CONTACT FORMATION PROCEDURES AND CORRESPONDING STRUCTURE

Abstract

comprising a semiconductor device: a metal gate structure having side wall spacers (316) arranged on side walls of the metal gate structure, wherein an upper surface of the metal gate structure is recessed with respect to an upper surface of the side wall spacers (316); a metal cover layer (502, 502A) arranged above and in contact with the metal gate structure, wherein a first width of a lower section of the metal cover layer (502, 502A) is greater than a second width of an upper section of the metal cover layer (502, 502A); a dielectric material (902) arranged on each side of the metal cover layer (502, 502A), wherein the side wall spacers (316) and a section of the metal gate structure are arranged under the dielectric material, and an ILD layer (320) arranged adjacent to the metal gate structure, wherein a first lateral surface of the ILD layer contacts a second lateral surface of a side wall spacer (316) arranged along a side wall of the metal gate structure, wherein the upper surfaces of the metal cover layer (502, 502A), the dielectric material and the ILD layer are substantially planar.

Description

BACKGROUND

[0001] The electronics industry has experienced a steadily growing demand for smaller and faster electronic devices that can simultaneously support a greater number of increasingly complex and sophisticated functions. Consequently, there is a continuing trend in the semiconductor industry toward the production of cost-effective, high-performance, and energy-efficient integrated circuits (ICs). To date, these goals have been largely achieved by miniaturizing the dimensions of semiconductor ICs (e.g., the minimum feature size), thereby improving production efficiency and reducing associated costs. However, such scaling has also led to increased complexity in the semiconductor manufacturing process. Therefore, realizing continued progress in semiconductor ICs and devices requires similar advances in semiconductor manufacturing processes and technology.

[0002] To give just one example: To establish a reliable contact with a metal-gate electrode, a reliable and low-resistance metal-gate via is required. However, as the IC device scales up, the lower dimension of a metal-gate via (e.g., the width of the metal-gate via at its base) decreases, and the resistance at the interface between the metal-gate via and the underlying metal-gate electrode becomes more dominant. Consequently, the device performance (e.g., the device speed) deteriorates. Furthermore, the efficiency of etching the metal-gate via and filling metal gaps becomes significantly more difficult with a scaled-up metal-gate via. In at least some cases, this could lead to premature termination of the metal-gate via etching process (e.g.,This can result in incomplete metal-gate via formation or a significant void within the metal-gate via, thus degrading device performance. In some cases, an adhesive layer applied along a sidewall of the metal-gate via can also significantly impair device performance due to the adhesive's high resistance. This problem becomes more pronounced as the device dimensions shrink.

[0003] Thus, the existing techniques did not prove to be entirely satisfactory in every respect.

[0004] US 2019 / 0165123 A1 discloses a process comprising the following steps. First and second gate electrodes are formed over a substrate, with an ILD layer between the first and second gate electrodes. A first etching process is performed to etch the first and second gate electrodes. A sacrificial layer is formed over the etched first and second gate electrodes and the ILD layer. A second etching process is performed to etch the sacrificial layer and the first and second gate electrodes.

[0005] US 2015 / 0214220 A1 discloses an integrated circuit device comprising a pair of spacers defining a recess. The integrated circuit device may also include a lower conductive pattern within the recess and an upper conductive pattern on top of the lower conductive pattern. The upper conductive pattern may exhibit etch selectivity with respect to the lower conductive pattern and may expose an upper surface of the lower conductive pattern adjacent to a side wall of the upper conductive pattern. An inner side wall of one of the spacer pairs, the upper surface of the lower conductive pattern, and the side wall of the upper conductive pattern may define a space, and a cover pattern may be formed on the upper conductive pattern to seal off an upper portion of the space, thus providing a cavity beneath the cover pattern.

[0006] The invention is defined in the claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Aspects of this disclosure are best understood with reference to the following detailed description in conjunction with the accompanying drawings. It should be noted that, in accordance with industry practice, various features are not shown to scale. In fact, the dimensions of the various features may have been arbitrarily enlarged or reduced for the sake of clarity. Fig. Figure 1A is a cross-sectional view of a MOS transistor according to some embodiments; Fig. 1B is a perspective view of an embodiment of a FinFET device according to one or more aspects of the present disclosure; Fig. Figure 2 is a flowchart of a process for manufacturing contact structures including meta-gate vias according to some embodiments; Fig. 3A, Fig. 4A, Fig. 5A, Fig. 6A, Fig. 7A, Fig. 8A and Fig. Figure 9A shows cross-sectional views of a device in the intermediate stages of manufacture, produced according to the method in Fig. 2 is processed along a plane that is essentially parallel to a plane which is defined by the intersection BB' in Fig. 1B is defined according to some embodiments; Fig. 3B, Fig. 4B, Fig. 5B, Fig. 6B, Fig. 7B, Fig. 8B and Fig. Figure 9B shows cross-sectional views of a device in the intermediate stages of manufacture, produced according to the d7 em method in Fig. 2 is processed along a plane that is essentially parallel to a plane which is defined by the intersection AA' in Fig. 1B is defined according to some embodiments; Fig. Figure 10A shows an enlarged view of the device as shown in Fig. 9A shown and Fig. Figure 10B shows an enlarged view of the device as shown in Fig. 9B shown according to some embodiments; Fig. Figure 11 is a flowchart of another method for producing contact structures including metal-gate vias according to some embodiments; Fig. 12A, Fig. 13A, Fig. 14A, Fig. 15A and Fig. Figure 16A shows cross-sectional views of a device in the intermediate stages of manufacture, produced according to the method in Fig. 11 is processed along a plane that is essentially parallel to a plane which is defined by the intersection BB' in Fig. 1B is defined according to some embodiments; Fig. 12B, Fig. 13B, Fig. 14B, Fig. 15B and Fig. Figure 16B shows cross-sectional views of a device in the intermediate stages of manufacture, produced according to the method in Fig. 11 is processed along a plane that is essentially parallel to a plane defined by the intersection AA' in Fig. 1B is defined according to some embodiments; Fig. Figure 17A shows an enlarged view of the device as in Fig. 16A shown and Fig. Figure 17B shows an enlarged view of the device as in Fig. 16B shown according to some embodiments; Fig. Figure 18 is a flowchart of another method for producing contact structures including metal-gate vias according to some embodiments; Fig. 19A, Fig. 20A and Fig. Figure 21A shows cross-sectional views of a device in the intermediate stages of manufacture, produced according to the method in Fig. 18 is processed along a plane that is essentially parallel to a plane which is defined by the intersection BB' in Fig. 1B is defined according to some embodiments; Fig. 19B, Fig. 20B and Fig. Figure 21B shows cross-sectional views of a device in the intermediate stages of manufacture, produced according to the method in Fig. 18 is processed along a plane that is essentially parallel to a plane defined by the intersection AA' in Fig. 1B is defined according to some embodiments; Fig. Figure 22A shows an enlarged view of the device as shown in Fig. 21A shown and Fig. Figure 22B shows an enlarged view of the device as shown in Fig. 21B shown according to some embodiments; and Fig. 23, Fig. 24 and Fig. Figure 25 shows further embodiments of devices which are constructed according to the method in Fig. 2 are processed. DETAILED DESCRIPTION

[0008] The following disclosure provides many different embodiments or examples of the implementation of various features of the provided subject matter. To simplify the present disclosure, specific examples of components and arrangements are described below. For example, the formation of a first feature over or on top of a second feature in the following description may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features, so that the first and second features may not be in direct contact. Furthermore, reference numerals may be repeated in the various examples of the present disclosure.This repetition serves the purpose of simplicity and clarity and does not fundamentally prescribe a relationship between the various embodiments and / or configurations discussed herein.

[0009] Furthermore, for the sake of simplicity, spatially relative terms such as "below," "under," "downward," "above," "over," "upward," and the like may be used herein to describe the relationship of one element or feature to one or more other elements or features as shown in the drawings. These spatially relative terms are intended to encompass, in addition to the orientation shown in the drawings, various orientations of the device during use or operation. The device may be oriented differently (rotated by 90 degrees or in other orientations), and the spatially relative descriptors used herein may be interpreted accordingly. In various examples, thicknesses, widths, heights, or other dimensions described as equal, substantially equal, or the same may be within at least 10% of each other.

[0010] It should be noted that the present disclosure presents embodiments in the form of metal-gate vias that can be used in one of various device types. For example, embodiments of the present disclosure can be used to form metal-gate vias in planar bulk metal-oxide-semiconductor field-effect transistors (MOSFETs), multi-gate transistors (planar or vertical) such as FinFET devices, GAA devices (gate-all-around devices), Omega-gate devices (Ω-gate devices) or Pi-gate devices (Π-gate devices), strained semiconductor devices, SOI devices (silicon-on-substrate devices), PD-SOI devices (partially-depleted SOI devices), FD-SOI devices (fully-depleted SOI devices), or other known devices. Furthermore, the embodiments disclosed herein can be used in the manufacture of P-type and / or N-type devices.The person skilled in the art may recognize other embodiments of semiconductor devices that may benefit from aspects of the present disclosure.

