Optoelectronic component with a package having multiple openings

Abstract

An optoelectronic component (1) comprising a carrier (2) with at least two radiation sources (3, 4) configured to generate electromagnetic radiation, comprising a housing (5), wherein the housing (5) is made of a material that is impermeable to the electromagnetic radiation of the radiation sources (3, 4), wherein at least two openings (9) are provided in the housing (5), wherein each opening (9) is closed (10) with a plate, wherein the plate (10) is made of a material that is permeable to the electromagnetic radiation of the respective radiation source, wherein a radiation source (3, 4) is assigned to each of the openings (9), wherein the housing (5) has a cover (7), wherein the openings (9) are provided in the cover (7), wherein the cover (7) has a recess (13) with a housing wall (14) in the region of each opening (9), wherein the housing wall (14) has a support surface (15),wherein the support surface (15) surrounds the opening (9), wherein the plate (10) rests on the support surface (15) and is fastened to the support surface (15), and wherein the support surface (15) is arranged offset from an underside (11) of the cover (7) associated with the radiation sources (3, 4), wherein a distance between the underside (11) of the cover (7) and the support surface (15) is greater than or equal to a thickness of the plate (10), wherein the plate (10) is completely received in the recess (13).

Description

[0001] The invention relates to an optoelectronic component according to claim 1 and a housing for an optoelectronic component according to claim 15.

[0002] It is known in the prior art to provide an optoelectronic component containing radiation sources with a housing. The housing protects the radiation sources from environmental influences. The housing has a single large opening through which one or more radiation sources emit the electromagnetic radiation.

[0003] The document DE 20 2009 008 928 U1 discloses an LED lighting device with a housing and individual openings of the housing provided with lenses, each of which is assigned to an LED.

[0004] The document DE 100 08 240 A1 discloses a semiconductor light projection device in which a plurality of LED chips are arranged in a housing with a plurality of openings.

[0005] The document JP 2009 - 099 633 A discloses a semiconductor light emitting device in which a plurality of LED chips are arranged in a housing having a plurality of openings.

[0006] The document JP 2006 – 106 504 A discloses a cap for a light-emitting semiconductor.

[0007] The document JP 2008 140 667 A discloses a light-emitting semiconductor device in which several LED chips are arranged in a housing with several openings.

[0008] From the document WO 2012 / 093 637 A1 a semiconductor component is known which is designed to interrupt a power supply of a laser when the laser is removed from a housing of the semiconductor component.

[0009] The object of the invention is to provide an improved optoelectronic component and an improved housing for an optoelectronic component.

[0010] The object of the invention is achieved by the optoelectronic component according to patent claim 1 and by the housing for an optoelectronic component according to patent claim 15.

[0011] Further advantageous embodiments of the optoelectronic component are specified in the dependent claims.

[0012] One advantage of the optoelectronic component described is that the housing has multiple openings for emitting electromagnetic radiation. Each opening is covered with a plate. The plate is made of a material that allows electromagnetic radiation to pass through. By arranging multiple small openings with small plates, material for the plate is saved, as opposed to one large opening with a large plate. In addition, smaller plates can be connected to the housing more reliably. In particular, the long-term stable connection between the small plates and the housing is better. Due to the smaller shape of the individual plates, thermal stresses between the plate and the housing, for example, are lower. This means that the attachment between the plate and the housing is subjected to less mechanical stress.Furthermore, the housing is more stable because it has several small openings rather than a single large opening. The plates are made of an expensive material, so providing several smaller plates saves material and thus costs. The housing is made of a more cost-effective material. This makes the component more cost-effective to manufacture overall.

[0013] Furthermore, the cover has a recess in the area of ​​each opening, which is surrounded by a housing wall. The housing wall has a support surface surrounding the opening. The respective plate rests on the support surface and can be connected to the support surface via a connecting layer.

[0014] Furthermore, the recess is greater than or equal to the thickness of the plate. The plate is completely contained within the recess. This prevents reflection from one plate toward a neighboring plate when several plates are arranged side by side. This reduces mutual scattering effects.

