Soldering positioning device

Abstract

Solder positioning device (1, 1A, 1B, 1C, 1D, 1E, 1F) which is to be placed on an insulating substrate (11) during a soldering process of an electronic component (15) which is arranged such that it bridges a plurality of circuit patterns (14a, 14b, 14c, 14d, 14e) which is formed on the insulating substrate (11), wherein the solder positioning device (1, 1A, 1B, 1C, 1D, 1E, 1F) comprises • a plate-like element (2) which is to be placed on the insulating substrate (11) in a state in which it is brought into contact with an upper surface of the plurality of circuit patterns (14a, 14b, 14c, 14d, 14e), wherein • the plate-like element (2) comprises ◯ an opening section (4) which is formed on the plate-like element (2) to allow the electronic component (15) to be exposed, and ◯ a pair of projecting sections (5, 8a) formed on an outer edge section of the opening section (4) on the plate-like element (2) and projecting towards one side of the insulating substrate (11) in such a way that it can be inserted into a groove (16) formed between the plurality of circuit patterns (14a, 14b, 14c, 14d, 14e) on the insulating substrate (11).

Description

Background of the invention; Field of the invention

[0001] The present invention relates to a soldering positioning device. Description of the state of the art

[0002] In the assembly of a power module, a solder material is generally used as the connecting material for an electronic component, such as a chip resistor and a capacitor, arranged to bridge multiple circuit patterns formed on an insulating substrate. In the related prior art, a paste solder was used as the solder material, obtained by kneading a flux and a spherical solder. In this case, a paste solder is applied to a portion of a circuit pattern by printing, and subsequently, an electronic component is mounted and a reflow process is performed. A cleaning process is then carried out to remove the flux.

[0003] In recent years, a soldering process using plate solder instead of paste solder has become widespread. Since this soldering process does not use flux, there is no longer a need for a cleaning process, and manufacturing costs can be reduced accordingly.

[0004] However, switching from paste solder to solderboard degrades the holding function of the electronic component, necessitating a solder positioning device to align the component during soldering. The solder positioning device is positioned according to a circuit diagram or the outer shape of a baseboard. Consequently, manufacturing tolerances in the circuit diagram or the baseboard's shape can cause the electronic component to shift and tilt. This can lead to an incomplete connection between the electronic component and the circuit diagram. To address this issue, it is advisable to position the device close to the circuit diagram on which the electronic component is to be mounted.

[0005] For example, Japanese patent application JP S62-250 687 A discloses a method for mounting a small electronic component. The method includes a mounting device with a frame for attaching the component to a circuit substrate and a recessed section for securing the small electronic component. The mounting device secures the small electronic component, preventing any displacement between a terminal of the small electronic component and an electrode on the substrate during soldering.

[0006] Furthermore, for example, Japanese patent application JP 2009-231 379 A discloses a structure comprising a recessed section in a substrate. The recessed section serves as a positioning section, which positions a positioning device and allows for the insertion of a lower section of the positioning device.

[0007] However, in the technology described in Japanese patent application JP S62-250 687 A, the position of the mounting device shifts if there is a deviation in the dimensions of the circuit substrate due to a manufacturing tolerance of the circuit substrate. Therefore, a problem arose in that the degree of positional tolerance of the electronic component is increased.

[0008] In the technology described in Japanese patent application JP 2009-231 379 A, ​​positioning is performed at multiple positions from one end section to another of the substrate. Consequently, a distance to the positioning device is required to account for the thermal expansion of the substrate during soldering. This presents a problem: the degree of positional tolerance of the electronic component is increased.

[0009] JP 2002-361 410 A relates to a reflow soldering device configured to prevent component damage. This device positions components on a heat sink plate during reflow soldering. When the heat sink plate shrinks and cools after reflow soldering, a fixture is formed that prevents damage to the components through shrinkage between the components and the fixture. The device is used for reflow soldering at least two plate-shaped components on a heat sink plate by creating a gap between them. The device consists of first fixtures that hold the heat sink plate in a fixed position and second frame fixtures that hold the individual components in fixed positions.The first and second devices are positioned in fixed positions, and the second frame devices can be moved from these positions towards a partition wall.

