Substrate carrier with centering function, exchange station with a substrate carrier and method for treating a substrate

Abstract

Substrate carrier (1) for receiving and transporting a substrate (2), wherein the substrate carrier (1) has a centering device suitable for centering the substrate (2) along a first axis, wherein the centering device has two opposing, inwardly pre-tensioned springs (3), furthermore with several locking devices (4) suitable for holding the substrate (2) in the substrate carrier (1) in a form-fitting and force-free manner.

Description

[0001] The present invention relates to a substrate carrier for receiving and transporting a substrate, a changing station with such a substrate carrier and a method for treating a substrate.

[0002] In a wide variety of industrial processes, substrates such as glass plates, wafers, etc. are treated in a variety of ways, for example by coating. In order to move the substrates to different process stations, substrate carriers are usually used to hold and transport a substrate (or even multiple substrates). In some processes, such as coating, it can be crucial that the alignment of the substrate with respect to the substrate carrier is clearly defined and precisely maintained. Problems can arise from possible tolerances in the substrates or from heating problems during a certain process step if the substrate carrier and substrate expand to different extents.

[0003] Therefore, various devices for centering a substrate in a substrate carrier have already been described in the prior art, see, for example, US 2014 / 0 077 431 A1 and JP 2010- 103 226 A. However, the centering devices described therein have certain disadvantages. For example, US 2014 / 0 077 431 A1 proposes clamping the substrate between spring-loaded projections and alignment pins, which means that expansion of the substrate (for example during heating) is only possible asymmetrically, namely exclusively in the direction of the springs. While JP 2010- 103 226 A allows a symmetrical process in this regard, the force provided for centering is based on the weight of the substrate, which has various disadvantages. Firstly, the exact vertical position depends on the substrate width, which leads to inaccurate positioning with corresponding tolerances.On the other hand, a certain lateral friction force will always be effective when lifting the substrates, which is undesirable. Further devices for centering a substrate in a substrate carrier are described in EP 1 538 236 B1, DE 10 2019 135 740 A1, EP 2 089 899 B1, US 2010 / 0 055 296 A1, DE 195 33 402 A1, and DE 39 19 611 A1.

[0004] It is therefore an object of the present invention to provide an improved substrate carrier for receiving and transporting a substrate. This object is achieved by a substrate carrier according to claim 1.

[0005] The substrate carrier according to the invention has a centering device suitable for centering the substrate along a first axis, wherein the centering device has two opposing, inwardly biased springs. The substrate carrier further has a plurality of locking devices suitable for holding the substrate in the substrate carrier in a form-fitting and force-free manner. The provision of two opposing springs enables symmetrical centering, which ensures centering of the substrate with respect to the substrate carrier even at different temperatures and with different expansion properties of the substrate carrier and the substrate. Furthermore, the inwardly biased springs enable a defined centering force that is independent of the weight of the substrate.

[0006] The substrate carrier according to the invention is suitable for holding and transporting any substrate. However, large-area glass substrates with an area of ​​at least 1 m are particularly preferred. 2 and a thickness of preferably less than 5 mm and particularly preferably less than 3 mm.

[0007] The substrate carrier according to the invention is not limited to the centering of a single substrate in a substrate carrier. A substrate carrier can be suitable for accommodating multiple substrates and then has several of the described centering devices and / or locking devices.

[0008] With regard to the symmetrical force effect, the two opposing, inwardly biased springs are preferably arranged on a straight line that runs parallel to the first axis. The first axis, in turn, is preferably parallel to a side edge of a substrate accommodated in the substrate carrier and is preferably oriented substantially horizontally.

[0009] In principle, any springs can be used for the centering device, with the two opposing springs preferably having the same spring stiffness. The springs preferably have a contact area designed to come into contact with the substrate, with the contact area having a radius of curvature of at least 5 mm, preferably at least 10 mm, and particularly preferably at least 20 mm. It goes without saying that due to this curvature of the contact area, not the entire contact area can come into contact with the substrate. Rather, depending on the size of the substrate and the spring position, only a very small part of the contact area (e.g., a contact point or a contact line) will come into contact with the substrate.The contact area is therefore the part of the spring that could realistically come into contact with a substrate for different substrate sizes and different spring positions.