[0011] Referring to the example in Fig. Figure 1A shows a MOS transistor 100, which is merely an example of one type of device that may include embodiments of the present disclosure. It is understood that the exemplary transistor 100 is in no way intended to be limiting, and the person skilled in the art will recognize that embodiments of the present disclosure may also be applicable to various other types of devices, e.g., as mentioned above. The transistor 100 is formed on a substrate 102 and has a gate stack 104. The substrate 102 may be a semiconductor substrate, such as a silicon substrate. The substrate 102 may have various layers, including conductive or insulating layers, formed on the substrate 102. Depending on the design requirements, the substrate 102 may contain various doping configurations, as are known in the industry. The substrate 102 may also contain other semiconductors, such as...The substrate 102 may contain germanium, silicon carbide (SiC), silicon germanium (SiGe), or diamond. Alternatively, the substrate 102 may contain a compound semiconductor and / or an alloy semiconductor. Furthermore, in some embodiments, the substrate 102 may contain an epitaxial layer (epi-layer), the substrate 102 may be strained to improve performance, the substrate 102 may have a silicon-on-insulator (SOI) structure, and / or the substrate 102 may have other suitable enhancement features.

[0012] The gate stack 104 comprises a gate dielectric 106 and a gate electrode 108 arranged on the gate dielectric 106. In some embodiments, the gate dielectric 106 may have an interface layer such as a silicon oxide layer (SiO2) or silicon oxynitride (SiON), wherein this interface layer may be formed by chemical oxidation, thermal oxidation, atomic layer deposition (ALD), chemical vapor deposition (CVD), and / or other suitable methods. In some examples, the gate dielectric 106 includes a high-k dielectric layer such as hafnium oxide (HfO2). Alternatively, the high-k dielectric layer can also contain other high-k dielectrics, such as TiO2, HfZrO, Ta2O3, HfSiO4, ZrO2, ZrSiO2, LaO, AlO, ZrO, TiO, Ta2O5, Y2O3, SrTiO3 (STO), BaTiO3 (BTO), BaZrO, HfZrO, HfLaO, HfSiO, LaSiO, Al-SiO, HfTaO, HfTiO, (Ba,Sr)TiO3 (BST), Al2O3, Si3N4, oxynitrides (SiON), combinations thereof, or other suitable materials.High-K gate dielectrics, as used and described here, comprise dielectric materials with a high dielectric constant, which is, for example, greater than that of thermal silicon dioxide (~3.9). In other embodiments, the gate dielectric 106 may contain silicon dioxide or another suitable dielectric. The gate dielectric 106 may be formed by ALD, physical vapor deposition (PVD), CVD, oxidation, and / or other suitable processes. In some embodiments, the gate electrode 108 may be deposited as part of a gate-first process or a gate-last process (e.g., a substitute gate process). In various embodiments, the gate electrode 108 contains a conductive layer such as W, Ti, TiN, TiAl, TiAlN, Ta, TaN, WN, Re, Ir, Ru, Mo, Al, Cu, Co, TiSi, CoSi, Ni, NiSi, combinations thereof, and / or other suitable compositions.In some examples, the gate electrode 108 can contain a first metal material for an N-type transistor and a second metal material for a P-type transistor. Thus, the transistor 100 can have a metal-gate configuration with two different work functions. For example, the first metal material (e.g., for N-type devices) can contain metals with a work function that is substantially matched to the work function of the substrate conduction band, or at least substantially matched to the work function of the conduction band of a channel region 114 of the transistor 100. Similarly, the second metal material (e.g., for P-type devices) can contain metals with a work function that is substantially matched to the work function of the substrate valence band, or at least substantially matched to the work function of the valence band of channel region 114 of the transistor 100.Thus, the gate electrode 108 can serve as a gate electrode for the transistor 100, featuring both N- and P-type devices. In some embodiments, the gate electrode 108 may alternately or additionally include a polysilicon layer. In various examples, the gate electrode 108 can be fabricated by PVD, CVD, electron beam evaporation, and / or other suitable processes. In some cases, the gate stack 104 may also include one or more barrier layers, filler layers, and / or other suitable layers. In some embodiments, sidewall spacers are formed on the sidewalls of the gate stack 104. Such sidewall spacers may contain a dielectric material such as silicon oxide, silicon nitride, silicon carbide, silicon oxynitride, or combinations thereof.

[0013] The transistor 100 further comprises a source region 110 and a drain region 112, each formed within the semiconductor substrate 102 and adjacent to and on both sides of the gate stack 104. In some embodiments, the source and drain regions 110, 112 comprise diffused source / drain regions, ion-implanted source / drain regions, epitaxially grown source / drain regions, or a combination thereof. The channel region 114 of the transistor 100 is defined as the region between the source and drain regions 110, 112 beneath the gate dielectric 106 and within the semiconductor substrate 102. The channel region 114 has an associated channel length “L” and an associated channel width “W”. If a bias voltage greater than a threshold voltage (Vt) (i.e.,When a turn-on voltage is applied to the gate electrode 108 of transistor 100, together with a simultaneously applied bias voltage between the source and drain regions 110, 112, an electric current (e.g., a transistor driver current) flows between the source and drain regions 110, 112 through the channel region 114. The magnitude of the driver current developed for a given bias voltage (e.g., applied to the gate electrode 108 or between the source and drain regions 110, 112) is, among other things, a function of the mobility of the material used to form the channel region 114. In some examples, the channel region 114 contains silicon (Si) and / or a highly mobile material such as germanium, which may be epitaxially grown, as well as any of the various compound semiconductors or alloy semiconductors known in the field.Highly mobile materials include materials with greater electron and / or hole mobility than silicon (Si), which has an intrinsic electron mobility at room temperature (300 K) of about 1350 cm2 / Vs and an intrinsic hole mobility at room temperature (300 K) of about 480 cm2 / Vs.

[0014] With reference to Fig. Figure 1B shows a FinFET device 150, which is an example of an alternative device type that may include embodiments of the present disclosure. For example, the FinFET device 150 has one or more fin-based multi-gate field-effect transistors (FETs). The FinFET device 150 has a substrate 152, at least one fin element 154 extending from the substrate 152, isolation areas 156, and a gate structure 158 arranged on and around the fin element 154. The substrate 152 may be a semiconductor substrate, such as a silicon substrate. In various embodiments, the substrate 152 may be substantially the same as the substrate 102 and may include one or more of the materials used for the substrate 102 as described above.

[0015] Like substrate 152, the fin element 154 can have one or more epitaxially grown layers and can contain silicon or another elemental semiconductor such as germanium; a compound semiconductor including silicon carbide, gallium arsenide, gallium phosphide, indium phosphide, indium arsenide, and / or indium antimonide; an alloy semiconductor including SiGe, GaAsP, AlInAs, AlGaAs, InGaAs, GaInP, and / or GaInAsP; or combinations thereof. The fin elements 154 can be fabricated by suitable processes including photolithography and etching. The photolithography process can involve forming a photoresist layer (resist) over the substrate (e.g., on a silicon layer), exposing the resist to a structure, performing post-exposure baking processes, and developing the resist to form a masking element including the resist.In some embodiments, the structuring of the resist to form the masking element can be carried out by an electron beam lithography process. The masking element can then be used to protect areas of the substrate while an etching process forms recesses in the silicon layer, leaving behind an extending fin element 154. The recesses can be etched by dry etching (e.g., chemical oxide removal), wet etching, and / or other suitable processes. Numerous other embodiments of methods for forming the fin elements 154 on the substrate 152 can also be used.

[0016] Each of the multiple fin elements 154 further comprises a source region 155 and a drain region 157, wherein the source / drain regions 155, 157 are formed in, on, and / or around the fin element 154. The source / drain regions 155, 157 may have grown epitaxially over the fin elements 154. Furthermore, a channel region of a transistor within the fin element 154, beneath the gate structure 158, is arranged along a plane that is substantially parallel to a plane defined by section AA' in Fig. 1B is defined. In some examples, the channel area of ​​the fin element 154 contains a material with high mobility as explained above.

[0017] The insulating regions 156 can be shallow trench insulation (STI). Alternatively, a field oxide, a LOCOS feature, and / or other suitable insulating features can be implemented on and / or within the substrate 152. The insulating regions 156 can be formed from silicon oxide, silicon nitride, silicon oxynitride, fluorine-doped silicate glass (FSG), a low-k dielectric, combinations thereof, and / or other suitable materials known in the art. In one embodiment, the insulating regions 156 are STI features and are formed by etching trenches into the substrate 152. The trenches can then be filled with an insulating material, followed by a chemical-mechanical polishing (CMP) process. Other embodiments are also possible. In some embodiments, the insulating regions 156 can have a multilayer structure, e.g., with one or more lining layers.

[0018] The gate structure 158 comprises a gate stack consisting of an interface layer 160 formed over the channel region of the fin 154, a gate dielectric layer 162 formed over the interface layer 160, and a metal layer 164 formed over the gate dielectric layer 162. In various embodiments, the interface layer 160 is essentially the same as the interface layer described as part of the gate dielectric 106. In some embodiments, the gate dielectric layer 162 is essentially the same as that of the gate dielectric 106 and may contain high-k dielectrics similar to those of the gate dielectric 106. In various embodiments, the metal layer 164 is essentially the same as the gate electrode 108 as described above. In some cases, the gate structure 158 may also include one or more barrier layers, filler layers, and / or other suitable layers.In some embodiments, sidewall spacers are formed on the sidewalls of the gate structure 158. The sidewall spacers can contain a dielectric material such as silicon oxide, silicon nitride, silicon carbide, silicon oxynitride, or combinations thereof.

