Device for machining

Abstract

Device (100) for machining at least substantially cylindrical inner walls of workpieces, in particular pipes, by means of a rotational movement about a rotational axis (R), the device (100) comprising: at least two chip bodies (110a, 110b, 110c) for removing material from the workpiece, and a carrier body (120) for carrying the at least two chip bodies (110a, 110b, 110c), wherein the carrier body (120) has an adjusting device (121) for simultaneously moving the at least two chip bodies (110a, 110b, 110c) in the direction towards or in the direction away from the axis of rotation (R), wherein the adjusting device (121) comprises an adjusting body (122) and a transmission device (123), wherein the adjusting body (122) is designed to be rotated about a rotation axis which is aligned coaxially with the rotation axis (R) in order to adjust the chip bodies (110a, 110b, 110c), wherein the transmission device (123) is designed to transmit the movement of the adjusting body (122) to the chip bodies (110a, 110b, 110c) for effecting the simultaneous movement of the chip bodies (110a, 110b, 110c), wherein the transmission device (123) is designed as a planetary mechanism with a central sun gear (124d) and at least two planetary bodies (124a, 124b, 124c), wherein the planetary bodies (124a, 124b, 124c) are each assigned to one of the chip bodies (110a, 110b, 110c), wherein the central sun gear (124d) is arranged coaxially to the axis of rotation (R), and wherein the adjusting body (122) is designed to be rotatable relative to the central sun gear (124d), wherein the transmission device (123) is formed with two planetary mechanisms, and wherein the planetary bodies (124a, 124b, 124c) of one planetary mechanism are each connected to an axial end of the associated chip body (110a, 110b, 110c) and the planetary bodies (125a, 125b) of the other planetary mechanism are each connected to the other axial end of the associated chip body (110a, 110b, 110c), and wherein the carrier body (120) has a clamping device (126) for axial clamping, by means of which the adjusting device (121) can be clamped in such a way that a movement of the at least two chip bodies (110a, 110b, 110c) in the direction towards or in the direction away from the axis of rotation (R) is prevented.

Description

Technical FieldThe present invention relates to a device for machining at least substantially cylindrical inner walls of workpieces, in particular pipes, by means of a rotational movement about an axis of rotation.Prior ArtFrom the prior art, machining devices for internal processing, in particular internal grinding of pipes, are known. For example, they are used for grinding burrs, for producing a surface finish, for polishing the pipe inner side, for removing welds or weld protrusions, and for deburring the inner side of pipe ends.Known machining devices usually have a grinding head which rotates in the tube. To achieve a good result, the size of the grinding head is matched as accurately as possible to the tube. However, this entails the disadvantage that the machining device is accordingly only well suited for pipes of a certain diameter. Thus, for pipes with different diameters, different machining devices must also be provided or poorer results accepted.From this, attempts have been made in the prior art to provide more universal disintegraturing devices. For example, one solution consists in the fact that the grinding head of the machining device is designed to be particularly easily replaceable. Thus, grinding heads of different diameters can be provided for pipes of different diameters.However, such universal machining devices still have the disadvantage that grinding heads of different dimensions still have to be provided for different pipe diameters. This results in costs in obtaining, storing and replacing the grinding heads. Therefore, it would be desirable to provide a machining device that can be used universally for various tube inner diameters without the need to replace its grinding head.U.S. Pat. No. 1,803,701 A discloses a grinding device for machining cylindrical inner walls with three chip bodies. The chip bodies are supported by a support body, wherein the support body has an adjustment device for simultaneously moving the chip bodies. Reference is also made as prior art to U.S. Pat. No. 2,611,222 A.Proceeding from the above-mentioned prior art, it is an object of the present invention to provide a device for the machining of at least substantially cylindrical inner walls of workpieces, which device overcomes the problems and disadvantages of the systems known from the prior art and has corresponding advantages compared thereto. In particular, it is the object of the present invention to specify a universal device for machining which allows machining of pipes having different inner diameters without having to replace the grinding head or grinding body and accept trades with regard to the working result.SUMMARY OF THE INVENTIONThis object is achieved by the subject matter of independent claim 1. Further possible embodiments of the invention are specified in particular in the dependent claims.The