Laser processing machine with missile

Abstract

Laser processing machine, including: a flying object (12) that can move while suspended in space; a processing head (14) which is mounted on the missile (12) and is designed to emit laser light; a position / location detection unit (18) that detects the position and location of the machining head (14) in relation to a machining object (16); an irradiation position change unit (20) that can change the irradiation position of the laser light emitted by the processing head (14) based on the position and orientation of the processing head (14) detected by the position / orientation detection unit (18); and a laser oscillator (22) that supplies the laser light to the processing head (14), wherein the processing head has a laser scanner (14) adapted to change the emission direction of the laser beam from the processing head.

Description

[0001] The present invention relates to a laser processing machine with a missile, and more particularly relates to a laser processing machine used for processing components in production processes.

[0002] Systems in which an unmanned aerial vehicle such as a drone or the like is provided with the function of emitting a laser beam are known (see, for example, Patent Laid-Open No. JP 2014-126299 A or Patent Laid-Open No. JP 2014-126468 A).

[0003] Systems are also known that radiate a laser beam to a target object outside a visual range by using an airborne unmanned aerial vehicle such as a helicopter or the like as a laser beam relay station (see, for example, Patent Laid-Open No. JP 2009-162453 A).

[0004] In addition, a device is also known that measures the three-dimensional shape of an object from the air using a laser scanner installed in a multicopter (see, for example, Patent Application Laid-Open No. JP 2016-107843 A).

[0005] Furthermore, CN 1 05 382 423 A discloses a laser processing device comprising a four-rotor aircraft, wherein the position of the aircraft is determined by the position feedback device and transmitted to the microprocessor.

[0006] CN 2 05 681 015 U also provides an aircraft for overhead line trimming.

[0007] CN 1 05 337 220 A discloses a laser cutting device for an aircraft.

[0008] Furthermore, CN 1 05 449 581 A discloses an obstacle removal device for an overhead line, which is used for removing foreign objects on a high-voltage line, wherein the obstacle removal device comprises an aircraft, an aircraft housing and at least two rotors arranged on the aircraft housing.

[0009] CN 2 04 930 106 U further describes a laser aircraft comprising an aircraft body, an electrical transverse rotary shaft, an electrical longitudinal rotary shaft, a pan-tilt device, a camera, a laser, a control module and a battery, wherein the aircraft body is movably connected to the transverse electrical rotary shaft.

[0010] The conventional techniques described above are not intended for use in component processing in production processes and therefore lack the capability of scanning the irradiation position required for component processing with the desired precision. Conventional laser processing machines used for component processing are designed to move a processing head that emits laser light and a processing object (a workpiece) relatively. Specifically, an orthogonal-axis machine tool, a robot, a positioner, or the like are used.However, conventional laser processing machines have certain limitations with regard to the size of workpieces that can be laser processed and the position of the processing head with respect to the workpiece. In the case of performing laser processing that exceeds this limitation, it is necessary to specially design and prepare a different laser processing machine.

[0011] There is no conventional technology that applies a system in which a missile is equipped with the laser emission function to laser processing that requires comparatively high precision. The invention is based on the object of providing an improved laser processing machine.

[0012] According to the invention, this object is achieved by a laser processing machine having the features of claim 1.

[0013] One form of the present disclosure is a laser processing machine comprising a flying body capable of floating in space; a processing head mounted on the flying body and configured to emit laser light; a position / attitude detection unit capable of detecting the position and attitude of the processing head with respect to a processing object; an irradiation position changing unit capable of changing the irradiation position of the laser light emitted from the processing head based on the position and attitude of the processing head detected by the position / attitude detection unit; and a laser oscillator capable of supplying the laser light to the processing head, wherein the processing head includes a laser scanner configured to change an irradiation direction of the laser beam from the processing head.

[0014] The objects, features, and advantages of the present invention will become more apparent from the following explanation of embodiments taken in conjunction with the accompanying drawings. In the drawings is Fig. 1 is a view showing a basic structural example of a laser processing machine according to an embodiment; is Fig. 2a is a view illustrating a simplified cutting as an example of laser processing; is Fig. 2b is a view showing a simplified laser welding as another example of laser processing; is Fig. 3 is a view showing a concrete structural example of a laser processing machine; is Fig. 4a is a view showing an example of measuring / correcting the position or attitude of a machining head by a position / attitude detection unit; is Fig. 4b is a view showing an example of measuring / correcting the position or attitude of the machining head by the position / attitude detection unit; is Fig. 5 is a view showing an example of a galvanomechanism; is Fig. 6 is a view showing a configuration example of additional axes that change the position or attitude of the machining head; is Fig. 7a is a view showing an example of a position changing mechanism of the machining head; is Fig. 7b is a view showing an example in which the position of the machining head is changed from the state of Fig. 7a was amended; is Fig. 8 is a view showing an example where a missile penetrates a complicated location and performs laser processing. is Fig. 9 is a view showing an example of a fiber switch.

