DEVICE AND METHOD FOR DETECTING ION TRANSIT

Abstract

Device for detecting ion migration with: a first printed circuit board (PCB) pad (10) coupled to a ground (GND); a second PCB pad (20) which is located at a position spaced apart from the first PCB pad (10); a power supply unit (30) which is intended to supply power to the second PCB pad (20); a voltage detection unit (40) designed to detect a voltage at an output terminal of the first PCB pad (10); and a control unit (50) designed to determine whether an ion migration has occurred between the first PCB pad (10) and the second PCB pad (20), using the voltage detected by the voltage detection unit (40), characterized by a current disconnect unit (60) designed to interrupt the power supply to an electronic control unit (ECU) or actuator when the control unit (50) detects that ion migration has occurred between the first PCB pad (10) and the second PCB pad (20).

Description

CROSS-REFERENCES TO RELATED APPLICATIONS BACKGROUND OF THE INVENTION

[0001] The present invention relates to an apparatus and method for detecting ion migration, and more particularly, to an apparatus and method for detecting ion migration occurring between printed circuit board (PCB) pads based on a voltage change of a PCB pad due to byproducts generated by the ion migration.

[0002] Due to the increasing digitalization of vehicles, there is a trend towards an increase in the number of electronic control units (ECUs) installed in a vehicle.

[0003] An ECU includes an electronic circuit, a microcontroller (MCU), a sensor interface, a communication module, etc.

[0004] Because a vehicle equipped with many electronic components operates in various environments, including harsh conditions, fluid such as water or brake oil can be drawn into the ECU.

[0005] As such, when a PCB or ECU is exposed to different types of fluids during operation, ion migration can occur between sections within the ECU that have a relatively high voltage difference between them and are spaced relatively close together. Consequently, over time, a problem such as a short circuit or fire can occur within the ECU.

[0006] To solve the above problem, conventional research has been conducted on forming a film, a cured film, or the like to attenuate ion migration. Such research focuses on the technology of attenuating ion migration, but lacks the technology for rapidly and accurately detecting ion migration in an ECU.

[0007] The prior art of the present invention is disclosed in Korean Unexamined Patent Application 10-2016-7034451, published as KR 10 2017 033 813 A on March 27, 2017, entitled "Resin Composition for Forming a Cured Film, Cured Film, Conductive Member, and Migration Preventing Method." US 2015 / 0 097 185 A1 discloses an ion migration detection device having the features of the preamble of claim 1. OVERVIEW OF THE INVENTION

[0008] Embodiments of the present invention relate to an apparatus and method for detecting ion migration occurring between printed circuit board (PCB) pads based on a voltage change of a PCB pad due to the byproducts generated by the ion migration.

[0009] In one embodiment, an apparatus for detecting ion migration may include: a first printed circuit board (PCB) pad coupled to a ground; a second PCB pad disposed at a position spaced from the first PCB pad; a power supply unit configured to supply power to the second PCB pad; a voltage detection unit configured to detect a voltage of an output terminal of the first PCB pad; and a control unit configured to determine whether ion migration has occurred between the first PCB pad and the second PCB pad using the voltage detected by the voltage detection unit.

[0010] The control unit can determine whether ion migration has occurred depending on whether the voltage detected by the voltage detection unit is a predetermined value or greater than this.

[0011] The control unit can determine whether ion migration has occurred depending on whether there are a plurality of regions in which the voltage detected by the voltage detection unit is outside a predetermined range.

[0012] An end face of the first PCB pad and an end face of the second PCB pad may have a sawtooth shape.

[0013] An end face of the first PCB pad and an end face of the second PCB pad may each have a shape with alternating elevations and depressions.

[0014] An end face of the first PCB pad and an end face of the second PCB pad may each have a wavy shape.

[0015] The device may further comprise a warning unit provided for warning of PCB contamination when the control unit detects that ion migration has occurred between the first PCB pad and the second PCB pad.

[0016] According to the invention, the device further comprises a power disconnection unit which is used to interrupt a power supply of an electronic control unit (ECU) or an actuator when the control unit detects that ion migration has occurred between the first PCB pad and the second PCB pad.