solution according to the invention is to specify a device for machining at least substantially cylindrical inner walls of workpieces, in particular pipes, by means of a rotational movement about an axis of rotation, wherein the device has the following: at least two chip bodies for machining material of the workpiece, and a carrier body for carrying the at least two chip bodies, wherein the carrier body has an adjusting device for simultaneously moving the at least two chip bodies in the direction of or in the direction away from the axis of rotation.The device for machining can be designed for cutting with a geometrically defined cutting edge, such as for turning, milling or drilling, or for cutting with a geometrically undefined cutting edge, such as for grinding or honing. The term "grinding" also includes polishing. In operation, the device is rotated about the axis of rotation. Particularly preferably, the device for machining is an inner tube grinder which is designed for grinding inner walls of tubes.By means of the adjustment device, the chip path on which the chip bodies run can be adjusted. The chip path is generally defined by the areas of the chip bodies that are radially furthest away from the axis of rotation. The chip path is at least substantially circular. If the chip bodies are moved in the direction of the axis of rotation by means of the adjusting device, the chip path is reduced. If the chip bodies are moved in the direction away from the axis of rotation, the chip path increases. Thus, the chip path can be adapted to the diameter of the cylindrical inner wall to be machined.Since the adjusting device permits a simultaneous and homogeneous movement of the chip bodies, an actuation of the adjusting device is sufficient to adjust all chip bodies simultaneously and uniformly. The chip bodies therefore do not have to be individually adjusted. It can thus also be ensured that the adjusted chip path has the correct shape and, for example, that one of the chip bodies has not been adjusted too far. By means of the adjustment device, the device can be easily adapted overall to different inner diameters of the tubes.With the device according to the invention for machining, the object is achieved in a satisfactory manner. In particular, a universal device for machining is provided, which allows machining of pipes with different inner diameters without having to replace the grinding head or grinding body and accept trades with regard to the working result.In a preferred embodiment of the present invention, the adjusting device is configured for moving between and maintaining a first end position and a second end position, wherein in the first end position the chip bodies run along a first chip path during rotation of the device about the axis of rotation and in the second end position run along a second chip path, and wherein the second chip path has a larger diameter than the first chip path.For example, the first chip path can have a diameter which is smaller than 50 mm, preferably smaller than 48 mm, and the second chip path can have a diameter which is larger than 70 mm, preferably larger than 73 mm.An advantageous further development of this embodiment provides that the adjusting device is designed for moving between and maintaining a plurality of intermediate positions between the first end position and the second end position, wherein in the intermediate positions the chip bodies run along further chip paths during rotation of the device about the axis of rotation, and wherein the further chip paths have smaller diameters than the second chip path and larger diameters than the first chip path.It is thus possible to set a plurality of different diameters. Preferably, the diameters are fluidly adjustable. Thus, all diameters between the diameter of the first chip path and the diameter of the second chip path can be predetermined.According to an advantageous development of the invention, three chip bodies are arranged at a distance of 120° from one another.In the case of three chip bodies, three points of the device also touch the inner wall, as seen in cross section. This makes it possible to achieve a particularly good force distribution and symmetrical circulation of the device. Naturally, however, more chip bodies would also be conceivable.A particularly advantageous embodiment of the present invention provides that the chip bodies are designed as cylindrical grinding bodies, wherein at least substantially the entire lateral surface of the chip bodies is designed as a grinding surface.The cylindrical abrasive bodies extend in an axial direction that is oriented parallel to the rotational axis. Since the chip bodies are cylindrical, a long surface to be machined can therefore be machined as viewed in the axial direction without having to move the chip bodies further axially into the workpiece. During the machining of the workpiece, the entire lateral surface of the chip body in the circumferential direction is not required as a machining surface. Depending on the size of the chip bodies, for example, approximately 1 / 6 of the circumferential surface is required as the actual machining