[0015] Fig. 1 is a view showing a basic structural example of a laser processing machine 10 according to an embodiment of the present disclosure. The laser processing machine 10 includes a remotely controlled aerial vehicle 12 such as a drone, a multicopter, or the like; a processing head 14 mounted on the aerial vehicle 12 and configured to emit laser light; a position / attitude detection unit 18 that detects the position and attitude of the processing head 14 with respect to a processing object (a workpiece) 16; an irradiation position changing unit that can change the irradiation position (irradiation direction) of the laser light 19 emitted from the processing head 14 based on the position and attitude of the processing head 14 detected by the position / attitude detection unit 18; and a laser oscillator 22 that supplies the laser light to the processing head 14.The "laser processing" in the description of the present application is a processing of components using a laser, which is usually carried out in production processes or inspection processes in a factory, and is intended to include, in addition to marking, laser welding, drilling, cutting, sintering, plating and the like, also processing in which the appearance or shape of the irradiation object does not change (for example, heat treatments such as hardening or firing).

[0016] The processing of a component by a laser usually aims at high-precision processing due to the properties of a laser beam whose energy can be concentrated in a small area, which is why a certain precision is required for the irradiation point. For example, in a Fig. 2a, for cutting out a specific shape 17a from a workpiece 16, it is necessary to guide the laser light 19 from the processing head 14 along the contour of the shape 17a. Fig. In the welding process exemplified in Figure 2b, the workpiece 16 is a combined object consisting of multiple components 16a and 16b, and it is necessary to precisely guide the irradiation of the laser light 19 from the processing head 17 along a specific shape (joint region) 17b, generally appearing as a line. Thus, the laser processing machine according to the present disclosure is designed not to simply radiate laser light to the entire workpiece, but to guide the laser light along a specific shape with a specific precision.

[0017] The flying body 12 is a hovering (stationary flight) flying body, such as a multicopter, which, in addition to the processing head 14, may include a plurality of rotor blades 24 such as propellers, motors 26 that rotate these propellers, a battery 28 that supplies power to the motors, a flight controller 30 that receives commands from the ground (a wireless transmitter installed thereon) and controls the flight of the flying body 12, a fuselage (frame) 32 that connects and supports these elements, and the like. A detailed explanation of those elements thereof, for which conventional elements are sufficient, will be omitted. However, these elements are merely examples, and as long as the flying body 12 is equipped with a processing head and can move (fly) to a specific location, any elements may be used.Furthermore, the missile 12 preferably has a hovering function, but this is also not absolutely necessary. The missile 12 of the example shown is designed as a remotely controlled unmanned aerial vehicle, but this is not limited to this, and it is also possible to install a control unit (not shown) such as a processor or the like in the missile 12.

[0018] In the example shown, the laser oscillator 22 is not formed in the missile 12, but at a specific position such as on the ground or the like in a factory, and is connected to the machining head 14 via an optical fiber 34. However, if the laser oscillator 22 is relatively small or the weight that the missile 12 can bear is relatively large, it is also possible to install the laser oscillator 22 in the missile 12, in which case the laser oscillator 22 is connected to a power source (not shown) formed on the ground or the like via a power cable or the like. Since a power cable generally has greater flexibility than an optical fiber, by installing the laser oscillator 22 in the missile 12, it is possible to increase the mobility range of the missile 12.

[0019] Or, if the power source (such as the battery 28) that supplies power to the laser oscillator 22 is small in size, the power source can also be installed in the missile 12. In this case, since it is not necessary to connect a cable or the like from the ground to the missile 12 when the missile 12 is wirelessly controlled or a control unit is installed in the missile 12, the mobility range of the missile 12 can be greatly increased.

