Method for producing an organic building component

Abstract

Method for manufacturing an organic component, comprising the method: • Providing a carrier substrate (202); • Formation of an electrically conductive layer (203) on or above the support substrate (202); • Applying an electrical potential to the electrically conductive layer (203); and • Forming at least one organic, functional layer (210) to form the organic component on or above the electrically conductive layer (203) at least partially during the application of the electrical potential to the electrically conductive layer (203), wherein • the organic functional layer (210) is designed to conduct an electric current for the operation of the organic component, and • on the support substrate (202) and at least one further organic component is formed next to the organic component.

Description

[0001] The invention relates to a method for producing an organic building component.

[0002] An organic component can be an optoelectronic device that emits or absorbs light. Examples of organic components include organic light-emitting diodes (OLEDs), photodetectors, and solar cells.

[0003] Organic devices typically consist of active layers less than 1 µm thick and are therefore particularly sensitive to contamination by particles of comparable size during manufacturing. Typical failures caused by particles include short circuits or thin-film encapsulation defects, which can lead to total failure of the organic device. Manufacturing (which includes, for example, processing) usually takes place in a particle-reduced environment, such as a cleanroom or a vacuum. A support substrate, hereinafter also referred to as the substrate, and a capping substrate are typically provided. Although glass, for example, cap glass, is mentioned in the following examples, it should be noted that materials other than a capping substrate, such as a plastic film, can also be used.The carrier substrate and the cover substrate are usually transported with the side most susceptible to particles facing downwards. However, these measures do not completely prevent particle contamination. A certain degree of resistance to damage from small particles in the layer being formed can be achieved, albeit at a higher cost, by incorporating a thicker buffer layer, such as an organic buffer layer.

[0004] Typically, after the production of an organic component, it is measured whether the organic component has defects caused by particles, and the organic component is then possibly sorted out.

[0005] The publications US 2014 / 0 001 966 A1, US 2012 / 0 104 429 A1, US 2010 / 0 075 145 A1, US 5 682 043 A, US 2013 / 0 240 847 A1 and US 6 256 079 B1 describe methods for manufacturing an organic building component.

[0006] The object of the invention is to provide a simple and efficient method for producing an organic component, wherein the organic component has as few defects caused by particles as possible.

[0007] The problem is solved by a method according to claim 1. According to one aspect of the invention, the problem is solved by a method for producing an organic component comprising the provision of a support substrate. Furthermore, the method comprises forming an electrically conductive layer on or above the support substrate and applying an electrical potential to the electrically conductive layer. The method further comprises forming at least one organic, functional layer for forming the organic component on or above the electrically conductive layer, at least partially during the application of the electrical potential to the electrically conductive layer.By applying an electrical potential during the formation of the at least one organic functional layer, it is possible to minimize the potential difference between the at least one organic functional layer and particles from the environment. This can reduce the electrostatic attraction of particles from the environment to the at least one organic functional layer. An organic device manufactured in this way can exhibit a lower number of particle-induced defects.

[0008] According to a further training, the electrically conductive layer is grounded when an electrical potential is applied. By grounding the electrically conductive layer, the potential difference between the at least one organically functional layer and the particles from the environment can be minimized in a simple way.

[0009] According to a further development, the process also includes the formation of a first electrode and the formation of a second electrode, wherein at least one organic, functional layer is formed between the first electrode and the second electrode.

[0010] According to a further development, the electrically conductive layer forms the first and / or the second electrode, or the electrically conductive layer is formed as part of the first and / or second electrode. This makes the process efficient, as only a single layer is formed that serves as both the first electrode and the electrically conductive layer, and / or a single layer is formed that serves as both the second electrode and the electrically conductive layer.

[0011] According to further training, the first electrode and / or the second electrode will be designed to be transparent or translucent.

[0012] According to further training, the procedure also involves the formation of an encapsulation on or above the second electrode.

[0013] According to a further development, the encapsulation is formed from a metal, or the encapsulation is designed in such a way that it contains a metal. A metallic encapsulation exhibits high electrical conductivity. Therefore, during the formation of the encapsulation, an electrical potential can be applied to the layer located beneath the encapsulation, for example, to the second electrode, in order to reduce contamination of the encapsulation by particles from the environment.

[0014] According to a further training procedure, an electrical potential is applied to the electrically conductive layer at least partially during the formation of the first electrode, the second electrode, and / or the encapsulation. This makes it possible to form a first electrode, a second electrode, and / or an encapsulation with a low number of particle-induced defects.

[0015] According to a further development, the process also includes the provision of a cover substrate. Furthermore, the process includes the formation of an additional electrically conductive layer on the cover substrate. The process also includes the application of an electrical potential to this additional electrically conductive layer. Furthermore, the process includes the formation of an adhesive layer on or above the cover substrate, at least partially, during the application of the electrical potential to the additional electrically conductive layer. Finally, the process includes bonding the carrier substrate to the cover substrate by means of the adhesive layer. By applying an electrical potential during the formation of the adhesive layer, it is possible to minimize the potential difference between the adhesive layer and particles from the environment.This can lead to a reduction in the electrostatic attraction of particles from the environment by the adhesive layer.

[0016] According to further training, the bonding of the carrier substrate with the covering substrate results in a material-bonded bond between the adhesive layer and the encapsulation.

[0017] According to further training, the formation of the adhesion promoter layer involves the addition of an electrically conductive material to the adhesion promoter layer. This addition increases the electrical conductivity of the adhesion promoter layer. Therefore, during the formation of the adhesion promoter layer, an electrical potential can be applied to the additional electrically conductive layer to reduce contamination of the adhesion promoter layer by particles from the environment.

[0018] According to the invention, at least one further organic component is formed on the support substrate and next to the organic component.

[0019] According to a further development, the organic component and at least one other organic component are electrically connected to each other by means of the electrically conductive layer. By connecting the organic component to the at least one other organic component via the electrically conductive layer, it is possible to easily apply the same electrical potential to all organic components arranged on the support substrate.

[0020] According to a further development, the method also includes separating the organic component from at least one other organic component by cutting through the support substrate between the organic component and the at least one other organic component.

