Holding and separating device, automatic holding and separating system and holding and separating process for electrostatic chucks

Abstract

An adhesion and separation device (50) for electrostatic chucks (100) used for automatic adhesion or separation between a wireless electrostatic chuck (100) and a thinned substrate (200), wherein the underside of the electrostatic chuck (100) is provided with positive and negative conductive electrodes (105) by which an electrostatic field is generated, the adhesion and separation device (50) comprising: a frame (51, 52); a static electricity generating group (60) arranged on the frame (51, 52) and having a work plane for selectively mounting the electrostatic chuck (100), the work plane being provided with conductive electrodes (63) corresponding to the positive and negative conductive electrodes (105) located on the underside of the electrostatic chuck (100), the work plane being configured to position the electrostatic chuck (100) or the substrate (200) in the correct position; a substrate transfer group (80) arranged on the frame (51, 52) and opposite the static electricity generating group (60) so that the substrate transfer group (80) can attract a substrate (200) which is in the correct position and is thus displaceable relative to the static electricity generating group (60); wherein, after the substrate (200) and the electrostatic chuck (100) have been pressed against each other by driving by means of the substrate transfer group (80), an electrostatic field for attracting the substrate (200) can be generated at the electrostatic chuck (100) by actuating the static electricity generating group (60).

Description

Field of the invention

[0001] The present invention belongs to the automatic clamping technology for electrostatic chucks and particularly relates to a clamping and separating device, an automatic clamping and separating system and a clamping and separating method for electrostatic chucks. State of the art

[0002] In recent years, due to the miniaturization trend in semiconductor manufacturing, the thickness of the silicon wafer has been reduced to less than 100 micrometers. In addition, the thickness of the ultra-thin blue glass filter used for mobile phone camera lenses is close to 200 μm, 100 μm, or even less than 50 μm. When the area of this type of thinned substrate is larger, especially when the substrate has a diameter of 15.24 cm (6 inches) or more and a thickness of 300 μm or less, the thinned substrate becomes very soft and elastic, resulting in warpage. Warpage causes unevenness and stress on the substrate during the manufacturing process, leading to process defects such as uneven thickness during coating.Due to the warpage problem occurring in the substrate, effective focusing cannot be performed during inspection, resulting in detection errors or delays during inspection time, which directly impact the detection of defective products. In addition, the substrates also have problems such as low retention capacity and easy breakage during transportation and assembly. Therefore, substrate warpage has a significant adverse impact on the reliability of the manufacturing process and causes problems such as increased manufacturing costs and defect rates.

[0003] To keep the substrate flat and ensure a smooth transition into the manufacturing process, a temporary bonding process is currently used to reinforce the substrate tension. The temporary bonding process mainly uses multilayer polymer bonding materials to reversibly bond the substrate to a carrier. However, after the manufacturing process, the carrier must be peeled off. It is important to ensure good substrate yield during bonding and peeling. Furthermore, there are some problems encountered during the temporary bonding process, such as the mismatch of the thermal expansion coefficients (CTE) of the bonding materials used and the acid and alkali problems of the bonding materials in the manufacturing environment.

[0004] The current improved method for substrate tightening is to use an electrostatic chuck (e-chuck or supporter) during substrate fabrication. Currently, the electrostatic chuck is used manually for substrate tightening. However, this method has the problems of slow speed, poor tightening quality, and poor efficiency. Cracks or fragments may even occur due to misalignment, displacement, or uneven pressing.

[0005] Document US 2008 / 0 237 819 A1 describes a conventional handling technique for processing ultra-thin wafers in commercially available processing equipment for normal wafers. A carrier wafer and a wafer assembly are disclosed, with which thin or ultra-thin wafers can be handled. Object of the invention

[0006] It is an object of the present invention to provide an adhesion and separation device for electrostatic chucks, by which the adhesion efficiency can be increased, the adhesion failure rate can be greatly reduced, and the occurrence of cracks or fragments can be minimized.