[0010] CN 1 03 000 559 A shows a positioning clamp for a semiconductor chip. The positioning clamp prevents molten solder spray, which is produced during a vacuum welding process, from splashing out and from contamination or damage to the semiconductor chip by the spray. The positioning clamp is used when the semiconductor chip is welded onto a metal sheet on an insulated circuit substrate. It has a through-hole to receive the semiconductor chip. At the lower end of the through-hole is a recess that faces the semiconductor chip.

[0011] CN 1 05 578 794 A describes a positioning tool for an electronic component. The positioning tool consists of a carrier plate and an alignment plate. The carrier plate has several positioning grooves machined into its upper surface to accommodate all electronic components. The alignment plate is movably mounted on the carrier plate and has several positioning holes that correspond to the positioning grooves. Once the electronic components are placed in the positioning grooves of the carrier plate, they protrude from the upper surface of the alignment plate. When solder paste is printed onto the electronic components, the alignment plate is moved, causing all electronic components to move in the same direction and be positioned in the positioning grooves. The solder paste is then printed.This allows the electronic elements to be positioned evenly, thereby reducing random deflections of the electronic elements during solder paste printing.

[0012] DE 696 25 127 T2 relates to methods for attaching an electronic component to a wiring substrate. The method comprises the following steps: forcibly inserting the main body of an electronic component from below into an opening in an insulating film, wherein the electronic component has terminals extending from the ends of a lower surface of the same, the insulating film is made of an elastic material, and the opening is slightly smaller than the outer configuration of the main body of the electronic component; placing the electronic component, held by the insulating film, on an insulating substrate; bringing the terminals of the electronic component into contact with a conductor pattern formed on the insulating substrate; and joining the insulating film and the insulating substrate by locally soldering an area.surrounding the terminals of the electronic component, or connected by local fusion and welding at predetermined welding sections provided in the vicinity of the terminals, thereby attaching the electronic component to the insulating substrate, wherein the opening of the insulating film comprises a plurality of flexible sections provided along its edge, the flexible sections being separated from one another by recesses at the edge or by slots, and the flexible sections being bent when the main body of the electronic component is inserted into the opening.

[0013] JP 2009-076 592 A discloses a method in which an electrode of a semiconductor device and a heat spreader can be crimped uniformly and at the same time damage to the semiconductor device can be prevented without the use of spacers and holes when several semiconductor devices are clamped by an upper and a lower electrode and one electrode of the upper and one of the lower electrodes is crimped to the heat spreader.In a method for crimping an electrode of semiconductor devices and a heat spreader, in which several semiconductor devices are clamped by an upper electrode and a lower electrode, and an electrode of the upper electrode and the lower electrode is crimped to the heat spreader, an auxiliary crimping device is inserted between the several semiconductor devices, and a crimping device is present which engages with the edges of an electrode and the auxiliary crimping device while gaps between the several semiconductor devices and the other electrode are formed and surrounded, and an electrode is crimped to the heat spreader by sliding the crimping device. Summary

[0014] The present invention has an objective of providing a solder positioning device that can reduce the extent of a positional tolerance of an electronic component even when there is a deviation in the dimensions of an insulating substrate due to a manufacturing tolerance of the insulating substrate.

[0015] The problem underlying the invention is solved according to the invention in a soldering positioning device by the features of claim 1. Advantageous further developments are the subject of the respective dependent claims.

[0016] A soldering positioning device according to the present invention is placed on an insulating substrate during a soldering process of an electronic component, which is arranged to bridge between a plurality of circuit patterns formed on the insulating substrate. The soldering positioning device comprises a plate-like element which is placed on the insulating substrate in a state in which it is brought into contact with an upper surface of the plurality of circuit patterns. The plate-like element comprises an opening section and a pair of projecting sections. The opening section is formed on the plate-like element to allow the electronic component to be exposed.The pair of protruding sections, which is formed on an outer edge section of the opening section on the plate-like element, projects in such a way towards the side of the insulating substrate that it can be inserted into a groove which is formed between the majority of circuit patterns on the insulating substrate.