[0017] In another embodiment, a method for detecting ion migration may include: detecting, by a voltage detection unit, a voltage of an output terminal of a first printed circuit board (PCB) pad positioned at a position spaced from a second PCB pad; and determining, by a control unit, whether ion migration has occurred between the first PCB pad and the second PCB pad using the voltage detected by the voltage detection unit.

[0018] When determining whether ion migration has occurred, the control unit can determine whether ion migration has occurred depending on whether the voltage detected by the voltage detection unit is a predetermined value or greater.

[0019] When determining whether ion migration has occurred, the control unit may determine whether ion migration has occurred depending on whether there are a plurality of regions in which the voltage detected by the voltage detection unit is outside a predetermined range.

[0020] An end face of the first PCB pad and an end face of the second PCB pad may each have a sawtooth shape.

[0021] An end face of the first PCB pad and an end face of the second PCB pad may each have a shape with alternating elevations and depressions.

[0022] An end face of the first PCB pad and an end face of the second PCB pad may each have a wavy shape.

[0023] The method may further comprise warning of PCB contamination by a warning unit when the control unit detects that ion migration has occurred between the first PCB pad and the second PCB pad.

[0024] According to the invention, the method further comprises interrupting a power supply of an electronic control unit (ECU) or an actuator by a power isolating unit when the control unit detects that ion migration has occurred between the first PCB pad and the second PCB pad.

[0025] An apparatus and method for detecting ion migration according to an embodiment of the invention can detect ion migration occurring between two PCB pads based on a voltage change of the PCB pads due to byproducts generated by the ion migration.

[0026] An ion migration detection apparatus and method according to an embodiment of the present invention can quickly and accurately detect ion migration and warn an occupant in a vehicle of a malfunction of an electronic control unit and cut off the power supply of an ECU upon detection of ion migration, thereby fundamentally preventing the occurrence of a fire due to a short circuit in the ECU. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 shows a block diagram illustrating an apparatus for detecting ion migration according to an embodiment of the invention. Fig. 2 is a diagram showing an example of an ion migration generating unit according to an embodiment of the present invention. Fig. 3 is a diagram showing another example of the ion migration generating unit according to an embodiment of the present invention. Fig. 4 is a diagram showing another example of the ion migration generating unit according to an embodiment of the present invention. Fig. 5 is a diagram showing an example of a method for detecting ion migration according to an embodiment of the present invention. Fig. 6 is a diagram showing another example of the method for detecting ion migration according to an embodiment of the present invention. DESCRIPTION OF SPECIFIC EMBODIMENTS

[0027] As is common in the relevant art, some exemplary embodiments may be depicted in the drawings as functional blocks, units, and / or modules. Those skilled in the art will understand that these blocks, units, and / or modules are physically implemented by electronic (or optical) circuits such as logic circuits, discrete components, processors, wired circuits, memory elements, wire connections, and the like. When the blocks, units, and / or modules are implemented by processors or similar hardware, they may be programmed and controlled by software (e.g., code) to perform various functions discussed herein. Alternatively, each block, unit, and / or module may be implemented by dedicated hardware or as a combination of dedicated hardware for performing some functions and a processor (e.g.,one or more programmed processors and associated circuitry) to perform other functions. Each block, unit, and / or module of some exemplary embodiments may be physically separated into two or more interacting discrete blocks, units, and / or modules without departing from the scope of the inventive concept. Furthermore, blocks, units, and / or modules of some exemplary embodiments may be physically combined into more complex blocks, units, and / or modules without departing from the scope of the inventive concept.

[0028] An apparatus and method for detecting ion migration according to an embodiment of the present invention will be described in more detail below with reference to the accompanying drawings. It should be noted that the drawings are not necessarily to scale and may differ from the actual illustration in terms of line thickness or component sizes for the sake of clarity and simplicity of description. Furthermore, the terms used herein are defined with respect to functions of the invention and may vary depending on the purposes or practices of a user or operator. Therefore, these terms should be defined based on the present overall disclosure.

