decoupling shell (11), which is at least partially surrounded by the second housing (10). [10] Electronic component according to at least one of claims 1 to 9, characterized by , that the fixing / shielding element (5) has at least one positioning aid (12) which is designed for positioning in an injection molding tool, in particular the positioning aid is designed as a recess and / or anchor hole and / or tab for being held in place. [11] Method for manufacturing an electronic component, in particular an electronic component according to at least one of claims 1 to 11, wherein at least one electronic element (7, 8, 9) is connected to a first circuit carrier (1), the first circuit carrier being designed as a leadframe comprising a dambar (6, 13), the at least one electronic element (7, 8, 9) and the first circuit carrier (1) being at least partially embedded in a first housing (3), the dambar (13) then being partially removed and at least one residual dambar structure (6) remaining. characterized by , that the raw electronic component is positioned and / or fixed in an injection molding tool by means of the fixing / shielding element (5), after which a second housing (10) is formed from injection molding, which at least partially embeds the first circuit carrier (1), the first housing (3) and the fixing / shielding element (5). [12] Method according to claim 11, characterized by , that a fixing / shielding element (5) is attached to at least one Dambar residual structure (6). [13] Method according to claim 11 or 12, characterized by , that in the injection molding tool at least one positioning pin of the injection molding tool is positively connected to a positioning aid of the fixing / shielding element (5) and / or that the fixing / shielding element (5) is clamped by at least two positioning pins of the injection molding tool, after which, during or after the injection molding process to produce the second housing (10), the at least one positioning pin or all positioning pins are withdrawn and / or released from the fixing / shielding element (5).

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