[0017] The extent of a positional tolerance of an electronic component can be reduced even if there is a deviation in the dimensions of an insulating substrate due to a manufacturing tolerance of the insulating substrate.

[0018] These and other tasks, features, aspects and advantages of the present invention will become clearer with reference to the following detailed description of the present invention in conjunction with the accompanying figures. Brief description of the characters Fig. Figure 1 is a perspective view of the back side of a solder positioning device according to a first embodiment. Fig. Figure 2 is a cross-sectional diagram illustrating a state in which the solder positioning device is placed on an insulating substrate. Fig. Figure 3 is a cross-sectional diagram illustrating a state in which the solder positioning device is placed on the insulating substrate. Fig. Figure 4 is a perspective view illustrating a state in which an electronic component is mounted on the insulating substrate. Fig. Figure 5 is a cross-sectional diagram illustrating a state in which a solder positioning device according to a second embodiment is placed on the insulating substrate. Fig. Figure 6 is a cross-sectional diagram illustrating a state in which a solder positioning device according to a third embodiment is placed on the insulating substrate. Fig. Figure 7 is a cross-sectional diagram illustrating a state in which a solder positioning device according to a fourth embodiment is placed on the insulating substrate. Fig. Figure 8 is a cross-sectional diagram illustrating a state in which a solder positioning device according to a modification of the fourth embodiment is placed on the insulating substrate. Fig. Figure 9 is a cross-sectional diagram illustrating a state in which a solder positioning device according to a fifth embodiment is placed on the insulating substrate. Fig. Figure 10 is a cross-sectional diagram illustrating a soldering positioning device according to a sixth embodiment. Fig. Figure 11 is a cross-sectional diagram illustrating a state in which a conventional solder positioning device, which does not have the protruding sections, is placed on the insulating substrate. Description of preferred embodiments<Erste Ausführungsform>

[0019] A first embodiment of the present invention is described below with reference to the figures. Fig. Figure 1 is a perspective view of the back side of a solder positioning device 1 according to the first embodiment. Fig. Figure 2 is a cross-sectional diagram illustrating a state in which the solder positioning device 1 is placed on an insulating substrate 11, and is in particular a diagram showing a cross-sectional shape of a vertically inverted side. Fig. 1, which is taken along line AA and illustrates a cross-sectional shape of the insulating substrate 11. Fig. Figure 3 is a cross-sectional diagram illustrating a state in which the solder positioning device 1 is placed on the insulating substrate 11, and is in particular a diagram showing a cross-sectional shape of a vertically inverted side. Fig. 1, which is taken along line BB and illustrates a cross-sectional shape of the insulating substrate 11.

[0020] As in Fig. 1 to Fig. As illustrated in Figure 3, the soldering positioning device 1 is a device that is placed on the insulating substrate 11 during a soldering process of an electronic component 15.

[0021] First, the insulating substrate 11 and the electronic component 15 are described with reference to Fig. 4 described. Fig. Figure 4 is a perspective view illustrating a state in which the electronic component 15 is mounted on the insulating substrate 11. The insulating substrate 11 comprises a baseboard 12 and an insulating layer 13 formed on a top surface of the baseboard 12. Circuit patterns 14a, 14b, 14c, and 14d are formed on the top surface of the insulating substrate 11. The electronic component 15 is, for example, a chip resistor, a capacitor, or the like, and has a rectangular shape in a top view. The electronic component 15 is positioned in a bridged state between circuit patterns 14a and 14b. In this state, the electronic component 15 is soldered to connect to the circuit patterns 14a and 14b.

[0022] The soldering positioning device 1 is described again. As in Fig. 1 to Fig. As illustrated in Figure 3, the soldering positioning device 1 comprises a plate-like element 2, which has a rectangular shape in a top view. The plate-like element 2 is placed on the insulating substrate 11 in a state in which it is in contact with a top surface of the circuit patterns 14a, 14b, 14c, and 14d, and comprises a frame section 3, an opening section 4, and a pair of projecting sections 5.