[0029] Fig. 1 shows a block diagram illustrating an apparatus for detecting ion migration according to an embodiment of the invention, Fig. Fig. 2 is a diagram showing an example of an ion migration generating unit according to an embodiment of the present invention, Fig. Fig. 3 is a diagram showing another example of the ion migration generating unit according to an embodiment of the present invention, and Fig. 4 is a diagram showing another example of the ion migration generating unit according to an embodiment of the present invention.

[0030] With reference to Fig. 1, the ion migration detection device according to an embodiment of the invention may comprise: a first (printed circuit board) PCB pad 10, a second PCB pad 20, a power supply unit 30, a voltage detection unit 40, a control unit 50, a power separation unit 60, and a warning unit 70.

[0031] The first PCB pad 10 is a connector mounted on a PCB of an electronic control unit (ECU) and coupled to a ground through a resistor R1. The first PCB pad 10 can be formed on at least one portion of the PCB by pattern printing or plating.

[0032] The second PCB pad 20 is a connector installed on a PCB of the ECU and coupled to the power supply unit 30 through a resistor R2. Here, the second PCB pad 20 may be formed on at least a portion of the PCB by pattern printing or plating.

[0033] Since, as described above, the second PCB pad 20 is coupled to the power supply unit 30, the second PCB pad 20 can be supplied with a preset voltage of the power supply unit 30.

[0034] The second PCB pad 20 may be arranged at a position spaced a predetermined distance d from the first PCB pad 10. The distance between the first PCB pad 10 and the second PCB pad 20 may be set to different values ​​depending on a voltage detected between the first PCB pad 10 and the second PCB pad 20 by ion migration.

[0035] In other words, a plurality of first PCB pads 10 and a plurality of second PCB pads 20 may be arranged on the PCB at positions spaced apart by a predetermined distance d. In particular, the first and second PCB pads 10 and 20 may be evenly distributed on the PCB or arranged in an area with a comparatively high probability of detecting ion migration. This will be described below.

[0036] The voltage detection unit 40 is coupled to an output terminal of the first PCB pad 10 to detect a voltage of the output terminal of the first PCB pad 10.

[0037] When no ion migration is generated between the first PCB pad 10 and the second PCB pad 20, the voltage detection unit 40 can detect a voltage of 0 V. However, when ion migration occurs between the first PCB pad 10 and the second PCB pad 20 due to fluids present in the ECU, such as brake oil or water entering the ECU, insulation failure occurs between the first PCB pad 10 and the second PCB pad 20 due to byproducts generated by the ion migration. As a result, a short circuit occurs between the first PCB pad 10 and the second PCB pad 20, causing a leakage current between them.

[0038] Due to such a leakage current between the first PCB pad 10 and the second PCB pad 20, the voltage detection unit 40 can detect a higher voltage between the first PCB pad 10 and the second PCB pad 20 than before the short circuit occurred.

[0039] Brake oil and water are typically major contaminants in brake components. When two types of fluids meet and are present on the PCB, as the amount of water in the brake oil and the temperature in the ECU increase, resistance is reduced, increasing the risk of malfunction. Due to circuit characteristics of ion migration, short circuits are essentially repeatedly caused or interrupted. Therefore, the occurrence of ion migration can be determined when a relatively high voltage is detected or when the detection of such a voltage is repeated a predetermined number of times or more within a predetermined time. Furthermore, when the voltage in a circuit changes repeatedly a predetermined number of times or more, only a heavily contaminated component can be replaced with a new one instead of the entire device. This can reduce maintenance costs.

[0040] For example, if a leakage current is generated between a positive power supply (B+) terminal of the first PCB pad 10 and a ground (GND) terminal of the second PCB pad 20, a voltage measured by the voltage detection unit 40 rises to or above a predetermined value. In this case, it is impossible to ensure normal operation of a product due to excessive contamination of the ECU.