[0007] It is a further object of the present invention to provide an automatic adhesion and separation system for electrostatic chucks, which, after automatic cleaning, baking and pre-alignment, can meet the requirements of high-precision manufacturing processes and can perform automatic adhesion to meet the requirements of automated substrate production.

[0008] It is still another object of the present invention to provide an electrostatic chuck adhesion and separation method by which an electrostatic chuck can quickly and accurately automatically attract a substrate, so that the electrostatic chuck and the substrate adhered thereto can be used in the subsequent manufacturing process, thereby significantly increasing the process yield of the substrates and thus reducing costs and increasing profits.

[0009] The present invention solves the above-mentioned objects and achieves the advantageous effects mainly by the following technical means: The invention is for automatic adhesion and separation after adhesion between an electrostatic chuck and a substrate, wherein the underside of the electrostatic chuck is provided with conductive electrodes by which an electrostatic field is generated or canceled, wherein the circumference of the electrostatic chuck and that of the substrate each have a positioning notch for determining the direction and position, wherein the automatic adhesion and separation system comprises: a machine body comprising at least one first material inlet and outlet opening and at least one second material inlet and outlet opening; at least one baking device arranged in the machine body, the baking devices comprising at least a first baking device for baking the substrate and at least a second baking device for baking the electrostatic chuck; at least one pre-alignment device arranged in the machine body and used to pre-determine a specified orientation and position of the electrostatic chuck and the substrate by means of the corresponding positioning notches; at least one adhesion and separation device comprising a static electricity generating group for attracting an electrostatic chuck and a substrate transfer group for attracting a substrate, wherein the substrate transfer group is linearly displaceable relative to the static electricity generating group, so that the substrate is pressed onto the surface of the electrostatic chuck of the static electricity generating group by driving by the substrate transfer group to generate or cancel an electrostatic field upon actuation of the electrostatic chuck, so that the electrostatic chuck and the substrate can be adhered to or separated from each other in the same specified orientation and position; and at least one transfer device arranged in the machine body, wherein the transfer devices can grip the substrate or the electrostatic chuck and move it between the first baking device and the second baking device of the baking device, the pre-alignment device and the adhesion and separation device, which correspond to the first material inlet and outlet opening and the second material inlet and outlet opening. Brief description of the drawings Fig. 1 shows a schematic view of the structure of the automatic adhesion and separation system according to the invention; Fig. Figure 2 shows a schematic view of the operations of the automatic adhesion and separation system according to the invention; Fig. Fig. 3 is a schematic view showing the appearance of the automatic bonding and separating device according to the present invention; Fig. 4 shows a schematic side view of the automatic adhesion and separation device according to the invention; Fig. Fig. 5 is a schematic view showing the appearance of the static electricity generating group of the carrier of the automatic adhesion and separation device according to the present invention; Fig. 6 shows a schematic partial plan view of the static electricity generating group of the carrier of the automatic adhesion and separation device according to the invention; Fig. Figure 7 shows a schematic side view of the static electricity generating group of the carrier of the automatic adhesion and separation device according to the invention; Fig. Figure 8 is a schematic side view of the operations of the static electricity generating group of the support of the automatic adhesion and separation device according to the invention; Fig. Figure 9 shows another schematic side view of the operations of the static electricity generating group of the support of the automatic adhesion and separation device according to the invention; Fig. 10 is a schematic view showing the appearance of the substrate transfer group of the adhesion and separation device according to the present invention; Fig. 11 shows a schematic partial bottom view of the substrate transfer group of the adhesion and separation device according to the invention; Fig. 12 shows a schematic flow diagram of the adhesion and separation process according to the invention. Detailed description of the embodiment

[0010] It will be Fig. 1. The automatic adhesion system for electrostatic chucks according to the invention is used for automatic adhesion and separation between a wireless electrostatic chuck 100 (e-chuck or supporter) and a large-area thinned substrate 200 (based on a substrate with a diameter of 15.24 cm (6 inches) and a thickness of less than 300 µm), wherein the substrate 200 can be a semiconductor wafer, a glass plate, or a plastic plate, wherein the automatic adhesion and separation system comprises a machine body 10, at least one transfer device 2, at least one baking device 30, at least one pre-alignment device 40, and at least one adhesion and separation device 50.