[0019] As explained above, both the transistor 100 and the FinFET device 150 can each have one or more metal-gate vias, embodiments of which are described in detail below. In some examples, the metal-gate vias described herein can be part of a local interconnect structure. The term "local interconnect" as used herein describes the lowest level of metal interconnects and is distinct from intermediate and / or global interconnects. Local interconnects extend over relatively short distances and are sometimes used, for example, to electrically connect the source, drain, body, and / or gate of a particular device or of nearby devices. Additionally, local interconnects can be used to provide a vertical connection between one or more devices and an overlying metallization layer (e.g.,to facilitate this (with an intermediate interconnect layer), for example, through one or more vias. Interconnects (e.g., including local, intermediate, or global interconnects) can generally be formed as part of back-end-of-line (BEOL) fabrication processes and comprise a multi-stage network of metal wiring. Furthermore, any of several IC circuits and / or devices (e.g., the Transistor 100 or the FinFET 150) can be connected via such interconnects.

[0020] Given the aggressive scaling and ever-increasing complexity of advanced IC devices and circuits, the design of contacts and local interconnects has proven to be a significant challenge. For example, establishing a reliable contact with a metallic gate electrode (such as gate electrode 108 or metal layer 164 as described above) requires a reliable and low-resistance metal-gate via. However, as the IC device scales up, the lower dimension of a metal-gate via (e.g., the width of the metal-gate via at the bottom of the via) decreases, and the resistance at an interface between the metal-gate via and the underlying metal-gate electrode becomes more dominant. Consequently, device performance (e.g., device speed) degrades.Furthermore, the etching of metal-gate vias and the ability to fill metal gaps are significantly hampered by the large scale of the metal-gate vias. In at least some cases, this could lead to premature termination of the metal-gate via etching process (e.g., resulting in incomplete formation of the metal-gate via) or cause a significant gap in the metal-gate via, thus degrading device performance. In some cases, an adhesive layer applied along a sidewall of the metal-gate via can also severely degrade device performance due to the high resistance of the adhesive layer. This problem becomes more pronounced as the device dimensions are reduced. Therefore, existing methods are not entirely satisfactory.

[0021] Embodiments of the present disclosure offer advantages over the prior art. Although it is assumed that other embodiments may offer further advantages, not all advantages are necessarily discussed here, and no particular advantage is required for all embodiments. For example, the embodiments discussed here include methods and structures geared towards a fabrication process for contact structures, including metal vias. In some embodiments, a cut-metal process for forming metal-gate vias is disclosed, which are used to establish an electrical contact with an underlying metal-gate electrode. The disclosed metal-gate vias may occasionally be referred to as a VG (via gate).Therefore, in some cases, the cut-metal process disclosed herein may also be referred to as a cut-VG-metal process. In general, and in various embodiments, the cut-metal process described herein provides a metal-gate through-hole by forming a metal layer over a gate stack, performing a cut-metal photolithography process, and performing a cut-metal etching process, thereby forming the metal-gate through-hole.Such a method contrasts with at least some conventional methods for forming metal-gate vias, which involve structuring and etching to form a metal-gate via opening (which in some cases may be incompletely formed due to the scaled-up device dimensions), followed by metal deposition (prone to problems related to metal gap filling) to form a metal-gate via, which may result in incomplete formation of metal-gate vias and / or cavities formed within the metal-gate via.

[0022] According to the invention, the disclosed cut-metal process creates a tapered (conical, tapered) metal-gate via structure with a smaller upper dimension (e.g., width of the metal-gate via at the top) compared to a larger lower dimension (e.g., width of the metal-gate via at the bottom). While the upper dimension (e.g., width) of the metal-gate via is smaller than the lower dimension (e.g., width), in some embodiments it can be similar in size to the upper dimension (e.g., width) of a conventional metal-gate via structure. Furthermore, according to some embodiments, no adhesive layer is provided along the sidewalls of the metal-gate via, which, given the elimination of the resistance of the parasitic adhesive layer, results in significantly improved device performance.In some embodiments, the larger lower dimension (e.g., due to the tapered metal-gate via structure) creates a larger interface between the metal-gate via and an underlying metal-gate electrode, resulting in a significantly reduced interface resistance and improved device performance (e.g., including improved device speed). Furthermore, and in various examples, the cut-metal process disclosed herein does not require an etching process to form a metal-gate via opening and metal deposition (metal gap filling), thus avoiding challenges faced by at least some conventional implementations. Consequently, the cut-metal process disclosed herein enables better process feasibility, particularly for scaled-up devices.Thus, the embodiments of the present disclosure provide a reduced interfacial resistance between a metal-gate via and an underlying metal-gate electrode (e.g., by providing a larger contact area). Furthermore, aspects of the present disclosure solve the serious problems in etching metal gates and filling metal voids that occur in at least some conventional ultra-small metal-gate via structures. Further details of the embodiments of the present disclosure are explained below, and additional advantages and / or other benefits will be available to the person skilled in the art thanks to the present disclosure.

[0023] With reference to now Fig. Section 2 describes a method 200 for producing contact structures, including metal-gate vias, according to some embodiments. The method 200 is described below with reference to Fig. 3A / 3B - 9A / 9B described in detail. Fig. Figures 3A-9A show cross-sectional views of a device 300 along a plane that is substantially parallel to a plane defined by section BB' in Fig. 1B is defined (parallel to the direction of the gate structure 158), and Fig. Figures 3B-9B show cross-sectional views of the device 300 along a plane that is substantially parallel to a plane defined by section AA' in Fig. 1B is defined (perpendicular to the direction of the gate structure 158). Method 200 and other methods discussed herein can be applied to a planar device with a single gate, e.g., the exemplary transistor 100 as above with reference to Fig. 1A described above, as well as being implemented on a device with multiple gates, e.g. the FinFET device 150 as above with reference to Fig. 1B described. Thus, one or more aspects explained above with reference to transistor 100 and / or FinFET 150 may also apply to method 200. To be certain, method 200, as well as other methods discussed herein, may be implemented in various embodiments on other devices, such as GAA devices, Ω-gate devices, or Π-gate devices, and on strained semiconductor devices, SOI devices, PD-SOI devices, FD-SOI devices, or other devices known in the industry.

[0024] It is understood that sections of Method 200, as well as of other methods described herein and / or each of the exemplary transistor devices discussed with reference to Method 200 or other methods described herein, can be fabricated by a process sequence known in complementary metal-oxide-semiconductor (CMOS) technology, and therefore some processes are only briefly described herein. Furthermore, it is understood that all the exemplary transistor devices discussed herein may include various other devices and features, such as additional transistors, bipolar transistors, resistors, capacitors, diodes, fuses, etc., but have been simplified for a better understanding of the inventive concepts of this disclosure. Furthermore, in some embodiments, the exemplary transistor device(s) disclosed herein may include several semiconductor devices (e.g.,(transistors) which may be interconnected. Furthermore, in some embodiments, various aspects of the present disclosure may be applicable to either a gate-last process or a gate-first process.

[0025] Furthermore, the transistor devices illustrated herein by way of example may, in some embodiments, include a representation of a device in an intermediate stage of processing, such as may be manufactured in the processing of an integrated circuit, or a section thereof, which may include an SRAM (static random access memory) and / or other logic circuits, passive devices such as resistors, capacitors and inductors, and active devices such as P-field effect transistors (PFETs), N-FETs (NFETs), MOSFETs, CMOS transistors, bipolar transistors, high-voltage transistors, high-frequency transistors, other memory cells and / or combinations thereof.

[0026] Process 200 begins at block 202, where a substrate with a gate structure and one or more dielectric layers is provided and a CMP process is performed. With reference to Fig. 3A / 3B and in one embodiment of block 202, a device 300 is provided with a substrate 302 and a gate structure 304. In some embodiments, the substrate 302 can be substantially the same as one of the substrates 102, 152 described above. A region of the substrate 302 on which the gate structure 304 is formed and includes regions of the substrate 302 between adjacent gate structures can have an active region of the substrate 302. In some embodiments, regions adjacent to the gate structure 304 (parallel to a plane defined by section AA' in Fig. (as defined in Section 1B) includes a source region, a drain region, or a body region. In various embodiments, the gate structure 304 can have an interface layer formed over the substrate 302, a gate dielectric layer formed over the interface layer, and a metal gate layer (MG layer) 314 formed over the gate dielectric layer. In some embodiments, the interface layer, the dielectric layer, and the metal gate layer 314 of the gate structure 304 can be substantially the same as described above with reference to the transistor 100 and the FinFET 150. Furthermore, the gate structure 304 can have sidewall spacer layers 316. In various embodiments, the side wall spacer layers contain 316 SiOx, SiN, SiOxNy, SiCxNy, SiOxCyNz, AlOx, AlOxNy, AlN, HfO, ZrO, HfZrO, CN, Poly-Si, combinations thereof or other suitable dielectric materials.In some embodiments, the sidewall spacer layers 316 have multiple layers, such as main spacer sidewalls, lining layers, and the like. For example, the sidewall spacer layers 316 can be formed by depositing a dielectric material over the device 300 and anisotropically back-etching the dielectric material. In some embodiments, the back-etching process (e.g., for spacer formation) can include a multi-stage etching process to improve etch selectivity and allow for over-etching control.