[0021] They show: Fig. 1. A flowchart of a process for manufacturing an organic component; Fig. 2a a cross-sectional view of an organic component in a method for producing an organic component; Fig. 2b a top view of an organic component in a process for producing an organic component; Fig. 2c a cross-sectional view of an organic component in a method for producing an organic component; Fig. 3 a cross-sectional view of an organic component in a process for manufacturing the organic component; Fig. 4 a cross-sectional view of an organic component in a process for manufacturing the organic component; Fig. 5 a cross-sectional view of an organic component in a process for manufacturing the organic component; Fig. 6. A top view of an organic component in a process for producing an organic component; Fig. 7 a top view of an organic component in a process for producing an organic component; Fig. 8 a cross-sectional view of an organic component in a process for manufacturing an organic component; Fig. 9 a top view of an organic component in a process for producing an organic component; and Fig. 10 a schematic representation of a device for intermediate storage in a process for manufacturing an organic component.

[0022] The following detailed description refers to the accompanying drawings, which form part of this description and in which specific embodiments of the invention are shown for illustration. It is understood that other embodiments may be used and structural or logical modifications may be made. It is understood that the features of the various embodiments described herein may be combined unless specifically stated otherwise. The following detailed description is therefore not to be interpreted as limiting, and the present invention is defined by the attached claims.

[0023] Within the scope of this description, the terms "connected," "attached," and "coupled" are used to describe both direct and indirect connections, direct or indirect links, and direct or indirect couplings. In the figures, identical or similar elements are labeled with identical reference symbols where appropriate.

[0024] The terms "translucent" and "translucent layer" can be understood in various embodiments to mean that a layer or material is permeable to light, for example, to the light generated by the electromagnetic radiation source, for example, to one or more wavelength ranges, for example, to light in a wavelength range of visible light (for example, at least in a sub-range of the wavelength range from 380 nm to 780 nm). For example, the term "translucent layer" can also be understood in various embodiments to mean that essentially all the amount of light coupled into a structure (for example, a layer) is also coupled out of the structure (for example, layer), whereby some of the light may be scattered.

[0025] The term "transparent" or "transparent layer" can be understood in various embodiments to mean that a layer is permeable to light (for example, at least in a sub-range of the wavelength range from 380 nm to 780 nm), whereby light coupled into a structure (for example, a layer) is also coupled out of the structure (for example, layer) without scattering or light conversion.

[0026] Fig. Figure 1 shows a flowchart of a process for manufacturing an organic component.

[0027] The method for producing an organic building component involves providing 101 a support substrate 202, for example in Fig. 2a. Furthermore, the method involves the formation 102 of an electrically conductive layer 203, for example in Fig. 2a shows the formation of a layer on or above the support substrate 202 and the application 103 of an electrical potential to the electrically conductive layer 203. Furthermore, the method involves the formation 104 of at least one organic, functional layer 210, for example in Fig. 2c shows the formation of the organic component on or above the electrically conductive layer 203, at least partially during the application of the electrical potential to the electrically conductive layer 203.

[0028] The organic component can be designed as an optoelectronic device that emits or absorbs light. It can be an organic light-emitting diode (OLED), a photodetector, or a solar cell. The organic component can, for example, contain one, two, or more LED elements. These LED elements can be, for example, organic light-emitting diodes, or parts or segments thereof.

[0029] In 101, the support substrate 202 is provided. The support substrate 202 can be translucent or transparent. The support substrate 202 serves as a substrate for electronic elements or layers, for example, light-emitting elements. The support substrate 202 can, for example, consist of or be formed from plastic, metal, glass, quartz, and / or a semiconductor material. Furthermore, the support substrate 202 can consist of or be formed from a plastic film or a laminate with one or more plastic films. The support substrate 202 can be mechanically rigid or mechanically flexible.

[0030] According to one embodiment, a first barrier layer, for example a first barrier thin film, is formed on the support substrate 202. The first barrier layer serves to protect elements formed on the support substrate 202 from harmful external influences such as oxygen and / or moisture.

[0031] In 102, the electrically conductive layer 203 is formed on or above the support substrate 202.

[0032] The electrically conductive layer 203 is configured to include an electrically conductive material, for example, a metal and / or a transparent conductive oxide (TCO), or a stack of multiple layers comprising metals or TCOs. The electrically conductive layer 203 can be configured to include a stack of layers combining a layer of a metal on a layer of a TCO, or vice versa. An example is a silver layer deposited on an indium tin oxide (ITO) layer (Ag on ITO) or ITO-Ag-ITO multilayers.The electrically conductive layer can be formed alternatively or additionally to the aforementioned materials such that the electrically conductive layer comprises at least one of the following materials: networks of metallic nanowires and particles, for example made of silver, networks of carbon nanotubes and / or graphene particles and layers.

[0033] According to one embodiment, the electrically conductive layer 203 is formed on a surface, for example a main processing surface, of the support substrate 202, for example over the entire main processing surface. The electrically conductive layer 203 can be formed as a continuous layer covering a large area over the entire main processing surface of the support substrate 202.

[0034] According to one embodiment, the electrically conductive layer 203 is structured on the support substrate 202, for example by means of optical lithography and / or using a shadow mask.

[0035] The electrically conductive layer 203 can be formed on or over the support substrate 202 by physical vapor deposition, for example by sputtering, thermal evaporation and / or electron beam evaporation. The electrically conductive layer 203 can also be formed on or over the support substrate by spin coating, dip coating, spray coating and / or curtain coating.

[0036] In 103, the electrical potential is applied to the electrically conductive layer 203.

[0037] According to one embodiment, the electrical potential is a suitable reference potential, for example the ground potential, for example 0V.

[0038] In other words, when the electrical potential 103 is applied, the electrically conductive layer 203 is grounded.

[0039] In 104, at least one organic functional layer 210 is formed on or above the electrically conductive layer 203 to form the organic component, wherein the organic functional layer 210 is formed at least partially during the application 103 of the electrical potential to the electrically conductive layer 203.