[0011] It is based on the Fig. 1 and Fig. 2, which show the detailed structure of the preferred embodiment of the automatic bonding and separating system. At least one first material inlet and outlet opening 16 and at least one second material inlet and outlet opening 18 are arranged on the machine body 10, wherein the material inlet and outlet openings can be the material inlet and outlet openings of a typical semi-standardized FOUP and serve to automatically inlet and outlet the electrostatic chuck 100 and the substrate 200. Furthermore, the transfer devices 20 can be used to grip the electrostatic chuck 100 or the substrate 200 and to translate and position it in the machine body 10 between the first material inlet and outlet opening 16 or the second material inlet and outlet opening 18, the baking device 30, the pre-alignment device 40, and the bonding and separating device 50.The transfer devices 20 can be linear, six-axis, or seven-axis robot arms. In some embodiments, a slide rail mechanism 15 can be arranged in the machine body 10, and the transfer devices 20 can be slidably arranged on the slide rail mechanism 15, so that the transfer devices 20 can selectively slide on the slide rail mechanism 15.

[0012] Furthermore, the baking device 30 is arranged in the machine body 10, wherein the baking device 30 can comprise at least a first baking device 31 for receiving and baking the substrate 200 and a second baking device 35 for receiving and baking the electrostatic chuck 100. In some embodiments, a cleaning device 38 can be arranged on the side of the machine body 10 corresponding to the second material inlet and outlet opening 18, so that the electrostatic chuck 100 can be cleaned before baking. A rinsing, wiping, or non-contact technique for particle removal can be used for the cleaning device 38. The pre-alignment devices 40 are arranged in the machine body 10 and serve to detect the positioning notch 101, 201 (notch of the wafer, such as a V-shaped notch and a flat cutting edge) of the electrostatic chuck 100 orof the substrate 200, so that the electrostatic chuck 100 and the substrate 200 are inserted into the adhesion and separation devices 50 in a specified orientation and position, thus allowing the electrostatic chuck 100 and the substrate 200 to adhere to each other in the same specified orientation and position. According to some embodiments, at least one temporary material storage opening 45 for temporarily storing the electrostatic chuck 100 or the substrate 200 for the adhesion process is arranged in the machine body 10 to increase the efficiency of the automatic operation.

[0013] Referring to the Fig. 3 and Fig. 4, the adhesion and separation devices 50 are arranged in the machine body 10. The adhesion and separation devices 50 comprise a static electricity generating group 60 for attracting the electrostatic chuck 100 and a substrate transfer group 80 for attracting the substrate 200, which are displaceable relative to one another. The adhesion and separation device 50 comprises a frame attachable to the machine body 10, the frame having a lower frame 51 and an upper frame 52, the static electricity generating group 60 being arranged above the lower frame 51.By arranging a lifting-lowering mechanism 82 of the substrate transfer group 80 provided on the upper frame 52 correspondingly above the static electricity generating group 60, the substrate transfer group 80 can suck the substrate 200 relative to the static electricity generating group 60 or drive the substrate 200 so that it is correspondingly pressed onto the surface of the electrostatic chuck 100 located above the static electricity generating group 60.

