ARRANGEMENT WITH AT LEAST ONE ANTENNA AND ONE THERMALLY INSULATING COMPONENT

Abstract

An arrangement (200) which includes: at least one antenna (201), wherein at least one antenna is configured to transmit a radio frequency (RF) communication field at an operating frequency in the range of 6 GHz to 100 GHz; and a heat-insulating component (202, 300), the heat-insulating component (202, 300) comprises: - a thermal insulation layer (301); - a protective film (302), wherein the protective film (302) comprises: a polymer layer (303); and a first adhesive layer (304), wherein the first adhesive layer (304) is arranged between the thermal insulation layer (301) and the polymer layer (303); and wherein (i) the heat-insulating component (202, 300) further comprises a second adhesive layer (305), wherein the thermal barrier layer (301) is arranged between the protective film (302) and the second adhesive layer (305), and wherein the second adhesive layer (305) is arranged between the thermal barrier layer (301) and the at least one antenna (201), and the heat-insulating component (202, 300) is connected to the at least one antenna (201) by the second adhesive layer (305); or (ii) the arrangement is located in a housing and the heat-insulating component (701) is connected to the housing (703) by a second adhesive layer (705); wherein the heat-insulating component (202, 300) is arranged within the RF communication field, and wherein the heat-insulating component (202) has a thermal conductivity of 0.0025 W / m·K to 0.025 W / m·K at 25 °C and 1 atm.

Description

FIELD

[0001] The present disclosure relates to the field of thermal insulation for an assembly including at least one antenna. BACKGROUND

[0002] Fifth-generation wireless technology, or 5G, faces many technical challenges during implementation. These challenges can be particularly evident at higher frequency bandwidths. At certain high frequencies, including but not limited to those operating in the millimeter wave range, radio frequencies can become susceptible to signal interruptions. At the same time, touch and temperature guidelines (e.g., the UL62368-1 standard) can limit the surface temperature of a 5G mobile device to protect users from excessive heat generated by a 5G antenna on the mobile device. Assemblies are needed that incorporate materials that not only minimize signal interruption but also control the surface temperature of a 5G mobile device.

[0003] US 2017 / 0 271 745 A1 discloses an antenna cover for an aircraft antenna. The antenna cover comprises a thermal barrier with an aerogel blanket that has a shape similar to the antenna cover. The aerogel blanket has an inner side and an outer side with intermediate edges. The inner side is designed to face the antenna. The antenna cover comprises a cover layer applied to the aerogel blanket. The cover layer comprises at least one polytetrafluoroethylene (PTFE) film, which is attached to the outer side of the aerogel blanket as a structurally reinforcing layer to impart rigidity to the aerogel blanket.

[0004] US 2005 / 0 100 728 A1 discloses a material comprising aerogel particles and a polytetrafluoroethylene (PTFE) binder, wherein the material is formed with a thermal conductivity of less than or equal to 25 mW / mK under atmospheric conditions. The material is moldable or deformable, with little or no shedding of the filler particles, and can be formed into structures such as tapes or composites, for example, by bonding the material between two outer layers. Advantageously, the composites can be bent, stretched, or curved without significant dust formation or loss of insulating properties.

[0005] US Pat. No. 10,446,920 B1 discloses systems and methods for lightweight, adaptable antennas with improved performance and mechanical properties. In some embodiments, aerogels are used, for example, as a substrate for antenna fabrication. The reduced weight and complexity, as well as the increased ability to adapt antenna designs, enable a system to mitigate a variety of stresses, along with the additional benefits offered.

[0006] Radio frequencies are defined and described in "Radio frequency" in: Wikipedia, The Free Encyclopedia. Last edited: January 15, 2022, 06:25 UTC, URL: https: / / en.wikipedia.org / wiki / Radio_frequency [accessed January 18, 2022]. Radio frequency is the oscillation rate of an alternating electric current or voltage, or of a magnetic, electric, or electromagnetic field, or of a mechanical system in the frequency range from about 20 kHz to about 300 GHz. This lies roughly between the upper limit of audio frequencies and the lower limit of infrared frequencies; these are the frequencies at which the energy of an oscillating current can radiate from a conductor into space as radio waves. Different sources specify different upper and lower limits for the frequency range. SUMMARY

[0007] Some embodiments of the present disclosure relate to an arrangement comprising: at least one antenna, wherein the at least one antenna is configured to transmit a radio frequency (RF) communication field at an operating frequency in the range of 6 GHz to 100 GHz; and a heat-insulating component, wherein the heat-insulating component is arranged within the RF communication field, and wherein the thermally insulating component has a thermal conductivity of 0.0025 W / m·K to 0.025 W / m·K at 25 °C and 1 atm.

[0008] Some embodiments of the present disclosure relate to a method of using an arrangement, the method comprising: Obtaining the order, the order comprising: at least one antenna; and a heat-insulating component, wherein the heat-insulating component is arranged within the RF communication field, and wherein the thermally insulating component has a thermal conductivity of 0.0025 W / m·K to 0.025 W / m·K at 25 °C and 1 atm; Transmitting a radio frequency (RF) communication field from the at least one antenna at an operating frequency in the range of 6 GHz to 100 GHz, wherein the RF communication field is transmitted such that the heat-insulating component is arranged in the RF communication field.

[0009] Some embodiments of the present disclosure relate to a method of manufacturing an assembly, the method comprising: to obtain at least one antenna; wherein the at least one antenna is configured to transmit a radio frequency (RF) communication field at an operating frequency in the range of 6 GHz to 100 GHz; and Applying a thermally insulating component to at least one surface of the at least one antenna to form an assembly; wherein the mounting of the heat-insulating component on at least one surface of the antenna array places the heat-insulating component within the field of RF communication, and wherein the thermally insulating component has a thermal conductivity of 0.0025 W / m·K to 0.025 W / m·K at 25 °C and 1 atm.

[0010] Some embodiments of the present disclosure relate to an arrangement comprising: at least one antenna, wherein the at least one antenna is configured to transmit a radio frequency (RF) communication field at an operating frequency in the range of 6 GHz to 100 GHz; and a heat-insulating component, wherein the heat-insulating component is arranged within the RF communication field, and wherein the heat-insulating component has a thermal conductivity in the range of 0.0025 W / m·K to 0.025 W / m·K at 25 °C and 1 atm, wherein the thermally insulating component has a dielectric constant in the range of 1.05 to 4, measured according to IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using a split post dielectric resonator (SPDR), and wherein the thermally insulating component has a loss tangent in the range of 0.00001 to 0.1, measured according to IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using the SPDR.

[0011] Some embodiments of the present disclosure relate to an arrangement comprising: at least one antenna, wherein the at least one antenna is configured to transmit a radio frequency (RF) communication field at an operating frequency in the range of 6 GHz to 100 GHz; and a heat-insulating component, wherein the thermal insulation component is arranged within the RF communication field, wherein the thermal insulation component has a thickness of 0.03 mm to 2 mm, and wherein the heat-insulating component comprises an aerogel in an amount of 30 wt% to 95 wt% based on a total weight of the heat-insulating component.

[0012] Some embodiments of the present disclosure relate to an arrangement comprising: an antenna group, wherein the antenna array is configured to transmit a radio frequency (RF) communication field at an operating frequency in the range of 6 GHz to 100 GHz; and a heat-insulating component, wherein the heat-insulating component is arranged within the RF communication field, and wherein the heat-insulating component comprises: a protective film; at least one thermal insulation layer, wherein the at least one thermal insulation layer is arranged between the protective film and the at least one adhesive layer; wherein the at least one thermal insulation layer makes up 50% to 99% of a total thickness of the thermally insulating component; at least one adhesive layer, wherein the at least one adhesive layer is arranged between the antenna field and the thermal insulation layer of the thermal insulation part.

[0013] The discussed embodiments are defined by the claims, not by the above summary. The above summary is an overview of various aspects and introduces some of the concepts described in the "Detailed Description" section below. This summary is not intended to identify important or essential features of the claimed subject matter, nor is it intended to be used in isolation to determine the scope of the claimed subject matter. The subject matter should be understood by reference to the relevant portions of the entire description, any or all of the drawings, and each claim. DRAWINGS Fig. 1 shows a non-limiting example of an array according to the present disclosure. Fig.Figure 2 shows a non-limiting example of a thermally insulating component arranged in a radio frequency (RF) communication field. The Fig. 3A to 3J are non-limiting examples of thermally insulating components according to the present disclosure. Fig. 4 is a non-limiting example of a location where an operating temperature of an assembly may be measured. The Fig. 5A to 5K are non-limiting examples of arrangements according to the present disclosure. The Fig. 6A and Fig. 6B show a non-limiting example of an arrangement with a thermally insulating component embedded in an antenna array. Fig. Figure 7 shows a non-limiting example of an arrangement within a housing. Fig. Figure 8 is a non-limiting example of a model for calculating thermal conductivity. Fig. Figure 9 is a non-limiting example of a model for calculating RF transmission characteristics. The Fig. 10A to 10D show exemplary layout spaces for some non-limited arrangements of the present disclosure. The Fig. 11A through 11B show further exemplary design spaces for some non-limited arrangements of the present disclosure.

[0014] Some embodiments of the disclosure are described herein by way of example only with reference to the accompanying drawings. Specific reference will now be made to the drawings in detail, with the understanding that the embodiments shown are provided by way of example and for the purpose of illustrative discussion of embodiments of the disclosure. In this regard, the description, together with the drawings, will clearly indicate to those skilled in the art how the embodiments of the disclosure may be practiced. DETAILED DESCRIPTION

[0015] As used here, an “antenna” is any device configured to transmit a radio frequency (RF) communication field.

[0016] As used herein, "thermal conductivity" is a measure of a material's ability to conduct heat. "Thermal conductivity" can be calculated using Fourier's law. In some non-limiting embodiments, the thermal conductivity of a component comprising multiple layers (such as, but not limited to, a thermal insulation component described herein) can also be calculated using the following equation: keq=teqt1k1+t2k2+⋯tnkn; where k eq is the thermal conductivity of the multilayer component, where t eq is a total thickness of the component, where t1, t2, ... t n are the respective thicknesses of each layer and where k1, k2, ... k nthe respective thermal conductivities of each individual layer.

[0017] As used herein, a “thermal insulation component” is any component of an assembly described herein that has a thermal conductivity disclosed herein (such as, but not limited to, a thermal conductivity of less than 0.025 W / m·K at 25°C and 1 atm).

[0018] As used herein, a “thermal barrier layer” is a layer of a thermally insulating component described herein that has a thermal conductivity disclosed herein (such as, but not limited to, a thermal conductivity of less than 0.025 W / m·K at 25°C and 1 atm).

[0019] As used herein, an “aerogel” is a solid material that contains at least one gas (e.g., air) as a dispersed interstitial medium within a structural (e.g., microstructural) framework of the solid material.

[0020] As used herein, a "reinforced aerogel" is an aerogel that contains at least one reinforcing material. Several non-limiting examples of reinforced aerogels and reinforcing materials are disclosed herein, see below.

[0021] The "dielectric constant" is a dimensionless quantity that measures the permittivity of a particular material. In some embodiments, the "dielectric constant" can be calculated as the ratio of a measured dielectric constant (i.e., due to the passage of an electromagnetic wave through a particular material) to a reference dielectric constant (i.e., due to the passage of the same electromagnetic wave through a reference material such as a vacuum). As used herein, the dielectric constant is measured according to IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using a split-post dielectric resonator (SPDR). A non-limiting method for measuring the dielectric constant is described in the "Examples" section (see below).

[0022] The term "loss tangent" used here is a dimensionless quantity that measures the ability of a given material to dissipate, or "lose," electromagnetic energy (e.g., in the form of heat, frictional losses, and static losses). As used here, the loss tangent is measured according to IEC 61189-2-721, Edition 1, 2015-04, at 10 GHz using a split-post dielectric resonator (SPDR). A non-limiting method for measuring the loss tangent is described in the "Examples" section (see below).

[0023] As used herein, the term "bonded" refers to any mechanism by which a plurality of materials are joined together. Examples of suitable joining mechanisms include, but are not limited to, heat bonding, laser bonding, mechanical fastening, one or more adhesives, or a combination thereof.

[0024] As used here, the term “plated” refers to a configuration of a structure in which dissimilar components (e.g., a membrane and an aerogel) of the structure are bonded together.

[0025] Some embodiments of the present disclosure relate to an assembly. The assembly includes at least one antenna and a thermally insulating component.

[0026] The at least one antenna is configured to transmit a radio frequency (RF) communication field having an operating frequency in the range of 6 GHz to 100 GHz. In some embodiments, the at least one antenna is configured to transmit an RF communication field at an operating frequency in the range of 10 GHz to 100 GHz. In some embodiments, the at least one antenna is configured to transmit an RF communication field at an operating frequency in the range of 20 GHz to 100 GHz. In some embodiments, the at least one antenna is configured to transmit an RF communication field at an operating frequency in the range of 30 GHz to 100 GHz. In some embodiments, the at least one antenna is configured to transmit an RF communication field at an operating frequency in the range of 40 GHz to 100 GHz.In some embodiments, the at least one antenna is configured to transmit an RF communication field at an operating frequency in the range of 50 GHz to 100 GHz. In some embodiments, the at least one antenna is configured to transmit an RF communication field at an operating frequency in the range of 60 GHz to 100 GHz. In some embodiments, the at least one antenna is configured to transmit an RF communication field at an operating frequency in the range of 70 GHz to 100 GHz. In some embodiments, the at least one antenna is configured to transmit an RF communication field at an operating frequency in the range of 80 GHz to 100 GHz. In some embodiments, the at least one antenna is configured to transmit an RF communication field at an operating frequency in the range of 90 GHz to 100 GHz.

[0027] In some embodiments, the at least one antenna is configured to transmit an RF communication field having an operating frequency in the range of 6 GHz to 90 GHz. In some embodiments, the at least one antenna is configured to transmit an RF communication field having an operating frequency in the range of 6 GHz to 80 GHz. In some embodiments, the at least one antenna is configured to transmit an RF communication field at an operating frequency in the range of 6 GHz to 70 GHz. In some embodiments, the at least one antenna is configured to transmit an RF communication field at an operating frequency in the range of 6 GHz to 60 GHz. In some embodiments, the at least one antenna is configured to transmit an RF communication field at an operating frequency in the range of 6 GHz to 50 GHz.In some embodiments, the at least one antenna is configured to transmit an RF communication field at an operating frequency in the range of 6 GHz to 40 GHz. In some embodiments, the at least one antenna is configured to transmit an RF communication field at an operating frequency in the range of 6 GHz to 30 GHz. In some embodiments, the at least one antenna is configured to transmit an RF communication field at an operating frequency in the range of 6 GHz to 20 GHz. In some embodiments, the at least one antenna is configured to transmit an RF communication field at an operating frequency in the range of 6 GHz to 10 GHz.