[0027] As in Fig. In a further embodiment of block 202 shown in 3A, a dielectric layer 310 (e.g. parallel to a plane defined by the section BB') can be incorporated. Fig. (as defined in 1B) at opposite ends of the metal gate layer 314 of the gate structure 304, the dielectric layer 310 can, in some cases, provide insulation between the metal gate layers of adjacent devices. In some embodiments, the dielectric layer 310 can be formed using a cut-metal-gate process in which a section of the metal gate layer 314 within a cut metal area is removed (e.g., etched) to form a recess, and the dielectric layer 310 is deposited to fill the recess and provide insulation. In various examples, the dielectric layer 310 can contain SiC, LaO, AlO, AlON, ZrO, HfO, SiN, Si, ZnO, ZrN, ZrAlO, TiO, TaO, YO, TaCN, ZrSi, SiOCN, SiOC, SiCN, HfSi, LaO, SiO, or a combination thereof. In some embodiments, the dielectric layer 310 can be deposited by CVD, ALD, PVD, or other suitable processes.

[0028] Additionally, as in Fig. Figure 3B shows that a dielectric layer 320 is formed over the substrate 302 and on both sides of the gate structure 304 in contact with the sidewall spacer layers 316. For example, the dielectric layer 320 can be an interlayer dielectric (ILD) layer containing materials such as tetraethyl orthosilicate oxide (TEOS), undoped silicate glass, or doped silicon dioxide such as boron phosphosilicate glass (BPSG), fluorosilicate glass (FSG), phosphosilicate glass (PSG), boron-doped silicon dioxide (BSG), and / or other suitable dielectric materials. The dielectric layer 320 can be deposited by a subatmospheric CVD process (SACVD), a flowable CVD process, or another suitable deposition technique.In some embodiments, sections of the dielectric layer 320 can be removed in a subsequent processing step to form a metal layer in contact with a source, drain, or body region that may be located adjacent to the gate structure 304. After the formation of the gate structure 304, the sidewall spacer layers 316, the dielectric layer 310, and the dielectric layer 320, a CMP process can be performed to remove excess material and planarize the top surface of the device 300. In some embodiments, the CMP process may include a metal-gate CMP process.

[0029] Procedure 200 continues with block 204, where a metal gate etching process is performed. With reference to Fig. 3A / 3B and 4A / 4B, and in one embodiment of block 204, a metal gate etching process is performed to etch the metal gate layer 314 of the gate structure 304 and form a recess 402. In some embodiments, the etching process in block 204 may include a wet etching process, a dry etching process, or a combination thereof. In some examples, the etching process in block 204 may also etch the sidewall spacer layers 316, as shown in Fig. Figure 4B shows that after the etching process, and at least in some embodiments, an upper surface of the metal gate layer 314 is recessed relative to an upper surface of the side wall spacer layers 316. In other words, a plane defined by an upper surface of the metal gate layer 314 may, after the etching process, be located below a plane defined by an upper surface of the side wall spacer layers 316. For example, the recess 402, as jointly defined by the etched metal gate layer 314 and the etched side wall spacer layers 316, may generally form a T-shaped recess, as shown in Figure 4B. Fig. 4B is shown.

[0030] Process 200 continues with block 206, where a metal cover layer is deposited and a CMP process is carried out. With reference to Fig. 4A / 4B and 5A / 5B, and in one embodiment of block 206, a metal cover layer 502 is deposited over the device 300, including within the recess 402 and over the back-etched metal gate layer 314 and the back-etched sidewall spacer layers 316. After deposition of the metal cover layer 502, and in some embodiments, a CMP process is performed to remove excess material and planarize the top surface of the device 300. In some embodiments, the metal cover layer 502 may contain Co, W, Ru, Al, Mo, Ti, TiN, TiSi, CoSi, NiSi, Cu, TaN, or a combination thereof. In various examples, the metal cover layer 502 may be deposited by PVD, CVD, ALD, e-beam evaporation, or another suitable process. In some cases, the metal cover layer 502 has a height H1 in a range of approximately 0.5 nm - 30 nm.In some embodiments, an adhesive layer can optionally be formed beneath the metal cover layer 502, located between the metal cover layer 502 and the underlying metal gate layer 314. Optionally, the adhesive layer can contain Co, W, Ru, Al, Mo, Ti, TiN, TiSi, CoSi, NiSi, Cu, TaN, or a combination thereof. However, even if an adhesive layer is present between the metal gate layer 314 and the metal cover layer 502, no adhesive layer will be present along the sidewalls of the structured metal cover layer 502 (which defines a metal gate via for the device 300) that is formed in a subsequent processing stage, as described below. Since the recess 402 generally defines a T-shaped recess, the metal cover layer 502 formed within the recess 402 can generally define a T-shaped metal cover layer, as shown in [Figure 1]. Fig. 5B is shown.

[0031] Process 200 continues with block 208, where one or more hard mask layers are formed. With reference to Fig. 5A / 5B and 6A / 6B, and in one embodiment of block 208, a first hard mask layer 602 is formed over the device 300, and a second hard mask layer 604 is formed over the first hard mask layer 602. In some embodiments, the first hard mask layer 602 and the second hard mask layer 604 may have etch stop layers. In some cases, the hard mask layers 602, 604 provide a metal-gate via mask that is used to structure a metal-gate via, as described in detail below. For example, the hard mask layers 602, 604 may contain Ti, TiN, TiC, TiCN, Ta, TaN, TaC, TaCN, W, WN, WC, WCN, TiAl, TiAlN, TiAlC, TiAlCN, or combinations thereof. In various embodiments, the hard mask layers 602, 604 can be deposited by a SACVD, flowable CVD, ALD, PVD process or another suitable deposition process.

[0032] Process 200 continues with block 210, where a cut-metal photolithography process is performed. With reference to Fig. 6A / 6B and 7A / 7B and in one embodiment of block 210, a cut-metal photolithography process comprises depositing a resist layer (e.g., by spin coating), exposing the resist layer, and developing the exposed resist layer to form a structured resist layer 702. In some embodiments, the structured resist layer 702 can be used as a masking layer to define a subsequently formed metal-gate via, as explained below. As in Fig. As shown in Figures 7A / 7B, the structured resist layer 702 can, in some embodiments, have a tapered profile with a smaller upper dimension (e.g., width of the structured resist layer 702 at the top) compared to a larger lower dimension (e.g., width of the structured resist layer 702 at the bottom). In some embodiments, the tapered structured resist layer 702 can at least partially create the tapered profile of the subsequently formed metal-gate via structure, as explained below.

[0033] Process 200 continues with block 212, where a cut-metal etching process is performed. With reference to Fig. 7A / 7B and 8A / 8B and in one embodiment of block 212, a cut-metal etching process is performed to remove portions of the hard mask layers 602, 604, portions of the metal cover layer 502, and portions of the adhesive layer (if present) that are located outside an area protected by the structured resist layer 702, in order to form recesses 802 that expose portions of the back-etched metal gate layer 314 and the back-etched sidewall spacer layers 316. The cut-metal etching process in block 212 may comprise a wet etching process, a dry etching process, or a combination thereof.In some embodiments, the cut-metal etching process can be selective for the hard mask layers 602, 604 and the metal cover layer 502, such that the cut-metal etching process etches the portions of the hard mask layers 602, 604 and portions of the metal cover layer 502 (located outside an area protected by the structured resist layer 702) without substantially etching other adjacent layers (e.g., the dielectric layers 310, 320, the sidewall spacer layers 316, or the metal gate layer 314). The cut-metal etching process can thus expose portions of the back-etched metal gate layer 314 and the back-etched sidewall spacer layers 316. In various embodiments and after the cut-metal etching process, the structured resist layer 702 and remaining sections of the hard mask layers 602, 604 can be removed.For example, the structured resist layer 702 can be removed using an ashing process, a solvent or another suitable photoresist stripping technique, and the remaining sections of the hard mask layers 602, 604 can be removed by a wet etching process, a dry etching process or a combination thereof.

[0034] In various embodiments, a section of the metal cover layer 502A remaining after the cut-metal etching process (e.g., arranged between the recesses 802) can define a metal gate via for the device 300, establishing an electrical connection with the underlying metal gate layer 314 of the gate structure 304. Thus, a section of the metal cover layer 502A can equivalently be described as a via feature. Furthermore, in some embodiments, the section of the metal cover layer 502A can be substantially aligned with (e.g., centered on) the metal gate layer 314. It should be noted that although an adhesive layer may be present between the metal gate layer 314 and the section of the metal cover layer 502A as described above, there is nevertheless no adhesive layer along the sidewalls of the section of the metal cover layer 502A. As described in Fig. As shown in Figures 8A / 8B, the metal cover layer section 502A has a tapered profile with a smaller upper dimension W1 (e.g., width of the metal cover layer section 502A at the top) compared to a larger lower dimension W2 (e.g., width of the metal cover layer section 502A at the bottom). In some embodiments, the upper dimension W1 of the metal cover layer section 502A is in the range of approximately 0.5 nm to 30 nm, and the lower dimension W2 of the metal cover layer section 502A is in the range of approximately 0.5 nm to 40 nm. Additional details regarding the structure and dimensions of various features of the metal cover layer section 502A (metal-gate via) and the device 300, including the metal-gate via in general, are described below with reference to Figure 8A / 8B. Fig. 10A / 10B described.