[0020] A technique in which a missile is connected to a laser oscillator installed in a vehicle or the like and a laser is irradiated at a distant, stationary target object outside of a visual range is known, but a technique that uses a missile for laser processing of components on a production line or the like in a factory is not known. Fig. 1, the laser processing machine shown in FIG. 1 uses the position / attitude detection unit 18 installed in the flying body 12, detects the position and attitude of the processing head 14 with respect to the workpiece 16, and changes the irradiation direction of the laser light 19 so that the laser light 19 is irradiated to a specific location on the workpiece 16. This allows machining with the same precision as laser machining conventionally performed using a machining head mounted on a robot. Since the position of the processing head 14 can be sequentially measured and corrected (with an appropriate control period) by the position / attitude detection unit 18, laser machining maintaining a certain precision is possible even when one or both of the workpiece 16 and the flying body 12 are moving.Furthermore, laser processing while maintaining a certain level of precision is possible even when the actual position and orientation of the workpiece 16 deviates from a predetermined position and orientation. Furthermore, since a missile 12 can also penetrate complicated areas that cannot be reached by a robot or the like, laser processing of the workpiece 16 can be performed from various angles.

[0021] Most conventional laser processing machines offered for component manufacturing or machining drive the processing head or workpiece with a servo motor. More specifically, an orthogonal-axis machine tool, a robot, a positioner, or the like are used. Since it is not rational to make such a processing machine unnecessarily large or complicated, the movement range and position of the processing head relative to the workpiece are limited to a range pre-designed according to the dimensions or shape of the workpiece. Therefore, when the dimensions or shape of a workpiece differ to the extent that they exceed this pre-designed range, it is necessary to specifically design and prepare a different laser processing machine.In contrast, since the laser processing machine 10 according to the present disclosure allows laser irradiation of the workpiece from any position in any attitude, workpieces having various dimensions / shapes can be processed with one system (one laser processing machine).Since in mechanical machining (grinding, cutting, or the like), a machining reaction force acts in an amount corresponding to the tool or the like, when a grinding tool or the like is mounted on a missile and machining is performed, there is a risk that a positional shift of the missile due to the machining reaction force will occur and the machining accuracy will deteriorate. However, since in laser machining, almost no machining reaction force acts on the machining head, even when the machining head is mounted on a missile, the positional shift or the like of the machining head due to the machining reaction force will not occur, so that high-precision laser machining can be performed.

[0022] Fig. 3 is a view showing a concrete structural example of the laser processing machine 10. An ideal concrete example of the position / attitude detection unit 18 includes a pickup device (for example, a 2D or 3D camera) mounted on the missile 12, and an image processing device 36 that receives the measurement data (image data) from the camera 18 wirelessly or the like and processes the image obtained by the camera 18. The image processing result of the image processing device 36 is sent to a main control device 38 that controls the flight of the missile 12.The main control device 38 determines the position and attitude of the machining head 14 relative to the workpiece 16 based on the image processing result. Based on the determined position and attitude and a specific machining program, the main control device 38 controls the flight (position and attitude) of the flying object 12. It sends data related to the position and attitude of the machining head 14 to a scanner control device 40. The scanner control device 40 controls the irradiation position changing unit 20 based on the sent data and appropriately changes the laser irradiation direction. By detecting the position and attitude using the camera and the image processing device, it is possible to change / correct the position and attitude of the machining head with higher precision and responsiveness than using GPS or a gyro sensor.

[0023] Fig. 4a and Fig. 4b show examples of measuring / correcting by the position / position detection unit 18 when performing a measurement as shown in Fig. 2a. The position / attitude detection unit 18 can detect the relative position and attitude of the machining head 14 with respect to the workpiece 16 by picking up the workpiece 16 with a certain accuracy. The main control device 38 or the scanner control device 40 corrects the irradiation position of the laser light 19 using the information obtained by the detection, thereby performing component machining in which the laser light is guided while maintaining a certain precision. Fig. 4a and Fig. 4b, the position and orientation of the machining head 14 with respect to the workpiece 16 differ, but by performing a measurement / correction by the position / position detection unit (camera) 18, it is possible in both cases to emit laser light with a certain precision to a specific location 17a of the workpiece 16.

[0024] Furthermore, based on the machining program, the main control device 38 may send a command regarding laser irradiation to a laser control device 42 that controls the laser oscillator 22. Specifically, the command from the main control device 38 to the laser control device 42 may include the power, frequency, and duty cycle representing laser irradiation conditions. Alternatively, various irradiation conditions may be stored in advance in a memory or the like in the laser control device 42, and the command from the main control device 38 may include an instruction regarding which irradiation conditions should be used in the memory and an instruction regarding the timing of the start and end of irradiation.