[0040] According to one embodiment, the electrical potential is applied to the at least one organic, functional layer 210 during the entire period of formation 104.

[0041] The at least one organic functional layer 210 is designed such that it contains at least one organic substance, for example an organic semiconductor and / or an organic conductor.

[0042] In the case where the organic device is designed as an organic light-emitting diode (OLED), the at least one organic functional layer 210 can be configured as a hole injection layer, a hole transport layer, an emitter layer, an electron transport layer, and / or an electron injection layer. The hole injection layer serves to reduce the band gap between the first electrode and the hole transport layer. In the hole transport layer, the hole conductivity is greater than the electron conductivity. The hole transport layer serves to transport the holes. In the electron transport layer, the electron conductivity is greater than the hole conductivity. The electron transport layer serves to transport the electrons. The electron injection layer serves to reduce the band gap between the second electrode and the electron transport layer. The organic functional layer can be translucent or transparent.

[0043] According to one embodiment, the at least one organic functional layer 210 is formed as part, or as a sublayer, of an organic functional layer structure. The organic functional layer structure can be designed such that it comprises one, two, or more functional layer structure units, each of which includes the aforementioned sublayers and / or further intermediate layers.

[0044] An organic component can have multiple layers, which can be formed on top of each other during the manufacturing process. Conventionally, the layers are electrically isolated from ground potential during the manufacturing process, which can lead to electrostatic charging. This can result in increased attraction of particles from the environment. By applying an electrical potential to the electrically conductive layer 203 during the formation of the at least one functional organic layer 210, it is possible to reduce, or even minimize, the existing potential difference between the at least one functional organic layer 210 and the particles from the environment, such as dust particles.This reduces the electrostatic attraction between particles from the environment and the at least one organic functional layer 210. An organic device manufactured in this way can exhibit fewer particle-induced defects. Grounding the electrically conductive layer 203 makes it easy to reduce, for example, minimize, the potential difference between the at least one organic functional layer 210 and the particles from the environment. Electrostatic charging of the support substrate 202 during the fabrication of the organic device, for example, the OLED, can be avoided. Particles are attracted less strongly or not at all. Thus, the particle load is reduced, and the yield of the organic devices, or rather their quality, increases.

[0045] Fig. 2a shows a cross-sectional view and Fig. Figure 2b shows a top view of an organic component in a process for manufacturing an organic component.

[0046] Fig. Figure 2a shows a support substrate 202 with an electrically conductive layer 203 formed on the support substrate 202. The electrically conductive layer 203 can be formed such that it has several sub-regions, for example by optical lithography or by using a shadow mask. For example, the electrically conductive layer 203 can be formed such that it has a component surface 204, on which the organic component is to be formed. Furthermore, the electrically conductive layer 203 can be formed such that it has at least one contact surface 206 and at least one connecting surface 208. The at least one connecting surface 208, hereinafter also referred to as at least one connecting line 208, connects the at least one contact surface 206 to the component surface 204. The contact surface 206 can be, as shown in Figure 2a, formed by a contact surface 206, a contact surface 206, a contact surface 206, a contact surface 204 ... Fig. The contact surface 206, as shown in Figure 2b, is formed in an edge region of the support substrate 202. The contact surface 206 can have the form of a frame. A frame-shaped contact surface 206 can also be referred to as a contact frame 206. The contact surface 206 can be formed on the support substrate 202 and around its entire edge region. Using a contact frame 206 formed in this way simplifies electrical contacting, since electrical contacting can take place on the entire edge region of the support substrate 202.

[0047] According to one embodiment, the contact surface 206 is designed such that it has several contact pads instead of or in addition to the circumferential contact frame 206.

[0048] The carrier substrate 202 can be provided with an electrically conductive layer 203, hereinafter also referred to as electrically conductive coating 203, and with at least one connecting line 208, hereinafter also referred to as at least one electrical connecting line 208, to one or more contact surfaces, wherein the one or more contact surfaces are grounded during storage, transport and / or manufacture of the organic component.

[0049] Fig. Figure 2c shows a cross-sectional view of an organic component in a process for manufacturing an organic component.

[0050] On the electrically conductive layer 203, at least one organic, functional layer 210 is formed.

[0051] According to one embodiment, at least one organic functional layer 210 is formed on the component surface 204 of the electrically conductive layer 203. The organic functional layer 210 can be formed on the component surface 204 such that the area of ​​the support substrate 202 which is free of the component surface 204 is free of the organic functional layer 210.

[0052] According to a further development, the method further comprises forming a first electrode 312 and forming a second electrode 314, wherein at least one organic, functional layer 316 is formed between the first electrode 312 and the second electrode 314.

[0053] Fig. Figure 3 shows a cross-sectional view of an organic component in a process for manufacturing an organic component.

[0054] As in Fig. As shown in Figure 3, the first electrode 312 is formed on or above the support substrate 202.

[0055] The first electrode 312 can be configured as an anode or as a cathode. According to one embodiment, the first electrode 312 is translucent or transparent. The first electrode 312 can be configured to have an electrically conductive material, for example, a metal and / or a conductive transparent oxide, or a stack of multiple layers comprising metals or TCOs. For example, the first electrode 312 can be configured to have a stack of layers comprising a combination of a metal layer on a TCO layer, or vice versa. An example is a silver layer deposited on an indium tin oxide (ITO) layer (Ag on ITO) or ITO-Ag-ITO multilayers.The first electrode 312 can be designed such that the first electrode 312 has, as an alternative or in addition to the aforementioned materials: networks of metallic nanowires and particles, for example made of silver, networks of carbon nanotubes, graphene particles and layers and / or networks of semiconducting nanowires.

[0056] According to one embodiment, a first contact section 313 is formed next to the first electrode 312. The first contact section 313 is designed such that it is in direct (physical) contact with the first electrode 312. The first contact section 313 serves to electrically contact the first electrode 312. The first contact section 313 can be formed simultaneously with the first electrode 312. The first contact section 313 can be made of the same materials as the first electrode 312. The first contact section 313 can also be referred to as the contact pad 313 of the first electrode.