[0023] Frame section 3 extends along the entire outer edge of the plate-like element 2. Frame section 3 projects from a lower surface of the outer edge of the plate-like element 2. When the solder positioning device 1 is placed on the insulating substrate 11, frame section 3 abuts the upper surface of the insulating substrate 11. Opening section 4 has a rectangular shape in a top view and is formed in a central section of the plate-like element 2. The outline of opening section 4 is larger in a top view than the outline of the electronic component 15, and consequently, the electronic component 15 can be exposed by opening section 4.

[0024] The pair of projecting sections 5 is formed in such a way that the pair of projecting sections 5 faces each other on an outer edge section of the opening section 4 on the plate-like element 2, i.e., in positions in a front-and-back direction of the drawing sheet in Fig. 1. The pair of projecting sections 5 extends downwards from these positions, i.e., towards the side of the substrate 11, and can be inserted into a groove 16 formed between the circuit patterns 14a and 14b. It should be noted that in the following description, the front and back orientation of the drawing sheet is used. Fig. 1 is referred to as the "front-and-back direction", and the right-and-left direction of the drawing sheet of Fig. 1 is referred to as the "right-and-left direction".

[0025] Next, a method for positioning the solder positioning device 1 with respect to the insulating substrate 11 is described. As in Fig. As illustrated in Figure 2, the ends of the plate-like element 2 are located further to the right and left on one side of an outer edge than the outer edges of the ends of the circuit patterns 14a and 14b, and a gap is formed between an inner wall of the frame section 3 and the outer edges of the ends of the circuit patterns 14a and 14b. When the pair of projecting sections 5 is inserted into the groove 16, which is formed between the circuit patterns 14a and 14b, the solder positioning device 1 is positioned in the horizontal direction.

[0026] As in Fig. As illustrated in Figure 3, the ends of the plate-like element 2 lie further along one side of an outer edge in the front-and-back direction than the outer edges of the ends of circuit patterns 14c and 14d, and the inner wall of the frame section 3 abuts the outer edges of the ends of circuit patterns 14c and 14d. When the inner wall of the frame section 3 of the plate-like element 2 abuts the outer edges of the ends of circuit patterns 14c and 14d, the solder positioning device 1 is positioned in the front-and-back direction.

[0027] In a state where the soldering positioning device 1 is positioned relative to the insulating substrate 11, the electronic component 15 is guided through the opening section 4 in such a way that it bridges circuit patterns 14a and 14b, and is soldered to connect to these circuit patterns. Since the electronic component 15 is mounted here to bridge circuit patterns 14a and 14b, positioning in the left-right direction is more important than positioning in the front-back direction.

[0028] Next, the effects of the solder positioning device 1 according to the first embodiment are described in comparison to a case in which a conventional solder positioning device 101, which does not have the protruding sections 5, is placed on the insulating substrate 11. Fig. Figure 11 is a cross-sectional diagram illustrating a state in which the conventional solder positioning device 101, which does not have the protruding sections 5, is placed on the insulating substrate 11.

[0029] As in Fig. As illustrated in Figure 11, the conventional solder positioning device 101, which does not have the protruding sections 5, is placed on the insulating substrate 11, using the outer edges of the ends of the circuit patterns 14a and 14b, on which the electronic component 15 is mounted, as a reference. This configuration shifts the position of the solder positioning device 101 if there is a deviation in the dimensions of the insulating substrate 11 due to a manufacturing tolerance of the insulating substrate 11. This can cause a positional displacement of the electronic component 15 and tilt the electronic component 15, resulting in an incomplete connection between the electronic component 15 and the circuit patterns 14a and 14b.

[0030] In contrast, the soldering positioning device 1 according to the first embodiment comprises the plate-like element 2, which is to be placed on the insulating substrate 11 in a state in which it is brought into contact with the upper surface of the circuit patterns 14a, 14b, 14c, and 14d. The plate-like element 2 comprises the opening section 4, which is formed on the plate-like element 2 such that it allows the electronic component 15 to be exposed, and the pair of projecting sections 5, which are formed on the outer edge section of the opening section 4 on the plate-like element 2 and project towards the side of the insulating substrate 11 such that they can be inserted into the groove 16, which is formed between the circuit patterns 14a and 14b on the insulating substrate 11.