[0025] The laser oscillator 22 in the present embodiment is a laser light source that supplies laser light to the processing head 14. The type of laser oscillated by the laser oscillator 22 may be, for example, a fiber laser, a CO2 laser, a YAG laser, or the like, but other types of lasers may also be used. By transmitting and receiving commands with an appropriate control period in the above-mentioned control devices, laser processing can be performed with sufficient precision for practical use. Fig. In Figure 2, the image processing device 36, the main control device 38, the scanner control device 40, and the laser control device 42 are each shown as separate computational processing devices (processors) or the like, but some of them may be combined to form a single device. For example, the (function of) the scanner control device 40 may also be incorporated into the main control device 38. Or, it is also possible to install at least one of these control devices in the missile 12.

[0026] Fig. 5 is a view showing an example in which the machining head 14 is a laser scanner having a galvano scanner as the irradiation position changing unit 20. Specifically, a galvano mechanism 44 that can change the radiation direction of the laser light to any direction is incorporated into the machining head 14 as a mechanism that can change the laser irradiation position. The galvano mechanism 44 includes at least one group (two groups in the illustrated example) of a galvano motor 46 and a mirror 48. More specifically, a mirror 48 that reflects the laser light is attached to the front end portion of each galvano motor 46, and the radiation angle of the laser light irradiated from the laser oscillator can be arbitrarily changed by adjusting the rotation angle of the galvano motor 46.As shown by way of example, the laser irradiation position in a plane can be arbitrarily regulated by using two groups of galvanomotors 46 and mirrors 48.

[0027] Since the electroplating mechanism is driven by voltage control, operation with extremely high responsiveness is possible. Therefore, the laser radiation direction can be quickly changed without changing the position of the flying body 12 or the orientation of the machining head 14, and laser processing such as contour machining can also be performed with high precision. However, the irradiation direction changing unit is not limited to a electroplating mechanism; for example, a resonant scanner or a lens mechanism can also be used, which arbitrarily changes the focal length of the laser light. It is also possible to form additional axes on the machining head 14 and change one or both of the irradiation position and the irradiation direction by changing one or both of the position and attitude of the machining head 14.

[0028] Fig. 6 shows a configuration example in which scanning and changing the irradiation position of the laser light is enabled by additional axes. The missile 12 has first additional axes 51 movably mounted relative to the fuselage (frame) 32 in a first direction 49, and a second additional axis 55 movably mounted relative to the first additional axes 51 in a second direction different from the first direction 49 (preferably orthogonal to the first direction 49). The processing head 14 is mounted on the second additional axis 55.In this way, the machining head 14 is made movable within a certain range with respect to the fuselage of the missile using at least one additional axis (and preferably two or more of them), thereby enabling scanning of the laser machining position for component machining and correction based on information from the position / attitude detection unit.

[0029] Fig. 7a and Fig. 7b are views for explaining an attitude change mechanism that changes the attitude of the processing head 14 with respect to the body (the frame 32 and the like) of the aircraft 12. When the processing head 14 is a laser scanner and has an additional axis, the laser irradiation direction can be changed within a certain range even without changing the position and attitude of the aircraft 12. However, when the laser irradiation direction is to be changed to a large extent (for example, changing the vertical component of the irradiation direction from downward to upward), it is difficult to achieve this within the movement range of the scanner. This is because, when the aircraft 12 is a multicopter, for example, the aircraft 12 cannot be maintained in a vertically inverted attitude.

[0030] Now, for example, as in Fig. 7a, a drive mechanism 52, which can rotate the machining head 14 with respect to the body 32 about an approximately horizontally directed axis line 50, can be designed as a position change mechanism. For example, as shown in Fig. As shown in Figure 7b, the laser irradiation direction 54 can be changed by rotating the machining head 14 by 90° or more around the axis line 50 using the attitude changing mechanism 52 so that its vertical component is changed from downward to upward. For example, the laser irradiation direction can be completely reversed upon rotation of 180 degrees. By using such an attitude changing mechanism 52, the laser irradiation direction can be set to various directions even without changing the attitude of the flying body 14, thereby greatly increasing the degree of freedom in laser processing.