[0028] In some embodiments, the at least one antenna is configured to transmit an RF communication field having an operating frequency in the range of 10 GHz to 90 GHz. In some embodiments, the at least one antenna is configured to transmit an RF communication field having an operating frequency in the range of 20 GHz to 80 GHz. In some embodiments, the at least one antenna is configured to transmit an RF communication field at an operating frequency in the range of 30 GHz to 70 GHz. In some embodiments, the at least one antenna is configured to transmit an RF communication field having an operating frequency in the range of 40 GHz to 60 GHz.

[0029] In some embodiments, the at least one antenna is configured to transmit a radio frequency (RF) communication field having a wavelength in the range of 3 mm to 50 mm. In some embodiments, the at least one antenna is configured to transmit an RF communication field having a wavelength in the range of 10 mm to 50 mm. In some embodiments, the at least one antenna is configured to transmit an RF communication field having a wavelength in the range of 20 mm to 50 mm. In some embodiments, the at least one antenna is configured to transmit an RF communication field having a wavelength in the range of 30 mm to 50 mm. In some embodiments, the at least one antenna is configured to transmit an RF communication field having a wavelength in the range of 40 mm to 50 mm.

[0030] In some embodiments, the at least one antenna is configured to transmit an RF communication field having a wavelength in the range of 3 mm to 40 mm. In some embodiments, the at least one antenna is configured to transmit an RF communication field having a wavelength in the range of 3 mm to 30 mm. In some embodiments, the at least one antenna is configured to transmit an RF communication field having a wavelength in the range of 3 mm to 20 mm. In some embodiments, the at least one antenna is configured to transmit an RF communication field having a wavelength in the range of 3 mm to 10 mm.

[0031] In some embodiments, the at least one antenna is configured to transmit an RF communication field having a wavelength in the range of 10 mm to 40 mm. In some embodiments, the at least one antenna is configured to transmit an RF communication field having a wavelength in the range of 20 mm to 30 mm.

[0032] In some embodiments, the at least one antenna may be in the form of an antenna array. In some embodiments, the antenna array is configured to transmit a field of RF communication at any operating frequency disclosed herein, any wavelength disclosed herein, or any combination thereof. In some embodiments, the antenna array may include a plurality of antennas. In some embodiments, each antenna of the plurality of antennas is configured to transmit a field of RF communication at any operating frequency disclosed herein, any wavelength disclosed herein, or any combination thereof.

[0033] In some embodiments, the antenna array comprises a plurality of planes, e.g., by forming a shape that has a plurality of planes. Without limitation, the antenna array could be in the shape of a cube, a triangular prism, a rectangular prism, or any polyhedron.

[0034] A non-limiting example of an antenna array is shown in Fig. 1. As illustrated, the exemplary antenna array 100 may include a plurality of antennas 101. In some non-limiting embodiments, the antenna array 100 may be shaped like a rectangular prism with a plurality of planes 102.

[0035] In some embodiments, the antenna array may include at least 2 antennas. In some embodiments, the antenna array may include at least 3 antennas. In some embodiments, the antenna array may include at least 4 antennas. In some embodiments, the antenna array may include at least 5 antennas. In some embodiments, the antenna array may include at least 10 antennas. In some embodiments, the antenna array may include at least 16 antennas. In some embodiments, the antenna array may include at least 25 antennas. In some embodiments, the antenna array may include at least 50 antennas. In some embodiments, the antenna array may include at least 75 antennas. In some embodiments, the antenna array may include at least 100 antennas.

[0036] In some embodiments, the antenna array may include 2 to 100 antennas. In some embodiments, the antenna array may include 3 to 100 antennas. In some embodiments, the antenna array may include 4 to 100 antennas. In some embodiments, the antenna array may include 5 to 100 antennas. In some embodiments, the antenna array may include 10 to 100 antennas. In some embodiments, the antenna array may include 16 to 100 antennas. In some embodiments, the antenna array may include 25 to 100 antennas. In some embodiments, the antenna array may include 50 to 100 antennas. In some embodiments, the antenna array may include 75 to 100 antennas.

[0037] In some embodiments, the antenna array may include 2 to 75 antennas. In some embodiments, the antenna array may include 2 to 50 antennas. In some embodiments, the antenna array may include 2 to 25 antennas. In some embodiments, the antenna array may include 2 to 16 antennas. In some embodiments, the antenna array may include 2 to 10 antennas. In some embodiments, the antenna array may include 2 to 5 antennas. In some embodiments, the antenna array may include 2 to 4 antennas. In some embodiments, the antenna array may include 2 to 3 antennas.

[0038] In some embodiments, the antenna array may include 3 to 75 antennas. In some embodiments, the antenna array may include 4 to 50 antennas. In some embodiments, the antenna array may include 5 to 25 antennas. In some embodiments, the antenna array may include 10 to 16 antennas.

[0039] In some embodiments, the antenna array comprises 4 to 8 planes. In some embodiments, the antenna array comprises 5 to 8 planes. In some embodiments, the antenna array comprises 6 to 8 planes. In some embodiments, the antenna array comprises 7 to 8 planes.

[0040] In some embodiments, the antenna array comprises 4 to 7 levels. In some embodiments, the antenna array comprises 4 to 6 levels. In some embodiments, the antenna array comprises 4 to 5 levels.

[0041] In some embodiments, the antenna array comprises 5 to 7 levels. In some embodiments, the antenna array comprises 5 to 6 levels.

[0042] The heat-insulating component is arranged within the field of RF communication generated by the at least one antenna. A non-limiting example of an arrangement in which the heat-insulating component is arranged within the field of RF communication is shown in Fig. 2. As shown, the assembly 200 may include a thermally insulating component 202 that may be disposed within an RF communication field (Φ) generated by at least one antenna 201.

[0043] In some embodiments, a portion of the thermally insulating component extends beyond the RF communication field. In some embodiments, 10% of the thermally insulating component extends beyond the RF communication field. In some embodiments, 20% of the thermally insulating component extends beyond the RF communication field. In some embodiments, 30% of the thermally insulating component extends beyond the RF communication field. In some embodiments, 40% of the thermally insulating component extends beyond the RF communication field. In some embodiments, 50% of the thermally insulating component extends beyond the RF communication field. In some embodiments, 60% of the thermally insulating component extends beyond the RF communication field.In some embodiments, 70% of the thermally insulating component extends beyond the RF communication field. In some embodiments, 80% of the thermally insulating component extends beyond the RF communication field. In some embodiments, 90% of the thermally insulating component extends beyond the RF communication field.

[0044] The thermally insulating component comprises a thermal insulation layer. In some embodiments, the thermally insulating component is embedded in the antenna array.

[0045] The thermally insulating component, the thermal barrier layer, or any combination thereof has a thermal conductivity of less than 0.025 W / m·K at 25°C and 1 atm. In some embodiments, the thermally insulating component, the thermal barrier layer, or any combination thereof has a thermal conductivity of less than 0.02 W / m·K at 25°C and 1 atm. In some embodiments, the thermally insulating component, the thermal barrier layer, or any combination thereof has a thermal conductivity of less than 0.01 W / m·K at 25°C and 1 atm. In some embodiments, the thermally insulating component, the thermal barrier layer, or any combination thereof has a thermal conductivity of less than 0.005 W / m·K at 25°C and 1 atm.

[0046] The thermally insulating component, the thermal barrier layer, or any combination thereof has a thermal conductivity in the range of 0.0025 W / m·K to 0.025 W / m·K at 25°C and 1 atm. In some embodiments, the thermally insulating component, the thermal barrier layer, or any combination thereof has a thermal conductivity in the range of 0.005 W / m·K to 0.025 W / m·K at 25°C and 1 atm. In some embodiments, the thermally insulating component, the thermal barrier layer, or any combination thereof has a thermal conductivity in the range of 0.01 W / m·K to 0.025 W / m·K at 25°C and 1 atm. In some embodiments, the thermally insulating component, the thermal barrier layer, or any combination thereof has a thermal conductivity in the range of 0.02 W / m·K to 0.025 W / m·K at 25°C and 1 atm.

[0047] In some embodiments, the thermally insulating component, the thermal barrier layer, or any combination thereof has a thermal conductivity in the range of 0.0025 W / m·K to 0.02 W / m·K at 25°C and 1 atm. In some embodiments, the thermally insulating component, the thermal barrier layer, or any combination thereof has a thermal conductivity in the range of 0.0025 W / m·K to 0.01 W / m·K at 25°C and 1 atm. In some embodiments, the thermally insulating component, the thermal barrier layer, or any combination thereof has a thermal conductivity in the range of 0.0025 W / m·K to 0.005 W / m·K at 25°C and 1 atm.

[0048] In some embodiments, the thermally insulating component, the thermal barrier layer, or any combination thereof has a thermal conductivity in the range of 0.005 W / m·K to 0.02 W / m·K at 25°C and 1 atm. In some embodiments, the thermally insulating component, the thermal barrier layer, or any combination thereof has a thermal conductivity in the range of 0.005 W / m·K to 0.01 W / m·K at 25°C and 1 atm. In some embodiments, the thermally insulating component, the thermal barrier layer, or any combination thereof has a thermal conductivity in the range of 0.01 W / m·K to 0.02 W / m·K at 25°C and 1 atm.

[0049] In some embodiments, the thermally insulating component, the thermal insulation layer, or any combination thereof has a dielectric constant in the range of 1.05 to 4, measured according to IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using a split post dielectric resonator (SPDR). In some embodiments, the thermally insulating component, the thermal insulation layer, or any combination thereof has a dielectric constant in the range of 1.5 to 4, measured according to IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using an SPDR. In some embodiments, the thermally insulating component, the thermal insulation layer, or any combination thereof has a dielectric constant in the range of 2 to 4, measured according to IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using an SPDR.In some embodiments, the thermally insulating component, the thermal insulation layer, or any combination thereof has a dielectric constant in the range of 2.5 to 4, measured according to IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using an SPDR. In some embodiments, the thermally insulating component, the thermal insulation layer, or any combination thereof has a dielectric constant in the range of 3 to 4, measured according to IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using an SPDR. In some embodiments, the thermally insulating component, the thermal insulation layer, or any combination thereof has a dielectric constant in the range of 3.5 to 4, measured according to IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using an SPDR.

[0050] In some embodiments, the thermally insulating component, the thermal insulation layer, or any combination thereof has a dielectric constant in the range of 1.05 to 3.5, measured in accordance with IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using an SPDR. In some embodiments, the thermally insulating component, the thermal barrier layer, or any combination thereof has a dielectric constant in the range of 1.05 to 3, measured according to IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using an SPDR. In some embodiments, the thermally insulating component, the thermal barrier layer, or any combination thereof has a dielectric constant in the range of 1.05 to 2.5, measured according to IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using an SPDR.In some embodiments, the thermally insulating component, the thermal barrier layer, or any combination thereof has a dielectric constant in the range of 1.05 to 2, measured according to IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using an SPDR. In some embodiments, the thermally insulating component, the thermal insulation layer, or any combination thereof has a dielectric constant in the range of 1.05 to 1.5, measured according to IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using an SPDR.

[0051] In some embodiments, the thermally insulating component, the thermal barrier layer, or any combination thereof has a dielectric constant in the range of 1.1 to 4, measured according to IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using an SPDR. In some embodiments, the thermally insulating component, the thermal barrier layer, or any combination thereof has a dielectric constant in the range of 1.2 to 4, measured according to IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using an SPDR. In some embodiments, the thermally insulating component, the thermal insulation layer, or any combination thereof has a dielectric constant in the range of 1.1 to 1.5, measured according to IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using an SPDR.

[0052] In some embodiments, the thermally insulating component, the thermal barrier layer, or any combination thereof has a dielectric constant in the range of 1.5 to 3.5, measured according to IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using an SPDR. In some embodiments, the thermally insulating component, the thermally insulating layer, or any combination thereof has a dielectric constant in the range of 2 to 2.5, measured according to IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using an SPDR.

[0053] In some embodiments, the thermally insulating component, the thermal insulation layer, or any combination thereof has a loss tangent in the range of 0.00001 to 0.1, measured according to IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using an SPDR. In some embodiments, the thermally insulating component, the thermal insulation layer, or any combination thereof has a loss tangent in the range of 0.0001 to 0.1, measured according to IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using an SPDR. In some embodiments, the thermally insulating component, the thermal insulation layer, or any combination thereof has a loss tangent in the range of 0.001 to 0.1, measured in accordance with IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using an SPDR.In some embodiments, the thermally insulating component, the thermally insulating layer, or any combination thereof has a loss tangent in the range of 0.01 to 0.1, measured according to IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using an SPDR. In some embodiments, the thermally insulating component, the thermally insulating layer, or any combination thereof has a loss tangent in the range of 0.05 to 0.1, measured according to IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using an SPDR.

[0054] In some embodiments, the thermally insulating component, the thermal barrier layer, or any combination thereof has a loss tangent in the range of 0.00001 to 0.05, measured according to IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using an SPDR. In some embodiments, the thermally insulating component, the thermal insulation layer, or any combination thereof has a loss tangent in the range of 0.00001 to 0.01, measured according to IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using an SPDR. In some embodiments, the thermally insulating component, the thermal insulation layer, or any combination thereof has a loss tangent in the range of 0.00001 to 0.001, measured in accordance with IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using an SPDR.In some embodiments, the thermally insulating component, the thermally insulating layer, or any combination thereof has a loss tangent in the range of 0.00001 to 0.0001, measured according to IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using an SPDR.