[0031] When the pair of protruding sections 5 is inserted into the groove 16 formed between the circuit patterns 14a and 14b on the insulating substrate 11, the solder positioning device 1 is positioned relative to the insulating substrate 11. This configuration reduces the degree of positional tolerance of the electronic component 15 without being affected by the manufacturing tolerance of the insulating substrate 11, and stabilizes the position of the electronic component 15. As a result, the electronic component 15 and the circuit patterns 14a and 14b are connected in a stable state, and thus the yield of the products in which the electronic component 15 is mounted on the circuit patterns 14a and 14b of the insulating substrate 11 is improved.

[0032] Furthermore, the solder positioning device 1 is positioned at two locations near the central section of the insulating substrate 11, where the electronic component 15 is to be mounted. Therefore, the solder positioning device 1 does not require high dimensional accuracy. Consequently, the manufacturing costs of the solder positioning device 1 are less susceptible to increase. Additionally, this positioning method is less affected by thermal expansion of the insulating substrate 11, and therefore the distance between the insulating substrate 11 and the solder positioning device 1 can be reduced. This configuration also reduces the degree of positional tolerance of the electronic component 15 and stabilizes its position. <Zweite Ausführungsform>

[0033] Next, a soldering positioning device 1A according to a second embodiment is described. Fig. Figure 5 is a cross-sectional diagram illustrating a state in which the soldering positioning device 1A according to the second embodiment is placed on the insulating substrate 11. It should be noted that in the second embodiment, components that are the same as those described in the first embodiment are identified by the same reference numerals, and their descriptions are omitted.

[0034] As in Fig. As illustrated in Figure 5, in the second embodiment two electronic components 15 are mounted. Accordingly, the plate-like element 2 comprises two opening sections 4 and two pairs of projecting sections 5. One of the electronic components 15 is arranged in a state in which it bridges circuit patterns 14a and 14e, and the other electronic component 15 is arranged in a state in which it bridges circuit patterns 14e and 14b. It should be noted that if three or more electronic components 15 are mounted, the number of opening sections 4 and pairs of projecting sections 5 can be adjusted accordingly.

[0035] As described above, the plate-like element 2 in the solder positioning device 1A according to the second embodiment comprises a plurality of opening sections 4 and a plurality of pairs of projecting sections 5. This configuration reduces the degree of positional tolerance of the electronic component 15 without being affected by a manufacturing tolerance of the insulating substrate 11, and stabilizes the position of the electronic component 15 even when two or more electronic components 15 are mounted. <Dritte Ausführungsform>

[0036] Next, a soldering positioning device 1B according to a third embodiment is described. Fig. Figure 6 is a cross-sectional diagram illustrating a state in which the soldering positioning device 1B according to the third embodiment is placed on the insulating substrate 11. It should be noted that in the third embodiment, components that are the same as those described in the first and second embodiments are identified by the same reference numerals, and their descriptions are omitted.

[0037] Due to heat, the insulating substrate 11 and the circuit patterns 14a, 14b, 14c, and 14d can warp into a downward-projecting shape, and a gap can form between the central section of the solder positioning device 1 and the circuit patterns 14a, 14b, 14c, and 14d. In this condition, when the electronic component 15 is mounted on the central section, the position of the electronic component 15 can be displaced, and the product can be considered defective with respect to its external appearance.

[0038] To solve such a problem, in the third embodiment, as in Fig. Figure 6 illustrates an area encompassing a part of the outer edge section of the opening section 4, which can be removably mounted on the plate-like element 2.

[0039] The solder positioning device 1B further comprises a removable element 6, which can be removably mounted on the plate-like element 2. In a state mounted on the plate-like element 2, the removable element 6 forms the area that encompasses part of the outer edge section of the opening section 4 on the plate-like element 2. Specifically, the removable element 6 forms the outer edge section of the opening section 4 on a side where the projecting sections 5 are not formed. In a state mounted on the plate-like element 2, the removable element 6 comprises an adjacent section 6a, which projects toward the side of the insulating substrate 11 and is adjacent to the circuit patterns 14a and 14b, and a mounting section 6b, which is attached to the plate-like element 2. Furthermore, the adjacent section 6a and the mounting section 6b are integrally formed.