[0041] Here, the predetermined value is a voltage, which is a criterion for detecting an occurrence of ion migration between the first PCB pad 10 and the second PCB pad 20 due to a leakage current between the B+ terminal of the first PCB pad 10 and the GND terminal of the second PCB pad 20. The predetermined value can be set in advance to different values ​​depending on thicknesses, intervals, etc. of the PCB patterns.

[0042] Furthermore, if a leakage current occurs between circuit component lead pins or circuit component bodies in the ECU, a plurality of regions may be generated where the voltage detected by the voltage detection unit 40 is outside a predetermined range. In this case, the circuit function of the ECU may be lost.

[0043] Here, the predetermined range is a voltage range, which is a criterion for determining the occurrence of ion migration between the first PCB pad 10 and the second PCB pad 20 due to a leakage current between the circuit component lead pins or the circuit component bodies in the ECU. The predetermined range is previously set to different values ​​depending on the distances, etc., between the circuit component lead pins or the circuit component bodies in the ECU, which are formed from PCB patterns.

[0044] If ion migration is detected between the first PCB pad 10 and the second PCB pad 20, the warning unit 70 warns of PCB contamination due to the ion migration. The warning unit 70 can warn of PCB contamination in various ways, using an image, a warning light, or a sound. An instrument or the like of a vehicle can be used as the warning unit 70.

[0045] When it is determined that ion migration has occurred between the first PCB pad 10 and the second PCB pad 20, the power cut-off unit 60 may cut off the power supplied from the power supply unit 30 to the ECU, other actuator, or the like.

[0046] In this case, even when a control signal is input from the control unit 50, the power cut-off unit 60 may cut off the power supply to the ECU immediately, or cut off the power supply after a predetermined elapsed time or when a current operation of the ECU stops.

[0047] The control unit 50 can detect ion migration occurring between the first PCB pad 10 and the second PCB pad 20 based on a voltage detected by the voltage detection unit 40.

[0048] When ion migration occurs between the first PCB pad 10 and the second PCB pad 20, a short circuit is caused between the first PCB pad 10 and the second PCB pad 20, as described above. Thus, a voltage detected on the output terminal of the first PCB pad 10 is relatively increased.

[0049] Based on this, the control unit 50 determines whether ion migration has occurred between the first PCB pad 10 and the second PCB pad 20, depending on whether the voltage detected by the voltage detection unit 40 is the predetermined value or greater and whether a plurality of regions are detected in which the voltage detected by the voltage detection unit 40 is outside the predetermined range.

[0050] For example, if ion migration occurs between the first PCB pad 10 and the second PCB pad 20 due to fluids present in the ECU, such as brake oil or water entering the ECU, an insulation breakdown occurs between the first PCB pad 10 and the second PCB pad 20 due to byproducts generated by the ion migration. As a result, a short circuit occurs between the first PCB pad 10 and the second PCB pad 20, creating a leakage current between them.

[0051] Such a leakage current may occur between the B+ terminal of the first PCB pad 10 or the GND terminal of the second PCB pad 20, or between circuit component lead pins or circuit component bodies in the ECU.

[0052] The control unit 50 determines whether the voltage detected by the voltage detection unit 40 is the predetermined value or greater than it. If the voltage detected by the voltage detection unit 40 is the predetermined value or greater than it, the control unit 50 determines that ion migration has occurred between the first PCB pad 10 and the second PCB pad 20.

[0053] In addition, the control unit 50 determines whether the voltage detected by the voltage detection unit 40 is outside the predetermined range and whether a plurality of regions have been detected in which the voltage detected by the voltage detection unit 40 is outside the predetermined range. As a result of the determination, if a plurality of regions have been detected in which the voltage detected by the voltage detection unit 40 is outside the predetermined range, the control unit 50 determines that ion migration has occurred between the first PCB pad 10 and the second PCB pad 20.

[0054] When it is determined that ion migration has occurred between the first PCB pad 10 and the second PCB pad 20 based on the voltage detected by the voltage detection unit 40, the control unit 50 interrupts a power supply to the ECU by means of the power cut unit 60 or warns of contamination of the PCB by the warning unit 70, thereby preventing a short circuit, fire, or the like in the ECU and enabling the occupant in the vehicle to recognize the contamination of the PCB or the ECU.