[0015] In one embodiment, the recess has a similar cross-section to the plate, with the cross-section of the recess being slightly larger than the cross-section of the plate. This reduces assembly effort, as no separate adjustment of the plate in relation to the opening is required. During assembly, the plate is simply placed into the recess. The formation of the recesses automatically adjusts the plates in relation to the opening surrounded by the support surface. This eliminates the need for complex adjustment of the position of the plate. Depending on the design selected, several openings can be formed in one recess. In addition, several plates can also be arranged in one recess.

[0016] Depending on the selected design, the recess is directed away from the radiation source. The recess is arranged in the cover of the housing and has a larger cross-sectional area than the opening in the region of the side of the cover associated with the radiation source. In this way, electromagnetic radiation emitted by the radiation source is first limited by the wider opening cross-section of the recess. The electromagnetic radiation is then guided further through the plate towards the opening. The opening itself has a precise edge contour that precisely defines and limits a radiation cone from the radiation source. This achieves improved beam guidance of the electromagnetic radiation.

[0017] In a further embodiment, the housing has a frame that surrounds the cover all the way around. The frame has a circumferential edge that is connected to the carrier plate. The formation of a plurality of openings results in a greater distance between the circumferential edge and the individual openings, in particular the openings arranged in the middle of the cover. The arrangement of a plurality of openings means that the individual opening is a greater distance from the edge. After the plates have been assembled, the edge is connected to the carrier plate using thermal processes, in particular by a hermetically sealed connection all the way around. For example, the connection can be in the form of a welded joint. Due to the greater distance, the thermal effect on the individual plate of the openings, in particular the connection of the plate to the support surface, is smaller when the edge is connected to the carrier plate.

[0018] In another embodiment, the radiation source is designed in the form of a laser diode. For example, small openings can offer the advantage of limiting the aperture of the radiation source.

[0019] In a further embodiment, the plate has a device, in particular a lens, for influencing a propagation direction of the electromagnetic radiation. In this embodiment, the plate itself can be designed as a device for influencing the propagation direction of the electromagnetic radiation, or a device for influencing the propagation direction of the electromagnetic radiation can be provided in addition to the plate. The arrangement of several openings makes it possible to provide the individual plates with different devices for influencing the electromagnetic radiation. Thus, individual radiation sources can be influenced in the propagation direction independently of the other radiation sources.

[0020] In a further embodiment, devices are assigned to the openings to change the wavelength of the electromagnetic radiation. In this way, the wavelengths of individual radiation sources can be individually adjusted. In this embodiment, the plate itself can also be designed as a device for changing the wavelength of the electromagnetic radiation. The device can be designed to shift and / or block at least part of the wavelength spectrum of the radiation source.

[0021] In another embodiment, the plates are hermetically sealed to the lid. This provides improved protection for the radiation sources.

[0022] Depending on the selected embodiment, a laser bank with multiple laser diodes can also be provided as the radiation source. In this embodiment, the laser diodes of a laser bank can each be assigned to an opening. Furthermore, depending on the selected embodiment, the component can be designed such that each laser bank can be controlled individually.

[0023] In another embodiment, the lid is made of a metallic material. Furthermore, the recesses are preferably formed into the metal plate of the lid using a deep-drawing process. This allows for cost-effective production of the lid. Furthermore, the recesses provide a stiffened lid design.

[0024] In another embodiment, the housing frame is connected to the carrier via a circumferential weld. This weld enables a mechanically stable connection to the carrier and also provides a hermetically sealed connection.

[0025] The above-described properties, features and advantages of this invention, as well as the manner in which they are achieved, will become clearer and more clearly understood in connection with the following description of the embodiments, which are explained in more detail in connection with the drawings, in which Fig. 1 a schematic cross-section of a component with housing, Fig. 2 a schematic cross-section of a housing for a component, Fig. 3 a schematic representation of an opening of the housing, Fig. 4 a view of a top side of the housing, Fig. 5 a cross section through another embodiment of a housing, Fig. 6 a schematic representation of another embodiment of a housing, Fig. 7 a schematic representation of another embodiment of a housing, Fig. 8 a perspective view of a component with a housing, Fig. 9 a schematic cross-section through an opening of a housing, Fig. 10 a schematic cross section through a further embodiment of an opening of a housing, and Fig. 11 shows a schematic cross section through a further embodiment of a component with a housing.