[0010] During a corresponding process step, the substrate is clamped into the substrate carrier by means of the opposing springs and is held in a centered position by the spring forces of the two springs. However, in order to be able to insert the substrate into the substrate carrier, the contact areas of the springs should be moved outwards relative to the contact situation in order to leave sufficient space for inserting the substrate. For this purpose, it is particularly preferred that each of the springs has a receiving area for a first movement element and that the springs can be moved outwards using the first movement elements. The movement elements can be part of a changing station, described in more detail below, by means of which the springs can be opened and closed, preferably automatically.

[0011] According to the invention, the substrate carrier can further comprise a substrate which is received in the substrate carrier. Preferably, the springs in the contact region have an extension in the direction of the substrate thickness (i.e. perpendicular to the substrate surface) which is greater than the thickness of the substrate. This makes it possible, for example, to compensate for deformations of the substrate due to temperature variations, in that the contact region of the respective spring can also come into contact with a substrate that is bent upwards or downwards, thus ensuring centering. Preferably, the ratio between the extension of the contact region and the thickness of the substrate is at least 1.5 and particularly preferably at least 2. Preferably, the extension of the spring in the contact region in the direction of the substrate thickness is at least 2 mm, preferably at least 3 mm.

[0012] Depending on the process, the substrates in the substrate carrier according to the invention can be aligned in different ways. According to a first variant, the substrate in the substrate carrier is aligned substantially vertically, with the substrate resting on the substrate carrier at its lower edge, which extends parallel to the first axis. A substantially vertical alignment not only includes a directly vertical arrangement, but also an alignment that is slightly tilted compared to the perfectly vertical arrangement, i.e. by up to + / - 10°. In other words, the substrate held in the substrate carrier (or its surface) can assume an angle of between 80° and 100° with the horizontal. Because the substrate rests on the substrate carrier at its lower edge, a static friction force exists between the lower edge of the substrate and the substrate carrier.It is preferred that a decentering of the substrate along the first axis by 2 mm, preferably by 1 mm, and particularly preferably by 0.5 mm, generates a resultant force of the two springs on the substrate that is greater than this static friction force. Therefore, if the substrate is displaced by a corresponding offset from the central position with respect to the substrate carrier (for example, because the different expansion of the substrate carrier and substrate during heating results in an asymmetrical positioning of the substrate in the substrate carrier), the spring forces of the two springs produce a resultant force that is large enough to overcome the static friction force between the substrate and substrate carrier and, accordingly, to move the substrate back to its central position. It is preferred that the static friction coefficient be less than 0.2, preferably less than 0.15, and particularly preferably less than 0.1.

[0013] If the substrate carrier according to the invention is to be used, for example, in a coating process, it is further preferred that the substrate carrier has a masking layer for partially covering the substrate, wherein the masking layer is preferably an integral component of the substrate carrier. If such a masking layer is present, centering the substrate with respect to the substrate carrier (and then also with respect to the masking layer) is particularly important, since otherwise, edges in the edge regions of the substrate may be covered by the masking layer that are too large or too small.

[0014] As explained above, the substrate carrier also includes a plurality of locking devices suitable for holding the substrate in the substrate carrier in a form-fitting and force-free manner. Preferably, at least one such locking device is provided on each edge of the substrate.

[0015] In order to center the substrate not only along a first axis but with respect to two axes, preferably arranged perpendicular to one another, the substrate carrier preferably has a further centering device which is suitable for centering the substrate along a second axis, wherein the further centering device has two pairs of opposing, inwardly prestressed springs. The further centering device and its springs preferably have the same features discussed above with regard to the first centering device and its springs. However, it is preferred that the further centering device, in contrast to the first centering device, has two pairs of opposing, inwardly prestressed springs, i.e. a total of four springs. This is intended to prevent the substrate from twisting or tilting relative to the substrate carrier.The provision of two centering devices with a total of six springs is particularly advantageous when the substrate is essentially aligned horizontally in the substrate carrier, with the substrate resting on the substrate carrier at its lateral edges. Here, too, perfect horizontal alignment is not required; rather, a deviation of up to 20° from the horizontal alignment is tolerated.