[0057] According to one embodiment, the first electrode 312 is placed on or above the electrically conductive layer 203 (not in Fig. 3 shown) trained.

[0058] According to one embodiment, the first electrode 312 is formed on the component surface 204 of the electrically conductive layer 203. The first electrode 312 can be formed on the component surface 204 such that the area of ​​the support substrate 202 which is free of the component surface 204 is also free of the first electrode 312.

[0059] According to one embodiment, the electrical potential is applied to the electrically conductive layer 203 at least partially during the formation of the first electrode 312.

[0060] According to one embodiment, the electrically conductive layer 203 is grounded on or above the electrically conductive layer 203 during the formation of the first electrode 312. This makes it possible to form the first electrode 312 with a reduced number of particles from the environment. A first electrode 312 formed in this way can have no or only a few particle-induced defects.

[0061] According to one embodiment, the electrical potential is applied to the first electrode 312 during the entire period of forming 104.

[0062] According to one embodiment, the electrically conductive layer 203 forms the first electrode 312, or the electrically conductive layer 203 is formed as part of the first electrode 312. This makes the process even more efficient, since both the first electrode 312 and the electrically conductive layer 203 can be formed together in just one process step.

[0063] As in Fig. As shown in Figure 3, at least one organic, functional layer 316 is formed on the first electrode 312.

[0064] The at least one functional organic layer is an electrically and / or optically active region. The active region is, for example, the area of ​​the organic device in which electric current flows to operate the device and / or in which electromagnetic radiation is generated or absorbed. A getter structure (not shown) can be arranged on or above the active region. The getter layer can be translucent, transparent, or opaque. The getter layer can be designed to contain a material that absorbs and binds substances that are harmful to the active region.

[0065] The second electrode 314 is configured according to an embodiment of the first electrode 312 described above, wherein the first electrode 312 and the second electrode 314 can be configured identically or differently. The first electrode 312 serves, for example, as the anode or cathode of the optoelectronic layer structure. Correspondingly to the first electrode 314, the second electrode 314 serves as the cathode or anode of the at least one optoelectronic layer or the optoelectronic layer structure.

[0066] According to one embodiment, the second electrode 314 is designed to be transparent or translucent.

[0067] According to one embodiment and as described in Fig. As shown in Figure 3, a second contact section 315 is formed next to the first electrode 312. The second electrode 314 is configured to be in direct contact with the second contact section 315. The second contact section 315 serves to electrically connect the second electrode 314. The second contact section 315 can be formed simultaneously with the first electrode 312. The second contact section can be made of the same materials as the first electrode 312. The second contact section 315 can also be referred to as the contact pad 315 of the second electrode. The first electrode 312 is electrically insulated from the second contact section 315 by means of an electrical insulation barrier 317.

[0068] According to one embodiment, the second electrode 314 is formed on the component surface 204 of the electrically conductive layer 203. The second electrode 314 can be formed on the component surface 204 such that the area of ​​the support substrate 202 which is free of the component surface 204 is also free of the second electrode 314.

[0069] According to one embodiment, the electrical potential is applied to the electrically conductive layer 203 at least partially during the formation of the second electrode 314.

[0070] According to one embodiment, the electrically conductive layer 203 is grounded above the electrically conductive layer 203 during the formation of the second electrode 314. This makes it possible to form the second electrode 314 with a reduced number of particles from the environment. A second electrode 314 formed in this way can have no or only a few particle-induced defects.

[0071] According to one embodiment, the method further comprises forming an encapsulation 318 on or above the second electrode 314.

[0072] The encapsulation 318, also referred to as the encapsulation layer 318, is formed on or above the second electrode 314 and partially over the first contact section 313 and partially over the second contact section 315. The encapsulation 318 encapsulates the at least one organic functional layer. The encapsulation layer 318 can be configured as a second barrier layer, for example, as a second barrier thin film. The encapsulation layer 318 can also be referred to as a thin-film encapsulation 318. The encapsulation layer 318 forms a barrier against chemical impurities or atmospheric substances, in particular against water (moisture) and oxygen. The encapsulation layer 318 can be configured as a single layer, a stack of layers, or a layered structure.The encapsulation layer 318 can be configured to contain or be formed from the following materials: aluminum oxide, zinc oxide, zirconium oxide, titanium oxide, hafnium oxide, tantalum oxide, lanthanum oxide, silicon oxide, silicon nitride, silicon oxynitride, indium tin oxide, indium zinc oxide, aluminum-doped zinc oxide, a carbide, for example silicon carbide or other carbide compounds, poly(p-phenylene terephthalamide), nylon 66, as well as mixtures and alloys thereof. Optionally, the first barrier layer on the support substrate 202 can be configured correspondingly to an embodiment of the encapsulation layer 318.

[0073] According to one embodiment, a first recess of the encapsulation layer 318 is formed above the first contact section 313, and a second recess of the encapsulation layer 318 is formed above the second contact section 315. In the first recess of the encapsulation layer 318, a first contact area of ​​the first contact section 313 is exposed, and in the second recess, a second contact area of ​​the second contact section 315 is exposed. The first contact area serves for electrical contacting the first contact section 313, and the second contact area serves for electrical contacting the second contact section 315.

[0074] According to one embodiment, the encapsulation 318 is formed from a metal, or the encapsulation 318 is designed to be metal. A metallic encapsulation 318 has high electrical conductivity. Therefore, during the formation of the encapsulation 318, an electrical potential can be applied to the layer arranged beneath the encapsulation, for example, to the second electrode 312, in order to reduce the contamination of the encapsulation 318 by particles from the environment.

[0075] According to one embodiment, the electrical potential is applied to the electrically conductive layer 203 at least partially during the formation of the encapsulation 318.

[0076] According to one embodiment, the electrically conductive layer 203 is grounded above the electrically conductive layer 203 during the formation of the encapsulation 318. This makes it possible to form the encapsulation 318 with a reduced number of particles from the environment. An encapsulation 318 formed in this way may have no or only a few particle-induced defects.