[0035] Process 200 continues with block 214, where a dielectric filling process and a CMP process are carried out. With reference to Fig. 8A / 8B and 9A / 9B, and in one embodiment of block 214, a dielectric layer 902 is deposited over the device 300, including within the recesses 802 and over the exposed portions of the back-etched metal gate layer 314 and over the back-etched sidewall spacer layers 316. After deposition of the dielectric layer 902, and in some embodiments, a CMP process is performed to remove excess material and planarize the top surface of the device 300. In this way, the dielectric layer 902 can provide insulating features on both sides of the metal cover layer portion 502A (e.g., the metal gate via of the device 300). In some embodiments, the dielectric layer 902 may contain SiC, LaO, AlO, AlON, ZrO, HfO, SiN, Si, ZnO, ZrN, ZrAlO, TiO, TaO, YO, TaCN, ZrSi, SiOCN, SiOC, SiCN, HfSi, LaO, SiO or a combination thereof.In various examples, the dielectric layer 902 can be deposited by CVD, ALD, PVD, or another suitable process. In some embodiments, and after the dielectric filling and CMP process in block 214, the upper surfaces of the metal cover layer section 502A, the dielectric layer 902, the dielectric layer 310, and the dielectric layer 320 can be substantially coplanar.

[0036] The device 300 can be further processed to form various features and areas known in the prior art. For example, during further processing, various contacts / vias / conductors and multilayer interconnect features (e.g., metal layers and interlayer dielectrics) can be formed on the substrate 302, which are configured to connect the various features (e.g., including the metal-gate via) to form a functional circuit that may include one or more devices. To illustrate the example, a multilayer interconnect can include vertical connections such as vias or contacts and horizontal connections such as metal conductors. Various conductive materials such as copper, tungsten, and / or silicide can be used for the various interconnect features.In one example, a Damascus and / or double Damascus process is used to form a copper-like multilayer interconnect structure. Furthermore, additional process steps can be implemented before, during, and after Method 200, and some of the process steps described above can be replaced or eliminated according to various embodiments of Method 200.

[0037] With reference to Fig. Sections 10A / 10B now provide further details regarding the structure and dimensions of various features of the metal cover layer section 502A (metal-gate via) and the device 300 in general, including the metal-gate via. In various embodiments, the device 300, as described in Fig. Figure 10A shows an enlarged view of the device 300 as shown in Fig. 9A shown ready and the device 300 as in Fig. Figure 10B shows an enlarged view of the device 300 as shown in Fig. 9B is shown ready. Fig. However, 10A / 10B also show an optional adhesive layer 1002, which, as explained above, can be arranged between the metal gate layer 314 and the section of the metal cover layer 502A (metal gate via). Fig. Figure 10A further shows a lateral recess LR1 in the dielectric layer 310 and a vertical recess VR1 in the metal gate layer 314, which can be formed, for example, during the cut-metal etching process in block 212. In some embodiments, the lateral recess LR1 and the vertical recess VR1 can be located in a range of approximately 0.5 nm to 30 nm. However, it is possible that neither a lateral recess LR1 nor a vertical recess VR1 is present.

[0038] With reference to Fig. 10B and in some embodiments, a cavity 1004 can be formed in the dielectric layer 902. If the cavity 1004 is present, which is not always the case, a distance D1 between the cavity 1004 and the upper surface of the dielectric layer 902 can be in a range of about 1 nm to 30 nm. The cavity 1004, if present, can have a width dimension W3 in a range of about 0.5 nm to 30 nm and a height dimension H2 in a range of about 0.5 nm to 30 nm. The cavity 1004 can, in some cases, be formed during the deposition of the dielectric layer 902, particularly in highly scaled devices where the cavity filling dimension is small. Regardless of whether cavities (e.g., such as cavity 1004) are present within the dielectric layer 902 or not, embodiments of the present disclosure can, however, prevent the formation of cavities within the metal-gate via (e.g.,the metal cover layer section 502A) effectively prevent. In some examples, the metal cover layer 502, as explained above, can have a height H1 in a range of about 0.5 nm to 30 nm. In some embodiments, the upper dimension W1 of the metal cover layer 502A is in a range of about 0.5 nm to 30 nm, and the lower dimension W2 of the metal cover layer 502A is in a range of about 0.5 nm to 40 nm, as also explained above. In some cases, an angle θ1 is defined on a bottom side of the metal cover layer section 502A, wherein the angle θ1 can be in a range of about 90 degrees to 150 degrees. The adhesive layer 1002, if present, can have a thickness T1 in a range of about 0.5 nm to 30 nm. Furthermore, the adhesive layer 1002, if present, can extend beyond the metal cover layer section 502A by a distance D3 of approximately 10 nm.Furthermore, a dimension W4 of the adhesive layer 1002, if present, lies in a range of approximately 0.5 nm to 50 nm in some embodiments. In some cases, dimension W4 may be essentially equal to the lower dimension W2 of the metal cover layer section 502A (as, for example, in ). Fig. (23 shown). In embodiments including the adhesive layer 1002, a distance D4 can be defined between an end of the adhesive layer 1002 and an adjacent sidewall spacer layer 316, wherein the distance D4 is approximately 10 nm. In some embodiments, an angle θ2 can also be defined at an end of the adhesive layer 1002, if present, wherein the angle θ2 can be in a range of approximately 90 degrees to 150 degrees.

[0039] With reference to now Fig. In Section 11, a method 1100 for the fabrication of contact structures, including metal-gate vias, is described according to some embodiments. The method 1100 is described below with reference to Fig. 12A / 12B - 16A / 16B described in detail. Fig. Figures 12A-16A show cross-sectional views of a device 1200 along a plane that is substantially parallel to a plane defined by section BB' in Fig. 1B is defined (parallel to the direction of the gate structure 158), and Fig. Figures 12B-16B show cross-sectional views of the device 1200 along a plane that is substantially parallel to a plane defined by section AA' in Fig. 1B is defined (perpendicular to the direction of the gate structure 158). In various examples, method 1100 may be similar to method 200 explained above. Thus, one or more aspects explained above with reference to method 200 (and the associated device 300) may also apply to method 1100 (and the associated device 1200). Furthermore, for the sake of clarity, aspects of method 1100 that overlap with method 200 may be discussed only briefly, while the explanation focuses on the defining aspects of method 1100.

[0040] Process 1100 begins in block 1102, where a substrate with a gate structure and one or more dielectric layers is provided and a CMP process is performed. With reference to Fig. 12A / 12B and in one embodiment of block 1102, a device 1200 is provided with a substrate 1202 and a gate structure 1204. In some embodiments, the substrate 1202 can be substantially similar to the substrates 102, 152, 302 described above. In various embodiments, the gate structure 1204 can have an interface layer formed over the substrate 1202, a gate dielectric layer formed over the interface layer, and a metal gate layer (MG layer) 1214 formed over the gate dielectric layer. In some embodiments, the interface layer, the dielectric layer, and the metal gate layer 1214 of the gate structure 1204 can be substantially the same as described above with reference to the transistor 100, the FinFET 150, and the device 300.In at least some embodiments, the metal gate layer 1214 contains Co, W, Ru, Al, Mo, Ti, TiN, TiSi, CoSi, NiSi, Cu, TaN, or a combination thereof. Furthermore, the gate structure 1204 may have sidewall spacer layers 1216, which may be essentially the same as the sidewall spacer layers 316 as explained above.

[0041] In another embodiment of block 1102, as in Fig. As shown in 12A, a dielectric layer 1210 (e.g. parallel to a plane defined by the section BB' in Fig. 1B is defined) at opposite ends of the metal gate layer 1214 of the gate structure 1204. The dielectric layer 1210 can, in some cases, provide insulation between the metal gate layers of adjacent devices and can be essentially the same as the dielectric layer 310 described above. Additionally, as in Fig. As shown in Figure 12B, a dielectric layer 1220 is formed over the substrate 1202 and on both sides of the gate structure 1204 in contact with the sidewall spacer layers 1216. For example, the dielectric layer 1220 can be essentially the same as the dielectric layer 320 as explained above. After the formation of the gate structure 1204, the sidewall spacer layers 1216, the dielectric layer 1210, and the dielectric layer 1220, a CMP process can be performed to remove excess material and planarize the top surface of the device 1200.

[0042] Process 1100 continues with block 1104, where one or more hard mask layers are formed. With reference to Fig. 12A / 12B and 13A / 13B, and in one embodiment of block 1104, a first hard mask layer 1302 is formed over the device 1200, and a second hard mask layer 1304 is formed over the first hard mask layer 1302. In some embodiments, the first hard mask layer 1302 and the second hard mask layer 1304 may have etch stop layers. In some cases, the hard mask layers 1302, 1304 provide a metal-gate via hard mask that is used to structure a metal-gate via as described herein. In some embodiments, the hard mask layers 1302, 1304 may be substantially the same as the hard mask layers 602, 604 as explained above.Thus, in method 1100, the hard mask layers 1302, 1304 are formed directly over the metal gate layer 1214 of the gate structure 1204, instead of performing a metal gate back-etching process and depositing a metal cover layer before the hard mask layers are deposited, as in method 200. Consequently, and instead of using a metal cover layer to define the metal gate via (as done in method 200), an upper portion of the metal gate layer 1214 can be structured in a subsequent processing stage to define a metal gate via for the device 1200, as explained below. By eliminating the metal gate back-etching process and the metal cover layer deposition process, the sidewall spacer layers 1216 can also remain unetched.