[0016] Analogous to the vertical alignment discussed above, a static friction force exists between the lateral edges of the substrate and the substrate carrier during horizontal alignment. Preferably, a decentering of the substrate along the first axis or the second axis by 2 mm, preferably by 1 mm, and particularly preferably by 0.5 mm, generates a resulting force of the corresponding springs on the substrate that is greater than the static friction force. Here, too, the static friction coefficient is preferably less than 0.2, more preferably less than 0.15, and particularly preferably less than 0.1.

[0017] The present invention further relates to a changing station with a substrate carrier as described above. The changing station is configured to exchange the substrates in the substrate carrier, i.e., to insert substrates into the substrate carrier and to remove them from the substrate carrier after the respective process. As already discussed above, each of the springs preferably has a receiving area for a first movement element. Accordingly, the changing station has two or more first movement elements that are suitable for moving the springs outward. This preferably occurs automatically, for example, with the aid of an actuator of the changing station.

[0018] Furthermore, the changing station has several locking devices on the substrate carrier, which are designed to hold the substrate in the substrate carrier in a form-fitting and force-free manner. These locking devices can also be moved, preferably automatically, for example, using an actuator.

[0019] The present invention further relates to a method for treating a substrate. According to the invention, a substrate is first placed in a substrate carrier as described above, preferably with the aid of the change station discussed above. Subsequently, the substrate is treated while it is in the substrate carrier, for example, heated, cleaned, polished, coated, assembled, etc.

[0020] Before the substrate is inserted into the substrate carrier, the springs of the centering device are moved outwards, preferably automatically. If the substrate carrier has the locking devices discussed above, which are suitable for holding the substrate in the substrate carrier in a form-fitting and force-free manner, the locking devices are preferably also opened, preferably automatically, before the substrate is inserted into the substrate carrier. In this state, i.e. with the locking devices opened and the springs moved outwards, the substrate can be easily inserted into the substrate carrier. After the substrate has been inserted, the springs of the centering device are then moved inwards, preferably automatically, and if necessary, the locking devices are closed, preferably automatically. The substrate is then held in the substrate carrier in a form-fitting and force-free manner and positioned in a central position by the springs of the centering device.In this state the treatment of the substrate can then take place.

[0021] After the process step (or possibly several process steps), the substrate is removed from the substrate carrier. Both insertion and removal of the substrate are preferably carried out using the change station discussed above.

[0022] Analogous to the insertion process, the springs of the centering device are moved outwards, preferably automatically, before the substrate is removed, and the optional locking devices are opened, preferably automatically, before the substrate is removed.

[0023] As already mentioned above, the invention is particularly advantageous when the substrate carrier and the substrate behave differently during heating or cooling. It is therefore preferred that the substrate carrier and / or the substrate is / are heated from a first temperature to a second temperature between the introduction of the substrate and the treatment of the substrate and / or during the treatment of the substrate. The first temperature is preferably in a range below 100°C, more preferably below 80°C, and particularly preferably below 70°C, and the second temperature is preferably in a range above 120°C, more preferably above 150°C, and particularly preferably above 180°C.

[0024] Between the introduction of the substrate into the substrate carrier and the treatment of the substrate and / or during the treatment of the substrate, the substrate is preferably held in the substrate carrier in a form-fitting and force-free manner, preferably automatically, by means of several locking devices.