[0077] The organic device, for example the OLED, should ideally be constructed from electrically conductive layers. For example, the encapsulation 318 can be formed from a thick metal layer instead of a thin layer, whereas thin encapsulation layers are usually formed by CVD and contain silicon nitride, silicon carbide, silicon oxide or similar materials, or non-conductive adhesive materials.

[0078] Fig. Figure 4 shows a cross-sectional view of a covering substrate 420 with an adhesive layer 422 in a method for producing an organic building component.

[0079] According to a further development, the method also includes providing a cover substrate 420. Furthermore, the method includes forming another electrically conductive layer 834 (not shown) on the cover substrate 420. The additional electrically conductive layer 834 is, for example, in Fig. Figure 8 illustrates the process. Furthermore, the method involves applying an electrical potential to the additional electrically conductive layer 834. The method also involves forming an adhesive layer 422 on or over the covering substrate, at least partially, during the application of the electrical potential to the additional electrically conductive layer 834. Finally, the method involves bonding the support substrate to the covering substrate by means of the adhesive layer.

[0080] According to one embodiment, the application of the electrical potential to the further electrically conductive layer 834 is configured in the same way as the application of the electrical potential to the electrically conductive layer 203. By applying the electrical potential during the formation of the adhesive layer 422, it is possible to minimize the potential difference between the adhesive layer 422 and particles from the environment. This can lead to a reduction in the electrostatic attraction of particles from the environment by the adhesive layer 422.

[0081] According to one embodiment, the adhesive layer 422 is configured to include an adhesive, for example an adhesive such as a laminating adhesive, a varnish, and / or a resin. Furthermore, the adhesive layer 422 can be configured to include particles that scatter electromagnetic radiation, for example, light-scattering particles.

[0082] According to one embodiment, the adhesive layer 422 can be designed to include a laminating adhesive. An electrically conductive adhesive, such as a silver conductive adhesive, can be used as the laminating adhesive. Alternatively, the laminating adhesive can be mixed with conductive particles, such as carbon black.

[0083] The adhesive layer 422 is formed on or over the cover substrate 420. The adhesive layer 422 serves to attach the cover body 420 to the encapsulation layer 318. The cover substrate 420 can be configured to consist of a plastic, a glass, and / or a metal. For example, the cover substrate 420 can be formed primarily of glass and have a thin metal layer, such as a metal foil, and / or a graphite layer, such as a graphite laminate, on the glass body. The cover substrate 420 serves to protect the organic component, for example, from external mechanical forces. Furthermore, the cover substrate 420 can serve to distribute and / or dissipate heat generated in the organic component.For example, the glass of the cover substrate 420 can serve as protection against external influences, and the metal layer of the cover substrate 420 can serve to distribute and / or dissipate the heat generated during the operation of the organic component. According to one embodiment, the cover substrate 420 is designed like the support substrate 202 described above.

[0084] According to one embodiment, the formation of the adhesive layer 422 involves the addition of an electrically conductive material to the adhesive layer 422. By adding an electrically conductive material to the adhesive layer 422, the electrical conductivity of the adhesive layer 422 can be increased. Thus, during the formation of the adhesive layer 422, an electrical potential can be applied to the further electrically conductive layer 834 to reduce the contamination of the adhesive layer 422 by particles from the environment.

[0085] According to one embodiment, the electrical potential is applied to the further electrically conductive layer during the entire period of formation of the adhesive layer 422.

[0086] According to one embodiment, the further electrically conductive layer 203 is grounded on or above the further electrically conductive layer 203 during the formation of the adhesive layer 422.

[0087] According to one embodiment, the connection of the carrier substrate with the cover substrate involves a material-bonded connection of the adhesive layer 422 with the encapsulation 318.

[0088] Fig. Figure 5 shows a cross-sectional view of an organic component in a process for manufacturing an organic component.

[0089] According to one embodiment, the method includes providing the support substrate 202. The electrically conductive layer 203 (not shown) is formed on or above the support substrate 202. A first layer 524a is formed on the component surface 204 of the electrically conductive layer 203. The first layer 524a can be formed like one of the layers described above; for example, the first layer can be formed like the at least one organic functional layer 210. The electrically conductive layer 203 can be grounded before or during the formation of the first layer 524a. The grounding of the electrically conductive layer 203 can be maintained for the entire period required to form the first layer 524a. The first layer 524a can be grounded by grounding the electrically conductive layer 203. Furthermore, a second layer 524b can be formed on the first layer 524a.The second layer 524b can be formed like any of the layers described above; for example, the second layer 524b can be formed like the at least one organic functional layer 210. The electrically conductive layer 203 can be grounded before or during the formation of the second layer 524b. The grounding of the electrically conductive layer 203 can be maintained for the entire period required to form the second layer 524b. The second layer 524b can be grounded by grounding the electrically conductive layer 203.In the event that the electrical leakage resistance of the first layer 524a is too high (for example, if the leakage resistance is greater than or equal to 1 GΩ, greater than or equal to 1 MΩ, or greater than or equal to 1 kΩ) for the second layer 524b to also be grounded by means of the grounding of the electrically conductive layer 203, a first electrically conductive intermediate layer 526a can be formed between the first layer 524a and the second layer 524b. The first electrically conductive intermediate layer 526a can comprise the electrically conductive materials listed above in connection with the first electrode 312, or the materials of the hole injection layer or the electron injection layer. Furthermore, a third layer 524c can be formed on top of the second layer 524b.The third layer 524c can be formed like any of the layers described above; for example, the third layer can be formed like the second electrode 314. The electrically conductive layer 203 can be grounded before or during the formation of the third layer 524c. The grounding of the electrically conductive layer 203 can be maintained for the entire period required to form the second layer 524b. The third layer 524c can be grounded by grounding the electrically conductive layer 203.In the event that the electrical leakage resistance of the second layer 524b is too high (for example, if the leakage resistance is greater than or equal to 1 GΩ, greater than or equal to 1 MΩ, or greater than or equal to 1 kΩ) for the third layer 524c to also be grounded by means of the grounding of the electrically conductive layer 203, a second electrically conductive intermediate layer 526b can be formed between the second layer 524b and the third layer 524c. The second electrically conductive intermediate layer 526b can be formed in the same way as the first electrically conductive intermediate layer 526b.