[0026] Fig. 1 shows a schematic representation of a cross section through an optoelectronic component 1 with a carrier 2 on which two radiation sources 3, 4 are arranged. The carrier 2 is covered by a housing 5 which is connected to the carrier 2. The housing 5 is placed on a peripheral edge 6 of the carrier 2. Depending on the selected embodiment, the housing 5 is connected to the edge 6 of the carrier 2 in a hermetically sealed manner. The housing 5 has a cover 7 which is surrounded by a peripheral edge region 8. Openings 9 are provided in the cover 7. The cover 7 and the edge region 8 are, for example, formed in one piece and consist of a material that is impermeable to electromagnetic radiation from the radiation sources 3, 4. The term impermeable refers to a reduction in radiation of more than 80%.

[0027] The openings 9 are covered with plates 10. Depending on the selected embodiment, the plates 10 are hermetically sealed to the cover 7. In the illustrated embodiment, each radiation source 3, 4 is assigned an opening 9. The electromagnetic radiation from the radiation source 3, 4 is emitted to the outside via the opening 9. Depending on the selected embodiment, several radiation sources 3, 4 can also be assigned to one opening 9. The radiation source 3, 4 can, for example, be in the form of a laser diode or a light-emitting diode. The plate 10 is made of a material that is permeable to the electromagnetic radiation from the radiation sources 3, 4. The term permeable refers to a transmission of more than 80% of the electromagnetic radiation.

[0028] For example, a metallic material can be used to form the housing. Furthermore, glass or plastic, for example, can be used to form the plate 10.

[0029] Depending on the selected embodiment, other materials may also be used for the formation of the housing 5 and / or for the formation of the plates 10.

[0030] The arrangement of several openings 9 in the cover 7 gives the cover 7 increased stability compared to a single large opening. In addition, less material is required for the plates 10 compared to a single large opening. Furthermore, the plates 10 can be attached to the cover 7 with greater reliability due to their small size. In particular, a hermetically sealed connection between the plate 10 and the cover 7 can be produced more easily. Furthermore, the design of the relatively small openings 9 enables more precise beam guidance of the electromagnetic radiation from the individual radiation sources 3, 4. Depending on the desired embodiment, an aperture of the radiation sources 3, 4 can be limited by a suitable selection of the cross-sections of the openings 9.

[0031] Fig. 2 shows a perspective partial cross-section through the housing 5 of the Fig. 1 with a view of an underside 11, which is assigned to the radiation sources 3, 4 in the assembled state. The housing 5 has a cover 7 which has recesses 13. The recesses 13 are delimited by a sleeve-shaped housing wall 14, which merges into an annular support surface 15. The annular support surface 15 delimits the openings 9. A connecting layer 16, for example, is applied to the support surface 15. A plate 10 is placed on the connecting layer 16. The plate 10 is connected to the support surface 15 via the connecting layer 16, in particular connected hermetically. For this purpose, the connecting layer 16 is formed circumferentially around the opening 9. The material used for the connecting layer 16 can be, for example, a solder material, in particular a glass solder.Depending on the selected embodiment, a separate connecting layer 16 can be dispensed with and a direct connection between the material of the plate and the material of the support surface can be formed.

[0032] In the illustrated embodiment, the recesses 13 have a circular cross-section. Accordingly, the plates 10 can also be circular. The support surface 15 is arranged at a distance from the underside 11 of the cover 7. The support surface 15 is aligned parallel to the underside 11 of the cover 7. A distance between the underside 11 of the cover 7 and the support surface 15 is preferably selected such that the plate 10 can be accommodated with its entire thickness in the recess 13. Thus, the plate 10 does not protrude beyond the underside 11 of the cover 7.

[0033] In this way, electromagnetic radiation can be prevented from being reflected from one plate 10 to the adjacent plate 10. In addition, the plate 10 is protected against damage. This is advantageous, for example, during transport of the housing 5 prior to assembly with the carrier 2. In addition, the formation of the recesses 13 allows for easy adjustment of the plates 10 with respect to the openings 9 by inserting the plates 10 into the recesses 13. The opening 9 is delimited by a precise edge 18 of the support surface 15. In this way, the boundary of the beam cone of the radiation source is precisely defined. The other openings 9 are also provided with plates 10 in a similar manner.