surface. Depending on the adjusted size of the chip path, different areas of the actual working surface are required. The abrasive surface itself may be grained or formed by lamellae.According to the invention, the adjusting device has an adjusting body and a transmission device, wherein the adjusting body is configured to be rotated about an axis of rotation which is aligned coaxially with the axis of rotation for adjusting the chip bodies, and wherein the transmission device is configured to transmit the movement of the adjusting body to the chip bodies for causing the simultaneous movement of the chip bodies.The chip path of the chip bodies is thus adjusted by rotating the adjusting body, in particular around a central shaft introduced later. This allows a comfortable setting or adjustment of the chip bodies.According to the invention, the transmission device is designed as a planetary mechanism with a central sun wheel and at least two planetary bodies, wherein the planetary bodies are each assigned to one of the chip bodies, wherein the central sun wheel is arranged coaxially to the axis of rotation and wherein the adjusting body is designed to be rotatable relative to the central sun wheel.When the adjusting body is rotated relative to the sun gear, this leads to a rolling-down movement of the planetary bodies. For this purpose, the toothed central sun wheel is in engagement with the planetary bodies, which are designed to be toothed in certain areas. Depending on the adjustable chip paths, for example, less than 300°, preferably less than 270°, particularly preferably less than 180°, are configured in a toothed manner in the planetary bodies.According to an advantageous development of this embodiment, the planetary bodies are lever-shaped and configured to move the associated chip body away from the axis of rotation or towards the axis of rotation in a pivoting movement when the sun wheel is rotated.A first end of the lever-shaped planet bodies is thus engaged with the sun gear and a second end is connected to the chip body. During the pivoting movement away from the axis of rotation, the chip bodies are moved outwards. During the pivoting movement towards the axis of rotation, the chip bodies are moved inward. The chip bodies therefore do not perform a purely radial movement during the adjustment of the chip path, but rather a combined movement in the radial direction and the circumferential direction. This pivoting movement changes the area of the lateral surface which is arranged on the outside as the actual working surface. This makes it possible to reduce wear.In a particularly preferred embodiment, the planet bodies are rotatably mounted on a common planet carrier, wherein the planet carrier is a part of the adjusting body.In order to enable the pivoting movement, the planetary bodies must be rotatably mounted. For this purpose, the planet carrier can have bolts, for example, which serve as shafts for the planet bodies. The fact that the planet carrier is part of the adjusting body means that the planet carrier is also designed to be rotatable with respect to the central sun wheel. Since the planet carrier is simultaneously formed as part of the adjusting body, the number of components can be reduced.According to the invention, the transmission device is designed with two planetary mechanisms, wherein the planetary bodies of one planetary mechanism are each connected to one axial end of the associated chip body and the planetary bodies of the other planetary mechanism are each connected to the other axial end of the associated chip body.This allows reliable and stable movement of the chip bodies. The mechanism thus has less tendency to jam or twist. In this case, two planet carriers are also formed, wherein these can be formed connected, for example, by means of connecting struts.According to a further embodiment of the present invention, the chip bodies have a polygonal, preferably hexagonal, hub, wherein each chip body is formed supported by means of a correspondingly polygonal shaft.The hubs are thus designed as hexagon socket, wherein the hubs and shafts are designed to be complementary. Of course, another polygonal configuration would also be possible. The embodiment as a hexagonal entrainment profile, however, has the advantage that the chip bodies can be rotated through 60° during wear and can be attached again to the carrier body with a previously unused chip surface region.Since the shafts are formed in polygonal fashion, i.e. not rotationally symmetrical, it is also possible to prevent undesired co-rotation of the chip bodies during operation. For this purpose, the part of the carrier body which carries the chip body, for example the planetary body, has a polygonal recess which is complementary to the shaft. This recess then positively counteracts a rotation of the chip body relative to the planetary body.An advantageous embodiment provides that each polygonal shaft connects one of the planetary bodies of one planetary mechanism and one of the planetary bodies of the other planetary mechanism to one another. In this case, it is sufficient if the force transmission for moving the