[0025] According to a first variant, the substrate can be oriented substantially vertically during the treatment step and preferably also during the insertion of the substrate into the substrate carrier and / or during the removal of the substrate from the substrate carrier. In this case, the centering device is preferably located in the lower half and particularly preferably in the lower third of the substrate. It is further preferred that essentially no frictional forces act between the substrate and the substrate carrier during the step of inserting the substrate into the substrate carrier and / or during the step of removing the substrate from the substrate carrier.This can be achieved, for example, by inserting the substrate into the substrate carrier at an angle relative to a plane defined by the substrate carrier, such that the lower edge of the substrate initially rests on a lower side of the substrate carrier and the substrate is then tilted, preferably frictionlessly, into the plane of the substrate carrier. This is preferably done by means of a robot. A relatively small inclination of the substrate relative to the plane defined by the substrate carrier may be sufficient, for example, an angle of at least 1°, preferably at least 5°, or particularly preferably at least 15°.Similarly, when removing the substrate from the substrate carrier, it is preferred that the substrate is first tilted out of the plane defined by the substrate carrier, so that only the lower edge of the substrate rests on a lower side of the substrate carrier, and then the substrate is removed in the tilted state, preferably without friction. This is also preferably carried out by means of a robot.

[0026] The present invention is explained in more detail below with reference to the figures. These show: - Fig. 1 a plan view of a substrate carrier according to the invention according to a preferred embodiment; - Fig. 2 the spring of a centering device according to the invention according to a preferred embodiment in the open position; - Fig. 3 the spring according to Fig. 2 in the closed position; - Fig. 4 a cross-sectional view of a substrate carrier according to the invention according to a preferred embodiment; - Fig. 5 a detailed view of Fig. 4; - Fig. 6 a view analogous to Fig. 5, but with offset substrate; - Fig. 7 a plan view of a substrate carrier according to the invention according to a further preferred embodiment; - Fig. 8 a perspective view of the movement elements for a centering device of a changing station according to the invention according to a preferred embodiment; - Fig. 9 is a perspective view of the movement elements for a closure device of a changing station according to a preferred embodiment; - Fig. 10 shows a vertical cross section through a substrate in the substrate carrier according to a preferred embodiment; and - Fig. 11 a vertical cross section through the substrate according to Fig. 10 during removal.

[0027] Fig. 1 shows a preferred embodiment of a substrate carrier 1 according to the invention in plan view. In this case, a substrate 2 is already accommodated in the substrate carrier 1, which is held in the substrate carrier 1 in a form-fitting and force-free manner by means of several locking devices 4. Even though ten locking elements 4 are shown in the illustrated embodiment, it should be understood that fewer or more locking elements can be provided in other symmetrical or asymmetrical arrangements. The substrate carrier 1 further comprises a centering device suitable for centering the substrate along a first axis, wherein the centering device comprises two opposing, inwardly preloaded springs 3.

[0028] In the preferred embodiment shown, the substrate 2 is aligned substantially vertically in the substrate carrier 1, so that the substrate 2 rests on the substrate carrier 1 at its lower edge, which extends parallel to the first axis between the two springs 3. With such an arrangement, the vertical alignment of the substrate 2 with respect to the substrate carrier 1 is defined by the substrate 2 resting on the substrate carrier at its lower edge. Centering occurs only in the horizontal direction, i.e., along the first axis extending between the two springs 3. For this purpose, at least two opposing springs 3 are required on the respective vertical side edges of the substrate 2, which are preferably arranged at the same height relative to the lower edge of the substrate 2. The springs 3 of the centering device are preferably located near the lower edge, as in Fig. 1. This allows the forces for centering the substrate 2 to act in its lower area. However, the springs can also be provided higher up. Furthermore, two or more pairs of opposing springs can also be provided.

[0029] In the Fig. 2 and Fig. 3 is the right of the two centering springs 3 of the Fig. 1 shown in detail, once in the open position (cf. Fig. 2) and once in the closed position (cf. Fig. 3). The spring 3 comprises a curved spring element 6, which is mounted on two holders 7. This spring element 6 has a contact area 6a, which is intended to come into contact with the substrate 2 at its side edge. This contact area has, as shown in Fig. 2, has a curvature whose radius of curvature is preferably at least 5 mm. In the preferred embodiment shown, the movable end of the spring element 6 ends in the region of the contact area 6a in a loop or a hook, which has or forms a receiving area for a first movement element 9a. This first movement element 9a can be part of a changing station, which will be explained below. In the embodiment shown, the first movement element 9a is essentially a pin, which can dip into the loop or curve or the hook of the spring element 6. In the embodiment shown in Fig. In the open spring position shown in Figure 2, the spring element 6 is held in the outwardly or rightwardly deflected position by means of this pin 9a, counter to its preload, so that the contact area 6a does not touch the side edge of the substrate 2. In this position of the spring 3, the substrate 2 can be inserted into or removed from the substrate carrier in a simple manner and without interaction with the spring 3.