[0040] The plate-like element 2 further comprises an outer groove 7, which holds an outer edge section of the removable element 6. The outer groove 7 is formed in a position corresponding to the mounting section 6b of the removable element 6 on the plate-like element 2. The vertical width of the outer groove 7 is greater than the thickness of the mounting section 6b. Therefore, the removable element 6 can be moved vertically on the plate-like element 2 when mounted. In this way, the adjacent section 6a of the removable element 6 can be brought into contact with the upper surface of the circuit patterns 14a and 14b of the insulating substrate 11, even when the insulating substrate 11 and the circuit patterns 14a, 14b, 14c, and 14d are warped in a downward-projecting shape.

[0041] As described above, the solder positioning device 1B according to the third embodiment comprises the removable element 6, which is removably mountable on the plate-like element 2. In a state mounted on the plate-like element 2, the removable element 6 comprises the adjacent section 6a, which includes a portion of the outer edge section of the opening section 4 on the plate-like element 2, and projects towards the side of the insulating substrate 11 and abuts the circuit patterns 14a and 14b. The plate-like element 2 further comprises the outer groove 7, which holds the outer edge section of the removable element 6.

[0042] Even if the insulating substrate 11 and the circuit patterns 14a, 14b, 14c, and 14d warp into a downward-projecting shape due to heat, bringing the adjacent section 6a of the removable element 6 to the upper surface of the circuit patterns 14a and 14b of the insulating substrate 11 can stabilize the position of the electronic component 15 and reduce the number of products which are considered defective with respect to their external appearance.

[0043] Since the adjacent section 6a is integrally formed with the fastening section 6b in the removable element 6, the adjacent section 6a and the fastening section 6b are not separated, which leads to an improvement in operability, at the time of placing the solder positioning device 1B on the insulating substrate 11 and removing the solder positioning device 1B from the insulating substrate 11. <Vierte Ausführungsform>

[0044] Next, a soldering positioning device 1C according to a fourth embodiment and a soldering positioning device 1D according to a modification of the fourth embodiment are described. Fig. Figure 7 is a cross-sectional diagram illustrating a state in which the solder positioning device 1C according to the fourth embodiment is placed on the insulating substrate 11. Fig. Figure 8 is a cross-sectional diagram illustrating a state in which the soldering positioning device 1D is placed on the insulating substrate 11 according to a modification of the fourth embodiment. It should be noted that in the fourth embodiment, components that are the same as those described in the first to third embodiments are identified by the same reference numerals, and their descriptions are omitted.

[0045] Circuit patterns 14a, 14b, 14c, and 14d are typically formed by etching. Depending on the etching conditions during fabrication, the cross-sectional shape of circuit patterns 14a, 14b, 14c, and 14d can be trapezoidal, with one upper side longer than one lower side, or trapezoidal, with one lower side longer than one upper side. In this case, if each protruding section 5 has a rectangular cross-sectional shape, fitting it into the groove 16 formed between circuit patterns 14a and 14b is unsatisfactory. This can cause the electronic component 15 to shift position and tilt, resulting in an incomplete connection between the electronic component 15 and circuit patterns 14a and 14b.

[0046] To solve such a problem, in the fourth embodiment, an end surface of the tip of each projecting section 5 is formed in a curved surface. Specifically, as shown in Fig. Figure 7 illustrates that the end face of the tip of each projecting section 5 forms an arc shape. Alternatively, as shown in Fig. As illustrated in Figure 8, the end face of the tip of each projecting section 5 can have a hemispherical shape. This design makes it satisfactory to fit into the groove 16, which is formed between the projecting sections 5 and the circuit patterns 14a and 14b. It should be noted that although Fig. 7 and Fig. 8. Illustrating a trapezoidal shape in which, in the cross-sectional shape of circuit patterns 14a and 14b, a lower side is longer than an upper side, a trapezoidal shape in which an upper side is longer than a lower side, can produce similar effects.