[0090] It should be noted that an electrically conductive intermediate layer, formed like the first electrically conductive intermediate layer 526a described above or like the second electrically conductive intermediate layer 526b, can optionally also be formed between other layers. For example, a third electrically conductive intermediate layer (not shown) can be formed between the third layer 524c and a fourth layer (not shown) formed above the third layer 524c. According to one embodiment, the electrically conductive intermediate layer can optionally be formed on each of the layers of the organic device described above.

[0091] As an alternative to the grounding of the electrically conductive layer 203 described above, an electrical potential can be applied to the electrically conductive layer 203.

[0092] In Fig. Figure 5 further shows a grounding contact 528, which, according to one embodiment, is formed next to the first layer 524a. The grounding contact 528 can be formed as part of the electrically conductive layer 203 or be electrically connected to the electrically conductive layer 203. For example, the electrical potential, the ground potential, or the earth potential can be applied to the grounding contact 528.

[0093] An optional first insulation barrier 530a is arranged between the grounding contact 528 and the first layer 524a. The first insulation barrier 530a is formed adjacent to a first side surface of the first layer 524a.

[0094] The first layer 524a has two main faces and at least one side face connecting the two main faces. For example, the first layer 524a can approximate the shape of a cuboid. In this case, the first layer 524a has two main faces and four side faces arranged perpendicular to them. The surface normals of the two main faces of the first layer 524a are parallel to the surface normals of the main face of the support substrate 202. For thin layers, the size of the side faces can be negligibly small. Fig. Figure 5 shows a cross-sectional view of an approximately cuboid-shaped first layer. Fig. Figure 5 shows a first layer with a first edge having a first edge surface and a second edge having a second edge surface. The first electrically conductive intermediate layer 526a is partially formed on the grounding contact 528 such that an electrical contact is formed between the first electrically conductive intermediate layer 526a and the grounding contact 528. The second electrically conductive intermediate layer 526b is partially formed on the first electrically conductive intermediate layer 526a such that an electrical contact is formed between the first electrically conductive intermediate layer 526a and the second electrically conductive intermediate layer 526a. An optional second insulating barrier 530b is arranged next to the second layer 524b.The second insulating barrier 530b is formed adjacent to a first side face of the second layer 524b, the second layer being geometrically configured like the first layer 524a. The third layer 524c is formed on the second electrically conductive intermediate layer 526b. The first layer 524a, the second layer 524b, and the third layer 524c are formed one above the other to form a stack of layers. An optional third insulating barrier 530c is arranged adjacent to the third layer 524c. The third insulating barrier 530c is formed adjacent to a first side face of the third layer 524c, the third layer being geometrically configured like the first layer 524a. The first insulating barrier 530a, the second insulating barrier 530b, and the third insulating barrier, if provided, are arranged approximately congruently one above the other.

[0095] According to the in Fig. In the embodiment shown in Figure 5, the encapsulation 318 is formed on the third layer 524c and on the optional third insulating barrier 530c. The encapsulation 318 is further arranged on the second electrically conductive intermediate layer 526b such that an electrical contact is formed between the second electrically conductive intermediate layer 526b and the encapsulation 318. The encapsulation can also be partially formed on the support substrate 202. Even if in Fig. 5 not shown, in various embodiments a first electrode (for example anode) and a second electrode (cathode) are provided in the layer stack, wherein the second electrode is arranged on the third layer 524c and the encapsulation in this case is arranged on the second electrode.

[0096] As in Fig. Figure 5 shows an embodiment in which the first electrically conductive intermediate layer 526a is formed up to the second edge of the first layer 524a such that the second boundary surface of the first layer 524a is free of the first electrically conductive intermediate layer 526a and an edge of the first electrically conductive intermediate layer 526a borders the second edge of the first layer 524a. Furthermore, the second electrically conductive intermediate layer 526b is also formed up to a second edge of the second layer 524b such that a second boundary surface of the second layer 524b is free of the second electrically conductive intermediate layer and an edge of the second electrically conductive intermediate layer 526b borders the second edge of the second layer 524b.An optional fourth insulating barrier 532 is formed adjacent to the second edge of the first layer 524a, the second layer 524b, and the third layer 524c, and adjacent to the edge of the first electrically conductive intermediate layer 526a and adjacent to the edge of the second electrically conductive intermediate layer 526b. The optional fourth insulating barrier 532 is configured to laterally separate the encapsulation 318 from the first layer 424a, the second layer 424b, the third layer 424c, the first electrically conductive intermediate layer 426a, and the second electrically conductive intermediate layer 426b.

[0097] An area of ​​the substrate 202 on or above which the grounding contact 528 is formed can also be referred to as the grounding area. An area of ​​the substrate 202 on or above which the first insulating barrier 530a, the second insulating barrier 530b, and the third insulating barrier 530c are formed can also be referred to as the insulation area. The grounding area is formed adjacent to the insulation area. An area of ​​the substrate 202 on or above which the component surface 204 of the electrically conductive layer 203, the first layer 424a, the second layer 424b, and the third layer 424c are formed can be referred to as the component area. According to one embodiment, the grounding contact area is separated from the component area by cutting through the substrate 202 in the insulation area (in Fig. 5 (shown by means of the dashed line). Furthermore, when the support substrate 202 is cut, the layers lying on or above the support substrate are also cut.

[0098] According to one embodiment, immediately after the formation of a slightly electrically conductive layer, such as an organic functional layer, hereinafter also referred to as organic, or a thin film encapsulation (TFE), an electrically conductive intermediate layer, for example a metal, is formed on the slightly electrically conductive layer.

[0099] Fig. Figure 6 shows a top view of an organic component in a process for manufacturing an organic component.