[0055] On the one hand, there is a requirement for rapidly increasing ion migration to increase the possibility of ion migration on the PCB as well as the ion migration detection capability.

[0056] Ion migration occurs due to a potential difference between the first PCB pad 10 and the second PCB pad 20. Thus, to relatively increase the potential difference, the first PCB pad 10 and the second PCB pad 20 may be arranged such that corresponding end surfaces 11 and 21 of the first and second PCB pads 10 and 20 are spaced apart by the predetermined distance d and may be formed in different shapes, so that the surface areas of the end surfaces 11 and 21 can be increased.

[0057] For example, the end face 11 of the first PCB pad 10 and the end face 21 of the second PCB pad 20, as shown in Fig. 2, each have a sawtooth shape, can, as shown in Fig. 3, have a shape with alternating elevations and depressions, and can, as shown in Fig. 4, have a wavy shape.

[0058] Although the present embodiment illustrates the case where the end face 11 of the first PCB pad 10 and the end face 21 of the second PCB pad 20 each have a sawtooth shape, a shape with alternately formed protrusions and depressions, or a wavy shape, the present invention is not limited to this, and the end faces may be changed in various ways depending on an environmental change, a set voltage, the thicknesses or intervals of the PCB patterns, the structure of the PCB, etc.

[0059] The first PCB pad 10 and the second PCB pad 20 may further be evenly distributed on the PCB, so that the possibility of detecting ion migration can be further improved.

[0060] Hereinafter, a method for detecting ion migration according to an embodiment of the invention will be described in detail by reference to Fig. 5 and Fig. 6 described.

[0061] Fig. 5 is a diagram showing an example of the method for detecting ion migration according to an embodiment of the present invention.

[0062] With reference to Fig. 5, the voltage detection unit 40 detects the voltage of the output terminal of the first PCB pad 10 (in step S110).

[0063] The control unit 50 determines whether the voltage detected by the voltage detection unit 40 is the predetermined value or greater (in step S120). The case where the voltage detected by the voltage detection unit 40 is the predetermined value or greater may refer to the case where a leakage current occurs between the B+ terminal of the first PCB pad 10 and the GND terminal of the second PCB pad 20.

[0064] As a result of the determination in step S120, if the voltage detected by the voltage detection unit 40 is less than the predetermined value, the control unit 50 returns the process to step S110. On the other hand, if the voltage detected by the voltage detection unit 40 is the predetermined value or greater, the control unit 50 determines that ion migration has occurred and warns of PCB contamination through the warning unit 70 and controls the power cutoff unit 60 to cut off the power supply to the ECU. Furthermore, the control unit 50 initiates the replacement of a component, such as the ECU (in step S130).

[0065] Fig. 6 is a diagram showing another example of the method for detecting ion migration according to an embodiment of the present invention.

[0066] With reference to Fig.6, the voltage detection unit 40 detects the voltage of the output terminal of the first PCB pad 10 (in step S210).

[0067] The control unit 50 determines whether the voltage detected by the voltage detection unit 40 is outside the predetermined range and determines whether a plurality of regions have been detected where the voltage detected by the voltage detection unit 40 is outside the predetermined range (in step S220). The case where a plurality of regions have been detected where the voltage detected by the voltage detection unit is outside the predetermined range may refer to the case where a leakage current has occurred between the circuit component lead pins and the circuit component bodies in the ECU.

[0068] As a result of the determination in step S220, when a plurality of regions have been detected in which the voltage detected by the voltage detection unit 40 is outside the predetermined range, the control unit 50 determines that ion migration has occurred between the first PCB pad 10 and the second PCB pad 20.

[0069] The control unit 50, which detects that ion migration has occurred, therefore warns of PCB contamination via the warning unit 70 and controls the power cutoff unit 60 to interrupt the power supply to the ECU. Furthermore, the control unit 50 initiates the replacement of a component, e.g., the ECU (in step 230).

