ELECTRONIC DEVICE AND MANUFACTURING METHOD FOR AN ELECTRONIC DEVICE

Abstract

An electronic device characterized in that it comprises: a substrate (110) with a first surface (112), a second surface (114) and a side surface (116) connecting the first surface (112) and the second surface (114), wherein a perpendicular vector of the side surface (116) differs from that of the first surface (112) and the second surface (114); an edge wire (142) configured on the substrate (110) and extending from the first surface (112) to the second surface (114) while passing through the side surface (116); a first protective layer (150) configured on the edge wire (142), wherein the edge wire (142) is sandwiched between the substrate (110) and the first protective layer (150), and the edge wire (142) and the first protective layer (150) form an undercut structure;and a second protective layer (160) configured on the substrate (110) and filling the undercut structure.;

Description

BACKGROUNDTechnical FieldThis disclosure relates to an electronic device and a manufacturing method of the electronic device.DESCRIPTION OF THE RELATED ARTIn response to diversified applications of electronic devices, various manufacturing technologies and product designs have been continuously developed. To provide further diversified applications, products having a narrow margin or no margin have been successively proposed. For example, a product with a narrow edge or no edge may be used in a divided product (such as a divided display panel) in addition to providing a larger functional area (such as a display area and a touch area).Reference is also made to CN 1 09 545 828 A. It describes a display unit and a production method for the latter. According to the display unit for connection and the manufacturing method thereof, element damage can be avoided, difficulty of the manufacturing process is reduced, reliability is improved, manufacturing yield is improved, and manufacturing cost is lowered. The display unit for bonding includes a first substrate and a second substrate, wherein the adhesive layer is disposed between the first substrate and the second substrate, and the conductive adhesive layer is disposed on the first substrate. The second substrate includes a first wire pattern and a second wire pattern disposed on a surface of the second substrate. The first substrate is attached to a surface of the second substrate. The conductive adhesive layer is electrically connected to the first substrate, and the first wire pattern is electrically connected to the conductive adhesive layer. The second substrate does not overlap the portion of the first substrate to define a plurality of protrusions. A portion of the first wire structure is located in one of the protrusions and a second wire structure is located in the other of the protrusions. One of the protrusions is bent and connected to the sidewalls of the first substrate and the first substrate, and the other of the protrusions is bent back to the first substrate.SUMMARYThis disclosure provides an electronic device using an edge wire construction to reduce a margin.This disclosure provides a manufacturing method for an electronic device that can manufacture a stable side wire to improve the yield of the side wire.An electronic device according to the disclosure includes a substrate, an edge wire, a first protection layer, and a second protection layer. The substrate has a first surface, a second surface, and a side surface connecting the first surface and the second surface. A normal vector of the side surface is different from the first surface and the second surface. The edge wire is configured on the substrate and extends from the first surface to the second surface while passing through the side surface. The first protective layer is configured on the edge wire. The edge wire is sandwiched between the substrate and the first protective layer, and the edge wire and the first protective layer form an undercut structure. The second protective layer is configured on the substrate and fills the undercut structure.In an embodiment of the disclosure, the edge wire is recessed relative to the second protective layer.In an embodiment of the disclosure, the second protective layer surrounds the first protective layer.In an embodiment of the disclosure, the undercut structure is distributed along a periphery of an edge wire.In an embodiment of the disclosure, the first protective layer has a thickness that gradually decreases outward.In an embodiment of the disclosure, the electronic device further includes a driver circuit structure. The driver circuit structure is configured on the substrate, and the driver circuit structure is electrically connected to the edge wire.In an embodiment of the disclosure, the electronic device further includes a light emitting element. The light emitting element is configured on the substrate and electrically connected to the driver circuit structure.In an embodiment of the disclosure, the driver circuit structure includes a first pad configured on the first surface and a second pad configured on the second surface, and the edge wire is connected to the first pad and the second pad.An electronic device according to the disclosure includes a substrate, an edge wire, and a protection structure. The substrate has a first surface, a second surface, and a side surface connecting the first surface and the second surface. A perpendicular vector of the side surface is different from the first surface and the second surface. The edge wire is