chip bodies inward or outward is transmitted only via one of the planetary mechanisms.According to the invention, the carrier body has a bracing device, by means of which the setting device can be braced in such a way that a movement of the at least two chip bodies in the direction toward or away from the axis of rotation is prevented.According to the invention, the adjusting device is axially braced. For example, the clamping device can have a clamping nut and a clamping plate. The clamping nut serves as an actuating element of the clamping device. The clamping plate preferably has the same shape as the planetary carrier.An advantageous embodiment of the device according to the invention provides a central shaft which extends coaxially to the axis of rotation and on which the sun gear is arranged in a rotationally fixed manner.When the adjusting device is braced, the adjusting device is also arranged on the central shaft in a rotationally fixed manner. When the adjusting device is released, the adjusting device is rotatable relative to the central shaft in order to enable an adjustment, i.e. a change of the chip path.Preferably, the central shaft extends throughout the device. The central shaft may include a thread for engaging the clamping nut. In operation, the central shaft is rotated so as to co-rotate the chip bodies and remove material.In a particularly user-friendly embodiment, the device has a centering wheel for centering the device within the workpiece.The centering wheel simplifies the insertion of the device into the workpiece. Preferably, the centering wheel is arranged on the central shaft, in particular rotatably with respect to the central shaft. Depending on the diameter to be machined, i.e. the chip path, centering wheels with different diameters can be arranged. Thus, the centering wheel is selected in its size to match the workpiece to be machined and attached to the device.All of the advantages described above can be used particularly well in an internal grinder for pipes.Brief Description of the FiguresFurther features, advantages and embodiments of the invention are evident from the following description with reference to the figures. The following are shown: FIG. 1 shows an illustration of a device according to the invention for machining, FIG. 2 shows the device illustrated in FIG. 1 in an illustrative exploded illustration, FIG. 3 shows a simplified sectional view of the device according to the invention with chip bodies in a second end position, and FIG. 4 shows a simplified sectional view of the device according to the invention with chip bodies in a first end position.WAYS OF CARRYING OUT THE INVENTIONSimilar elements are generally denoted by the same or similar reference numerals in the figures.FIG. 1 shows an illustration of a device 100 according to the invention for the machining of at least substantially cylindrical inner walls of workpieces. In particular, the device 100 is an internal pipe grinder.The device 100 has three chip bodies 110 a, 110 b, 110 c, wherein the chip bodies 110 a, 110 b, 110 care designed as grinding bodies. The chip bodies 110 a, 110 b, 110 care of cylindrical design, wherein the lateral surface 111 a, 111 b, 111 cals chip surface or as grinding surface is designed.The chip bodies 110 a, 110 b, 110 care arranged on a carrier body 120. The carrier body 120 connects the chip bodies 110 a, 110 b, 110 cto a central shaft 130. The central shaft 130 is rotatable about an axis of rotation R. When machining the inner wall of the workpiece to be machined, for example tube, the central shaft 130 is rotated, wherein the chip bodies 110 a, 110 b, 110 crotate therewith.The carrier body 120 has an adjustment device 121, by means of which the chip path, here the grinding path, can be varied.For this purpose, the adjusting device 121 has an adjusting body 122 and a transmission device 123. The adjusting body 122 serves as an actuating element and is rotated about the axis of rotation R upon actuation. Here, the adjusting body 122 has two planet carriers 122 a, which are connected by means of connecting struts 122 b. The adjusting body 122 can be formed in one piece. Alternatively, however, the planet carriers 122 aand the connecting struts 122 bmay also be individual components which are connected to one another.The transmission device 123 serves to transmit the rotational movement of the adjusting body 122 into a movement of the chip bodies or grinding bodies 110 a, 110 b, 110 cin the outward or inward direction. The exact mechanism will be explained in more detail with reference to Figures 2, 3 and 4. Although the mechanism is described here as having two planet carriers 122a, a single planet carrier 122a would also suffice. The adjusting body 122 then correspondingly has only one planetary carrier 122 a.The carrier body 120 further comprises a bracing device 126, which is designed to allow or prevent the rotational movement of the adjusting body 122. In a clamped state of the clamping device 126, the latter clamps the transmission device 123 in place, so that an adjustment of the chip bodies 110 a, 110 b, 110 cmay not take place. Thus, the device 100 is also