[0070] As described above, an apparatus and method for detecting ion migration according to an embodiment of the present invention can detect ion migration occurring between PCB pads based on a voltage change of the PCB pads due to byproducts generated by the ion migration.

[0071] Furthermore, the ion migration detection apparatus and method according to an embodiment of the present invention can quickly and accurately detect ion migration and warn an occupant in a vehicle of a malfunction of an ECU and interrupt the current upon detection of ion migration, thereby fundamentally preventing the occurrence of a fire due to a short circuit in the ECU.

Claims

[1] Device for detecting ion migration with: a first printed circuit board (PCB) pad (10) coupled to a ground (GND); a second PCB pad (20) arranged at a position spaced from the first PCB pad (10); a power supply unit (30) provided for supplying power to the second PCB pad (20); a voltage detection unit (40) provided for detecting a voltage of an output terminal of the first PCB pad (10); and a control unit (50) designed to determine whether ion migration has occurred between the first PCB pad (10) and the second PCB pad (20) using the voltage detected by the voltage detection unit (40), characterized by a power disconnect unit (60) configured to interrupt a power supply to an electronic control unit (ECU) or an actuator when the control unit (50) detects that ion migration has occurred between the first PCB pad (10) and the second PCB pad (20). [2] The device according to claim 1, wherein the control unit determines whether the ion migration has occurred depending on whether the voltage detected by the voltage detection unit (40) is a predetermined value or greater. [3] The apparatus according to claim 1, wherein the control unit determines whether the ion migration has occurred depending on whether there are a plurality of regions in which the voltage detected by the voltage detection unit (40) is outside a predetermined range. [4] The device according to claim 1, wherein an end face (11) of the first PCB pad (10) and an end face (21) of the second PCB pad (20) each have a sawtooth shape. [5] Device according to claim 1, wherein an end face (11) of the first PCB pad (10) and an end face (21) of the second PCB pad (20) each have a shape with alternately formed elevations and depressions. [6] The device according to claim 1, wherein an end face (11) of the first PCB pad (10) and an end face (21) of the second PCB pad (20) each have a wavy shape. [7] The apparatus of claim 1, further comprising a warning unit (70) configured to warn of PCB contamination when the control unit (50) detects that ion migration has occurred between the first PCB pad (10) and the second PCB pad (20). [8] Method for detecting ion migration with the following steps: Detecting, by means of a voltage detection unit (40), a voltage of an output terminal of a first printed circuit board (PCB) pad (10) arranged at a position spaced from a second PCB pad (20); and Determining, by means of a control unit (50), whether ion migration has occurred between the first PCB pad (10) and the second PCB pad (20) using the voltage used by the voltage detection unit (40), characterized by interrupting, by a power isolating unit (60), a power supply of an electronic control unit (ECU) or an actuator when the control unit (50) detects that ion migration has occurred between the first PCB pad (10) and the second PCB pad (20). [9] The method according to claim 8, wherein, in determining whether ion migration has occurred, the control unit (50) determines whether ion migration has occurred depending on whether the voltage detected by the voltage detection unit (40) is a predetermined value or greater. [10] The method according to claim 8, wherein, in determining whether the ion migration has occurred, the control unit (50) determines whether the ion migration has occurred depending on whether there are a plurality of regions in which the voltage detected by the voltage detection unit (40) is outside a predetermined range. [11] The method according to claim 8, wherein an end face (11) of the first PCB pad (10) and an end face (21) of the second PCB pad (20) each have a sawtooth shape. [12] The method according to claim 8, wherein an end face (11) of the first PCB pad (10) and an end face (21) of the second PCB pad (20) each have a shape with alternating elevations and depressions. [13] The method according to claim 8, wherein an end face (11) of the first PCB pad (10) and an end face (21) of the second PCB pad (20) each have a wavy shape. [14] The method of claim 8, further comprising warning of PCB contamination by a warning unit (70) when the control unit (50) determines that ion migration has occurred between the first PCB pad (10) and the second PCB pad (20).

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