[0031] Fig. Figure 8 shows an example of how the flying object 12 can perform machining operations on a complicated area at different angles. When using a universal machine tool or a robot, it is difficult to penetrate deep into the interior of a workpiece and perform machining, and in fact, it is necessary to specifically design or adjust the length of the arm or the angle at which the machining head is held depending on the work content. However, in the example of Fig. 8, even when the workpiece 16 has a complex shape, by forming an opening portion 62 that allows the missile 12 to penetrate inside, the missile 12 can approach a specific processing location 64 and perform a desired laser processing by appropriately changing the laser irradiation direction 54 of the processing head 14 using the irradiation position changing unit or the attitude changing mechanism described above. Consequently, by using the missile 12, prior design or setup of the processing machine becomes unnecessary.

[0032] Fig.9 is a view showing an example in which a fiber switch (beam switch) is formed when a plurality of missiles and a laser oscillator are connected by optical fibers. For example, when laser light is supplied from a laser oscillator 22 to two missiles 12a and 12b using optical fibers 34, by forming a fiber switch 56 on the optical fibers 34, a machining system with even higher operating efficiency can be constructed, or a machining system that can accommodate even wider machining processes can be constructed.

[0033] For example, if the fiber switch 56 is of such a type that the laser light from the laser oscillator 22 is time-shared to only one flying body (so-called time-sharing), the flying body 12b can move (fly) to a position where a next laser processing is performed during laser processing using the flying body 12a and be kept in a waiting state there, so that the processing by the waiting flying body 12b can be started immediately after the completion of the processing by the flying body 12a, whereby the entire cycle time can be shortened.

[0034] Or if the fiber switch 56 is of such a type that the laser light from the laser oscillator 22 is supplied to both missiles in a specific ratio (the so-called power sharing), in addition to simultaneous performance of separate laser processing by the two missiles, it is also possible to irradiate a workpiece with a laser from different directions by the two missiles simultaneously, so that in addition to shortening the cycle time, laser processing that cannot be performed with one processing head, such as simultaneous laser irradiation of both surfaces of a workpiece or the like, becomes possible.

[0035] The fiber switch 56 of the illustrated example is provided with one input terminal connected to the laser oscillator 22 and two output terminals 60a and 60b connected to the missiles 12a and 12b, respectively, but it is of course also possible to use a fiber switch provided with three or more output terminals so that three or more missiles can be operated simultaneously.

[0036] By this form of the present disclosure, a laser processing machine can be provided which can perform processing in which a laser beam is scanned with a certain precision by a laser emitted from a missile, and in which the restrictions on the dimensions and shape of the processed object are less than in a conventional laser processing machine.

Claims

[1] Laser processing machine, comprising: a flying body (12) which can move in a suspended state in a space; a processing head (14) mounted on the missile (12) and configured to emit laser light; a position / location detection unit (18) which detects the position and location of the machining head (14) with respect to a machining object (16); an irradiation position changing unit (20) that can change the irradiation position of the laser light emitted from the processing head (14) based on the position and attitude of the processing head (14) detected by the position / attitude detection unit (18); and a laser oscillator (22) which supplies the laser light to the processing head (14), wherein the processing head has a laser scanner (14) which is adapted to change an emission direction of the laser beam from the processing head. [2] Laser processing machine (10) according to claim 1, wherein the position / attitude detection unit (18) comprises a recording device (18) arranged on the missile (12), and an image processing device (36) which processes the image obtained from the recording device (18). [3] Laser processing machine according to claim 1, wherein the laser scanner (14) comprises a galvanomechanism (44) provided with a plurality of mirrors. [4] Laser processing machine according to claim 1 or 2, wherein the irradiation position changing unit (20) has at least one additional axis (51, 55) attached to the processing head (14). [5] Laser processing machine according to one of claims 1 to 4, comprising a position changing mechanism (52) which changes the position of the processing head (14) with respect to a fuselage of the missile (12). [6] Laser processing machine according to one of claims 1 to 5, wherein the laser oscillator (22) is connected to the processing head (14) by an optical fiber (34). [7] Laser processing machine according to claim 6, comprising a plurality of missiles (12), wherein a fiber switch (56) is connected to the optical fiber (34). [8] Laser processing machine according to one of claims 1 to 5, wherein the laser oscillator (22) is arranged in the flying body (12). [9] Laser processing machine according to claim 8, wherein a power source (28) which supplies power to the laser oscillator (22) is arranged in the flying body (12).

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