in a ready-to-use state. If, on the other hand, the clamping device 126 is released, the transmission device 123 can be moved, so that an adjustment of the chip bodies 110 a, 110 b, 110 cis possible.The clamping device 126 shown in FIG. 1 has a clamping nut 126 a, a clamping plate 126 band an intermediate disk 126 c. The clamping nut 126 ais in threaded engagement with the central shaft 130 and serves as an actuator of the clamping device 126. This also means that the actuation of the bracing device 126 takes place likewise as a rotation about the axis of rotation R. The washer 126 cis axially disposed between the clamping nut 126 aand the clamping plate 126 b. The clamping plate 126 bhas the same shape as the planetary carrier 122 a. The clamping plate 126 bmay also be understood as a second part of the planetary carrier 122 a.In FIG. 1, only the bracing device 126 on the left side of the device 100 is provided with reference numerals. As can be seen, however, a corresponding bracing device is also arranged on the right side. This is constructed in particular in the same way as the bracing device 126 on the left side.On the right side, a centering wheel 140 is arranged on the central shaft 130. The centering wheel 140 serves to facilitate insertion of the device 100 into the workpiece. Preferably, the centering wheel 140 is rotatably mounted on the central shaft 130. Accordingly, the right side in FIG. 1 is the insertion side and the left side in FIG. 1 is the drive side of the device 100. Depending on the diameter to be machined, i.e. the chip path, centering wheels 140 with different diameters can be mounted on. Therefore, the centering wheels 140 are designed to be replaceable.FIG. 2 shows the device 100 illustrated in FIG. 1 in an illustrative exploded illustration. Most of the components shown in Figure 2 have already been described with reference to Figure 1. A new description of the already known aspects is largely omitted in the following. All aspects or components already described with reference to FIG. 1 can, however, be transferred to FIG. 2 and also to the following figures.In the exploded illustration, the transmission device 123 can be seen better. The transmission device 123 is designed as a planetary mechanism. More specifically, the transmission device 123 is formed by two planetary mechanisms. Here, the transmission device 123 has a central sun gear 124 dand three planetary bodies 124 a, 124 b, 124 con the left side. The central sun gear 124 dis formed rotationally fast with the central shaft 130 and rotatable with respect to the planet carrier 122 a, more generally with respect to the adjusting body 122.Around the center sun gear 124d, the three planet bodies 124a, 124b, 124c are arranged at an equal interval. The planet bodies 124 a, 124 b, 124 care rotatably mounted on the planet carrier 122 a. To this end, bolts 127 are arranged, which serve as shafts of the planetary bodies 124 a, 124 b, 124 cand are connected to the planetary carrier 122 a.In particular, the planetary bodies 124 a, 124 b, 124 care arranged between the planetary carrier 122 aand the clamping plate 126 b. In this case, the clamping plate 126 bis likewise connected to the bolts 127 or at least has bores for receiving the bolts 127.The center sun gear 124d has external teeth which mesh with a meshing portion of the planet bodies 124a, 124b, 124c. Thus, a rolling-down movement of the planetary bodies 124 a, 124 b, 124 con the sun gear 124 dmay be made possible. The planetary bodies 124 a, 124 b, 124 care at least substantially lever-shaped, wherein the toothed region is respectively formed at one end of the planetary bodies 124 a, 124 b, 124 c. As can be seen in FIG. 2, a bore for mounting the planetary bodies 124 a, 124 b, 124 con the bolts 127 is also arranged at this one end of the planetary bodies 124 a, 124 b, 124 c. The other end of the planet bodies 124 a, 124 b, 124 cis connected to one of the chip bodies 110 a, 110 b, 110 c, respectively.For adjustment, the adjusting body 122 is rotated relative to the central shaft 130 and also relative to the sun gear 124 d, which is connected to the central shaft 130 in a rotationally fixed manner. This then leads to a rolling-down movement of the planetary bodies 124 a, 124 b, 124 c, since the planetary carrier 122 arotates relative to the sun gear 124 d. Thus, depending on the direction of rotation, the chip bodies 110 a, 110 b, 110 cmay be pivoted inward, i.e. in the direction of the axis of rotation R, or outward, i.e. in the direction away from the axis of rotation R.In FIGS. 3 and 4, the chip bodies 110 a, 110 b, 110 care adjusted inward when the adjusting body 122 or the planet carrier 122 arotates in the clockwise direction. When the adjusting body 122 rotates counterclockwise, they are adjusted correspondingly outwards.As indicated, the central sun gear 124 dis secured against rotation on the central shaft 130 in the direction of the axis of rotation R, for example by means of a hexagonal driver profile. For adjustment, the central shaft 130 is held in place with a tool and the adjusting body 122 is adjusted by applying a special key to two of the three bearing