[0034] The cover 7 is circumferentially bounded by the edge region 8, which has a circumferential connecting surface 17. The connecting surface 17 is connected to the edge 6 of the carrier 2 during assembly. For example, a welded connection is used to connect the connecting surface 17 to the carrier 2. Due to the arrangement of several openings 9, the connecting surface 17 is spaced further apart from the plates 10. In this way, the thermal influence on the plate 10 and its connecting layer 16 during welding of the connecting surface 17 to the carrier 2 is reduced.

[0035] Fig. Figure 3 shows a schematic top view of a recess 13 with the housing wall 14. It can be clearly seen that the connecting layer 16 is arranged circumferentially around the opening 9. After assembly of the housing 5, the underside 11 is assigned to the radiation sources 3, 4. An upper side 12 of the cover 7, arranged opposite the underside 11, is located on the outside of the housing 5 after assembly.

[0036] Fig. Figure 4 shows a schematic top view of another embodiment of a housing 5. The circumferential connecting surface 18 is clearly visible. This embodiment also has 16 openings 9. Depending on the selected embodiment, more or fewer openings 9 can be provided. Furthermore, the cross-section of the openings 9 can be circular, square, rectangular, or other shapes. Furthermore, the arrangement of the openings 9 can be arbitrarily configured on the surface of the cover 7.

[0037] Fig. 5 shows a schematic representation of a cross-section through another embodiment of a housing 5. In this embodiment, no recesses 13 are provided; instead, the plates 10 are placed on an underside 11 of the cover 7 and connected to the cover 7 via a connecting layer 16. Depending on the selected embodiment, the plates 10 can also be arranged on the top side 12 of the cover 7.

[0038] Fig. Figure 6 shows a schematic representation of another arrangement of openings 9 in a housing 5, without showing the plates 10 that cover the openings 9. In this embodiment, the openings 9 are provided in a uniform grid in a 5 x 4 arrangement. The openings 9 are circular. Accordingly, the plates 10 can also be designed in the form of round circular disks. In addition, the plates 10 can also have an angular, in particular a rectangular, shape.

[0039] Fig. 7 shows, by way of example, another embodiment of a housing 5, in which the openings 9 have a rectangular cross-section, in particular a square cross-section. In this arrangement, the openings 9 are formed as a 4 x 4 arrangement. As already explained above, other shapes, numbers, and cross-sections of the openings 9 can also be provided in the cover 7 of the housing 5. Accordingly, the plates 10 can also have angular, in particular rectangular, shapes. In addition, the plates 10 can also have a circular disk shape.

[0040] Fig. 8 shows a perspective view of a component 1 having a carrier 2 and a housing 5. Openings 9 are provided in the cover 7 in order to be able to emit electromagnetic radiation from a radiation source. The component 1 has first electrical connections 19 on a first side and second electrical connections 20 on a second side. Depending on the selected embodiment, the component 1 can be designed in such a way that, for example, electromagnetic radiation with a first wavelength emerges from the openings 9 in a first row 21, electromagnetic radiation with a second wavelength in a second row 22, electromagnetic radiation with a third wavelength in a third row 23, and electromagnetic radiation with a fourth wavelength in a fourth row 24.For example, the radiation sources of the individual rows 21, 22, 23, 24 can be controlled separately via the first and second connections 19, 20. For this purpose, radiation sources emitting the desired wavelength are provided, and / or wavelength-changing devices are provided that generate the desired wavelength from the electromagnetic radiation of the radiation sources.

[0041] Fig. 9 shows a cross-section of an exemplary embodiment of an opening 9 in the cover 7, in which the plate 10 additionally assumes the function of a lens 30. For this purpose, for example, one side of the plate 10 is shaped accordingly, as shown schematically. By designing the plate 10 in the shape of a lens or by separately forming a lens in the opening 9, the electromagnetic radiation through the opening 9 can be shaped in a desired manner, for example, bundled. This is particularly advantageous when using laser diodes as the radiation source. Furthermore, depending on the selected embodiment, a lens 30 can be provided at an opening 9 in addition to the plate 10.