[0100] According to one embodiment, at least one further organic component is formed on the support substrate 202 and next to the organic component. Fig. Figure 6 shows, for example, that four organic components are formed on the support substrate 202. According to one embodiment, the organic component and at least one other organic component are connected to each other by means of the electrically conductive layer 203. By connecting the organic component to the at least one other organic component by means of the electrically conductive layer 203, it is possible to apply the same electrical potential to all organic components arranged on the support substrate. In this way, for example, several organic components can be formed under the same electrostatic conditions.

[0101] In Fig. Figure 6 shows that the electrically conductive layer 203 is formed with the contact surface 206, the component surface 204, the at least one connecting line 208, the first contact surface 313, and the second contact surface 315. An electrical insulation barrier 317 (not shown) can be arranged between the second contact surface 315 and the component surface. Furthermore, the electrically conductive layer 203 can be formed with a further first contact surface 613b, which, according to one embodiment, is formed with the first contact surface 313. The first contact surface 313 and the further first contact surface 613b can be arranged on opposite sides of the component surface 204. Furthermore, the electrically conductive layer 203 can be formed with a further second contact surface 615b, which, according to one embodiment, is formed with the second contact surface 615b.The second contact surface 315 and the further second contact surface 615b can be arranged on opposite sides of the component surface 204.

[0102] The component surface 204 with the first contact surface 313, the second first contact surface 613b, the second contact surface 315 and the second second contact surface 615b can be referred to as a component unit. As in Fig. As shown in Figure 6, for example, four component units, a first component unit 617a, a second component unit 617b, a third component unit 617c, and a fourth component unit 617d, can be arranged in a matrix on the support substrate 202. According to one embodiment, the first contact surface 313 of the first component unit 617a is connected to the contact frame 206 by means of at least one connecting line 208. The second first contact surface 613b of the first component unit 617a is connected to the first contact surface 313 of the second component unit 617b by means of at least one connecting line 208. The second first contact surface 613b of the second component unit 617b is connected to the third first contact surface 613b of the third component unit 617c by means of at least one connecting line 208.The first contact surface 313 of the second component unit 617b is connected to the first contact surface 313 of the third component unit 617c by means of at least one connecting line 208. The first contact surface 313 of the third component unit 617c is connected to the further first contact surface 613b of the fourth component unit 617d by means of at least one connecting line 208. The first contact surface 313 of the fourth component unit 617d is connected to the first contact surface 313 of the first component unit 617a and to the contact frame 206.

[0103] According to one embodiment, the contact surface 206 is designed such that it has several contact pads instead of a circumferential contact frame.

[0104] The at least one connecting line 208 can also be referred to as conductor track 208 in the following.

[0105] The first contact surface 313 and the second first contact surface 613b can be referred to as anode or cathode contacts. Correspondingly, the second contact surface 315 and the second second contact surface 615b can be referred to as cathode or anode contacts.

[0106] Conductive traces or the electrically conductive layer, which may have several electrically conductive layers, connect the individual components on the substrate 202 to one or more contact pads or a surrounding contact frame. The anode and / or cathode contacts of the individual components can be used. These conductive traces can be routed to defined contact points at the edge of the substrate 202, thus enabling consistent contacting during the process and during storage.

[0107] The in Fig. Figure 6 shows that the component surface 204 is designed to have an approximately circular shape. Alternatively, the component surface can also have any other arbitrary shape, for example an approximately rectangular shape as shown in Figure 6. Fig. 7 is shown.

[0108] According to one embodiment, the method further comprises separating the organic component from the at least one further organic component by cutting through the support substrate 202 between the organic component and the at least one further organic component.

[0109] The cutting of the carrier substrate 202 is in Fig. 6 is represented by the dashed line. For example, the support substrate 202 can be cut along the dashed line, for example by a saw or a cutting device. The support substrate 202 is cut in such a way that only those areas remain which have the component surface 204, the first contact surface 313, the second first contact surface 613b, the second contact surface 315 and the second second contact surface 615b.

[0110] Fig. Figure 7 shows a top view of an organic component in a process for manufacturing an organic component.

[0111] As in Fig. 6, shows Fig. 7 a carrier substrate 202 on which four organic building elements are to be formed. In contrast to the one in Fig. In the embodiment shown in section 6, the component surface 204 of the Fig. 7 is approximately rectangular. The component surface 204 is configured such that it has two short sides and two long sides, with the first contact surface 313, the second contact surface 315, and the further second contact surface 615b being arranged on one of the short sides. According to one embodiment, the first contact surfaces 313 of the four component units are connected to each other and to the contact frame 206 by means of the further electrically conductive layer.

[0112] Fig. Figure 8 shows a cross-sectional view of a covering substrate 420 with an adhesive layer 422 in a method for producing an organic building component.

[0113] The further electrically conductive layer 834 is arranged on the covering substrate 420. The adhesive layer 422 is arranged on the further electrically conductive layer 834. The adhesive layer 422 (not shown) is configured such that it has a first adhesive region 836 and at least one second adhesive region 838. The first adhesive region 836 and the second adhesive region 838 can be arranged side by side.

[0114] According to one embodiment, the connection of the carrier substrate 202 with the cover substrate 420 comprises a material-bonded connection of the first adhesive area 836 with the encapsulation 318 of the organic component and a material-bonded connection of the at least one second adhesive area 838 with the encapsulation 318 of the at least one further organic component.

[0115] According to one embodiment, the encapsulation 318 is designed such that the organic component and at least one other organic component share the encapsulation 318.

[0116] Fig. Figure 9 shows a top view of a covering substrate 420 with an adhesive layer 422 in a process for manufacturing an organic building component.

[0117] According to one embodiment, the electrically conductive layer 834 is made of aluminum or ITO.

[0118] The further electrically conductive layer 834 can be configured to have a contact surface 906, wherein the contact surface 906 is configured according to an embodiment of the contact frame 206 described above. Furthermore, the further electrically conductive layer 834 can have a so-called conductor network 940. As in Fig. As shown in Figure 9, the conductor network 940 can be configured to have horizontal and vertical lines on the cover substrate 420. The conductor network 940 can approximately have the form of a grid.