[0055] In some embodiments, the thermally insulating component, the thermal barrier layer, or any combination thereof has a loss tangent in the range of 0.0001 to 0.05, measured according to IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using an SPDR. In some embodiments, the thermally insulating component, the thermal insulation layer, or any combination thereof has a loss tangent in the range of 0.001 to 0.01, measured according to IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using an SPDR. In some embodiments, the thermally insulating component, the thermal barrier coating, or any combination thereof has a loss tangent in the range of 0.005 to 0.1, measured according to IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using an SPDR.

[0056] In some embodiments, the thermally insulating component, the thermal insulation layer, or any combination thereof attenuates a transmitted RF signal by less than 1 dB, measured relative to air. In some embodiments, the thermally insulating component, the thermal insulation layer, or any combination thereof attenuates a transmitted RF signal by less than 0.75 dB, measured relative to air. In some embodiments, the thermally insulating component, the thermal insulation layer, or any combination thereof attenuates a transmitted RF signal by less than 0.5 dB, measured relative to air. In some embodiments, the thermally insulating component, the thermal insulation layer, or any combination thereof attenuates a transmitted RF signal by less than 0.25 dB, measured relative to air.

[0057] In some embodiments, the thermally insulating component, the thermal insulation layer, or any combination thereof attenuates a transmitted RF signal by 0.001 dB to 1 dB, measured relative to air. In some embodiments, the thermally insulating component, the thermal insulation layer, or any combination thereof attenuates a transmitted RF signal by 0.01 dB to 1 dB, measured relative to air. In some embodiments, the thermally insulating component, the thermal insulation layer, or any combination thereof attenuates a transmitted RF signal by 0.1 dB to 1 dB, measured relative to air. In some embodiments, the thermally insulating component, the thermal insulation layer, or any combination thereof attenuates a transmitted RF signal by 0.25 dB to 1 dB, measured relative to air.In some embodiments, the thermally insulating component, the thermal insulation layer, or any combination thereof attenuates a transmitted RF signal by 0.5 dB to 1 dB, measured relative to air. In some embodiments, the thermally insulating component, the thermal insulation layer, or any combination thereof attenuates a transmitted RF signal by 0.75 dB to 1 dB, measured relative to air.

[0058] In some embodiments, the thermally insulating component, the thermal insulation layer, or any combination thereof attenuates a transmitted RF signal by 0.001 dB to 0.75 dB, measured relative to air. In some embodiments, the thermally insulating component, the thermal insulation layer, or any combination thereof attenuates a transmitted RF signal by 0.001 dB to 0.5 dB, measured relative to air. In some embodiments, the thermally insulating component, the thermal insulation layer, or any combination thereof attenuates a transmitted RF signal by 0.001 dB to 0.25 dB, measured relative to air. In some embodiments, the thermally insulating component, the thermal insulation layer, or any combination thereof attenuates a transmitted RF signal by 0.001 dB to 0.1 dB, measured relative to air.In some embodiments, the thermally insulating component, the thermal barrier coating, or any combination thereof attenuates a transmitted RF signal by 0.001 dB to 0.01 dB, measured relative to air.

[0059] In some embodiments, the thermally insulating component, the thermal insulation layer, or any combination thereof attenuates a transmitted RF signal by 0.01 dB to 0.75 dB, measured relative to air. In some embodiments, the thermally insulating component, the thermal insulation layer, or any combination thereof attenuates a transmitted RF signal by 0.1 dB to 0.5 dB, measured relative to air.

[0060] In some embodiments, the thermal barrier layer, the thermally insulating component, or any combination thereof comprises an aerogel. In some embodiments, the thermal barrier layer, the thermally insulating component, or any combination thereof comprises the aerogel in an amount of at least 30 wt. % based on the total weight of the thermal barrier layer, the thermally insulating component, or any combination thereof. In some embodiments, the thermal barrier layer, the thermally insulating component, or any combination thereof comprises the aerogel in an amount of at least 40 wt. % based on the total weight of the thermal barrier layer, the thermally insulating component, or any combination thereof. In some embodiments, the thermal barrier layer, the thermally insulating component, or any combination thereof comprises the aerogel in an amount of at least 50 wt.-%, based on the total weight of the thermal barrier layer, the thermally insulating component, or any combination thereof. In some embodiments, the thermal barrier layer, the thermally insulating component, or any combination thereof comprises the aerogel in an amount of at least 60 wt.%, based on the total weight of the thermal barrier layer, the thermally insulating component, or any combination thereof. In some embodiments, the thermal barrier layer, the thermally insulating component, or any combination thereof comprises the aerogel in an amount of at least 70 wt.%, based on the total weight of the thermal barrier layer, the thermally insulating component, or any combination thereof. In some embodiments, the thermal barrier layer, the thermally insulating component, or any combination thereof comprises the aerogel in an amount of at least 80 wt.-%, based on the total weight of the thermal barrier layer, the thermally insulating component, or any combination thereof. In some embodiments, the thermal barrier layer, the thermally insulating component, or any combination thereof comprises the aerogel in an amount of at least 90 wt.%, based on the total weight of the thermal barrier layer, the thermally insulating component, or any combination thereof. In some embodiments, the thermal barrier layer, the thermally insulating component, or any combination thereof comprises the aerogel in an amount of at least 95 wt.%, based on the total weight of the thermal barrier layer, the thermally insulating component, or any combination thereof.

[0061] In some embodiments, the thermal barrier layer, the thermally insulating component, or any combination thereof comprises the aerogel in an amount of 30 wt. % to 95 wt. % based on the total weight of the thermal barrier layer, the thermally insulating component, or any combination thereof. In some embodiments, the thermal barrier layer, the thermally insulating component, or any combination thereof comprises the aerogel in an amount of 40 wt. % to 95 wt. % based on the total weight of the thermal barrier layer, the thermally insulating component, or any combination thereof. In some embodiments, the thermal barrier layer, the thermally insulating component, or any combination thereof comprises the aerogel in an amount of 50 wt. % to 95 wt. % based on the total weight of the thermal barrier layer, the thermally insulating component, or any combination thereof.In some embodiments, the thermal barrier layer, the thermally insulating component, or any combination thereof comprises the aerogel in an amount of 60 wt. % to 95 wt. % based on the total weight of the thermal barrier layer, the thermally insulating component, or any combination thereof. In some embodiments, the thermal barrier layer, the thermally insulating component, or any combination thereof comprises the aerogel in an amount of 70 wt. % to 95 wt. % based on the total weight of the thermal barrier layer, the thermally insulating component, or any combination thereof. In some embodiments, the thermal barrier layer, the thermally insulating component, or any combination thereof comprises the aerogel in an amount of 80 wt. % to 95 wt. % based on the total weight of the thermal barrier layer, the thermally insulating component, or any combination thereof.In some embodiments, the thermal barrier layer, the thermally insulating component, or any combination thereof comprises the aerogel in an amount of 90 wt.% to 95 wt.% based on the total weight of the thermal barrier layer, the thermally insulating component, or any combination thereof.

[0062] In some embodiments, the thermal barrier layer, the thermally insulating component, or any combination thereof comprises the aerogel in an amount of 30 wt. % to 90 wt. % based on the total weight of the thermal barrier layer, the thermally insulating component, or any combination thereof. In some embodiments, the thermal barrier layer, the thermally insulating component, or any combination thereof comprises the aerogel in an amount of 30 wt. % to 80 wt. % based on the total weight of the thermal barrier layer, the thermally insulating component, or any combination thereof. In some embodiments, the thermal barrier layer, the thermally insulating component, or any combination thereof comprises the aerogel in an amount of 30 wt. % to 70 wt. % based on the total weight of the thermal barrier layer, the thermally insulating component, or any combination thereof.In some embodiments, the thermal barrier layer, the thermally insulating component, or any combination thereof comprises the aerogel in an amount of 30 wt. % to 60 wt. % based on the total weight of the thermal barrier layer, the thermally insulating component, or any combination thereof. In some embodiments, the thermal barrier layer, the thermally insulating component, or any combination thereof comprises the aerogel in an amount of 30 wt. % to 50 wt. % based on the total weight of the thermal barrier layer, the thermally insulating component, or any combination thereof. In some embodiments, the thermal barrier layer, the thermally insulating component, or any combination thereof comprises the aerogel in an amount of 30 wt. % to 40 wt. % based on the total weight of the thermal barrier layer, the thermally insulating component, or any combination thereof.

[0063] In some embodiments, the thermal barrier layer, the thermally insulating component, or any combination thereof comprises the aerogel in an amount of 40 wt. % to 90 wt. %, based on the total weight of the thermal barrier layer, the thermally insulating component, or any combination thereof. In some embodiments, the thermal barrier layer, the thermally insulating component, or any combination thereof comprises the aerogel in an amount of 50 wt. % to 80 wt. % based on the total weight of the thermal barrier layer, the thermally insulating component, or any combination thereof. In some embodiments, the thermal barrier layer, the thermally insulating component, or any combination thereof comprises the aerogel in an amount of 60 wt. % to 70 wt. % based on the total weight of the thermal barrier layer, the thermally insulating component, or any combination thereof.

[0064] In some embodiments, the thermally insulating component has a thickness of 0.03 mm to 2 mm. In some embodiments, the thermally insulating component has a thickness of 0.05 mm to 2 mm. In some embodiments, the thermally insulating component has a thickness of 0.1 mm to 2 mm. In some embodiments, the thermally insulating component has a thickness of 0.5 mm to 2 mm. In some embodiments, the thermally insulating component has a thickness of 1 mm to 2 mm. In some embodiments, the thermally insulating component has a thickness of 1.5 mm to 2 mm.

[0065] In some embodiments, the thermally insulating component has a thickness of 0.03 mm to 1.5 mm. In some embodiments, the thermally insulating component has a thickness of 0.03 mm to 1 mm. In some embodiments, the thermally insulating component has a thickness of 0.03 mm to 0.5 mm. In some embodiments, the thermally insulating component has a thickness of 0.03 mm to 0.1 mm. In some embodiments, the thermally insulating component has a thickness of 0.03 mm to 0.05 mm.

[0066] In some embodiments, the thermally insulating component has a thickness of 0.05 mm to 1.5 mm. In some embodiments, the thermally insulating component has a thickness of 0.1 mm to 1 mm.

[0067] In some embodiments, the thermal barrier layer comprises an aerogel. In some embodiments, the aerogel is a ceramic aerogel, a polymer aerogel, or a combination thereof.

[0068] In some embodiments, the ceramic aerogel is a silica aerogel.

[0069] In some embodiments, the polymer aerogel is rendered hydrophobic. In some embodiments, the hydrophobic treatment of the polymer aerogel minimizes water absorption, water adsorption, or any combination thereof to reduce the adverse effect of water on RF transmission. In some embodiments, the polymer aerogel is treated with 2,2-bis-[4-(4-aminophenoxy)phenyl]propane ("BAPP") to render the polymer aerogel hydrophobic. In some embodiments, the polymer aerogel is rendered hydrophobic by at least one treatment described in Chinese Patent Application Publication No. CN 1 09 734 954 A to Hu et al., which is incorporated herein by reference in its entirety.

[0070] In some embodiments, the polymer aerogel is a polyimide aerogel. In some embodiments, the polymer aerogel is a polyamide aerogel.

[0071] In some embodiments, the aerogel is a reinforced aerogel. In some embodiments, the reinforced aerogel is a polymer-reinforced aerogel. In some embodiments, the polymer-reinforced aerogel is a silica aerogel containing at least one polymer as a reinforcing material. In some embodiments, the polymer-reinforced aerogel is a polyimide aerogel containing at least one polymer as a reinforcing material.

[0072] In some embodiments, the polymer-reinforced aerogel is a polyethylene terephthalate (PET)-reinforced aerogel. In some embodiments, the PET-reinforced aerogel is a silica aerogel comprising PET as a reinforcing material. In some embodiments, the PET-reinforced aerogel is a polyimide aerogel comprising PET as a reinforcing material. In some embodiments, the PET-reinforced aerogel may take the form of a PET nonwoven-reinforced aerogel.

[0073] In some embodiments, the polymer-reinforced aerogel is a polytetrafluoroethylene (PTFE)-reinforced aerogel. In some embodiments, the PTFE-reinforced aerogel is a silica aerogel comprising PTFE as a reinforcing material. A non-limiting example of a silica aerogel comprising PTFE as a reinforcing material is described in U.S. Patent 7,118,801 B1 to Ristic-Lehmann et al., which is incorporated herein by reference in its entirety. In some embodiments, the PTFE-reinforced aerogel is a polyimide aerogel comprising PTFE as a reinforcing material. In some embodiments, the PTFE-reinforced aerogel can take the form of a PTFE membrane-reinforced aerogel or a PTFE nanofiber nonwoven-reinforced aerogel.

[0074] In some embodiments, the PTFE-reinforced aerogel is a PTFE-reinforced aerogel in a jacketed configuration, wherein the jacketed configuration further comprises a plurality of layers of expanded polytetrafluoroethylene (ePTFE), each of the plurality of ePTFE layers bonded to a surface of the PTFE-reinforced aerogel.

[0075] In some embodiments, the polymer-reinforced aerogel comprises a polymer reinforcement material selected from: ePTFE, polyimide, polyamide, polypropylene, polyvinylidene difluoride (PVDF), polyethylene, or any combination thereof.

[0076] In some embodiments, the aerogel is a ceramic-reinforced aerogel. In some embodiments, the ceramic-reinforced aerogel comprises glass fiber as a reinforcement material.

[0077] In some embodiments, the aerogel is a membrane-reinforced aerogel. In some embodiments, the membrane of the membrane-reinforced aerogel is an ePTFE membrane, a polyethylene membrane, or a combination thereof.

[0078] In some embodiments, the aerogel is a nanofiber-reinforced aerogel. In some embodiments, the nanofiber-reinforced aerogel is reinforced with a polyimide nanofiber nonwoven, a polyamide nanofiber nonwoven, a polypropylene nanofiber nonwoven, a PVDF nanofiber nonwoven, a glass fiber nanofiber nonwoven, a PET nanofiber nonwoven, or a combination thereof.

[0079] In some embodiments, the aerogel is a textile-reinforced aerogel. In some embodiments, the textile-reinforced aerogel is a woven textile-reinforced aerogel. In some embodiments, the textile-reinforced aerogel is a nonwoven textile-reinforced aerogel. In some embodiments, the textile-reinforced aerogel is a fabric-reinforced aerogel. In some embodiments, the aerogel is a felt-reinforced aerogel.