[0042] Fig. 10 shows a further embodiment of an opening 9 of the housing 5, in which the plate 10 has a layer 25, 26 on an inner side and on an outer side, which shifts the wavelength of the electromagnetic radiation. A first layer 25 is provided on the inner side. A second layer 26 is arranged on the outer side of the plate 10. The first and second layers 25, 26 are designed, for example, in the form of a converting phosphor layer. The converting phosphor layer serves to shift the wavelength of the electromagnetic radiation incident on the phosphor layer. Instead of a phosphor layer, phosphor platelets can also be provided.

[0043] In this way, for example, white light or another desired wavelength can be generated from a laser diode with electromagnetic radiation of a blue wavelength. Depending on the selected embodiment, a corresponding layer for shifting the wavelength can also be provided on only one side of the plate 10. In addition, the plate 10 can also comprise corresponding material and thus assume the function of shifting at least part of the wavelength spectrum or of filtering out a wavelength range. Thus, in this embodiment, the formation of a separate layer 25, 26 is not necessary.

[0044] Furthermore, depending on the selected embodiment, a combination of the arrangements of the Fig. 9 and Fig. 10 may be provided. In this case, for example, the plate 10 may be designed in the form of a lens and additionally have a layer 25, 26 which causes a shift in the wavelength. In addition, the layers 25, 26 may also be designed in the form of a filter which filters out a specified wavelength or a specified wavelength range from the spectrum of the electromagnetic radiation. Furthermore, depending on the selected embodiment, the first and / or the second layer 25, 26 may be designed in the form of a separate element, ie a separate layer which is placed on the plate 10 and is connected to the plate 10.

[0045] In a further embodiment, which is Fig. 11 is a schematic cross section through a housing 5 and a component 1 of the Fig. 8. In this embodiment, the radiation source is in the form of a laser bar 27 having a plurality of laser diodes 29 along a first row 21. Each laser diode 29 is assigned to an opening 9 in the housing. In this embodiment, the laser bar 27 can be individually controlled, for example, by providing two electrical connections 19, 20.

[0046] Depending on the chosen embodiment, the various openings 9 of the described housings can accommodate the Fig. 1 to 11, various devices for influencing the radiation form of the electromagnetic radiation may be provided. In particular, various lenses may be provided in the corresponding openings 9.

[0047] In a further embodiment, various devices for shifting the wavelength of the electromagnetic radiation can be provided in the openings 9 of the housing 5. For example, in a row 21 of the openings 9 of the component 1 according to Fig. 8 layers 25 may be provided that transmit a specified wavelength or at least partially shift the electromagnetic radiation into a desired wavelength range. Accordingly, the rows 21, 22, 23, 24 of the component 1 may be provided with corresponding layers 25, 26. In this way, even when using the same laser bars 27 or the same radiation sources, different wavelengths can still be emitted from the component 1 via the openings 9.

[0048] Instead of phosphorus, other materials can be used to filter and / or shift the wavelength of electromagnetic radiation.

[0049] Furthermore, using the described embodiments, an RGBY module can be achieved by separately controlling individual laser banks in the four rows, which emits light in the colors red, green, blue, and yellow. The defined, limited size of the opening 9 defines an aperture, which suppresses stray light.

[0050] Furthermore, by providing individual openings 9 in the openings 9, a corresponding desired optic can be provided in order to influence both the scattering pattern and the wavelength spectrum of the electromagnetic radiation.

[0051] Although the invention has been illustrated and described in detail by the preferred embodiment, the invention is not limited to the disclosed examples and other variations may be derived therefrom by those skilled in the art without departing from the scope of the invention. List of reference symbols 1 component 2 carriers 3 first radiation source 4 second radiation source 5 housings 6 Edge 7 lids 8 Marginal area 9 Opening 10 plates 11 Bottom 12 Top 13 Deepening 14 Housing wall 15 support surface 16 Connection layer 17 Connecting surface 18 edge 19 first connection 20 second connection 21 first row 22 second row 23 third row 24 fourth row 25 first layer 26 second layer 27 laser bars 28 radiation cones 29 laser diode 30 lenses