[0030] As soon as the substrate 2 has been inserted into the substrate carrier 1, the pin 9a is moved along the elongated hole 8 on a circular path to the left (cf. Fig. 3), so that the spring element 6 springs inwards or to the left due to its pre-tension and the contact area 6a comes into contact with a side edge of the substrate 2. To ensure that the spring element 6 does not get caught or tilted, a second movement element 9b can be provided, which is moved together with the first movement element 9a along the curved slot 8 and, in the preferred embodiment shown, presses from the outside onto the loop or hook of the spring element 6 in order to move the spring element 6 into the Fig. 3. Subsequently, the two pins 9a and 9b can be removed from the corresponding receiving areas of the spring 3, since the spring element 6 now acts on the side edge of the substrate 2 solely due to its preload.

[0031] In this case, Fig. 3 shows a situation in which the contact area 6a of the spring element 6 of the spring 3 just comes into contact with a side edge of the substrate 2 without exerting a significant force on the substrate 2, since the movable end of the spring element 6 is in the position shown in Fig. 3 position against the stop 14. However, if the position shown in Fig. If, in the position shown in Figure 3, the substrate 2 were to expand along the first axis, i.e., here in the horizontal direction (or the substrate carrier 1 were to contract accordingly), the right-hand side edge of the substrate 2 would press the contact area 6a of the spring element 6 outwards or to the right, so that the spring element 6 would no longer rest against the stop 14. The spring force then exerted by the spring element 6 on the side edge of the substrate 2 (as well as the corresponding force of the opposite spring element) would then ensure a symmetrical or centered arrangement of the substrate 2 in the substrate carrier 1.

[0032] In Fig. 8 shows a perspective view of a corresponding actuator 11 of a changing station (not shown in detail and known per se) for opening and closing the springs. The actuator 11 is provided with two movement elements, of which the first movement element 10a is clearly visible. This extends through the curved slot 8 into the loop formed by the spring element 6 in the region of the contact area 6a, as previously described with reference to FIG. Fig. 2 and Fig. 3. The actuator 11 causes the two movement elements or pins to move along the elongated hole 8 as described above. Another actuator (not shown) can retract the two movement elements from the corresponding receiving areas 9a and 9b of the spring.

[0033] A corresponding actuator 13 and corresponding engagement elements or pins 12a and 12b can be provided for opening and closing the closure devices 4 (cf. Fig. 9). The actuator 13 moves the pins 12a and 12b for opening and closing the Fig. 9 shown locking loop 4a, which secures the substrate, for example, against tipping out of the substrate carrier.

[0034] Fig. 4 shows a sectional view of the substrate carrier according to Fig. 1 along the first axis. As can be clearly seen there, the substrate 2 rests against the substrate carrier 1 at its lateral edges, and the two opposite (here vertical) side edges of the substrate 2 are in contact with the contact areas 6a of the spring element 6 of the two springs 3.

[0035] Fig. Figure 5 shows an enlarged detail of the left spring 3, where it is clearly visible that the left side edge of the substrate 2 directly abuts the contact area 6a of the spring 3. It is preferred that the extension or thickness D1 of the spring 3 in the contact area 6a perpendicular to the substrate surface be significantly greater than the thickness D2 of the substrate. As already explained, the ratio between D1 and D2 is preferably at least 1.5 and particularly preferably at least 2.