[0043] Process 1100 continues with block 1106, where a cut-metal photolithography process is performed. With reference to Fig. 13A / 13B and 14A / 14B, and in an embodiment of block 1106, a cut-metal photolithography process comprises depositing a resist layer (e.g., by spin coating), exposing the resist layer, and developing the exposed resist layer to form a structured resist layer 1402. In some embodiments, the structured resist layer 1402 can be used as a masking layer to define a subsequently formed metal-gate via as described herein. The structured resist layer 1402 can, in some embodiments, as in Fig. Figures 14A / 14B show a tapered profile with a smaller upper dimension (e.g., width of the structured resist layer 1402 at the top) compared to a larger lower dimension (e.g., width of the structured resist layer 1402 at the bottom). In some embodiments, the tapered, structured resist layer 1402 can at least partially form the tapered profile of the subsequently formed metal-gate via structure as described herein.

[0044] Process 1100 continues with block 1108, where a cut-metal etching process is performed. With reference to Fig. In 14A / 14B and 15A / 15B, and in an embodiment of block 1108, a cut-metal etching process is performed to remove portions of the hard mask layers 1302, 1304, and part of an upper portion of the metal gate layer 1214 that are located outside an area protected by the structured resist layer 1402, in order to form recesses 1502 that expose a lower portion of the metal gate layer 1214. The cut-metal etching process in block 1108 may comprise a wet etching process, a dry etching process, or a combination thereof. In some embodiments, the cut-metal etching process can be selective for the hard mask layers 1302, 1304 and the metal gate layer 1214, such that the cut-metal etching process etches the sections of the hard mask layers 602, 604 and the upper sections of the metal gate layer 1214 (which are located outside an area protected by the structured resist layer 1402) without affecting other adjacent layers (e.g.to substantially etch the dielectric layers 1210, 1220 or the sidewall spacer layers 1216. In various embodiments and after the cut-metal etching process, the structured resist layer 1402 and remaining sections of the hard mask layers 1302, 1304 can be removed, for example, as explained above.

[0045] In various embodiments, an upper section of the metal gate layer 1214A, remaining after the cut metal etching process (e.g., arranged between the recesses 1502), can define a metal gate via for the device 1200, which establishes an electrical connection with the underlying lower section of the metal gate layer 1214 of the gate structure 1204. Thus, the upper section of the metal gate layer 1214A can equivalently be referred to as a via feature. In some embodiments, and similarly to the lower section of the metal gate layer 1214, the via feature (e.g., the upper section of the metal gate layer 1214A) can have more than one material layer, such as one or more barrier layers, filler layers, and / or other suitable layers (e.g., the layers as described above with reference to the gate stack 104 or the gate structure 158).In some examples, to avoid etching the entire metal gate layer 1214 and to obtain the desired dimensions of the upper section of the metal gate layer 1214, the parameters of the cut-metal etching process can be carefully controlled (e.g., including parameters such as etching time, etching temperature, etching pressure, etching chemistry, etc.). Furthermore, the metal gate via of the device 1200 (the upper section of the metal gate layer 1214A) and the underlying metal gate layer 1214 are formed from a single, continuous metal layer. Consequently, there is a continuous interface between the upper section of the metal gate layer 1214A and the underlying metal gate layer 1214. Thus, there is no adhesive layer at the interface between the upper section of the metal gate layer 1214A and the underlying metal gate layer 1214.Furthermore, as with the device 300 described above, there is also no adhesive layer on the side walls of the metal gate via (upper section of the metal gate layer 1214A). In some embodiments, the upper section of the metal gate layer 1214A can also be substantially aligned with (e.g., centered on) the underlying lower section of the metal gate layer 1214.

[0046] As in Fig. As shown in Figure 15A / 15B, the upper section of the metal gate layer 1214A has a tapered profile with a smaller upper dimension W5 (e.g., width of the upper section of the metal gate layer 1214A at the top of the upper section of the metal gate layer 1214A) compared to a larger lower dimension W6 (e.g., width of the upper section of the metal gate layer 1214A at the bottom of the upper section of the metal gate layer 1214A). In some embodiments, the upper dimension W5 of the upper section of the metal gate layer 1214A lies in a range of approximately 0.5 nm to 30 nm, and the lower dimension W6 of the upper section of the metal gate layer 1214A lies in a range of approximately 0.5 nm to 40 nm. It should also be noted that the lower dimension W6 (of the upper section of the metal gate layer 1214A) is smaller than a width W8 (of the lower section of the metal gate layer 1214).Further details regarding the structure and dimensions of various features of the upper section of the metal gate layer 1214A (metal gate via) and the device 1200 in general, including the metal gate via, are given below with reference to . Fig. 17A / 17B described.

[0047] Process 1100 continues with block 1110, where a dielectric filling and a CMP process are carried out. With reference to Fig. In 15A / 15B and 16A / 16B, and in one embodiment of block 1110, a dielectric layer 1602 is deposited over the device 1200, including within the recesses 1502 and over the exposed lower portion of the metal gate layer 1214. After deposition of the dielectric layer 1602, a CMP process is performed in some embodiments to remove excess material and planarize the upper surface of the device 1200. In this way, the dielectric layer 1602 can create insulating features on both sides of the upper portion of the metal gate layer 1214A (e.g., the metal gate via of the device 1200). In some embodiments, the dielectric layer 1602 can be substantially similar to the dielectric layer 902 as described above.In some embodiments, the upper surfaces of the upper section of the metal gate layer 1214A, the dielectric layer 1602, the side wall spacer layers 1216, the dielectric layer 1210 and the dielectric layer 1220 can be essentially planar (coplanar) to each other after the dielectric filling and CMP process in block 1110.

[0048] The device 1200 can be further processed to form various features and areas known in the prior art. For example, various contacts / vias / conductors and multilayer interconnect features (e.g., metal layers and interlayer dielectrics) can be formed during further processing on the substrate 1202, which are configured to connect the various features (e.g., including the metal-gate via) to form a functional circuit that may include one or more devices. To illustrate the example, a multilayer interconnect may have vertical connections such as vias or contacts and horizontal connections such as metal conductors. Various conductive materials such as copper, tungsten, and / or silicide may be used for the various interconnect features.In one example, a Damascus and / or double Damascus process is used to form a copper-like multilayer interconnect structure. Furthermore, additional process steps can be implemented before, during, and after Method 1100, and some of the process steps described above can be replaced or eliminated according to various embodiments of Method 1100.

[0049] With reference to Fig. References 17A / 17B provide further details regarding the structure and dimensions of various features of the upper section of the metal gate layer 1214A (metal gate via) and the device 1200 in general, including the metal gate via. In various embodiments, the device 1200, as described in Fig. Figure 17A shows an enlarged view of the device 1200 as shown in Fig. 16A shown ready and the device 1200 as in Fig. Figure 17B shows an enlarged view of the device 1200 as shown in Fig. 16B is shown ready. Fig. Figure 17A further shows a lateral recess LR2 in the dielectric layer 1210 and a vertical recess VR2 in the metal gate layer 1214, which can be formed, for example, during the cut-metal etching process in block 1108. In some embodiments, the lateral recess LR2 can be in a range of approximately 0.5 nm to 30 nm, and the vertical recess VR2 can also be in a range of approximately 0.5 nm to 30 nm. However, it is possible that the lateral recess LR2 or the vertical recess VR2 may not be present.

[0050] With reference to Fig. 17B and in some embodiments, a cavity can be formed in the dielectric layer 1602. If the cavity 1704 is present, which is not always the case, a distance D5 between the cavity 1704 and the upper surface of the dielectric layer 1602 can be in a range of about 1 nm to 30 nm. The cavity 1704, if present, can have a width dimension W7 in a range of about 0.5 nm to 30 nm and a height dimension H3 in a range of about 0.5 nm to 30 nm. The cavity 1704 can, in some cases, be formed during the deposition of the dielectric layer 1602, particularly in highly scaled devices where the cavity filling dimension is small. Regardless of whether cavities (for example, cavity 1704) are present within the dielectric layer 1602 or not, embodiments of the present disclosure can prevent the formation of cavities within the metal-gate via (e.g.,the upper section of the metal gate layer 1214A) effectively prevent. In some examples, the upper section of the metal gate layer 1214A can have a height H4 in a range of approximately 0.5 nm to 30 nm. In some embodiments, the upper dimension W5 of the upper section of the metal gate layer 1214A is in a range of approximately 0.5 nm to 30 nm, and the lower dimension W6 of the upper section of the metal gate layer 1214A is in a range of approximately 0.5 nm to 40 nm, as explained above. In some cases, an angle θ3 is defined at the bottom of the upper section of the metal gate layer 1214A, where the angle θ3 can be in a range of approximately 90 degrees to 150 degrees. In some embodiments, a distance D6 can be defined between a lower edge of the upper section of the metal gate layer 1214A and an adjacent side wall spacer layer 1216, wherein the distance D6 is approximately 10 nm.

[0051] With reference to now Fig. In Section 18, a method 1800 for the fabrication of contact structures, including metal-gate vias, is described according to some embodiments. The method 1800 is described below with reference to Fig. 19A / 19B - 21A / 21B described in detail. Fig. Figures 19A-21A show cross-sectional views of a device 1900 along a plane that is substantially parallel to a plane defined by section BB' in Fig. 1B is defined (parallel to the direction of the gate structure 158), and Fig. Figures 19B-21B show cross-sectional views of the device 1900 along a plane that is substantially parallel to a plane defined by section AA' in Fig. 1B is defined (perpendicular to the direction of the gate structure 158). Process 1800 is essentially the same as Process 200 as explained above, except that an additional step is added between the cut-metal etching process (Block 212) and the dielectric filling and CMP process (Block 214) of Process 200. For the sake of clarity, aspects of Process 1800 that overlap with Process 200 are therefore only briefly mentioned, while the explanation focuses on the additional features of Process 1800.