[0014] Referring to the Fig. 5, Fig. 6 and Fig. 7, the static electricity generating group 60 comprises a main frame plate 61 and two side wing plates 65 pivotably arranged on two side edges of the main frame plate 61. The main frame plate 61 and the two side wing plates 65 form a working plane on which the electrostatic chuck 100 can lie flat. The main frame plate 61 of the working plane is provided with a detection element 610 for detecting whether the electrostatic chuck 100 or the substrate 200 is present. Furthermore, a material lifting element 62 is arranged in the main frame plate 61, the material lifting element 62 being displaceable between the working plane and a higher material receiving plane (as in Fig. 8), which is convenient for the transfer device 20, such as the gripper of a robot arm, to be guided through the electrostatic chuck 100 or the substrate 200 and placed thereon or removed therefrom. The material lifting element 62 may consist of at least three synchronously raised and lowered lifting rods or a raised and lowered lifting plate. A telescopic cylinder 70 is arranged between the center of the outer lower edge of the two side wing plates 65 not belonging to the main frame plate 61 and the lower frame 51 in order to selectively actuate the outer side edges of the side wing plates 65, which do not belong to the two side wing plates 65 provided with a downwardly inclined outer side edge, so that they can be selectively tilted downward (as in Fig. 9), and to cause the electrostatic chuck 100 and the substrate 200 adhered thereto to separate from each other along an outer edge. Furthermore, the main frame plate 61 and the side wing plates 65 are each provided with a series of suction parts 64 (such as vacuum chucks) corresponding to the bottom surface of the electrostatic chuck 100, for selectively fixing the electrostatic chuck 100 to the working plane of the main frame plate 61 and the side wing plates 65, respectively.The main frame plate 61 is provided with two or a multiple of two conductive electrodes 63 for supplying current, which correspond to the positive and negative conductive electrodes 105 located on the underside of the electrostatic chuck 100, so that an electrostatic field can be generated or canceled on the surface of the electrostatic chuck 100 with respect to the substrate 200, and thus the electrostatic chuck 100 and the substrate 200 can be adhered to or separated from each other. The two side wing plates 65 are each provided with a guide rod group 66, wherein the guide rod group 66 comprises at least two fixed guide rods 660 and at least one movable guide rod 665 surrounding the outer periphery of the electrostatic chuck 100.In the present invention, two fixed guide rods 660 and two movable guide rods 665 represent the main embodiment, wherein the electrostatic chuck 100 can be pressed into the correct horizontal position of the fixed guide rods 660 by the movable guide rods 665. Furthermore, the upper periphery of each of the fixed guide rods 660 and the movable guide rod 665 is each provided with an inclined guide surface 661, 666, so that the electrostatic chuck 100 or the substrate 200 can be guided into the correct area of the work plane when the material lifting element 62 is lowered.Furthermore, a touch detection group 67 and an optical detection group 68 are arranged at a position of the static electricity generating group 60 corresponding to the outer circumference of the electrostatic chuck 100, wherein the touch detection group 67 comprises at least two retractable touch rods 670 surrounding the outer circumference of the electrostatic chuck 100 and at least one forward and backward movable alignment guide rod 675, wherein the alignment guide rod 675 can correspond to a positioning notch 101, 201 of the electrostatic chuck 100 or the substrate 200, so that the alignment guide rod 675 is rotated about the axis by means of the positioning notch 101, 201 of the electrostatic chuck 100 or the substrate 200 for alignment.An alarm may be triggered if the electrostatic chuck 100 or the substrate 200 is not aligned and comes into contact with one of the touch rods 670. The optical sensing assembly 68 includes at least three optoelectronic elements 680 surrounding the outer periphery of the electrostatic chuck 100, which serve to trigger an alarm if the electrostatic chuck 100 or the substrate 200 is not aligned and obscures one of the optoelectronic elements 680. In this way, precise alignment of the electrostatic chuck 100 and the substrate 200 can be ensured. As shown in FIG. Fig. As shown in Figure 9, a blowing unit 69 is arranged on the lower frame of the static electricity generating group 60 at the positions corresponding to the two side wing plates 65, each blowing unit 69 having a jet nozzle 690 extending axially from the outer periphery of the electrostatic chuck 100. When the electrostatic chuck 100 begins to separate and is driven by the two side wing plates 65 to peel off the substrate 200, a high-speed gas can be injected, whereby the electrostatic chuck 100 and the substrate 200 can be effectively separated from each other.