[0080] In some embodiments, the fabric of the woven textile-reinforced aerogel is a PET fabric, a polypropylene fabric, a polyamide fabric, or a combination thereof.

[0081] In some embodiments, the nonwoven textile of the nonwoven, textile-reinforced aerogel is a polypropylene nonwoven, a polyamide nonwoven, or a combination thereof.

[0082] In some embodiments, the fabric-reinforced aerogel comprises fiberglass fabric, cotton fabric, or a combination thereof.

[0083] In some embodiments, the felt-reinforced aerogel is made of fiberglass felt, cotton felt, or a combination thereof.

[0084] In some embodiments, the aerogel is a carrier film reinforced aerogel. In some embodiments, the carrier film is a polypropylene carrier film, a PET carrier film, or a combination thereof.

[0085] In some embodiments, the thermal barrier layer, the thermally insulating component, or any combination thereof comprises a fluoropolymer. In some embodiments, the fluoropolymer is PTFE. In some embodiments, the fluoropolymer is ePTFE.

[0086] In addition to a thermal barrier layer, the thermally insulating component comprises a protective film and at least one adhesive layer. In some embodiments, the thermally insulating component comprises a plurality of adhesive layers. At least one of the plurality of adhesive layers defines a portion of the protective film. In some embodiments, the thermally insulating component comprises a plurality of thermal barrier layers. In some embodiments, an adhesive layer is arranged between each thermal barrier layer.

[0087] In some embodiments, the protective film consists of a polymer layer and an adhesive layer. In some embodiments, the polymer layer of the protective film described herein comprises PET. In some embodiments, the polymer layer of the protective film described herein comprises PTFE. In some embodiments, the polymer layer of the protective film described herein comprises ePTFE.

[0088] In some embodiments, the polymer layer of the protective film described herein comprises polyethylene, polyimide, polyamide, polypropylene (such as, but not limited to, biaxially oriented polypropylene "BOPP"), PVDF, or a combination thereof.

[0089] In some embodiments, the polymer layer of the protective film described herein may comprise ultra-high molecular weight polyethylene (UHMWPE), expanded polyethylene (ePE), low density polyethylene (LDPE), high density polyethylene (HDPE), ethylene tetrafluoroethylene (ETFE), fluorinated ethylene propylene (FEP), tetrafluoroethylene hexafluoropropylene vinylidene fluoride terpolymer (THV), glass fiber reinforced epoxy, polystyrene, polyvinyl chloride (PVC), polyetheretherketone (PEEK), aramid polymers, polymethyl methacrylate (PMMA), or any combination thereof.

[0090] In some embodiments, each adhesive layer described herein (e.g., each adhesive layer of the thermally insulating component, the protective film, or any combination thereof) may comprise an acrylic-based adhesive. In some embodiments, each adhesive layer described herein (e.g., each adhesive layer of the thermally insulating component, the protective film, or any combination thereof) may comprise an acrylic-based adhesive and a PET carrier film. In some embodiments, each adhesive layer described herein (e.g., each adhesive layer of the thermally insulating component, the protective film, or any combination thereof) may comprise a silicone-based adhesive. In some embodiments, each adhesive layer described herein (e.g.,Each adhesive layer (each of the thermally insulating component, the protective film, or any combination thereof) may comprise a thermosetting adhesive, a urethane-based adhesive, a rubber adhesive, or any combination thereof. In some embodiments where there are multiple adhesive layers, each adhesive layer may be the same. In some embodiments where there are multiple adhesive layers, each adhesive layer may be different. In some embodiments with multiple adhesive layers, some adhesive layers may be the same, while others may be different.

[0091] In some embodiments, the combined thickness of the protective film and the adhesive layer or layers of the thermally insulating component does not exceed the thickness of the thermally insulating layer. In some embodiments, the combined thickness of the protective film and the adhesive layer or layers of the thermally insulating component does not exceed 50% of the thickness of the thermally insulating component. In some embodiments, the combined thickness of the protective film and the adhesive layer or layers of the thermally insulating component does not exceed 40% of the thickness of the thermally insulating component. In some embodiments, the combined thickness of the protective film and the adhesive layer or layers of the thermally insulating component does not exceed 30% of the thickness of the thermally insulating component.In some embodiments, the combined thickness of the protective film and the adhesive layer or layers of the thermally insulating component does not exceed 20% of the thickness of the thermally insulating component. In some embodiments, the combined thickness of the protective film and the adhesive layer or layers of the thermally insulating component does not exceed 10% of the thickness of the thermally insulating component.

[0092] In some embodiments, the thermal barrier layer makes up at least 50% of the total thickness of the thermally insulating component. In some embodiments, the thermal barrier layer makes up at least 60% of the total thickness of the thermally insulating component. In some embodiments, the thermal barrier layer makes up at least 70% of the total thickness of the thermally insulating component. In some embodiments, the thermal barrier layer makes up at least 80% of the total thickness of the thermally insulating component. In some embodiments, the thermal barrier layer makes up at least 90% of the total thickness of the thermally insulating component. In some embodiments, the thermal barrier layer makes up at least 95% of the total thickness of the thermally insulating component. In some embodiments, the thermal barrier layer makes up at least 99% of the total thickness of the thermally insulating component. In some embodiments, the thermal barrier layer makes up 100% of the total thickness of the thermally insulating component.

[0093] In some embodiments, the at least one thermal barrier layer makes up 50% to 99% of the total thickness of the thermally insulating component. In some embodiments, the at least one thermal barrier layer makes up 60% to 99% of the total thickness of the thermally insulating component. In some embodiments, the at least one thermal barrier layer makes up 70% to 99% of the total thickness of the thermally insulating component. In some embodiments, the at least one thermal barrier layer makes up 80% to 99% of the total thickness of the thermally insulating component. In some embodiments, the at least one thermal barrier layer makes up 90% to 99% of the total thickness of the thermally insulating component. In some embodiments, the at least one thermal barrier layer makes up 95% to 99% of the total thickness of the thermally insulating component.

[0094] In some embodiments, the at least one thermal barrier layer makes up 50% to 95% of the total thickness of the thermally insulating component. In some embodiments, the at least one thermal barrier layer makes up 50% to 90% of the total thickness of the thermally insulating component. In some embodiments, the at least one thermal barrier layer makes up 50% to 80% of the total thickness of the thermally insulating component. In some embodiments, the at least one thermal barrier layer makes up 50% to 70% of the total thickness of the thermally insulating component. In some embodiments, the at least one thermal barrier layer makes up 50% to 60% of the total thickness of the thermally insulating component.

[0095] In some embodiments, the at least one thermal barrier layer comprises 60% to 95% of the total thickness of the thermally insulating component. In some embodiments, the at least one thermal barrier layer comprises 70% to 90% of the total thickness of the thermally insulating component. In some embodiments, the at least one thermal barrier layer comprises 75% to 85% of the total thickness of the thermally insulating component.

[0096] Non-limiting examples of a thermal insulation component according to the present disclosure are shown in Fig. 3A to 3J.

[0097] As in Fig. 3A, the heat-insulating component 300 comprises a thermal insulation layer 301. As shown in Fig. 3A, the heat-insulating component 300 includes a protective film 302. As shown in the Fig. 3A and Fig. 3B, the protective film 302 comprises a polymer layer 303 and an adhesive layer 304. As shown in Fig.3A, the adhesive layer 304 of the protective film 302 is arranged between the thermal insulation layer 301 and the polymer layer 303 of the protective film 302.

[0098] As in Fig. 3A, the thermally insulating component 300 also includes the adhesive layer 305, which may be referred to as the "second adhesive layer." The thermally insulating layer 301 is disposed between the protective film 302 and the adhesive layer 305. The thermally insulating layer 301 is disposed between the adhesive layer 304 and the second adhesive layer 305, as shown in Fig. 3A. In the Fig. 3A and Fig. 3B, the adhesive layer 305 is arranged between the thermal insulation layer 301 and the at least one antenna (not shown).

[0099] As in Fig. 3D, the heat-insulating component 300 comprises the thermal insulation layer 301 and the adhesive layer 305. In Fig.3D, the adhesive layer 305 is arranged between the thermal insulation layer 301 and the at least one antenna (not shown).

[0100] Another non-limiting example of a thermal insulation component according to the present disclosure is shown in Fig. 3E. As shown in Fig. As shown in Figure 3E, the thermally insulating component 300 includes a thermal barrier layer 301 and a protective film 302. The protective film 302 includes a polymer layer 303. The adhesive layer 305 is disposed between the thermal barrier layer 301 and the at least one antenna (not shown). In some embodiments, the adhesive layer 305 may contact the protective film 302, the polymer layer 303, or any combination thereof at the edge seal 306.

[0101] Another non-limiting example of a thermal insulation component according to the present disclosure is shown in the Fig. 3F to 3H. In particular, Fig.3F a plan view of a thermal insulation component, Fig. 3G is an isometric exploded view of the thermal insulation component of Fig. 3F and Fig. 3H a cross-sectional view of the thermal insulation component of the Fig. 3F and Fig. 3G.

[0102] As in the Fig. 3F to 3H, the heat-insulating component 300 may have a structure including a plurality of wings 307. As shown in the Fig. 3G and Fig. As shown in Figure 3H, in some embodiments, the plurality of wings 307 may be present on the protective film 302, the adhesive layer 305, or a combination thereof. In some embodiments, the thermal barrier layer 301 also includes a plurality of wings. In some embodiments, the thermal barrier layer 301 does not include a plurality of wings.

[0103] Another non-limiting example of a thermal insulation component is Fig.31. As shown, the thermal insulation component 300 includes a protective film 302, a polymer layer 303, and a first adhesive layer 304. In some embodiments, the thermal insulation component 300 may further include a plurality of thermal barrier layers 301A and 301B and a plurality of second adhesive layers 305A and 305B. As shown, in some embodiments, at least one adhesive layer, such as, but not limited to, the second adhesive layer 305A, may be disposed between two insulation layers, such as, but not limited to, the thermal barrier layers 301A and 301B. In some embodiments, one of the plurality of adhesive layers, such as, but not limited to, the adhesive layer 305B, may be connected to at least one antenna (not shown). In some embodiments, additional thermal barrier layers, e.g., a polymer layer 303, and a first adhesive layer 304, may be included. B. [301C, 301D,...301Z...] may be present.In some embodiments, additional second adhesive layers, e.g., [301C, 301D,...301Z...], may be present.

[0104] Another additional, non-limiting example of a thermal insulation component according to the present disclosure is shown in Fig. 3J. As shown, the thermally insulating component 300 may have a clad configuration, wherein the clad configuration includes a plurality of ePTFE layers 308, each of the plurality of ePTFE layers 308 bonded to a surface of the thermal barrier layer 301. As described herein below, in some embodiments, the thermal insulation layer 301 may be a PTFE-reinforced layer, such as, but not limited to, a PTFE-reinforced aerogel. In some non-limiting examples, the PTFE-reinforced aerogel of the thermally insulating component is in the clad configuration.

[0105] In some embodiments, the assembly may be disposed within a housing. The housing may form part of any device, such as, but not limited to, a mobile device, a cellular phone, a laptop, an augmented reality device, a virtual reality device, a headset, a vehicle radar, or a combination thereof. In some embodiments, the device may be connected to the housing by any suitable connection mechanism described herein.

[0106] In some embodiments, the assembly may further include a power amplifier. In some embodiments, the power amplifier may be in physical contact with the assembly. In some embodiments, the power amplifier may be connected to the assembly using a suitable connection mechanism described herein. In some embodiments, the power amplifier may also be disposed within the housing.

[0107] In some embodiments, the operating temperature of the device may be measured at an interface between the thermally insulating component and the at least one antenna. A non-limiting example of an arrangement with an interface at which the operating temperature of the device may be measured is described in Fig. 4. As shown, the operating temperature of an assembly 400 can be measured at the interface 403 between the thermally insulating component 401 and the at least one antenna 402.

[0108] In some embodiments, the assembly has an operating temperature in the range of 20°C to 120°C. In some embodiments, the assembly has an operating temperature in the range of 40°C to 120°C. In some embodiments, the assembly has an operating temperature in the range of 60°C to 120°C. In some embodiments, the assembly has an operating temperature in the range of 80°C to 120°C. In some embodiments, the assembly has an operating temperature in the range of 100°C to 120°C.

[0109] In some embodiments, the assembly has an operating temperature in the range of 20°C to 100°C. In some embodiments, the assembly has an operating temperature in the range of 20°C to 80°C. In some embodiments, the assembly has an operating temperature in the range of 20°C to 60°C. In some embodiments, the assembly has an operating temperature in the range of 20°C to 40°C.

[0110] In some embodiments, the assembly has an operating temperature in the range of 40°C to 100°C. In some embodiments, the assembly has an operating temperature in the range of 60°C to 80°C.

[0111] A non-limiting example of an exemplary arrangement is shown in the Fig. 5A to 5C. Fig. Figure 5A is an exploded view of an exemplary arrangement. Fig. Figure 5B is a collapsed view of the exemplary assembly of Fig. 5A. Fig. Figure 5C is a cross-sectional view of the exemplary arrangement of the Fig. 5A and Fig. 5B.

[0112] As in the Fig. As shown in Figures 5A to 5C, the assembly 500 includes a thermally insulating component 501 and at least one antenna 505. The thermally insulating component 501 includes a thermal barrier layer 502, a protective film 503, and an adhesive layer 504.

[0113] Another non-limiting example of an exemplary arrangement is shown in the Fig. 5D to 5G shown. Fig. 5D is an exploded view of an exemplary assembly with wings 506 deployed. Fig. 5E is an exploded view of an exemplary arrangement with folded wings 506. Fig. Figure 5F is a collapsed view of the exemplary arrangement of the Fig. 5D and Fig. 5E. Fig. 5G is a cross-sectional view of the exemplary arrangement of the Fig. 5D to 5G.

[0114] As in the Fig. 5D to 5G, in some embodiments, the assembly 500 includes a thermal insulation component 501 and at least one antenna 505. The thermal insulation component 501 includes a thermal barrier layer 502, a protective film 503, and an adhesive layer 504.

[0115] As shown, the protective film 503, the adhesive layer 504, or any combination thereof may include a plurality of wings 506. In some embodiments, the plurality of wings 506 may be folded to form the assembly 500. In some embodiments, such as the embodiment of Fig. 5G, the protective film 503 can surround the thermal insulation layer 502.