Claims

[1] An optoelectronic component (1) comprising a carrier (2) with at least two radiation sources (3, 4) configured to generate electromagnetic radiation, comprising a housing (5), wherein the housing (5) is made of a material that is impermeable to the electromagnetic radiation of the radiation sources (3, 4), wherein at least two openings (9) are provided in the housing (5), wherein each opening (9) is closed (10) by a plate, wherein the plate (10) is made of a material that is permeable to the electromagnetic radiation of the respective radiation source, wherein a radiation source (3, 4) is assigned to each of the openings (9), wherein the housing (5) has a cover (7), wherein the openings (9) are provided in the cover (7), wherein the cover (7) has a recess (13) with a housing wall (14) in the region of each opening (9), wherein the housing wall (14) has a support surface (15),wherein the support surface (15) surrounds the opening (9), wherein the plate (10) rests on the support surface (15) and is fastened to the support surface (15), and wherein the support surface (15) is arranged offset from an underside (11) of the cover (7) associated with the radiation sources (3, 4), wherein a distance between the underside (11) of the cover (7) and the support surface (15) is greater than or equal to a thickness of the plate (10), wherein the plate (10) is completely received in the recess (13). [2] Optoelectronic component according to claim 1, wherein the housing (5) consists of a metallic material, and wherein the recesses (13) are produced by means of a deep-drawing process. [3] Optoelectronic component according to claim 2, wherein the metallic material of the cover (7) is formed integrally with the recesses (13). [4] Optoelectronic component according to one of the preceding claims, wherein the plate (10) is connected to the housing (5) via a circumferential connecting layer (16), in particular a solder layer, and wherein in particular the plate (10) is formed from glass. [5] Optoelectronic component according to one of the preceding claims, wherein the housing (5) has a cover (7) and an edge region (8), wherein the edge region (8) is connected circumferentially to the cover (7), and wherein the edge region (8) is connected to the carrier (2). [6] Optoelectronic component according to claim 5, wherein the edge region (8) has a circumferential connecting surface (17), wherein the connecting surface (17) is connected to a circumferential edge (6) of the carrier (2), wherein the connecting surface (17) is arranged above the underside (11) of the cover (7). [7] Optoelectronic component according to one of the preceding claims, wherein at least one radiation source (3, 4) is designed in the form of a laser diode. [8] Optoelectronic component according to one of the preceding claims, wherein at least one opening (9) is assigned a first device (30) in order to influence a propagation direction of the electromagnetic radiation, wherein the first device is designed in particular in the form of a lens. [9] Optoelectronic component according to claim 8, wherein two openings (9) are assigned to two different first devices (30) in order to influence a propagation direction of the electromagnetic radiation differently. [10] Optoelectronic component according to one of the preceding claims, wherein at least one opening (9) is assigned a second device (25, 26) in order to change a wavelength of an electromagnetic radiation, wherein the second device is designed in particular in the form of a phosphor layer. [11] Optoelectronic component according to claim 10, wherein two openings (9) are associated with two different second devices (25, 26), wherein the two devices (25, 26) change the wavelength of an electromagnetic radiation differently. [12] Optoelectronic component according to one of the preceding claims, wherein the plates (10) are hermetically sealed to the housing (5). [13] Optoelectronic component according to one of the preceding claims, wherein the housing (5) is connected to the carrier (2) via a circumferential welded connection. [14] Optoelectronic component according to one of the preceding claims, wherein the radiation source (3, 4) is designed in the form of at least two laser bars (27), each having a plurality of laser diodes (29), and wherein preferably each laser bar (27) can be controlled separately via electrical connections. [15] Housing (5) for an optoelectronic component (1) according to claim 1, wherein the housing (5) consists of a material that is impermeable to electromagnetic radiation, wherein at least two openings (9) are provided in the housing (5), wherein each opening (9) is covered with a plate (10), wherein the plate (10) consists of a material that is permeable to electromagnetic radiation, wherein the housing (5) has a cover (7), wherein the openings (9) are provided in the cover (7), wherein the cover (7) has a recess (13) with a housing wall (14) in the region of each opening (9), wherein the housing wall (14) has a support surface (15), wherein the support surface (15) surrounds the opening (9), wherein the plate (10) rests on the support surface (15) and is fastened to the support surface (15), and wherein the support surface (15) is opposite a bottom side assigned to the radiation sources (3, 4) (11) of the cover (7) is arranged offset,wherein a distance between the underside (11) of the cover (7) and the support surface (15) is greater than or equal to a thickness of the plate (10), wherein the plate (10) is completely received in the recess (13).

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