[0052] Method 1800 begins with step 1802, which comprises blocks 202-212 of Method 200. Thus, apparatus 1900 is, after step 1802 of Method 1800, with reference to Fig. 19A / 19B essentially the device 300 as in Fig. Figures 8A and 8B are shown identically, wherein the device 300 is depicted immediately after the cut-metal etching process (block 212). As such, the device 1900 has the recesses 802, which expose sections of the back-etched metal gate layer 314 and the back-etched sidewall spacer layers 316. In some embodiments, the device also has the section of the metal cover layer 502A that remains after the cut-metal etching process (e.g., arranged between the recesses 802) and which defines a metal gate via for the device 1900, providing an electrical connection with the underlying metal gate layer 314. As explained above, an adhesive layer may be present between the metal gate layer 314 and the section of the metal cover layer 502A, but no adhesive layer is present along the sidewalls of the portion of the metal cover layer 502A.

[0053] Instead of proceeding with the dielectric filling and CMP processes as in Process 200, Process 1800 continues with Block 1804, where selective metal deposition is performed. With reference to Fig. In 19A / 19B and 20A / 20B, and in one embodiment of block 1804, a metal layer 2002 is selectively deposited over metal areas, including the portion of the metal cover layer 502A and the exposed portions of the back-etched metal gate layer 314 on both sides of the portion of the metal cover layer 502A. In some embodiments, the selectively deposited metal layer 2002 may also be conformally deposited over the metal areas. In various examples, the metal layer 2002 is optionally not deposited over dielectric layers, such as the back-etched sidewall spacer layers 316, the dielectric layer 310, and the dielectric layer 320. In some embodiments, the metal layer 2002 may contain Co, W, Ru, Al, Mo, Ti, TiN, TiSi, CoSi, NiSi, Cu, TaN, or combinations thereof.In various examples, the metal layer 2002 can be deposited by PVD, CVD, ALD, e-beam evaporation, or another suitable process. In some examples, the metal layer 2002 can be used to further reduce the resistance of the metal-gate via of the device 1900 (e.g., the section of the metal cover layer 502A).

[0054] Process 1800 continues with block 1806, where the dielectric filling and CMP processes are carried out. With reference to Fig. In 20A / 20B and 21A / 21B, and in one embodiment of block 1806, the dielectric layer 902 is deposited over the device 1900, including within the recesses 802, over the selectively deposited metal layer 2002, and over the back-etched sidewall spacer layers 316. After deposition of the dielectric layer 902, a CMP process is performed in some embodiments to remove excess material and planarize the top surface of the device 1900. In some embodiments, the CMP process can remove the metal layer 2002 from a top surface of the metal cover layer section 502A. The dielectric layer 902 can thus provide insulating features on both sides of the metal cover layer section 502A (e.g., the metal gate via of the device 1900).In various embodiments, the dielectric layer 902 can be substantially the same as described above with reference to Block 214 of Process 200. In some embodiments, after the dielectric filling and CMP processes in Block 1806, the upper surfaces of the metal cover layer section 502A, the metal layer 2002 arranged on the side walls of the metal cover layer section 502A, the dielectric layer 902, the dielectric layer 310, and the dielectric layer 320 can be substantially coplanar.

[0055] Device 1900 can be further processed to form various features and areas known in the prior art. For example, various contacts / vias / conductors and multilayer interconnect features (e.g., metal layers and interlayer dielectrics) can be formed on substrate 302 during further processing. These features are configured to connect the various elements (e.g., including the metal-gate via) to form a functional circuit that may include one or more devices. To illustrate this example, a multilayer interconnect may include vertical connections such as vias or contacts and horizontal connections such as metal conductors. Various conductive materials, such as copper, tungsten, and / or silicide, may be used for the different interconnect features.In one example, a Damascus and / or double Damascus process is used to form a copper-like multilayer interconnect structure. Furthermore, additional process steps can be implemented before, during, and after Method 1900, and some of the process steps described above can be replaced or eliminated according to various embodiments of Method 1900.

[0056] With reference to Fig. References 22A / 22B provide further details regarding the structure and dimensions of various features of the metal cover layer section 502A (metal-gate via), the selectively deposited metal layer 2002, and, in general, the device 1900, including the metal-gate via. In various embodiments, the device 1900, as described in Fig. Figure 22A shows an enlarged view of the device 1900 as shown in Fig. 21A shown ready and the in device 1900 as in Fig. Figure 22B shows an enlarged view of the device 1900 as shown in Fig. 21B is shown ready. Fig. However, the optional adhesive layer 1002 described above is also shown in 22A / 22B. Fig. Figure 22A further illustrates the lateral recess LR1 and the vertical recess VR1, which may be substantially the same as described above. For example, in some embodiments, the lateral recess LR1 may be in a range of approximately 0.5 nm to 30 nm and the vertical recess VR1 may be in a range of approximately 0.5 nm to 30 nm. Optionally, there may be no lateral recess LR1 or vertical recess VR1.

[0057] Fig. 22B illustrates several features and dimensions that are essentially the same as the features and dimensions above with reference to Fig. 10B explains that the dimensions of the cavity can be the same. For example, the cavity 1004 in the dielectric layer 902, if present, can have a distance D1 from the upper surface of the dielectric layer 902, where 'D1' can be in a range of about 1 nm to 30 nm. The cavity 1004, if present, can also have a width dimension W3 in a range of about 0.5 nm to 30 nm and a height dimension H2 in a range of about 0.5 nm to 30 nm. As explained above, and regardless of whether cavities (e.g., the cavity 1004) are present within the dielectric layer 902 or not, embodiments of the present disclosure can effectively prevent the formation of cavities within the metal-gate via (e.g., the metal cover layer section 502A). As explained above, the metal cover layer 502 can have a height H1 in a range of approximately 0.5 nm - 30 nm.In some embodiments, the upper dimension W1 of the metal cover layer section 502A is in a range of approximately 0.5 nm to 30 nm, and the lower dimension W2 of the metal cover layer section 502A is in a range of approximately 0.5 nm to 40 nm, as also explained above. In some cases, an angle θ1 is defined on the underside of the metal cover layer section 502A, wherein the angle θ1 may be in a range of approximately 90 degrees to 150 degrees. The adhesive layer 1002, if present, may have a thickness T1 in a range of approximately 0.5 nm to 30 nm. Furthermore, the adhesive layer 1002, if present, may extend beyond the metal cover layer section 502A by a distance D3 of approximately 10 nm. Furthermore, in some embodiments, a dimension W4 of the adhesive layer 1002, if present, is in a range of approximately 0.5 nm to 50 nm.In some cases, dimension W4 may be essentially the same as the lower dimension W2 of the metal cover layer section 502A (as, for example, in . Fig. 23). In embodiments including the adhesive layer 1002, a distance D4 can be defined between an end of the adhesive layer 1002 and an adjacent sidewall spacer layer 316, wherein the distance D4 is approximately 10 nm. In some embodiments, an angle θ2 can also be defined at an end of the adhesive layer 1002, if present, wherein the angle θ2 can be in a range of approximately 90 degrees to 150 degrees. Furthermore, shows Fig. 22B the selectively deposited metal layer 2002 with a thickness T2 in a range of about 0.5 nm - 30 nm.

[0058] With reference to Fig. Figure 24 shows a device 2400 according to some embodiments. In various examples, the device 2400 can be similar to the device 300 and can be manufactured according to the method 200 as described above. However, the device 2400 differs in that an upper surface of the metal gate layer 314 is substantially planar (coplanar) with an upper surface of the sidewall spacer layers 316. In some embodiments, the coplanar upper surfaces of the metal gate layer 314 and the sidewall spacer layers 316 can be formed during the etching process, e.g., during the etching in block 204 of the method 200. In some cases, a similar etching process and the formation of the coplanar upper surfaces of the metal gate layer 314 and the sidewall spacer layers 316 can also be carried out as part of the method 1800, e.g., in step 1802 of the method 1800.

[0059] With reference to Fig.Figure 25 shows a device 2500 according to some embodiments. In some examples, the device 2500 may be similar to the device 300 and may be manufactured according to the method 200 as described above. However, the device 2500 differs in that an upper surface of the sidewall spacer layers 316 is substantially planar (coplanar) with an upper surface of the metal cover layer section 502A, an upper surface of the dielectric layer 902, and an upper surface of the dielectric layer 320.In other words, the sidewall spacer layers 316 extend beyond an upper surface of the metal gate layer 314, such that the upper surface of the metal gate layer 314 is recessed with respect to the upper surfaces of the sidewall spacer layers 316, or such that a plane defined by an upper surface of the metal gate layer 314 is located below a plane defined by an upper surface of the sidewall spacer layers 316. The sidewall spacers 316 of the device 2500 can be separated from the metal cover layer section 502A by the dielectric layer 902. Furthermore, the sidewall spacers 316 of the device 2500 can be arranged between the dielectric layer 902 and the dielectric layer 320 (e.g., the ILD layer) as shown.In some embodiments, the fabrication of the device 2500 may include performing the back-etching process (block 204 of method 200), wherein the back-etching process etches the metal gate layer 314 without substantially etching the side wall spacer layers 316. In some cases, a similar back-etching process and the formation of the coplanar upper surfaces of the side wall spacer layers 316, the metal cover layer section 502A, the dielectric layer 902, and the dielectric layer 320 may also be performed as part of method 1800, for example, in step 1802 of method 1800.