[0119] According to one embodiment, the electrically conductive layer 834 is formed as a continuous, contiguous layer covering a large area on the covering substrate 420. The electrically conductive layer 834 can be formed on a main surface of the covering substrate 420. The electrically conductive layer 834 can be formed on the covering substrate 420 such that the electrically conductive layer 834 completely covers at least one surface, for example, the main surface, of the covering substrate 420. Thus, an electrical contact can be established between the first adhesive region 836 and the at least one second adhesive region 838 by means of the additional electrically conductive layer 834, and a common electrical potential can be applied to the first adhesive region 836 and to the at least one second adhesive region 838.

[0120] The further electrically conductive layer 834 can be configured according to an embodiment of the electrically conductive layer 203. For example, the further electrically conductive layer 834 can be configured like the electrically conductive layer 203. For example, the further electrically conductive layer 834 can be configured such that it has a component surface, a contact surface or several contact pads and at least one connection surface, wherein the adhesive layer 422 is to be formed on the component surface of the further electrically conductive layer 834.

[0121] The cover substrate 420, for example glass, such as Capglas 420 or laminating glass 420, or one or more plastic films or another suitable cover substrate, is provided in various embodiments. The further electrically conductive layer 834 can also be referred to below as the electrically conductive coating 834. The contact surface or the multiple contact pads of the further electrically conductive layer 834 can be grounded during storage, transport, and / or the fabrication of the organic component. Electrostatic charging of the cover substrate 420 can be avoided during the fabrication of the organic component, for example, the OLED. Particles are attracted less strongly or not at all. Thus, the particle load can be reduced, and the yield or quality of the organic components can be increased.

[0122] Fig. Figure 10 shows a schematic representation of a device for intermediate storage 1042 of a cover substrate 420 or a support substrate 202 in a method for producing an organic building element.

[0123] According to one embodiment, the method for producing the organic component includes intermediate storage of the cover substrate 420 and / or the support substrate 202.

[0124] The device for intermediate storage 1042 is also referred to as tray 1042 or transport cassette 1042.

[0125] According to one embodiment, the carrier substrate 202, on which the electrically conductive layer 203 is already formed, is arranged in the intermediate storage device 1042; for example, the carrier substrate 202 is pushed into the tray 1042. Furthermore, the intermediate storage of the carrier substrate 202 includes electrical contact with the electrically conductive layer 203. This contacting of the electrically conductive layer 203 can be achieved, for example, with a contacting device 1044. For example, the contacting device 1044 can be configured such that when the carrier substrate 202 is pushed into the tray 1042, an electrical contact is formed with the contact surface 206 of the electrically conductive layer 203. The contacting of the cover substrate 420 can be carried out in an analogous manner.According to one embodiment, the cover substrate 420 and / or the carrier substrate 202 is grounded during intermediate storage by means of the contacting device 1044.

[0126] To ground the carrier substrate 202 and / or the cover substrate 420 throughout the entire manufacturing, intermediate storage, and storage process, the installation of contacting devices 1044 in tools and auxiliary equipment may be necessary. Auxiliary equipment includes, for example, transport cassettes, transport trolleys, handlers (e.g., for transport between the cassette and the process plant), robots, and bake-out ovens.

[0127] The invention is not limited to the embodiments given. For example, the embodiments described in the Fig. 2a, Fig. 2b, Fig. 2c, Fig. 3, Fig. 4, Fig. 5, Fig. 6, Fig. 7, Fig. 8 and Fig. The 9 illustrated examples can be combined with each other.

Claims

[1] Method for producing an organic component comprising the method: • Providing a carrier substrate (202); • Formation of an electrically conductive layer (203) on or above the support substrate (202); • Applying an electrical potential to the electrically conductive layer (203); and • Forming at least one organic, functional layer (210) to form the organic component on or above the electrically conductive layer (203) at least partially during the application of the electrical potential to the electrically conductive layer (203), wherein • the organic functional layer (210) is designed to conduct an electric current for the operation of the organic component, and • on the support substrate (202) and at least one further organic component is formed next to the organic component. [2] Method according to claim 1, wherein when the electrical potential is applied the electrically conductive layer (203) is grounded. [3] Method according to claim 1 or 2, further comprising: Forming a first electrode (312); and Forming a second electrode (314); wherein at least one organic, functional layer (210) is located between the first electrode (312) and the second electrode (314) is formed. [4] Method according to claim 3, wherein the electrically conductive layer (203) is formed as part of the first electrode (312) or forms the first electrode (312) or is formed as part of the second electrode (312) or forms the second electrode (312). [5] Method according to claim 3 or 4, wherein the first electrode (312) and / or the second electrode (314) is / is designed to be transparent or translucent. [6] Method according to any one of claims 3 to 5, further comprising: Forming an encapsulation (318) on or above the second electrode (314). [7] Method according to claim 6, further comprising: wherein the encapsulation (318) is formed from a metal or the encapsulation (318) is formed such that it has a metal. [8] Method according to claim 6 or 7, wherein an electrical potential is applied to the electrically conductive layer (203) at least partially during the formation of the first electrode (312), the second electrode (314) and / or the encapsulation (318). [9] Method according to any one of claims 6 to 8, further comprising: • Provide a covering substrate (420); • Formation of another electrically conductive layer on the cover substrate (420); • Applying an electrical potential to the further electrically conductive layer; • Forming an adhesive layer (422) on or over the covering substrate (420) at least partially during the application of the electrical potential to the further electrically conductive layer; and • Connecting the carrier substrate (202) to the cover substrate (420) by means of the adhesive layer (422). [10] Method according to claim 9, wherein the joining of the carrier substrate (202) with the cover substrate (420) comprises a material-bonded joining of the adhesive layer (422) with the encapsulation (318). [11] Method according to claim 9 or 10, wherein the formation of the adhesive layer (422) comprises the addition of an electrically conductive material to the adhesive layer (422). [12] Method according to claim 1, wherein the organic component and the at least one further organic component are electrically connected to each other by means of the electrically conductive layer (203). [13] Method according to claim 1 or 12, further comprising: Separating the organic component from at least one other organic component by cutting through the support substrate (202) between the organic component and the at least one other organic component.

Images