[0015] Referring to the Fig. 10 and Fig. 11, the substrate transfer assembly 80 consists of a frame base 81 that can selectively attract the substrate 200. The frame base 81 can be moved linearly up and down by a lifting-lowering mechanism 82 to selectively press the substrate 200 against the electrostatic chuck 100 located below it. The surface of the frame base 81 is provided with a detection element 810 for detecting the presence of a substrate 200. The frame base 81 has a suction surface, wherein the suction surface of the frame base 81 is provided with a plurality of suction parts 83, which may include the surface suction parts 830 located in the area corresponding to the substrate 200 or the edge suction parts 835 located near the edge of the substrate 200, wherein a suction technique based on Bernoulli's law may be used for the surface suction parts 830 in order to reduce possible damage to the substrate 200 during the adhesion process.Furthermore, an optical detection group 85 is arranged at a location on the substrate transfer group 80 corresponding to the outer circumference of the substrate 200. The optical detection group 85 comprises at least three optoelectronic elements 850 surrounding the outer circumference of the substrate 200. If the substrate 200 is not aligned and obscures one of the optoelectronic elements 850, an alarm can be triggered to ensure that the substrate 200 is accurately aligned. According to some embodiments, the circumference of the substrate transfer group 80 can be provided with a retractable and extendable waste protection element 86. When extended, the area covered by it is smaller than the outer diameter of the substrate 200.When the substrate 200 enters the suction surface of the substrate transfer group 80, the waste protection member 86 may be extended to prevent the substrate 200 from falling due to ineffective suction and to ensure that the substrate 200 is effectively sucked by the substrate transfer group 80. The waste protection member may then be retracted. According to some embodiments, the substrate transfer group 80 may be a robotic arm capable of grasping the substrate 200 relative to the static electricity generating group 60.

[0016] In this way, an automatic adhesion system is constructed by which the electrostatic chuck 100 and the substrate 200 can be automatically adhered to or separated from each other.