[0047] As described above, in the soldering positioning device 1C according to the fourth embodiment and the soldering positioning device 1D according to the modification of the fourth embodiment, the end surface of the tip of the projecting sections 5 is a curved surface. Therefore, the projecting sections 5 abut uniformly against the inner wall on both sides of the groove 16, which is formed between the circuit patterns 14a and 14b. Such uniform abutment facilitates centering, which is a process of moving the projecting sections 5 towards the center of the groove 16, and stabilizes the position of the electronic component 15. <Fünfte ausführungsform>

[0048] Next, a soldering positioning device 1E according to a fifth embodiment is described. Fig. Figure 9 is a cross-sectional diagram illustrating a state in which the soldering positioning device 1E according to the fifth embodiment is placed on the insulating substrate 11. It should be noted that in the fifth embodiment, components that are the same as those described in the first to fourth embodiments are identified by the same reference numerals, and their descriptions are omitted.

[0049] If the etching accuracy during the production of circuit patterns 14a, 14b, 14c, and 14d is unsatisfactory, the distance between the protruding sections 5 and the circuit patterns 14a and 14b is increased. This can cause a positional displacement of the electronic component 15 and tilt the electronic component 15, resulting in an incomplete connection between the electronic component 15 and the circuit patterns 14a and 14b.

[0050] To solve such a problem, as in Fig. Figure 9 illustrates that in the fifth embodiment each projecting section 5 is designed to have the form of a pair of hooks which can be fitted into the groove 16 formed between the circuit patterns 14a and 14b.

[0051] Each projecting section 5 is designed to have the shape of a pair of hooks, where each end of the tip is bent downwards towards the inner side to exhibit a spring-like characteristic. In a state where each projecting section 5 is not inserted into the groove 16, each projecting section 5 is in an open state in which the pair of hooks has a greater width than the horizontal width of the groove 16. In a state where each of the projecting sections 5 is inserted into the groove 16, each projecting section 5 is in a closed state in which the pair of hooks has a lesser width than the horizontal width of the groove 16. In this way, each projecting section 5 can be fitted into the groove 16.

[0052] In the soldering positioning device 1E according to the fifth embodiment, as described above, each projecting section 5 is configured to have the form of a pair of hooks, so that it can be inserted into the groove 16 formed between the circuit patterns 14a and 14b. This configuration reduces the distance between the projecting sections 5 and the circuit patterns 14a and 14b, and stabilizes the position of the electronic component 15. <Sechste Ausführungsform>

[0053] Next, a soldering positioning device 1F according to a sixth embodiment is described. Fig. Figure 10 is a cross-sectional diagram illustrating the soldering positioning device 1F according to the sixth embodiment. It should be noted that in the sixth embodiment, components that are the same as those described in the first to fifth embodiments are identified by the same reference numerals, and their descriptions are omitted.

[0054] In the fifth embodiment, the projecting sections 5 are integrally formed with the plate-like element 2. Consequently, if the projecting sections 5 are worn or damaged, the entire solder positioning device 1E must be replaced, thus increasing the operating costs of the solder positioning device 1E.

[0055] To solve such a problem, as in Fig.Figure 10 illustrates a projecting section 8a and a fastening section 8b, which is located at one end side of the base of the projecting section 8a, each provided as separate components and are removablely mountable on the plate-like element 2.

[0056] Instead of the projecting sections 5, the solder positioning device 1F comprises a removable element 8, which can be removably mounted on the plate-like element 2. The removable element 8 comprises the projecting section 8a, which is configured to have the form of a pair of hooks so that it can be inserted into a groove 16 formed between the circuit patterns 14a and 14b, and the fastening section 8b, which is formed on the end face of the base of the projecting section 8a and which is to be fastened to the plate-like element 2. The plate-like element 2 further comprises a retaining hole 9, which holds the fastening section 8b of the removable element 8. The retaining hole 9 is formed at positions in the front and rear directions on the outer edge section of the opening section 4 on the plate-like element 2, and the removable element 8 is fastened to the retaining hole 9.