points of the planetary bodies 124 a, 124 b, 124 c. In this case, by rotating the key about the axis of rotation R, the chip bodies 110 a, 110 b, 110 care set outwards or inwards. The planetary bodies 124a, 124b, 124c thereby execute the rolling-down movement via the stationary central sun gear 124d.In FIG. 2, individual parts of the planetary mechanism on the right side are also shown with reference numerals. In particular, this is the central sun gear 125d and the planetary bodies 125a and 125b. The third planetary body, which is assigned to the chip body 110 c, is not recognizable in FIG. 2. The planetary mechanism on the right side is constructed like the planetary mechanism described in detail above and therefore will not be described again.The chip bodies 110 a, 110 b, 110 care thus each supported by means of planetary body pairs, for example planetary bodies 124 aand 125 a. The associated planetary bodies, here 124 aand 125 a, are arranged at the axial ends of the chip bodies 110 a, 110 b, 110 c.It can also be clearly seen in FIG. 2 how the exact fastening of the chip bodies 110 a, 110 b, 110 cto the associated planetary bodies 124 a, 124 b, 124 c, 125 a, 125 bis effected. The cylindrical chip bodies 110 a, 110 b, 110 ceach have a hub (only the hub 112 ais illustrated in FIG. 2 ). The hub 112a is formed as a hexagonal socket. Each chip body 110 a, 110 b, 110 cis further assigned a shaft 113 a, 113 b, 113 c. The shafts 113a, 113b, 113c have an outer shape complementary to the hubs 112a. Accordingly, the shafts 113 a, 113 b, 113 care designed here as external hexagon. In principle, a different configuration of the hubs 112 aand shafts 113 a, 113 b, 113 cshould also be possible. The configuration shown, however, has the advantage that the chip bodies 110 a, 110 b, 110 cmay be rotated by 60° in each case during wear. Since the entire outer surface 111 a, 111 b, 111 cis designed as a grinding surface, a grinding surface that has not been worn up to now can thus be used.In addition, by means of the rotationally nonsymmetrical configuration of the shafts 113 a, 113 b, 113 c, a twisting of the chip bodies 110 a, 110 b, 110 cduring the grinding process can be prevented. This is explained below with reference to the chip body 110 a, wherein this aspect also applies to the other chip bodies 110 band 110 c. At least one of the planet bodies 124a or 125a (here the planet body 125a) has a matching hexagonal recess instead of a round bore. This recess can prevent the turning of the chip body 110 ain a positive-locking manner.The shafts 113a, 113b, 113c are respectively fixed to the respective planetary body pairs 124a and 125a, etc. by means of fixing means 114. Here, the fastening is effected by means of nuts and washers.FIG. 3 and FIG. 4 show simplified sectional views of the device 100 according to the invention with chip bodies 110 a, 110 b, 110 cin various positions. Here, the clamping plates 126 bare not shown in order to provide a better view of the transmission device 123.FIG. 3 shows the device 100 with the chip bodies 110 a, 110 b, 110 cin a second end position, in which the chip bodies 110 a, 110 b, 110 care arranged at a maximum distance from the axis of rotation R. When the device 100 is rotated about the axis of rotation R during operation, a large chip path B 2 can therefore be achieved. The chip path is generally defined by the areas of the lateral surfaces 111 a, 111 b, 111 c, which are radially furthest away from the axis of rotation R.If the planet carrier 122 aof the device 100 shown is rotated clockwise about the axis of rotation R relative to the central sun gear 124 d, the planet bodies 124 a, 124 b, 124 croll on the central sun gear 124 d. The chip bodies 110 a, 110 b, 110 care then moved in a pivoting movement in the direction of the axis of rotation R, so that a smaller chip path can therefore be set.If the planet carrier 122 ais moved further, the first end position shown in FIG. 4 is reached, in which the chip bodies 110 a, 110 b, 110 care arranged at a minimum distance from the axis of rotation R. Here, the furthest away regions of the lateral surfaces 111 a, 111 b, 111 crun on a small chip path B 1. Since the chip bodies 110 a, 110 b, 110 cmoves in a pivoting movement during the setting, the outermost regions of the lateral surface 111 a, 111 b, 111 cin FIG. 4 are not the same regions as in FIG. 3 ; as a result, wear can be reduced.List of reference characters100 Device 110 a, 110 b: chip body 111 a, 111 b: lateral surface (the chip body) 112 a: hub 113 a, 113 b: shaft 114: fastening device 120: carrier body 121: setting device 122: setting body 122 a: planet carrier 122 b: connecting strut 123: transmission device 124 a, 124 b: planet body 124 d: central sun gear 125 a, 125 b: planet body 125 d: central sun gear 126: bracing device 126 a: clamping nut 126 b: clamping plate 126 c: intermediate disk 127: bolt 130: central shaft 140: centering wheel R: axis of rotation B 1: first chip path B 2: second chip path

Claims