[0116] In some embodiments, the at least one antenna 505 may be in the form of an antenna array having a plurality of planes 507. In some of these embodiments, such as, but not limited to, some embodiments of Fig. 5G, the thermal insulation component 501 may be in contact with at least two of the plurality of levels 507. This may, in a non-limiting example, Fig. 5E and Fig.5G by folding the wings 506 of the protective film 503, the adhesive layer 504, or any combination thereof around the at least one antenna 505 (which may be in the form of an antenna array) such that the wings 506 of the protective film 503, the adhesive layer 504, or any combination thereof contact the plurality of levels 507.

[0117] Another non-limiting example of an exemplary arrangement is shown in the Fig. 5H to 5K shown. Fig. 5H is an exploded view of an exemplary arrangement with wings 506 deployed. Fig. 5I is an exploded view of an exemplary arrangement with folded wings 506. Fig. Figure 5J is a collapsed view of the exemplary arrangement of the Fig. 5H and Fig. 51. Fig. Figure 5K is a cross-sectional view of the exemplary arrangement of the Fig. 5H to 5J.

[0118] As in the Fig. As shown in Figures 5H through 5K, the thermal barrier layer 502 of the thermally insulating component 501 may also include wings 506 that may also contact the multiple levels 507 of at least one antenna 505 (which may be in the form of an antenna array). Accordingly, in some embodiments, the wings 506 of the thermally insulating component 502, the protective film 503, the adhesive layer 504, or any combination thereof may contact the multiple levels 507.

[0119] Another non-limiting example of an arrangement is set out in the Fig. 6A and Fig. 6B. Fig. 6A shows a non-limiting example of an antenna array 602 comprising antenna arrays 603, a plurality of dielectric / copper layers 604, and a plurality of copper layers 605. As in Fig.6B, in some embodiments, the assembly 600 may include a thermally insulating component 601 that is integrated into the antenna array 602 of Fig. 6A. Furthermore, in some embodiments, such as in the embodiment of Fig. 6B, the thermally insulating component 601 may be disposed within a field (Φ) of RF communication generated by the antenna array 602. In some embodiments, Φ propagates through the antenna array 602. In some embodiments, the copper layers 605 are made of copper. In some embodiments, the antenna arrays 603 are disposed beneath the thermally insulating component 601.

[0120] Another non-limiting example of an arrangement is in Fig.7. As shown, the assembly 700 includes a thermal insulation component 701 and at least one antenna 702. In some embodiments, the thermal insulation component 701 may be connected to the antenna 702 by an adhesive layer 704. In some embodiments, the assembly 700 may be housed in a housing 703. In some embodiments, the housing 703 defines a portion of a device, such as, but not limited to, a mobile device. In some embodiments, the assembly 700 may be adhered to the housing by a second adhesive layer 705. As shown, in some embodiments, the second adhesive layer 704 is disposed between the thermal insulation component 701 and the at least one antenna.

[0121] Some embodiments of the present disclosure relate to a method of using the array. In some embodiments, the method comprises acquiring the array and transmitting an RF communication field from the at least one antenna at an operating frequency in the range of 6 GHz to 100 GHz. In some embodiments, the method comprises acquiring the array and transmitting an RF communication field from the at least one antenna at an operating frequency in the range of 10 GHz to 100 GHz. In some embodiments, the method comprises acquiring the array and transmitting an RF communication field from the at least one antenna at an operating frequency in the range of 20 GHz to 100 GHz. In some embodiments, the method comprises acquiring the array and transmitting an RF communication field from the at least one antenna at an operating frequency in the range of 30 GHz to 100 GHz.In some embodiments, the method comprises acquiring the array and transmitting an RF communication field from the at least one antenna at an operating frequency in the range of 40 GHz to 100 GHz. In some embodiments, the method comprises acquiring the array and transmitting an RF communication field from the at least one antenna at an operating frequency in the range of 50 GHz to 100 GHz. In some embodiments, the method comprises acquiring the array and transmitting an RF communication field from the at least one antenna at an operating frequency in the range of 60 GHz to 100 GHz. In some embodiments, the method comprises acquiring the array and transmitting an RF communication field from the at least one antenna at an operating frequency in the range of 70 GHz to 100 GHz.In some embodiments, the method comprises acquiring the array and transmitting an RF communication field from the at least one antenna at an operating frequency in the range of 80 GHz to 100 GHz. In some embodiments, the method comprises acquiring the array and transmitting an RF communication field from the at least one antenna at an operating frequency in the range of 90 GHz to 100 GHz.

[0122] In some embodiments, the method comprises acquiring the array and transmitting an RF communication field from the at least one antenna at an operating frequency in the range of 6 GHz to 90 GHz. In some embodiments, the method comprises acquiring the array and transmitting an RF communication field from the at least one antenna at an operating frequency in the range of 6 GHz to 80 GHz. In some embodiments, the method comprises acquiring the array and transmitting an RF communication field from the at least one antenna at an operating frequency in the range of 6 GHz to 70 GHz. In some embodiments, the method comprises acquiring the array and transmitting an RF communication field from the at least one antenna at an operating frequency in the range of 6 GHz to 60 GHz.In some embodiments, the method comprises acquiring the array and transmitting an RF communication field from the at least one antenna at an operating frequency in the range of 6 GHz to 50 GHz. In some embodiments, the method comprises acquiring the array and transmitting an RF communication field from the at least one antenna at an operating frequency in the range of 6 GHz to 40 GHz. In some embodiments, the method comprises acquiring the array and transmitting an RF communication field from the at least one antenna at an operating frequency in the range of 6 GHz to 30 GHz. In some embodiments, the method comprises acquiring the array and transmitting an RF communication field from the at least one antenna at an operating frequency in the range of 6 GHz to 20 GHz.In some embodiments, the method comprises acquiring the assembly and transmitting an RF communication field from the at least one antenna having an operating frequency in the range of 6 GHz to 10 GHz.

[0123] In some embodiments, the method comprises acquiring the array and transmitting an RF communication field from the at least one antenna at an operating frequency in the range of 10 GHz to 90 GHz. In some embodiments, the method comprises acquiring the array and transmitting an RF communication field from the at least one antenna at an operating frequency in the range of 20 GHz to 80 GHz. In some embodiments, the method comprises acquiring the array and transmitting an RF communication field from the at least one antenna at an operating frequency in the range of 30 GHz to 70 GHz. In some embodiments, the method comprises acquiring the array and transmitting an RF communication field from the at least one antenna at an operating frequency in the range of 40 GHz to 60 GHz.

[0124] Some embodiments of the present disclosure relate to a method of manufacturing the assembly.

[0125] In some embodiments, the method includes obtaining at least one antenna and placing a thermal insulation component on at least one surface of the at least one antenna to form the assembly.

[0126] In some embodiments, the method comprises forming the thermally insulating component from a thermal barrier layer and a protective film. In some embodiments, the method comprises forming the protective film from a polymer layer and an adhesive layer. In some embodiments, the method comprises forming the thermally insulating component by bonding the adhesive layer of the protective film to the thermally insulating layer. In some embodiments, the method comprises forming the thermally insulating component from a thermal barrier layer and an adhesive layer. In some embodiments, the method comprises forming the thermally insulating component from a thermal barrier layer, an adhesive layer, and a protective film. In some embodiments, the method comprises applying the thermal insulation component to at least one surface of the at least one antenna.In some embodiments, the method comprises bonding the thermal insulation component to at least one surface of the at least one antenna. In some embodiments, the method comprises attaching the thermal insulation component to at least two levels of an antenna array described herein. In some embodiments, the method comprises attaching the assembly in a housing (e.g., a housing of a mobile device).

[0127] In addition to these disclosed advantages and improvements, other objects and advantages of this disclosure will become apparent from the following description taken in conjunction with the accompanying figures. Detailed embodiments of the present disclosure are disclosed herein; however, it is to be understood that the disclosed embodiments are merely illustrative of the disclosure, which may be embodied in various forms. Furthermore, each of the examples given with respect to the various embodiments of the disclosure is intended to be illustrative and not limiting.

[0128] Throughout the specification and claims, the following terms have the meanings expressly assigned herein, unless the context clearly dictates otherwise. The terms "in one embodiment" and "in some embodiments" as used herein do not necessarily refer to the same embodiment(s), but may. Furthermore, the terms "in another embodiment" and "in some other embodiments" as used herein do not necessarily refer to a different embodiment, although they may. All embodiments of the disclosure are intended to be capable of being combined without departing from the scope or spirit of the disclosure.

[0129] As used herein, the term "based on" is non-exclusive and permits the use of additional, undescribed factors unless the context clearly dictates otherwise. Furthermore, the meaning of "a" and "the" throughout this description includes plural references. The meaning of "in" includes "in" and "on."

[0130] As used herein, terms such as “comprising,” “including,” and “having” do not limit the scope of a particular claim to the materials or steps recited in the claim.

[0131] As used herein, the term “consisting essentially of” limits the scope of a specific claim to the materials or steps specified and those that do not substantially affect the basic and novel feature or features of the specific claim. EXAMPLESTest methods

[0132] Thermal Conductivity Test Method: Thermal conductivity is measured using a TA® Instruments FOX50 heat flow meter. This is a stationary method that complies with ASTM C518. In the FOX50 tester, the thermal conductivity of a material is measured on a two-inch diameter specimen at 25°C, with the hot plate temperature set at 30°C and the cold plate temperature at 20°C. Furthermore, the specimen was measured under a pressure of 6 psi.

[0133] Test method for dielectric properties: IEC 61189-2-721, Edition 1, 2015-04, describes the method for measuring the dielectric constant and dissipation factor of a material using a split-post dielectric resonator (SPDR). A 10 GHz SPDR measures the dielectric properties of a flat sheet sample with a rectangular geometry, 100 mm x 60 mm. The samples were not preconditioned, and the thickness was measured using a snap-in gauge at a pressure of 1 psi.

[0134] Thermogravimetric Analysis Test Method: Thermogravimetric analysis (TGA) data were acquired using a TA® Instruments Q5000 IR. 10-20 mg of sample was placed in a tared platinum sample pan. Samples were analyzed by heating to 100°C under a nitrogen purge and holding the sample isothermally for 20 minutes. The samples were then heated to 800°C at 50°C / minute and held isothermally for 10 minutes. The purge gas was then switched to air, and the samples were held isothermally for an additional 15 minutes. The weight percent aerogel loading is calculated by dividing the residual sample mass at the end of the test by the sample mass after the initial isothermal hold at 100°C. The initial isothermal hold time removes any residual water in the sample to obtain an accurate reading of the initial sample mass.The remaining mass of the sample at the end of the test should consist entirely of aerogel, since all other components are burned out of the sample after the isothermal holding time of 800 °C. Example 1:.

[0135] Measured material properties of exemplary thermally insulating components (“Components”) and exemplary build-up layers (e.g., a thermal barrier layer, at least one adhesive layer, a protective film, a polymer layer, or any combination thereof) were used to model the thermal and RF performance of various component designs. The components were tested against the Fig. 8 and Fig.9. The designs were iterated to identify a viable component design space that met the requirements. The material inputs were measured according to the thermal conductivity test method and the dielectric properties test method. The results were compared using the Fig. 8 and Fig. 9 determined.

[0136] As in the Fig. 8 and Fig.As shown in Figure 9, the component design space may, in some cases, be defined by the thermal conductivity (k), dielectric constant (Dk), and loss tangent (Df) of the component layers in the component stack, and in some embodiments, may be defined by the total thickness of the component and the composition (percentage) by thickness of each component layer. For example, an acceptable design space for a thermally insulating component may be based on the selected materials and the final composition.

[0137] In this example, three sample components (two component layers each) were designed with properties for the thermal insulation layer that encompass the limits of the currently measured materials. To visually simplify the effects of different parameters on the functional installation space, the properties of the protective film were specified for all sample components. The thickness of the protective film was not specified, so that the protective film can be built alongside the thermal insulation layer in various example designs. Fig. 10A-C show a diagram for each component as a function of the component thickness in mm (on the y-axis) and the percentage insulation by thickness (on the x-axis). In Fig. A key is shown in Figure 10D. The properties for each diagram are shown in Table 1 below. Table 1: Material properties of the build-up layers of Figures 10A-10C Figure No. Thermal insulation layer protective film k (W / m·K) Dk Df k (W / m·K) Dk Df 10A 0.015 1.1 0.005 0.2 2.5 0.01 10B 0.018 1.1 0.03 10C 0.021 1.8 0.005

[0138] In the Fig. 10A-C, the entire white area is considered to be the functional design area. Areas shown in gray exceed one or more of the thermal, RF, and thickness limits described above (and are indicated in the legend of Fig. 10D).

[0139] Again referring to Fig. 8, the thermal conductivity (k) of the component can depend on the respective conductivities of the components and the percentage thickness of each component layer in the component. This calculation is represented as a vertical limit in the diagrams, since it does not depend on the total thickness of the component. Fig. 10A to Fig. 10B to Fig. 10C, an increase in the thermal conductivity of the thermal insulation layer shifts the thermal limit to the right (increased percentage insulation by thickness), thereby narrowing the design space for the functional component.

[0140] As in Fig. As shown in Figure 9, the RF transmission loss of the component at a given frequency can depend on the dielectric constant (Dk), the loss factor (Df), and the thickness of the individual component layers of the component. Fig. 10A as a control condition and using the lower end values ​​of Dk (1.1) and Df (0.005) measured for thermal insulation layers, the usable design space (only for RF limits) can extend to the 2 mm thickness limit at ≥ ~80 % insulation through thickness. In Fig. 10B, the Dk value was kept at 1.1 and the Df value was increased to an upper end value measured for thermal insulation layers (0.03). The functional design space (only for HF limits) in Fig. 10B can be compared Fig. 10A and extends to the 2 mm thickness limit at ≥ ~90 % insulation thickness. In Fig.10C, the Df was reset to 0.005 and the Dk was increased to an upper limit value (1.8) measured for thermal barrier coatings. As shown, the functional design space (HF limits only) can be calculated from the Fig. 10A and Fig. 10B can be significantly narrowed down, resulting in functional components of ~0.5 mm thickness at ≥ ~85% insulation thickness and ~1.0 mm thickness at 100% insulation thickness.