[0017] It will be Fig. 12, which shows a flowchart of the automatic adhesion and separation process for electrostatic chucks. The adhesion and separation process is for automatic adhesion and automatic separation after adhesion between an electrostatic chuck 100 and a substrate 200, wherein the substrate 200 can be a semiconductor wafer, a glass plate, or a plastic plate, wherein the underside of the electrostatic chuck 100 is provided with conductive electrodes 105 through which an electrostatic field is generated, wherein the periphery of the electrostatic chuck 100 and the substrate 200 each has a positioning notch 101, 201 for determining the direction and position, wherein the adhesion and separation process comprises the following process steps (see the Fig. 1, Fig. 2 and Fig. 3): Step to prepare an electrostatic chuck and a substrate: An electrostatic chuck 100 is received by one of the transfer devices 20 located in the machine body 10 of the automatic adhesion and separation system via the second material inlet and outlet opening 18, and a substrate 200 is received by another transfer device 20 via the first material inlet and outlet opening 16; Step for baking the electrostatic chuck and the substrate to keep the surfaces dry: After obtaining the electrostatic chuck 100 and the substrate 200, respectively, the electrostatic chuck 100 can be placed into the corresponding second baking device 35 of the baking device 30 by means of one of the transfer devices 20, and the substrate 200 can be placed into the corresponding first baking device 31 of the baking device 30 by means of the other transfer device 20 to bake the two and keep their surfaces dry; Step for pre-aligning the electrostatic chuck and the substrate in the specified orientation and position: After the baking and drying of the electrostatic chuck 100 and the substrate 200 are completed, the electrostatic chuck 100 and the substrate 200 are transferred to the corresponding pre-alignment device 40 by means of the respective transfer device 20, so that the electrostatic chuck 100 and the substrate 200 can be positioned in the same specified orientation and position by means of the respective positioning notch 101, 201, and thus the electrostatic chuck 100 and the substrate 200 can completely overlap in the same specified orientation and position to facilitate the subsequent manufacturing process; Step to fix the electrostatic chuck and the substrate on two opposite surfaces in the same specified orientation and position: It is placed on Fig. 5. After completing the pre-alignment, the substrate 200 can first be placed on the working plane of the main frame plate 61 and the side wing plates 65 of the static electricity generating group 60 by means of a transfer device 20, wherein the substrate 200 is guided into the correct position of the working plane of the static electricity generating group 60 by means of the guide rod group 66. By using the contact detection group 67 and the optical detection group 68, it can be ensured that the electrostatic chuck 100 is positioned precisely in the specified orientation and position, and then the substrate transfer group 80 can be lowered.The substrate 200 is sucked into the correct position of the suction surface by means of the suction parts 83 of the substrate transfer group 80. Then, the substrate transfer group 80 is lifted to simultaneously remove the substrate 200 from the working plane of the static electricity generating group 60. Then, the electrostatic chuck 100 is placed on the working plane of the main frame plate 61 of the static electricity generating group 60 by means of a transfer device 20. The electrostatic chuck 100 is guided into the correct position on the working plane of the static electricity generating group 60 by means of the guide rod group 66. The contact detection group 67 and the optical detection group 68 are used to ensure that the electrostatic chuck 100 is positioned precisely in the specified orientation and position.Thereafter, the electrostatic chuck 100 can be fixed by means of the suction parts 64 of the static electricity generating group 60 so that the substrate 200 and the electrostatic chuck 100 can face each other in the same specified orientation and position. Step for adhering the electrostatic chuck and the substrate placed separately on two surfaces in a linear displacement manner: After the electrostatic chuck 100 and the substrate 200 are fixed in the same specified orientation and position on opposite surfaces, the substrate 200 is driven by the substrate transfer group 80 to be linearly displaceable relative to the electrostatic chuck 100 of the static electricity generating group 60, so that the substrate 200 can be attached to the surface of the electrostatic chuck 100 in the same specified orientation and position with the outer peripheries of the two completely overlapping (see the Fig. 3 and Fig. 4); Step for generating an electrostatic field by which the electrostatic chuck and the substrate can adhere to each other: After the electrostatic chuck 100 and the substrate 200 adhere to each other, the static electricity generating group 60 can be electrically connected to the electrostatic chuck 100 so that an electrostatic field can be generated at the electrostatic chuck 100 with respect to the substrate 200, thus completing the work of the electrostatic chuck 100 for electrostatically attracting the substrate 200; and Step for removing the electrostatic chuck with the substrate adhered thereto: Finally, after the adhesion process of the electrostatic chuck 100 and the substrate 200 is completed, the substrate transfer group 80 and the static electricity generating group 60 can be separated from each other in a linear displacement manner, the electrostatic chuck 100 with the substrate 200 adhered thereto is removed by one of the transfer devices 20 and then sequentially placed in the corresponding first material inlet and outlet port 16 and second material inlet and outlet port 18, respectively, to complete the entire bonding process so that these two can be used for the subsequent manufacturing process.

[0018] According to some embodiments, prior to baking the electrostatic chuck 100 and the substrate 200, a step may be added to clean the surface of the electrostatic chuck, wherein the surface is rinsed or wiped with a cleaning agent, or the particles on the surface of the electrostatic chuck 100 may be removed without contact to improve the effectiveness of the adhesion.