[0060] The various embodiments described herein offer several advantages over the prior art. It should be understood that not all advantages have necessarily been discussed here, that not all embodiments require a particular advantage, and that other embodiments may offer other advantages. An example of the embodiments described herein are methods and structures geared towards a manufacturing process for contact structures, including metal-gate vias. In some embodiments, a cut-metal method for forming metal-gate vias is disclosed, which are used to establish an electrical contact with an underlying metal-gate electrode. The disclosed cut-metal method provides a tapered metal-gate via structure with a smaller top dimension (e.g.,The width of the metal-gate via at the top of the via is different from the width of the bottom of the via. Furthermore, in some embodiments, there is no adhesive layer along the sidewalls of the metal-gate via, which offers much better device performance due to the elimination of the resistance of the parasitic adhesive layer. In some embodiments, the larger bottom dimension (e.g., due to the tapered metal-gate via structure) also provides a larger interface between the metal-gate via and an underlying metal-gate electrode, resulting in a significantly reduced interface resistance and improved device performance (e.g., including improved device speed).The cut-metal process disclosed herein further eliminates the need for etching to form a metal-gate via opening and for metal deposition (filling of metal gaps), thus avoiding challenges encountered in at least some conventional implementations. Consequently, the cut-metal process disclosed herein enables improved process feasibility, particularly for scaled-up devices. Thus, the embodiments of this disclosure provide for reduced interfacial resistance between a metal-gate via and an underlying metal-gate electrode (e.g., by providing a larger contact area). Furthermore, aspects of this disclosure resolve the significant problems associated with etching the metal-gate via and filling metal gaps that arise in at least some conventional ultra-small metal-gate via structures.

[0061] Thus, one embodiment of the present disclosure describes a semiconductor device comprising a metal gate structure with sidewall spacers arranged on the sidewalls of the metal gate structure. In some embodiments, an upper surface of the metal gate structure is recessed relative to an upper surface of the sidewall spacers. The semiconductor device may further comprise a metal cover layer arranged over and in contact with the metal gate structure, wherein a first width of a lower section of the metal cover layer is greater than a second width of an upper section of the metal cover layer. In some embodiments, the semiconductor device may further comprise a dielectric material arranged on both sides of the metal cover layer, with the sidewall spacers and a section of the metal gate structure arranged beneath the dielectric material.

[0062] In another embodiment, a semiconductor device is discussed that has a metal gate structure comprising an upper section and a lower section. In some embodiments, the upper section of the metal gate structure has a tapered profile. For example, a lower surface of the tapered profile has a greater width than an upper surface of the tapered profile. In some cases, the lower surface of the tapered profile has a narrower width than an upper surface of the lower section of the metal gate structure. The semiconductor device may further include sidewall spacers arranged on the sidewalls of the metal gate structure, the sidewall spacers contacting the lower section of the metal gate structure. In some embodiments, the sidewall spacers are separated from the upper section of the metal gate structure by a dielectric material.In some cases, part of the lower section of the metal gate structure is located beneath the dielectric material.

[0063] In another embodiment, a method for manufacturing a semiconductor device is discussed, comprising: providing a substrate with a metal gate structure having sidewall spacers arranged on the sidewalls of the metal gate structure. In some embodiments, the method further comprises back-etching the metal gate structure and the sidewall spacers, wherein, after back-etching, an upper surface of the metal gate structure is recessed relative to an upper surface of the sidewall spacers. In some examples, the method further comprises depositing a metal cover layer over the back-etched metal gate structure and the back-etched sidewall spacers.In various embodiments, the method further comprises structuring the metal cover layer by removing sections of the metal cover layer to expose the back-etched sidewall spacers and at least a section of the back-etched metal gate structure. In some embodiments, the structured metal cover layer provides a metal gate via, and a first width of a lower section of the structured metal cover layer is greater than a second width of an upper section of the structured metal cover layer.

Claims

[1] comprising a semiconductor device: a metal gate structure having side wall spacers (316) arranged on side walls of the metal gate structure, wherein an upper surface of the metal gate structure is recessed with respect to an upper surface of the side wall spacers (316); a metal cover layer (502, 502A) arranged above and in contact with the metal gate structure, wherein a first width of a lower section of the metal cover layer (502, 502A) is greater than a second width of an upper section of the metal cover layer (502, 502A); a dielectric material (902) arranged on each side of the metal cover layer (502, 502A), wherein the side wall spacers (316) and a section of the metal gate structure are arranged under the dielectric material, and an ILD layer (320) arranged adjacent to the metal gate structure, wherein a first lateral surface of the ILD layer contacts a second lateral surface of a side wall spacer (316) arranged along a side wall of the metal gate structure, wherein the upper surfaces of the metal cover layer (502, 502A), the dielectric material and the ILD layer are substantially planar. [2] Semiconductor device according to claim 1, wherein the upper surface of the metal gate structure and the upper surface of the side wall spacers (316) are both recessed with respect to an upper surface of the ILD layer. [3] Semiconductor device according to one of the preceding claims, wherein side walls of the metal cover layer (502, 502A) are free of an adhesive layer (1002). [4] Semiconductor device according to one of the preceding claims, wherein the metal cover layer (502, 502A) defines a metal gate via. [5] Semiconductor device according to one of the preceding claims, wherein the metal cover layer (502, 502A) has a tapered profile. [6] Semiconductor device according to one of the preceding claims, further comprising: an adhesive layer (1002) between the metal cover layer (502, 502A) and the metal gate structure. [7] Semiconductor device according to one of the preceding claims, wherein the upper surfaces of the metal gate structure on each side of the metal cover layer (502, 502A) are recessed with respect to a lower surface of the metal cover layer (502, 502A). [8] Semiconductor device according to one of the preceding claims, further comprising: a selectively deposited metal layer (164) located between the dielectric material and side walls of the metal cover layer (502, 502A), wherein the selectively deposited metal layer (164) is further located between the dielectric material and the section of the metal gate structure below the dielectric material. [9] comprising a semiconductor device: a metal gate structure having an upper section and a lower section, wherein the upper section of the metal gate structure has a tapered profile, wherein a lower surface of the tapered profile has a greater width than an upper surface of the tapered profile, and wherein the lower surface of the tapered profile has a lesser width than an upper surface of the lower section of the metal gate structure; Side wall spacers (316) arranged on side walls of the metal gate structure, wherein the side wall spacers (316) contact the lower section of the metal gate structure, wherein the side wall spacers (316) are separated from the upper section of the metal gate structure by a dielectric material (902), and wherein a part of the lower section of the metal gate structure is arranged under the dielectric material, and an ILD layer (320) arranged adjacent to the metal gate structure, wherein a first lateral surface of the ILD layer contacts a second lateral surface of a side wall spacer (316) arranged along a side wall of the metal gate structure, wherein the upper surface of the upper section of the metal gate structure, an upper surface of the dielectric material, an upper surface of the side wall spacer (316) and an upper surface of the ILD layer are substantially planar. [10] Semiconductor device according to claim 9, wherein side walls of the upper section of the metal gate structure are free of an adhesive layer (1002). [11] Semiconductor device according to claim 9 or 10, wherein the upper section of the metal gate structure defines a metal gate via. [12] Method for manufacturing a semiconductor device comprising: Providing a substrate (152, 302) having a metal gate structure which has side wall spacers (316) arranged on side walls of the metal gate structure; Etching back the metal gate structure and the side wall spacers (316), wherein an upper surface of the metal gate structure is reset after etching with respect to an upper surface of the side wall spacers (316); Deposition of a metal cover layer (502, 502A) over the back-etched metal gate structure and the back-etched sidewall spacers; and Structuring the metal cover layer (502, 502A) by removing sections of the metal cover layer (502, 502A) to expose the back-etched sidewall spacers and at least one section of the back-etched metal gate structure, wherein the structured metal cover layer (502, 502A) provides a metal gate via, and wherein a first width of a lower section of the structured metal cover layer (502) is greater than a second width of an upper section of the structured metal cover layer (502). [13] The method of claim 12, further comprising: Forming a dielectric material on each side of the structured metal cover layer (502) and over the exposed back-etched sidewall spacers and at least part of the back-etched metal gate structure. [14] The method of claim 12 or 13, further comprising: selective deposition of a metal layer (164) on an upper surface and sidewall surfaces of the structured metal cover layer (502) and on an exposed surface of at least part of the back-etched metal gate structure; and Formation of a dielectric material on both sides of the structured metal cover layer (502), over the selectively deposited metal layer (164) and over the exposed back-etched sidewall spacers. [15] Method according to any one of claims 12 to 14, wherein structuring the metal cover layer (502, 502A) comprises forming the structured metal cover layer (502) with a tapered side wall profile, and wherein the tapered side wall profile is free of an adhesive layer (1002). [16] Method according to any one of claims 12 to 15, comprising structuring the metal cover layer (502, 502A): Forming a hard mask layer (602, 604) over the metal cover layer (502, 502A); Forming a structured resist layer (702) over the hard mask layer (602, 604); and Etching of sections of the hard mask layer (602, 604) and the sections of the metal cover layer (502, 502A) to expose the back-etched sidewall spacers and at least part of the back-etched metal gate structure.

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