[0141] As demonstrated in the present example, in some aspects of the present disclosure, the dielectric constant of the thermal barrier coating may be more important than the loss tangent. Thus, in some embodiments, thermal barrier coatings with low thermal conductivity (k < 0.025 W / m K), low dielectric constants (Dk < 1.5), and moderate loss tangents (Df < 0.03) may provide a unique advantage for thermally insulating components in millimeter-wave antenna applications. Example 2:

[0142] The material properties of the individual layers of thermally insulating components were either measured or taken from data sheets or literature references. The thermal conductivity, dielectric constant, and loss tangent values ​​were determined for the following layers: adhesive layer, thermal barrier coatings, and protective films. Unless otherwise stated, the samples were measured according to the procedures described for the "Thermal Conductivity Test Method" and the "Dielectric Properties Test Method" (see "Test Methods" above). Table 2 summarizes the properties for each constituent layer of the present example. The layers in Table 2 are the measured component layers used for modeling. If multiple samples of a particular constituent layer were measured, a range is given to encompass the obtained measured values. Table 2: Measured constituent layers Constituent layer Sample type Constituent Level Code Material manufacturer Product P / N Material Description Thermal insulation layer TL1 WL Gore & Associates, Inc. - Silica aerogel reinforced with PTFE Thermal insulation layer TL2 WL Gore & Associates, Inc. - Silica aerogel reinforced with PTFE, laminated with ePTFE membranes Thermal insulation layer TL3 Sheen Electronica 1 Technolog y Co, Ltd SY30 0 Silica aerogel coating reinforced with PET carrier film Protective film: polymer layer + adhesive layer PF1 Sidike New Materials Science and Technolog y Co, Ltd. SDK7140 Single-sided PET acrylate adhesive tape Protective film: polymer layer PF2 WL Gore & Associates, Inc. - ePTFE film Adhesive layer (Second adhesive layer) AL1 Sidike New Materials Science and Technolog y Co, Ltd. SDK97C0 1 PET double-sided acrylic adhesive tape Table 2: Measured constituent layers (continued) Constituent Level Code Measured attributes Thickness (mm) Aerogel loading (wt%) Characteristics Thermal conductivity, k (W / m·K) Dielectric constant, Dk Loss tangent, Df TL1 0.25 - 0.78 55 0.015 - 0.02 1.16- 1.32 0.0095 - 0.0203 TL2 0.1 - 0.53 52 0.015 - 0.02 1.18- 1.36 0.0096 - 0.022 TL3 0.08 - 0.12 22 0.033 - 0.045 1.64 0.011 PF1 0.01 N / A 0.19a 2.75 0.023 PF2 0.006 N / A 0.06 1.1-2 0.00008 - 0.0002 AL1 0.005 - 0.01 N / A 0.19a 2.44 0.014 a. PET and acrylic values ​​taken from the following literature sources: https: / / www.electronics-cooling.com / 2001 / 05 / the-thermal-conductivity-of-unfilled-plastics / , http: / / www.matweb.com / search / datasheet.aspx?MatGUID=632572aeef2a4224b5ac8fbd4f1b6f77

[155] In addition, thermally insulating components consisting of multiple layers were tested. Unless otherwise stated, the layers were measured according to the procedures for the “Test Method for Thermal Conductivity” and the “Buffer Method for Dielectric Simplexes.” Table 3 summarizes the properties for the thermally insulating components. The layers in Table 3 are the measured components referenced for modeling. If multiple samples of a component were measured, an area is shown to record the obtained measured values. Table 3: Measured components of thermal insulation Component code Insulation manufacturers Product P / N TC1 WL Gore & Associates, Inc. - TC2 WL Gore & Associates, Inc. - TC3 WL Gore & Associates, Inc. - TC4 Panasonic (supplied by Digi-Key® Electronics) NASBIS® EYG-Y0912QN6S TC5 Panasonic (supplied by Digi-Key® Electronics) NASBIS® EYG-Y0912QN4S Table 3 (continued): Measured components of thermal insulation Component code TC1 Material Description Thermal insulation layer silica aerogel reinforced with PTFE Protective film ePTFE film + PET double-sided acrylic adhesive tape Adhesive layer (Secondary adhesive) PET double-sided acrylic adhesive tape TC2 Silica aerogel reinforced with PTFE, laminated with ePTFE membranes Single-sided PET acrylate adhesive tape PET double-sided acrylic adhesive tape TC3 Silica aerogel reinforced with PTFE Single-sided PET acrylate adhesive tape PET double-sided acrylic adhesive tape TC4 Silica aerogel reinforced with PET textile PET film (no adhesive) PET double-sided acrylic adhesive tape TC5 Silica aerogel reinforced with PET textile PET film (no adhesive) PET double-sided acrylic adhesive tape Table 3 (continued): Measured components of thermal insulation Component code Measured attributes Aerogel loading (wt%) Characteristics Thermal conductivity, k (W / m·K) Dielectric constant, Dk Loss tangent, Df TC1 55 0.016-0.022 1.34 0.0128 TC2 52 0.017-0.024 1.46 0.0151 TC3 55 0.016 - 0.021 1.32 - 1.38 0.0124 - 0.0170 TC4 20 0.024-0.033 1.6 0.009 TC5 48 0.019-0.023 1.4 0.007 Example 3:

[0143] The following articles and comparative articles, which are in the form of thermal barrier coatings, thermally insulating components, and combinations thereof, were designed and tested. Components and constituent layers were tested for thermal conductivity and dielectric properties and are described in Tables 2 and 3.

[0144] Item 1: (Item 1 is a thermal barrier coating referred to as component G1) A thermal barrier coating consisting of PTFE-reinforced silica aerogel was fabricated according to the teachings of US Patent 7,118,801 B2 to Ristic-Lehmann et al. with a thickness of 0.25 mm. The aerogel loading in the composite was measured at 55 wt% according to the "Thermogravimetric Analysis Method" (see above, "Test Methods"). The thermal conductivity of the composite was measured at 0.017 W / mK at 25 °C and 1 atm, measured according to the "Thermal Conductivity Test Method." The dielectric properties of the composite were measured using the Dielectric Property Test Method, with the dielectric constant of the composite being 1.27 at 10 GHz and the loss tangent of the composite being 0.0164 at 10 GHz.

[0145] Item 2: (Item 2 is referred to as Component H2) A thermal barrier coating consisting of PTFE-reinforced silica aerogel with two ePTFE membranes bonded by temperature and pressure to both surfaces of the composite was prepared according to the teachings of US Patent 7,118,801 B1 to Ristic-Lehmann et al. The ePTFE membranes were prepared according to the teachings of US Patent 5,476,589 A to Bacino, with both membranes having a mass per area of ​​0.5 g / m2, an air permeability of 3.4 Frazier, and a thickness of 0.004 mm. The final thickness of the thermal barrier coating was 0.1 mm. The aerogel loading in this thermal barrier coating was measured at 52 wt% using the thermogravimetric analysis method. The thermal conductivity of the thermal insulation layer was measured at 0.018 W / mK at 25 °C and 1 atm, measured according to the “Thermal Conductivity Test Method”.The dielectric properties of the thermal barrier coating were measured using the Dielectric Property Test Method, with the dielectric constant being 1.32 at 10 GHz and the loss tangent being 0.0185 at 10 GHz.

[0146] Item 3: (A thermal insulation component, referred to as Item A1) The thermal insulation layer from Item 1 was used to construct a thermal insulation component with an adhesive layer and a protective film made of ePTFE. A 0.006 mm thick, densified ePTFE film was prepared according to the teachings of US Patent 7,521,010 B2 to Kennedy et al. A 0.005 mm thick double-sided PET-acrylic adhesive tape (part number 82600 Electronic Double Sided Tapes from 3M) was adhered to the 0.006 mm thick, densified ePTFE film to create a protective film. This protective film was adhered to the 0.25 mm thick thermal insulation layer of Item 1 using a hand roller, applying light pressure. A 0.01 mm thick double-sided PET acrylic adhesive tape (part number SDK97C01 from Sidike New Materials Science and Technology Co., Ltd.) was applied to the thermal insulation layer on the side opposite the protective film. The adhesive was applied with light pressure using a hand roller.The thermal insulation component, consisting of a thermal insulation layer, a protective film, and an adhesive layer, had a thickness of 0.271 mm. The thermal conductivity of the thermal insulation component was measured at 0.018 W / mK at 25 °C and 1 atm, according to the Thermal Conductivity Test Method. The dielectric properties of the thermal insulation component were measured using the Dielectric Property Test Method, with the dielectric constant at 10 GHz being 1.34 and the loss tangent at 0.0128.

[0147] Item 4: (The thermal insulation component of Item 4 is referred to as components B1 and B2.) The thermal insulation layer from Item 2 was used to construct a thermal insulation component with an adhesive layer and a protective film made of PET. A 0.01 mm thick PET single-sided acrylic adhesive (part number SDK7140 from Sidike New Materials Science and Technology Co., Ltd.) was used as the protective film and adhered to the 0.1 mm thick thermal insulation layer of Item 2 with light pressure using a hand roller. A 0.01 mm thick PET double-sided acrylic adhesive tape (part number SDK97C01 from Sidike New Materials Science and Technology Co., Ltd.) was adhered to the thermal insulation layer on the side opposite the protective film. The adhesive was applied with light pressure using a hand roller. The thermal insulation component, consisting of a thermal insulation layer, a protective film and an adhesive layer, had a thickness of 0.12 mm.The thermal conductivity of the thermal insulation component was measured at 0.021 W / mK at 25 °C and 1 atm, measured according to the Thermal Conductivity Test Method. The dielectric properties of the thermal insulation component were measured according to the Dielectric Property Test Method, with the dielectric constant at 10 GHz being 1.52 and the loss tangent at 0.0149.

[0148] Item 5: (The thermal insulation component of Item 5 is referred to as components C1 and C2.) The thermal insulation layer of Item 1 was used to construct a thermal insulation component with an adhesive layer and a PET protective film. A 0.01 mm thick single-sided PET acrylic adhesive (part number SDK7140 from Sidike New Materials Science and Technology Co., Ltd.) was used as the protective film, which was adhered to the 0.25 mm thick thermal insulation layer of Item 1 with light pressure using a hand roller. A 0.01 mm thick double-sided PET acrylic adhesive tape (part number SDK97C01 from Sidike New Materials Science and Technology Co., Ltd.) was adhered to the thermal insulation layer on the side opposite the protective film. The adhesive was applied with light pressure using a hand roller. The thermal insulation component, consisting of a thermal insulation layer, a protective film and an adhesive layer, had a thickness of 0.27 mm.The thermal conductivity of the thermal insulation component was measured at 0.0185 W / mK at 25 °C and 1 atm, measured according to the Thermal Conductivity Test Method. The dielectric properties of the thermal insulation component were measured according to the Dielectric Property Test Method, with the dielectric constant at 10 GHz being 1.38 and the loss tangent at 0.017.

[0149] Article 6: (This thermal insulation component is referred to as components D1 and D2) A thermal insulation layer made of PTFE-reinforced silica aerogel was prepared according to the teachings of US Patent No. 7,118,801 B1 by Ristic-Lehmann et al. with a thickness of 0.35 mm. The aerogel loading in the composite was measured at 55 wt% using the thermogravimetric analysis method. The thermal insulation layer was used to assemble a thermal insulation part with an adhesive layer and a protective PET film.

[0150] A 0.01 mm thick single-sided PET acrylic adhesive (part number SDK7140 from Sidike New Materials Science and Technology Co., Ltd.) was used as a protective film and adhered to the 0.35 mm thick thermal barrier layer with light pressure applied with a hand roller.

[0151] A 0.01 mm thick double-sided PET acrylic adhesive tape (part number SDK97C01 from Sidike New Materials Science and Technology Co., Ltd.) was applied to the thermal insulation layer on the side facing away from the protective film. The adhesive was applied with light pressure using a hand roller.

[0152] The thermal insulation component, consisting of a thermal barrier layer, a protective film, and an adhesive layer, had a thickness of 0.37 mm. The thermal conductivity of the thermal insulation component was measured according to the Thermal Conductivity Test Method at 0.0167 W / mK at 25 °C and 1 atm. The dielectric properties of the thermal insulation component were measured according to the Dielectric Property Test Method, with the dielectric constant at 10 GHz being 1.32 and the loss tangent at 0.0124.

[0153] Item 7: (The thermal insulation component of Item 7 is referred to as Component F1) A thermal insulation component manufactured by Panasonic, consisting of silica aerogel reinforced with a PET nonwoven fabric (part number NASBIS® EYG-Y0912QN4S from Digi-Key® Electronics), was obtained. This part number consists of a 0.48 mm thick reinforced thermal insulation layer, a 0.01 mm thick PET protective film (containing no adhesive) on one side of the thermal insulation layer, and a 0.01 mm thick double-sided acrylic adhesive on the side of the thermal insulation layer opposite the protective film. The total thickness of the thermal insulation part is measured at 0.5 mm. The aerogel loading in this thermal insulation component was measured at 47.8 wt% by the thermogravimetric analysis method. The thermal conductivity of the heat-insulating component was measured at 0.020 W / mK at 25 °C and 1 atm, measured according to the Thermal Conductivity Test Method.The dielectric properties of the thermal insulation component were measured using the Dielectric Property Test Method, with the dielectric constant being 1.4 at 10 GHz and the loss tangent being 0.007 at 10 GHz. Comparative example 1:

[0154] Comparative Item 1: (The thermal insulation component of Comparative Item 1 is referred to as Component E1) A thermal insulation component manufactured by Panasonic, consisting of silica aerogel reinforced with a PET nonwoven fabric (part number NASBIS® EYG-Y0912QN6S from Digi-Key® Electronics), was obtained. This part number consists of a 0.1 mm thick reinforced thermal insulation layer, a 0.01 mm thick PET protective film (containing no adhesive) on one side of the thermal insulation layer, and a 0.01 mm thick double-sided acrylic adhesive on the side of the thermal insulation layer opposite the protective film. The total thickness of the thermal insulation part is measured at 0.12 mm. The aerogel loading in this thermal insulation component was measured at 20.1 wt% according to the "Thermogravimetric Analysis Method" (see "Test Methods" above).The thermal conductivity of the thermal insulation component was measured at 0.028 W / mK at 25 °C and 1 atm, measured according to the Thermal Conductivity Test Method. The dielectric properties of the thermal insulation component were measured according to the Dielectric Property Test Method, with a dielectric constant of 1.6 at 10 GHz and a loss tangent of 0.009 at 10 GHz.