[0019] Furthermore, the substrate 200 and the electrostatic chuck 100, which are adhered to each other, can also be separated from each other. The electrostatic chuck 100 adhered to the substrate 200 is placed and fixed on the static electricity generating group 60, and the substrate transfer group 80 is linearly displaced and fixed to the surface of the substrate 200 not belonging to the electrostatic chuck 100. Subsequently, the electrostatic field of the electrostatic chuck 100 is canceled by the static electricity generating group 60, so that the static electricity of the electrostatic chuck 100 is discharged and the substrate 200 can be separated. The substrate 200 is driven by the backward displacement of the substrate transfer group 80 to be separated from the electrostatic chuck 100.Finally, the electrostatic chuck 100 and the substrate 200 are placed in the second material inlet and outlet opening 18 and the first material inlet and outlet opening 16 by means of the opposite transfer device 20. It is shown on , Fig. 9. According to some embodiments, after the electrostatic chuck 100 is discharged, the outer periphery of the electrostatic chuck 100 may be moved downward so that the outer periphery of the electrostatic chuck 100 may be preliminarily peeled from the substrate 200 to form an opening. Subsequently, a high-speed gas is injected from the outer periphery of the electrostatic chuck 100 via the jet nozzle 690 of a blowing unit 69, so that the electrostatic chuck 100 and the substrate 200 can be effectively separated from each other. List of reference symbols 100 electrostatic chuck 101 Positioning notch 105 conductive electrode 200 substrate 201 Positioning notch 10 machine bodies 15 Slide rail mechanism 16 first material inlet and outlet opening 18 second material inlet and outlet opening 20 Transfer facility 30 Baking equipment 31 first baking device 32 second baking device 38 Cleaning device 40 Pre-alignment device 45 Opening for temporary material storage 50 Adhesive and separating device 51 lower frame 52 upper frame 60 static electricity generating group 61 Main frame plate 62 Material lifting element 620 detection element 63 conductive electrode 64 Suction part 65 Side wing plate 66 Command Staff Group 660 fixed guide rod 661 inclined guide surface 665 movable guide rod 666 inclined guide surface 67 Touch detection group 670 touch bar 675 Alignment guide rod 68 optical detection group 680 optoelectronic element 69 Blow unit 690 jet nozzle 70 drive element 80 Substrate transfer group 81 frame base 810 Detection element 82 Lifting and lowering mechanism 83 Suction part 830 Surface suction part 835 edge suction part 85 optical detection group 850 optoelectronic element 86 Waste protection element