Device (100) for machining at least substantially cylindrical inner walls of workpieces, in particular pipes, by means of a rotational movement about an axis of rotation (R), wherein the device (100) comprises: at least two chip bodies (110a, 110b, 110c) for machining material of the workpiece, and a carrier body (120) for carrying the at least two chip bodies (110a, 110b, 110c), wherein the carrier body (120) comprises an adjustment device (121) for simultaneously moving the at least two chip bodies (110a, 110b, 110c) in the direction towards or in the direction away from the axis of rotation (R), wherein the adjustment device (121) comprises an adjustment body (122) and a transmission device (123), wherein the adjustment body (122) is configured to, for adjusting the chip bodies (110a, 110b, 110c) to be rotated about an axis of rotation which is aligned coaxially with the axis of rotation (R), wherein the transmission device (123) is designed to transmit the movement of the adjusting body (122) for causing the simultaneous movement of the chip bodies (110a, 110b, 110c) to the chip bodies (110a, 110b, 110c), wherein the transmission device (123) is designed as a planetary mechanism having a central sun wheel (124d) and at least two planetary bodies (124a, 124b, 124c), wherein the planetary bodies (124a, 124b, 124c) are each assigned to one of the chip bodies (110a, 110b, 110c), wherein the central sun wheel (124d) is arranged coaxially with the axis of rotation (R), and wherein the adjusting body (122) is designed to be rotatable relative to the central sun wheel (124d), wherein the transmission device (123) is designed with two planetary mechanisms, and wherein the planetary bodies (124a, 124b, 124c) of the one planetary mechanism are each connected to one axial end of the associated chip body (110a, 110b, 110c) and the planetary bodies (125a, 125b) of the other planetary mechanism are each connected to the other axial end of the associated chip body (110a, 110b, 110c), and wherein the carrier body (120) has a bracing device (126) for axially bracing, by means of which the adjusting device (121) can be braced in such a way that a movement of the at least two chip bodies (110a, 110b, 110c) in the direction towards or in the direction away from the axis of rotation (R) is prevented.The device (100) according to claim 1, wherein the adjustment means (121) is configured to move between and maintain a first end position and a second end position, wherein in the first end position the chip bodies (110a, 110b, 110c) run along a first chip path (B1) when the device (100) is rotated about the axis of rotation (R) and in the second end position along a second chip path (B2), and wherein the second chip path (B2) has a larger diameter than the first chip path (B1).The device (100) according to claim 2, wherein the adjustment device (121) is configured to move between and maintain a plurality of intermediate positions between the first end position and the second end position, wherein in the intermediate positions the chip bodies (110a, 110b, 110c) run along further chip paths during rotation of the device (100) about the axis of rotation (R), and wherein the further chip paths have smaller diameters than the second chip path (B2) and larger diameters than the first chip path (B1).The device (100) according to any one of claims 1 to 3, wherein three chip bodies (110a, 110b, 110c) are arranged at a distance of 120° from each other.The device (100) according to any one of claims 1 to 4, wherein the chip bodies (110a, 110b, 110c) are formed as cylindrical grinding bodies, and wherein at least substantially the entire lateral surface (111a, 111b, 111c) of the chip bodies (110a, 110b, 110c) is formed as a grinding surface.Device (100) according to one of the preceding claims, wherein the planetary bodies (124a, 124b, 124c) are lever-shaped and are designed to move the associated chip body (110a, 110b, 110c) away from the axis of rotation (R) or towards the axis of rotation (R) in a pivoting movement when the sun wheel (124d) rotates.Device (100) according to one of the preceding claims, wherein the planetary bodies (124a, 124b, 124c) are rotatably mounted on a common planetary carrier (122a), and wherein the planetary carrier (122a) is part of the adjusting body (122).Device (100) according to one of the preceding claims, wherein the chip bodies (110a, 110b, 110c) have a polygonal, preferably hexagonal, hub (112a, 112b, 112c) and each chip body (110a, 110b, 110c) is formed supported by means of a correspondingly polygonal shaft (113a, 113b, 113c).The device (100) according to any one of the preceding claims, wherein each polygonal shaft (113a, 113b, 113c) connects one of the planet bodies (124a, 124b, 124c) of the one planetary mechanism and one of the planet bodies (125a, 125b) of the other planetary mechanism to each other, respectively.Device (100) according to any one of the preceding claims, wherein the device (100) comprises a central shaft (130) coaxial to the axis of rotation (R) and on which the central sun gear (124d) is arranged in a rotationally fixed manner.The apparatus (100) of any preceding claim, wherein the apparatus (100) comprises a centering wheel (140) for centering the apparatus (100) within the workpiece.

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