[0155] Comparative Item 2: (This thermal barrier coating is referred to as component I1) A thermal barrier coating made of silica aerogel reinforced with a PET carrier film (part number SY300N) manufactured by Shenzhen ShenEn Dianzi Keji ("Sheen Electronics") was purchased. This part number consists of a 0.03 mm thick PET carrier film with a 0.075 mm thick aerogel coating on one side of the PET carrier film. The thickness of the thermal barrier coating was measured at 0.105 mm. The aerogel loading in this thermal barrier coating was measured at 22.5 wt% according to the thermogravimetric analysis method. The thermal conductivity of the thermal barrier coating was measured at 0.033 W / mK at 25 °C and 1 atm, measured according to the thermal conductivity test method.The dielectric properties of the thermal barrier coating were measured using the Dielectric Property Test Method, with the dielectric constant being 1.64 at 10 GHz and the loss tangent being 0.011 at 10 GHz. Example 4:

[0156] Table 4: Model inputs - Measured components Example code Component construction Measured components Thermal insulation layer protective film Adhesive layer Adhesive layer A1* Silica aerogel reinforced with PTFE ePTFE film + adhesive Acrylic adhesive B1* Silica aerogel reinforced with PTFE, laminated with ePTFE membranes PET film + adhesive Acrylic adhesive C1* Silica aerogel reinforced with PTFE PET film + adhesive Acrylic adhesive D1* Silica aerogel reinforced with PTFE PET film + adhesive Acrylic adhesive E1* Silica aerogel reinforced with PET textile PET film Acrylic adhesive F1* Silica aerogel reinforced with PET textile PET film Acrylic adhesive Table 4: Model inputs - Measured components (cont.) Example code thickness Characteristics Measured components Total thickness of the component (mm) % Insulation layer % Protective film % Adhesive layer Adhesive layer Component Dk Component Df Component k (W / m·K) A1* 0.271 92. 23. 93.9 1.34 0.0128 0.0184 B1* 0.12 83. 48. 38.3 1.52 0.0149 0.0214 C1* 0.27 92. 63. 73.7 1.38 0.017 0.0185 D1* 0.37 94. 62. 72.7 1.32 0.0124 0.018 E1* 0.12 83. 48. 38.3 1.6 0.009 0.028 F1* 0.5 9622 1.4 0.007 0.02

[0157] Here and in the following, “*” means that the exact sample structure was tested for dielectric and thermal properties.

[0158] The thermal insulation components shown in Table 4 were physically constructed and tested according to the Thermal Conductivity Test Method and the Dielectric Property Test Method (see Test Methods above). The measured parameters were entered into the Fig.The model shown in Figure 9 was entered to determine whether the components met the RF transmission loss requirements. A thermal conductivity calculation was not necessary because the thermal conductivity was measured on the thermal insulation components.

[0159] The component layers of components B1, C1, and D1 were individually tested using the Thermal Conductivity Test Method and the Dielectric Property Test Method. Table 5 shows components B2, C2, and D2, which are virtual constructions of B1, C1, and D1, respectively, using the measured properties of the constituent layers and the principles of series impedance. The measured parameters were converted into the Fig. 8 and Fig.The models shown in Figure 9 were entered to determine whether the components: 1) met or failed to meet the thermal conductivity and RF transmission loss requirements, and 2) were consistent with their component counterparts (B2 versus B1, etc.). The results for components A1, B1, B2, C1, C2, D1, D2, E1, and F1 are shown in Table 6. Table 5: Model inputs - selected measured components by constituent layer Example code Component construction thickness Total component (mm) % Composition Virtual component constructions (from measured constituent layers) Thermal insulation layer protective film Adhesive layer Insulation layer Protective film Adhesive layer Adhesive layer B2 Silica aerogel reinforced with PTFE, laminated with ePTFE membrane PET film + adhesive Acrylic adhesive 0.12 83. 48. 38.3 C2 Silica aerogel reinforced with PTFE PET film + adhesive Acrylic adhesive 0.27 92. 63. 73.7 D2 Silica aerogel reinforced with PTFE PET film + adhesive Acrylic adhesive 0.37 94. 62. 72.7 Table 5 (continued): Model inputs - Selection of measured components by constituent layer Example code Characteristics Dk Df k (W / m·K) Virtual component constructions (from measured constituent layers) Thermal insulation layer Protective film Adhesive layer Thermal insulation layer Protective film Adhesive layer Thermal insulation layer Protective film Adhesive layer B2 1.322 .742 .44 0.01850 .01670 .014 0.0180 . 190.19 C2 1.282 .742 .44 0.01760 .01670 .014 0.0170 . 190.19 D2 1. 232.742 .44 0.01220 .01670 .014 0.0170 . 190.19 Table 6: Thermal and RF outputs (Pass / Fail) for the AF components Example code Thermal conductivity (W / m·K) RF transmission loss (dB) Component conductivity P / F (< 0.025 W / m·K) @ 28 GHz P / F (< 0.25 dB) @ 39 GHz P / F (< 0.25 dB) A1* 0.0184 P 0.0149 P 0.0224 P B1* 0.0214 P 0.0084 P 0.0124 P B2 0.0212 P 0.0098 P 0.0144 P C1* 0.0185 P 0.02 P 0.0297 P C2 0.0182 P 0.0201 P 0.0299 P D1* 0.018 P 0.0205 P 0.031 P D2 0.0179 P 0.0199 P 0.0298 P E1* 0.028 F 0.0063 P 0.0099 P F1* 0.02 P 0.0266 P 0.0436 P

[0160] All tested sample constructions met the requirements with the exception of component E1. Component E1 failed to meet the thermal conductivity description of < 0.025 W / m K at 25 °C and 1 atm. As shown in Table 2, this thermal component has an aerogel loading of 20 wt. %, illustrating that in some embodiments, a low aerogel loading in the thermal insulation component results in higher than desired thermal conductivity. For the tested components with a low aerogel loading, the resulting component conductivity is greater than that of air, resulting in an ineffective thermal barrier compared to air. The other components that met the thermal conductivity requirements had aerogel loadings of 48-55 wt.-%, which shows that in some embodiments the design of the thermal barrier layer is crucial to ensure thermal conductivity below that of air.

[0161] The thermal conductivity and RF transmission loss results for components B2, C2, and D2 are in very good agreement with their counterparts B1, C1, and D1, respectively. These results validate the approach of using virtual designs of thermally insulating components from constituent layers with given properties. In some of the following examples, this approach is used to create designs that are thicker than the physical samples tested in the "Thermal Conductivity Test Method" and the "Dielectric Properties Test Method." Example 5: Table 7: Model inputs - Virtual designs for two-layer components Example code Component construction Virtual designs for two-layer components Thermal insulation layer protective film G Silica aerogel reinforced with PTFE No H Silica aerogel reinforced with PTFE, laminated with ePTFE membranes No I Silica aerogel coating reinforced with PET carrier film No J Silica aerogel reinforced with PTFE ePTFE film K Silica aerogel reinforced with PTFE, laminated with ePTFE membranes PET film Table 7 (continued): Model inputs - Virtual designs for two-layer components Example code Characteristics Dk Df k (W / m·K) Virtual designs for two-layer components Thermal insulation layer protective film Thermal insulation layer protective film Thermal insulation layer protective film G 1.27N / A 0.0164N / A 0.017N / A H 1.32N / A 0.0185N / A 0.018N / A I 1.64N / A 0.01 1N / A 0.033N / A J 1.321 .4 0.02030 .0001 0.0150 .06 K 1.362 .75 0.0220 .023 0. 020.19

[0162] Table 7 describes components G, H, I, J, and K, which are virtual component designs composed of individual layers with measured properties, regardless of thickness. All components consist of a thermal barrier layer, while components J and K also consist of a protective film. Additional adhesive layers are omitted for simplicity in the following examples. Table 8: Thermal and RF outputs (Pass / Fail) for GK components Example Thickness inputs Thermal conductivity (W / m·K) Total thickness of the component (mm) % insulation % protective film Component conductivity P / F (< 0.025 W / m·K) G1* 0.25 100 0 0.017 P G2 2 100 0 0.017 P H1 0.03 100 0 0.018 P H2* 0.1 100 0 0.018 P H3 2 100 0 0.018 P I1* 0.12 100 0 0.033 F I2 2 100 0 0.033 F J1 0.5 50 50 0.024 P J2 2 50 50 0.024 P J3 2 80 20 0.0176 P J4 2 98 2 0.0152 P K1 0.5 50 50 0.0362 F K2 1 50 50 0.0362 F K3 1 80 20 0.0244 P K4 2 80 20 0.0244 P K5 1 98 2 0.0204 P K6 2 98 2 0.0204 P Table 8 (continued): Thermal and RF outputs (Pass / Fail) for GK components Example RF transmission loss (dB) @ 28 GHz P / F (< 0.25 dB) @ 39 GHz P / F (< 0.25 dB) G1* 0.0149 P 0.0216 P G2 0.1536 P 0.1856 P H1 0.0019 P 0.0027 P H2* 0.0066 P 0.0094 P H3 0.1889 P 0.2223 P I1* 0.0077 P 0.0119 P I2 0.3323 F 0.2926 F J1 0.0286 P 0.045 P J2 0.158 P 0.172 P J3 0.18 P 0.2037 P J4 0.1973 P 0.2327 P K1 0.1549 P 0.2569 F K2 0.4358 F 0.6631 F K3 0.2077 P 0.3064 F K4 0.4071 F 0.4295 F K5 0.1204 P 0.1744 P K6 0.2368 P 0.263 F

[0163] The sample components G1, G2, H1, H2, and H3 have aerogel loadings of 52-55 wt.%, resulting in k ≤ 0.02 W / m K, which meets the thermal conductivity criterion (k < 0.025 W / m K). The low Dk (< 1.5) and moderate Df (< 0.03 & > 0.01) of these components enable an RF transmission loss value of < 0.25 dB at 28 and 39 GHz, which meets the RF transmission loss criterion for all sample designs up to 2 mm.

[0164] Components I1 and I2 have aerogel loadings of 22.5 wt%, resulting in k > 0.025, which does not meet the thermal conductivity criterion (k < 0.025 W / m K). The moderate Dk (< 2.0) and moderate Df (< 0.03) of these components enable an RF transmission loss < 0.25 dB at 28 and 39 GHz for relatively thin samples (< ~0.5 mm) and an RF transmission loss > 0.25 dB at 28 and 39 GHz for thicker samples (> ~0.5 mm) up to 2 mm. Therefore, sample I1 (0.12 mm) meets the RF transmission attenuation criteria, and I2 (2 mm) does not meet the RF transmission attenuation criteria.

[0165] Components J and K are constructed with similar thermal barrier coatings and different protective films. While PET is a mass-produced product and PET protective films may have cost advantages, ePTFE protective films have relative advantages in terms of low k (0.06 W / m·K), low Dk (< 1.5), and very low Df (< 0.001). In comparison, the PET protective film has a moderate k (< 0.4 W / m·K), a moderately high Dk (< 3.0), and a moderate Df (< 0.03).

[0166] The thermal insulation layers for components J1, J2, J3, and J4 have aerogel loadings of ~55 wt.%. When bonded to an ePTFE protective film, the thermal conductivity of the thermally insulating component is < 0.025 W / m K for all sample structures ≥ 50% insulation thickness. These components enable an RF transmission loss of < 0.25 dB at 28 and 39 GHz, which meets the RF transmission loss criterion for all sample structures up to 2 mm.

[0167] The thermal insulation layers for components K1, K2, K3, K4, K5, and K6 have aerogel loadings of 52 wt.%. When bonded to a PET protective film, the thermal conductivity of the thermally insulating component is < 0.025 W / m K for all example designs ≥ 80% insulation thickness. These components enable RF transmission attenuation of < 0.25 dB at 28 and 39 GHz for certain combinations of component thickness and % insulation thickness. It should also be noted that some example designs can meet the RF transmission attenuation criteria at 28 GHz but not at 39 GHz, such as components K1, K3, and K6. The design space for the thermally insulating component K is shown in the graphic by Fig. 11A, where Fig. 11B a key for Fig.11A. The sample components K1, K2, K3, K4, K5 and K6 are marked in the diagram to indicate the passed and failed samples according to design requirements (Table 8). Components B, C and D are in Fig. 11A is shown for reference because the constituent materials and properties are comparable to those of component K. Example 6: Table 9: Model inputs - Virtual component designs that exhibit dielectric limits Example code Component construction Virtual designs for components with dielectric limits Thermal insulation layer protective film L Reinforced aerogel ePTFE film M Reinforced aerogel ePTFE film Table 9 (continued): Model input properties for virtual component designs Dielectric limits Example code Characteristics Dk Df k (W / m·K) Thermal insulation layer protective film Thermal insulation layer protective film Thermal insulation layer protective film Virtual designs for components with dielectric limits L 41.4 0. 010.0001 0.0170 .06 M 1. 21.4 0. 10.0001 0.0170 .06

[0168] Table 9 shows two thermally insulating components used to test the dielectric limits of the thermal barrier coating on the design space of the thermally insulating component. ePTFE is the protective film in this exercise due to its low dielectric properties. The thermal barrier coating of component L was chosen to have an upper limit of Dk (4.0), and the thermal barrier coating of component M was chosen to have an upper limit of Df (0.1). Table 10: Thermal and RF outputs (Pass / Fail) for LM components Example Thickness inputs Thermal conductivity (W / m·K) Total thickness of the component (mm) % insulation % protective film Component conductivity P / F (< 0.025 W / m·K) L1 0.04 80 20 0.0198 P L2 0.23 80 20 0.0198 P M1 0.04 80 20 0.0198 P M2 0.7 80 20 0.0198 P Table 10 (continued): Thermal and RF outputs (Pass / Fail) for components LM Example RF transmission loss (dB) @ 28 GHz P / F (< 0.25 dB) @ 39 GHz P / F (< 0.25 dB) L1 0.0069 P 0.0117 P L2 0.136 P 0.2467 P M1 0.0098 P 0.0137 P M2 0.1769 P 0.2465 P

[0169] Four samples were tested using the material properties from Table 9. The results are presented in Table 10. Samples L1 and M1 demonstrate that thin versions of these components are suitable in the design space. Samples L2 and M2 were designed to find the maximum thickness (80% insulation through thickness) so that the component passes all criteria for thermal and RF. For L2 and M2, the component thickness limits were found to be 0.23 mm and 0.7 mm, respectively. These results illustrate the trade-offs between the thickness and dielectric properties of the thermal insulation layer. The results also show that the dielectric constant of the thermal insulation layer can be more sensitive to thickness changes than the loss tangent of the thermal insulation layer.