Claims

[1] An adhesion and separation device (50) for electrostatic chucks (100) used for automatic adhesion or separation between a wireless electrostatic chuck (100) and a thinned substrate (200), the underside of the electrostatic chuck (100) being provided with positive and negative conductive electrodes (105) by which an electrostatic field is generated, the adhesion and separation device (50) comprising: a frame (51, 52); a static electricity generating group (60) arranged on the frame (51, 52) and having a work plane for selectively mounting the electrostatic chuck (100), the work plane being provided with conductive electrodes (63) corresponding to the positive and negative conductive electrodes (105) located on the underside of the electrostatic chuck (100), the work plane being configured to position the electrostatic chuck (100) or the substrate (200) in the correct position; a substrate transfer group (80) arranged on the frame (51, 52) and opposite the static electricity generating group (60) so that the substrate transfer group (80) can attract a substrate (200) which is in the correct position and is thus displaceable relative to the static electricity generating group (60); wherein, after the substrate (200) and the electrostatic chuck (100) have been pressed against each other by driving by means of the substrate transfer group (80), an electrostatic field for attracting the substrate (200) can be generated at the electrostatic chuck (100) by actuating the static electricity generating group (60). [2] The electrostatic chuck (100) adhesion and separation device (50) according to claim 1, wherein the work plane comprises a guide rod group (66), the guide rod group (66) comprising at least two fixed guide rods (660) surrounding the outer periphery of the electrostatic chuck (100) and at least one movable guide rod (665) by which the electrostatic chuck (100) is urged into the correct horizontal position of the fixed guide rods (660), so that the electrostatic chuck (100) or the substrate (200) can be positioned in the correct position of the work plane. [3] Holding and separating device (50) for electrostatic chucks (100) according to claim 1, wherein the working plane consists of a main frame plate (61) and two side wing plates (65) pivotably arranged on two side edges of the main frame plate (61), wherein the end of the respective side wing plate (65) not belonging to the main frame plate (61) is selectively displaceable downwards. [4] The adhesion and separation device (50) for electrostatic chucks (100) according to claim 3, wherein in the static electricity generating group (60), a blowing unit (69) is arranged at the positions corresponding to the two side wing plates (65), wherein each blowing unit (69) has a jet nozzle (690) extending from the outer circumference of the electrostatic chuck (100) in the axial direction, whereby the electrostatic chuck (100) and the substrate (200) can be effectively separated from each other. [5] The adhesion and separation device (50) for electrostatic chucks (100) according to claim 1, wherein the substrate transfer group (80) comprises a frame base (81), the surface of the frame base (81) being provided with a plurality of suction parts (83) including the surface suction parts (830) located in the area corresponding to the substrate (200) or the edge suction parts (835) located near the edge of the substrate (200), wherein a suction technique based on Bernoulli's law is used for the surface suction parts (830). [6] An automatic adhesion and separation system for electrostatic chucks (100), which serves for automatic adhesion and separation after adhesion between an electrostatic chuck (100) and a substrate (200), wherein the underside of the electrostatic chuck (100) is provided with positive and negative conductive electrodes (105) by which an electrostatic field is generated or canceled, wherein the circumference of the electrostatic chuck (100) and that of the substrate (200) each have a positioning notch (101, 201) for determining the direction and position, the automatic adhesion and separation system comprising: a machine body (10) comprising at least one first material inlet and outlet opening (16) and at least one second material inlet and outlet opening (18); at least one baking device (30) arranged in the machine body (10), the baking devices (30) comprising at least a first baking device (31) for baking the substrate (200) and at least a second baking device (32) for baking the electrostatic chuck (100); at least one pre-alignment device (40) arranged in the machine body (10) and used to determine in advance a specified alignment and position of the electrostatic chuck (100) and the substrate (200) by means of the corresponding positioning notches (101, 201); at least one adhesion and separation device (50) according to claim 1, for generating or canceling an electrostatic field upon actuation of the electrostatic chuck (100) such that the electrostatic chuck (100) and the substrate (200) can be adhered to or separated from each other in the same specified orientation and position; and at least one transfer device (20) with a gripping and movement area, which is arranged in the machine body (10), wherein the at least one transfer device (20) can grip the substrate (200) or the electrostatic chuck (100) and move it between the first baking device (31) and the second baking device (32) of the baking device (30), the pre-alignment device (40) and the adhesion and separation device (50), which correspond to the at least one first material inlet and outlet opening (16) and the at least one second material inlet and outlet opening (18). [7] Automatic adhesion and separation system for electrostatic chucks (100) according to claim 6, wherein a cleaning device (38) is arranged on the machine body (10) and serves to selectively clean the electrostatic chuck (100) or the adhesion surface of the substrate (200) within the gripping and movement range of the at least one transfer device (20). [8] Automatic clamping and separating system for electrostatic chucks (100) according to claim 6, wherein a slide rail mechanism (15) is arranged in the machine body (10) and the transfer devices (20) are slidably arranged on the slide rail mechanism (15) in order to increase the range of movement of the at least one transfer device (20). [9] An adhesion and separation method for electrostatic chucks (100) for automatically adhering and automatically separating after adhesion between a wireless electrostatic chuck (100) and a substrate (200), wherein the underside of the electrostatic chuck (100) is provided with positive and negative conductive electrodes (105) by which an electrostatic field is generated, wherein the periphery of the electrostatic chuck (100) and the substrate (200) each has a design for determining the direction and position, the adhesion and separation method comprising the following process steps: Step of providing the electrostatic chuck (100) and the substrate (200); Step for baking the electrostatic chuck (100) and the substrate (200) to keep the surfaces dry; Step of pre-aligning the electrostatic chuck (100) and the substrate (200) in the specified orientation and position; Step of fixing the electrostatic chuck (100) and the substrate (200) on two opposite surfaces in the same specified orientation and position; A step of adhering the electrostatic chuck (100) and the substrate (200) placed separately on two surfaces in a linear displacement manner; Step of generating an electrostatic field by which the electrostatic chuck (100) and the substrate (200) can adhere to each other; and Step to remove the electrostatic chuck (100) with the substrate (200) attached to it. [10] The adhesion and separation method for electrostatic chucks (100) according to claim 9, wherein a step of cleaning the surface of the electrostatic chuck (100) is added before baking to improve adhesion effectiveness.

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