[0057] As described above, in the solder positioning device 1F according to the sixth embodiment, the projecting section 8a and the fastening section 8b are removably mountable on the plate-like element 2 at the end side of the base of the projecting section 8a, and the plate-like element 2 further comprises the retaining hole 9 which holds the fastening section 8b.

[0058] Therefore, if the protruding section 8a is worn or damaged, only the removable element 8 comprising the protruding section 8a and the fastening section 8b, which is formed on the end side of the base of the protruding section 8a, needs to be replaced, and thus the running costs of the solder positioning device 1F are less susceptible to an increase.

[0059] It should be noted that in the present invention any of the embodiments can be freely combined, and any of the embodiments can be suitably modified or omitted within the scope of protection of the invention.

[0060] While the invention has been shown and described in detail, the foregoing description is illustrative in all aspects and not limiting. It is therefore understood that numerous modifications and variations can be conceived without departing from the scope of protection of the invention. Reference symbol list 1 Soldering positioning device 1A Soldering Positioning Device 1B Solder positioning device 1C Solder Positioning Device 1D solder positioning device 1E Solder positioning device 1F Solder Positioning Device 2 plate-like element 3. Frame section 4 Opening section 5 protruding section 6 removable element 6a adjacent section 7 Nut 8a protruding section 8b Fastening section 9 retaining holes 11 insulating substrate 14a Circuit diagram 14b Circuit diagram 14c Circuit diagram 14d circuit diagram 14e Circuit Pattern 15 electronic component 16 Nut 101 conventional soldering positioning devices

Claims

[1] Soldering positioning device (1, 1A, 1B, 1C, 1D, 1E, 1F) which is to be placed on an insulating substrate (11) during a soldering process of an electronic component (15) which is arranged such that it bridges a plurality of circuit patterns (14a, 14b, 14c, 14d, 14e) which is formed on the insulating substrate (11), wherein the soldering positioning device (1, 1A, 1B, 1C, 1D, 1E, 1F) comprises • a plate-like element (2) which is to be placed on the insulating substrate (11) in a state in which it is brought into contact with an upper surface of the plurality of circuit patterns (14a, 14b, 14c, 14d, 14e), wherein • the plate-like element (2) comprises ◯ an opening section (4) which is formed on the plate-like element (2) to allow the electronic component (15) to be exposed, and ◯ a pair of projecting sections (5, 8a) formed on an outer edge section of the opening section (4) on the plate-like element (2) and projecting towards one side of the insulating substrate (11) in such a way that it can be inserted into a groove (16) formed between the plurality of circuit patterns (14a, 14b, 14c, 14d, 14e) on the insulating substrate (11). [2] Solder positioning device (1A) according to claim 1, wherein the plate-like element (2) comprises a plurality of the opening sections (4) and a plurality of the pairs of the projecting sections (5). [3] Solder positioning device (1B) according to claim 1 or 2 further comprising • a removable element (6) which can be removed and mounted on the plate-like element (2), wherein • the removable element (6) in a state mounted on the plate-like element (2) comprises an adjacent section (6a) which includes a part of the outer edge section of the opening section (4) on the plate-like element (2), and which projects towards one side of the insulating substrate (11) and adjoins the plurality of circuit patterns (14a, 14b, 14c, 14d, 14e), and wherein • the plate-like element (2) furthermore comprises an outer groove (7) which holds an outer edge section of the removable element (6). [4] Solder positioning device (1C, 1D) according to claim 1 or 2, wherein an end surface of the tip of the pair of projecting sections (5, 8a) is a curved surface. [5] Solder positioning device (1E) according to claim 1 or 2, wherein each of the pairs of projecting sections (5) is designed to have the form of a pair of hooks which can be inserted into the groove (16). [6] Soldering positioning device (1F) according to claim 5, wherein • the pair of projecting sections (8a) and a fastening section (8b), which is formed on an end side of a base of the pair of projecting sections (5), are removably mountable on the plate-like element (2), and • the plate-like element (2) also includes a retaining hole (9) which holds the fastening section (8b).

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