[0170] The invention therefore relates in particular to an arrangement consisting of: at least one antenna, wherein the at least one antenna is configured to transmit a radio frequency (RF) communication field at an operating frequency in the range of 6 GHz to 100 GHz; and a heat-insulating component, wherein the heat-insulating component is arranged within the RF communication field, and wherein the thermally insulating component has a thermal conductivity of 0.0025 W / m·K to 0.025 W / m·K at 25 °C and 1 atm.

[0171] The heat-insulating component includes a thermal insulation layer and a protective film.

[0172] The protective film includes a polymer layer.

[0173] One embodiment provides that the protective film further comprises an adhesive layer, wherein the adhesive layer is arranged between the thermal insulation layer and the polymer layer.

[0174] One embodiment provides that the heat-insulating component comprises a heat-insulating layer and an adhesive layer, wherein the adhesive layer is arranged between the heat-insulating layer and the at least one antenna.

[0175] One embodiment provides that the heat-insulating component further comprises an adhesive layer, wherein the heat-insulating layer is arranged between the protective film and the adhesive layer, and wherein the adhesive layer is arranged between the heat-insulating layer and the at least one antenna.

[0176] The adhesive layer of the protective film is a first adhesive layer, wherein the heat-insulating component further comprises a second adhesive layer, wherein the heat-insulating layer is arranged between the protective film and the second adhesive layer, and wherein the second adhesive layer is arranged between the heat-insulating layer and the at least one antenna.

[0177] One embodiment provides that a combined thickness of the protective film and the second adhesive layer does not exceed the thickness of the thermal insulation layer.

[0178] One embodiment provides that the combined thickness of the protective film and the second adhesive layer does not exceed 50% of the thickness of the heat-insulating component.

[0179] One embodiment provides that the heat-insulating component has a thickness of 0.03 mm to 2 mm.

[0180] One embodiment provides that the thermal barrier layer, the thermally insulating component or any combination thereof comprises an aerogel.

[0181] One embodiment provides that the thermal barrier layer, the thermally insulating component or any combination thereof comprises the aerogel in an amount of at least 30 wt.%, based on a total weight of the thermal barrier layer, the thermally insulating component or any combination thereof.

[0182] One embodiment provides that the thermal barrier layer, the thermally insulating component or any combination thereof further comprises a fluoropolymer.

[0183] One embodiment provides that the fluoropolymer is polytetrafluoroethylene.

[0184] One embodiment provides that the aerogel is a ceramic aerogel, a polymer aerogel or a combination thereof.

[0185] One embodiment provides that the ceramic aerogel is a silica aerogel.

[0186] One embodiment provides that the polymer aerogel is a polyimide aerogel.

[0187] One embodiment provides that the aerogel is a reinforced aerogel.

[0188] One embodiment provides that the reinforced aerogel is a polyethylene terephthalate (PET) reinforced aerogel, a polytetrafluoroethylene (PTFE) reinforced aerogel, or a combination thereof.

[0189] One embodiment provides that the heat-insulating component comprises several heat-insulating layers.

[0190] One embodiment provides that an adhesive layer is also present between each thermal insulation layer.

[0191] One embodiment provides that the at least one antenna is in the form of an antenna array, wherein the antenna array comprises a plurality of antennas, each antenna being configured to transmit the RF communication field at the operating frequency in the range of 6 GHz to 100 GHz.

[0192] One embodiment provides that the heat-insulating component is embedded in the antenna group.

[0193] One embodiment provides that the thermal insulation layer has a thermal conductivity in the range of 0.0025 W / m·K to 0.025 W / m·K at 25 °C and 1 atm.

[0194] One embodiment provides that the thermally insulating component, the thermal insulation layer, or any combination thereof has a dielectric constant in the range of 1.05 to 4, measured according to IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using a split post dielectric resonator (SPDR).

[0195] One embodiment provides that the thermally insulating component, the thermal insulation layer, or any combination thereof has a loss tangent in the range of 0.00001 to 0.1, measured according to IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using a split post dielectric resonator (SPDR).

[0196] One embodiment provides that the arrangement is located within a housing.

[0197] One embodiment further provides that an adhesive layer is included between the heat-insulating component and the housing.

[0198] One embodiment provides that the housing is part of a mobile device.

[0199] One embodiment provides that a part of the heat-insulating component extends beyond the field of RF communication.

[0200] One embodiment provides that the antenna array comprises a plurality of levels and wherein the heat-insulating component is in contact with at least two levels of the plurality of levels.

[0201] One embodiment provides that the arrangement further comprises a power amplifier.

[0202] One embodiment provides that the power amplifier is in physical contact with the at least one antenna.

[0203] One embodiment provides that the power amplifier is connected to the at least one antenna.

[0204] One embodiment provides that the at least one antenna is configured to transmit a radio frequency (RF) communication field having a wavelength in the range of 3 mm to 50 mm.

[0205] One embodiment provides that the arrangement has an operating temperature in the range of 20 °C to 120 °C, wherein the operating temperature is measured at an interface between the heat-insulating component and the at least one antenna.

[0206] One embodiment provides that the PTFE-reinforced aerogel is a PTFE-reinforced aerogel in a jacketed configuration, wherein the jacketed configuration comprises a plurality of ePTFE layers, each of the plurality of ePTFE layers being bonded to a surface of the PTFE-reinforced aerogel.

[0207] One embodiment provides that the thermal barrier layer, the thermally insulating component or any combination thereof comprises the aerogel in an amount of 30 wt.% to 95 wt.%, based on a total weight of the thermal barrier layer, the thermally insulating component or any combination thereof.

[0208] In a further aspect, the invention thus relates to a method comprising: Obtaining an order, the order comprising: at least one antenna; and a heat-insulating component, wherein the heat-insulating component is arranged within the RF communication field, and wherein the thermally insulating component has a thermal conductivity of less than 0.025 W / m·K at 25 °C and 1 atm Transmitting a radio frequency (RF) communication field from the at least one antenna at an operating frequency in the range of 6 GHz to 100 GHz, wherein the RF communication field is transmitted such that the heat-insulating component is arranged in the RF communication field.

[0209] In a further aspect, the invention relates to a method comprising: obtaining at least one antenna; wherein the at least one antenna is configured to transmit a radio frequency (RF) communication field at an operating frequency in the range of 6 GHz to 100 GHz; and applying a thermal insulation component to at least one surface of the at least one antenna to form an assembly; wherein applying the thermal insulation component to at least one surface of the antenna array places the thermally insulating component within the field of RF communication, and wherein the thermally insulating component has a thermal conductivity of less than 0.025 W / m·K at 25 °C and 1 atm.

[0210] One embodiment further provides that the formation of the heat-insulating component from a heat-insulating layer and a protective film is included.

[0211] One embodiment further provides that the formation of the protective film from a polymer layer and an adhesive layer is included.

[0212] One embodiment further provides that the formation of the heat-insulating component is included by bonding the adhesive layer of the protective film to the heat-insulating layer.

[0213] One embodiment further provides that the formation of the heat-insulating component from a heat-insulating layer and an adhesive layer is included.

[0214] An embodiment further comprising forming the thermally insulating component from a thermal barrier layer, an adhesive layer, and a protective film.

[0215] One embodiment provides that attaching the heat-insulating component to at least one surface of the at least one antenna comprises connecting the heat-insulating component to at least one surface of the at least one antenna.

[0216] One embodiment provides that the at least one antenna is in the form of an antenna group, wherein the antenna group comprises a plurality of antennas, wherein the antenna group comprises a plurality of levels, and wherein the method comprises placing the heat-insulating component on at least two levels of the plurality of levels.

[0217] One embodiment further provides for the insertion of the arrangement into a housing of a mobile device.

[0218] The invention further relates to an arrangement consisting of: at least one antenna, wherein the at least one antenna is configured to transmit a radio frequency (RF) communication field at an operating frequency in the range of 6 GHz to 100 GHz; and a heat-insulating component, wherein the heat-insulating component is arranged within the RF communication field, and wherein the thermally insulating component has a thermal conductivity in the range of 0.0025 W / m·K to 0.025 W / m·K at 25 °C and 1 atm, wherein the thermally insulating component has a dielectric constant in the range of 1.05 to 4, measured according to IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using a split post dielectric resonator (SPDR), and wherein the thermally insulating component has a loss tangent in the range of 0.00001 to 0.1, measured according to IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using the SPDR.

[0219] The invention further relates to an arrangement consisting of: at least one antenna, wherein the at least one antenna is configured to transmit a radio frequency (RF) communication field at an operating frequency in the range of 6 GHz to 100 GHz; and a heat-insulating component, wherein the heat-insulating component is arranged within the RF communication field, wherein the thermal insulation component has a thickness of 0.03 mm to 2 mm, and wherein the thermally insulating component comprises an aerogel in an amount of 30 wt% to 95 wt%, based on a total weight of the thermally insulating component.

[0220] One embodiment provides that the thermally insulating component has a thermal conductivity in the range of 0.0025 W / m·K to 0.025 W / m·K at 25 °C and 1 atm. The invention also relates to an arrangement consisting of: an antenna group, wherein the antenna array is configured to transmit a radio frequency (RF) communication field at an operating frequency in the range of 6 GHz to 100 GHz; and a heat-insulating component, wherein the heat-insulating component is arranged within the RF communication field, and wherein the heat-insulating component comprises: a protective film; at least one thermal insulation layer, wherein the at least one thermal insulation layer is arranged between the protective film and the at least one adhesive layer, wherein the at least one thermal insulation layer makes up 50% to 99% of a total thickness of the thermally insulating component; at least one adhesive layer, wherein the at least one adhesive layer is arranged between the antenna field and the thermal insulation layer of the thermal insulation part.

[0221] One embodiment provides that the at least one thermal insulation layer has a thermal conductivity in the range from 0.0025 W / m·K to 0.025 W / m·K at 25 °C and 1 atm.

Claims

[1] An arrangement (200) comprising: at least one antenna (201), wherein the at least one antenna is configured to transmit a radio frequency (RF) communication field at an operating frequency in the range of 6 GHz to 100 GHz; and a heat-insulating component (202, 300), wherein the heat-insulating component (202, 300) comprises: - a thermal insulation layer (301); - a protective film (302), the protective film (302) comprising: a polymer layer (303); and a first adhesive layer (304), wherein the first adhesive layer (304) is arranged between the thermal insulation layer (301) and the polymer layer (303); and wherein (i) the heat-insulating component (202, 300) further comprises a second adhesive layer (305), wherein the heat-insulating layer (301) is arranged between the protective film (302) and the second adhesive layer (305), and wherein the second adhesive layer (305) is arranged between the heat-insulating layer (301) and the at least one antenna (201), and the heat-insulating component (202, 300) is connected to the at least one antenna (201) by the second adhesive layer (305); or (ii) the assembly is located in a housing and the heat-insulating component (701) is connected to the housing (703) by a second adhesive layer (705); wherein the heat-insulating component (202, 300) is arranged within the field of RF communication, and wherein the heat-insulating component (202) has a thermal conductivity of 0.0025 W / m·K to 0.025 W / m·K at 25 °C and 1 atm. [2] The assembly of claim 1, wherein the heat insulating component (202, 300) has a thickness of 0.03 mm to 2 mm. [3] The assembly of claim 1, wherein the thermally insulating component (202, 300) comprises an aerogel. [4] The assembly of claim 3, wherein the heat-insulating component (202, 300) comprises the aerogel in an amount of at least 30 wt.% based on the total weight of the heat-insulating component (202, 300). [5] The assembly of claim 3, wherein the thermally insulating component (202, 300) further comprises polytetrafluoroethylene (PTFE). [6] The assembly of claim 5, wherein the aerogel is a PTFE-reinforced aerogel. [7] The assembly of claim 1, wherein the thermally insulating component (202, 300) comprises a plurality of thermal insulation layers. [8] The arrangement of claim 1, wherein the at least one antenna (201) is in the form of an antenna array, the antenna array comprising a plurality of antennas, each antenna (201) configured to transmit the RF communication field at the operating frequency in the range of 6 GHz to 100 GHz. [9] The assembly of claim 8, wherein the thermally insulating component (202, 300) is embedded in the antenna array. [10] The arrangement of claim 1, wherein the thermally insulating component (202, 300) has a dielectric constant in the range of 1.05 to 4, measured according to IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using a split post dielectric resonator SPDR. [11] The arrangement of claim 1 or 10, wherein the thermally insulating component (202, 300) has a loss tangent in the range of 0.00001 to 0.1, measured according to IEC 61189-2-721 Edition 1 2015-04 at 10 GHz using a split-post dielectric resonator SPDR. [12] The assembly of claim 1, wherein a portion of the thermally insulating component (202, 300) extends beyond the RF communication field. [13] The arrangement of claim 1, wherein the arrangement further comprises a power amplifier. [14] The arrangement according to claim 1, wherein the arrangement has an operating temperature in the range of 20 °C to 120 °C, wherein the operating temperature is measured at an interface between the thermally insulating component (202, 300) and the at least one antenna (201). [15] The assembly of claim 6, wherein the PTFE-reinforced aerogel is a PTFE-reinforced aerogel in a jacketed configuration, the jacketed configuration comprising a plurality of ePTFE layers, each of the plurality of ePTFE layers bonded to a surface of the PTFE-reinforced aerogel. [16] The assembly of claim 6, wherein the thermally insulating component (202, 300) comprises the aerogel in an amount of 30 wt% to 95 wt% based on the total weight of the thermally insulating component (202, 300). [17] The assembly of claim 16, wherein the heat insulating component (202, 300) has a thickness of 0.03 mm to 2 mm. [18] The assembly of claim 8, wherein the thermal barrier layer comprises 50% to 99% of the total thickness of the thermally insulating component (202, 300).

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