[0036] The advantage of this feature is Fig. 6, which is analogous to the Fig. 5, however, the substrate 2 is offset downward by an offset V, which can be caused, for example, by a curvature of the substrate. Since the thickness D1 is greater than the thickness D2, the outer edge of the substrate 2 still rests in the contact area 6a of the spring 3 in this situation, so that centering by the spring 3 can still be ensured.

[0037] The substrate carrier according to the invention enables, among other things, a friction-free removal of a substrate from the substrate carrier, which can be seen from the schematic cross-sectional views of the Fig. 10 and Fig. 11 will be explained. Fig. Figure 10 shows a vertical cross section through a substrate 2 in the substrate carrier 1 according to a preferred embodiment, wherein the substrate 2 rests on its lower edge 2a on the substrate carrier 1. In the preferred embodiment shown, the substrate carrier has a strip 15 made of a material with a low coefficient of static friction in the region of the support surface in order to minimize the static friction force between the substrate and the substrate carrier. Fig. 10, the substrate is secured by means of the locking loop 4a (see also Fig. 9) of the closure device 4 against tipping out of the substrate carrier. Fig. The actuator 13 shown in Figure 9 now moves the locking loop 4a downwards to open the locking device 4 (cf. Fig. 11). In this state, the substrate can now first be tilted out of the plane defined by the substrate carrier (here: vertical), preferably by means of a robot, so that only the lower edge 2a of the substrate 2 rests on a lower side 15 of the substrate carrier, as shown in Fig. 11. The substrate can then be removed in an inclined position, preferably without friction. In a similar manner, the substrate can be inserted into the substrate carrier without friction.

[0038] Instead of a vertical alignment of the substrate, the substrate can also be aligned essentially horizontally in the substrate carrier, as is exemplified in Fig. 7. In this case, however, it is preferred that, in addition to the two springs 3 of the first centering device, a further centering device with two pairs of opposing, inwardly biased springs 23 is provided, which is suitable for centering the substrate along a second axis that is perpendicular to the first axis. The arrangement of the springs 3 and 23 in Fig. 7 is exemplary, although the symmetrical arrangement is preferred.

[0039] In the preferred embodiments shown, the springs are designed as leaf springs. However, other spring types may also be used in the context of the present invention. However, it is preferred that the spring be easily assembled and disassembled by simply plugging it in.

Claims

[1] Substrate carrier (1) for receiving and transporting a substrate (2), wherein the substrate carrier (1) has a centering device which is suitable for centering the substrate (2) along a first axis, wherein the centering device has two opposing, inwardly prestressed springs (3), further comprising a plurality of locking devices (4) which are suitable for holding the substrate (2) in the substrate carrier (1) in a form-fitting and force-free manner. [2] Substrate carrier according to claim 1, wherein the two springs (3) have the same spring stiffness. [3] Substrate carrier according to one of the preceding claims, wherein each of the springs (3) has a contact region (6a) intended to come into contact with the substrate (2), wherein the contact region (6a) has a radius of curvature of at least 5 mm. [4] Substrate carrier according to one of the preceding claims, wherein each of the springs (3) has a receiving area for a first movement element (9a) and wherein the springs can be moved outwards by means of the first movement elements (9a). [5] Substrate carrier according to one of the preceding claims, further comprising a substrate (2) received in the substrate carrier. [6] Substrate carrier according to claim 5, wherein each of the springs (3) has a contact region (6a) which is intended to come into contact with the substrate (2), wherein the spring in the contact region has an extension in the direction of the substrate thickness which is greater than the thickness of the substrate. [7] Substrate carrier according to claim 5 or 6, wherein the substrate (2) in the substrate carrier (1) is aligned substantially vertically and wherein the substrate rests on the substrate carrier at its lower edge (2a), which extends parallel to the first axis, wherein a substantially vertical alignment also includes an alignment tilted by up to + / - 10° with respect to the perfectly vertical arrangement. [8] Substrate carrier according to claim 7, wherein a static friction force exists between the lower edge (2a) of the substrate and the substrate carrier (1), and wherein a decentering of the substrate (2) along the first axis by 2 mm generates a resulting force of the two springs (3) on the substrate which is greater than the static friction force. [9] Substrate carrier according to one of the preceding claims, further comprising a masking for partially covering the substrate (2), wherein the masking is an integral part of the substrate carrier (1). [10] Substrate carrier according to one of the preceding claims, further comprising a further centering device adapted to center the substrate along a second axis, the further centering device comprising two pairs of opposing, inwardly biased springs (3). [11] Substrate carrier according to claim 10, dependent on claim 1, further comprising a substrate (2) which is received in the substrate carrier (1), wherein the substrate is aligned substantially horizontally in the substrate carrier, wherein the substrate rests on the substrate carrier at its lateral edges, wherein a substantially horizontal alignment also includes an alignment tilted by up to + / - 20° with respect to the perfectly horizontal arrangement. [12] Substrate carrier according to claim 11, wherein a static friction force exists between the lateral edges of the substrate (2) and the substrate carrier (1), and wherein a decentering of the substrate along the first or second axis by 2 mm generates a resulting force of the respective springs on the substrate which is greater than the static friction force. [13] Substrate carrier according to claim 8 or 12, wherein the static friction coefficient is less than 0.

2. [14] Changing station with a substrate carrier according to one of the preceding claims. [15] Changing station according to claim 14, wherein each of the springs (3) has a receiving area for a first movement element (9a) and wherein the changing station has two or more first movement elements (9a) which are suitable for moving the springs (3) outwards. [16] Changing station according to claim 15, wherein the first moving elements (9a) automatically move the springs (3) outwards. [17] Changing station according to claim 14, 15 or 16, wherein the locking devices (4) can be moved automatically. [18] Method for treating a substrate (2) comprising the following steps: a) introducing a substrate (2) into a substrate carrier (1) according to one of claims 1 to 13; and b) Treating the substrate (2). [19] Method according to claim 18, wherein the springs (3) of the centering device are moved outwards before the introduction of the substrate (2) and wherein the closure devices (4) are opened before the introduction of the substrate (2). [20] Method according to claim 18 or 19, wherein the springs (3) of the centering device are moved inwards after the introduction of the substrate (2) and wherein the closure devices (4) are closed after the introduction of the substrate (2). [21] A method according to any one of claims 18 to 20, further comprising the step: c) Removing the substrate (2) from the substrate carrier (1). [22] Method according to claim 21, wherein the springs (3) of the centering device are moved outwards before the removal of the substrate (2) and wherein the closure devices are opened before the removal of the substrate. [23] Method according to one of claims 18 to 22, wherein the substrate carrier (1) and / or the substrate (2) are heated from a first temperature to a second temperature between steps a) and b). [24] The method of claim 23, wherein the first temperature is in a range below 100°C. [25] A method according to claim 23 or 24, wherein the second temperature is in a range above 120°C. [26] Method according to one of claims 18 to 25, wherein the substrate (2) is held in the substrate carrier (1) between steps a) and b) by the plurality of closure devices (4) in a form-fitting and force-free manner. [27] Method according to claim 18, dependent on claim 1, wherein the substrate (2) in step b) is oriented substantially vertically, wherein a substantially vertical orientation also includes an orientation tilted by up to + / - 10° relative to the perfectly vertical arrangement. [28] Method according to claim 27, wherein the centering device is located in the lower half of the substrate (2). [29] Method according to claim 27 or 28, wherein in steps a) and / or c) no frictional forces act between the substrate (2) and the substrate carrier (1). [30] Method according to claim 29, wherein in step a) the substrate (2) is introduced into the substrate carrier at an inclination relative to a plane defined by the substrate carrier (1) such that firstly the lower edge of the substrate rests on a lower side of the substrate carrier and then the substrate is tilted into the plane of the substrate carrier. [31] Method according to claim 29 or 30, wherein in step c) the substrate (2) is first tilted out of the plane defined by the substrate carrier (1) so that only the lower edge of the substrate rests on a lower side of the substrate carrier, and then the substrate is removed in the tilted state.

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