configured on the substrate and extends from the first surface to the second surface while passing through the side surface. The protection structure is configured on the edge wire. The protection structure includes the edge wire, and there is a space between the protection structure and the edge wire. Furthermore, the intermediate space is a closed intermediate space.In an embodiment of the disclosure, the gap is distributed along a periphery of the edge wire.In an embodiment of the disclosure, the electronic device further includes a driver circuit structure. The driver circuit structure is configured on the substrate, and the driver circuit structure is electrically connected to the edge wire.A manufacturing method of the electronic device according to the disclosure includes, but is not limited to, the following steps. A layer of conductive material is formed on a substrate. The layer of conductive material extends continuously from a first surface of the substrate to a second surface as it passes through a side surface, the side surface connecting the first surface and the second surface. A first protection layer is formed on the conductive material layer, and the conductive material layer is patterned using the first protection layer as a mask to form an edge wire, the edge wire being recessed relative to the first protection layer, and forming an undercut structure. A second protective layer is formed on the substrate, and the second protective layer fills the undercut structure.In one embodiment of the disclosure, the first protective layer is formed on the layer of conductive material by transfer printing means.In an embodiment of the disclosure, a driver circuit structure is formed on the substrate before forming the conductive material layer, and at least a part of the driver circuit structure is covered by a release protective layer.In an embodiment of the disclosure, the releasable protective layer is removed after the second protective layer is formed.In an embodiment of the disclosure, the second protective layer is formed on the substrate by dipping, spraying, coating, or transfer printing.In an embodiment of the disclosure, a method of forming the second protective layer includes performing multiple printing steps, and overlapping at least some of the printed patterns of the multiple printing steps.In an embodiment of the disclosure, a method of forming a pattern of the layer of conductive material includes an isotropic etch process.In an embodiment of the disclosure, an etchant of the patterned conductive material layer has a selectivity related to the conductive material layer and the first protective layer.Based on the above, the electronic device according to the embodiments of the disclosure includes the edge wires disposed at the edge of the substrate, thereby reducing the edge width of the electronic device to achieve a narrow edge construction. In addition, the edge wires are protected by the protective structure and are not easily damaged. In some embodiments, the protective structure may include two protective layers, one of which is a protective layer used to define the contour of the edge wires, and the other layer is a protective layer covering the sidewalls of the edge wires to seal the edge wires. In this way, the stability of the edge wires can be improved.In order to make the above more comprehensible, various exemplary embodiments accompanied by drawings will be described in detail below.BRIEF DESCRIPTION OF THE DRAWINGSFIGS. 1, 2, 3-4 illustrate some steps of manufacturing an electronic device according to some embodiments of the disclosure. FIG. 5 is a schematic cross-sectional view of the structure of FIG. 4 taken along a line I-I'. FIG. 6 is a partially enlarged schematic view of a region E in FIG. 4. FIG. 7 is a schematic cross-sectional view of the structure taken along a line II-II' in FIG. 6. FIG. 8 is a partially enlarged schematic view of a region F in FIG. 4. FIG. 9 is a schematic cross-sectional view of the structure taken along a line III-III' in FIG. 8. FIG. 10 illustrates some steps of manufacturing an electronic device according to some embodiments of the disclosure. FIG. 11 is a schematic cross-sectional view taken along a line IV-IV' in FIG. 10. FIG. 12 is a partially enlarged schematic view of a region G in FIG. 10. FIG. 13 is a schematic cross-sectional view taken along a line V-V' in FIG. 12. FIG. 14 is a partially enlarged schematic view of a region H in FIG. 10. FIG. 15 is a schematic cross-sectional view taken along a line VI-VI' in FIG. 14. FIG. 16 is a schematic cross-sectional view of an electronic device according to some embodiments of the disclosure. FIG. 17 is a schematic cross-sectional view taken along a line VII-VII' in FIG. 16, according to some embodiments of the disclosure. FIG. 18 is a schematic cross-sectional view taken along a line VIII-VIII' in FIG. 16. FIG. 19 is a schematic cross-sectional view of the electronic device in FIG. 16 along a line of extension of the line VII-VII' according to some embodiments. FIG. 20 is a schematic cross-sectional view of the electronic device in FIG. 16 along a line of extension of the line VII-VII' according to some embodiments. FIG. 21 is a schematic cross-sectional view of the electronic device in FIG. 16 along a line of extension of the line VII-VII' according to some embodiments. FIG. 22 is a schematic cross-sectional view of the electronic device in FIG. 16 along a line of extension of the line VII-VII' according to some embodiments.DESCRIPTION OF THE EMBODIMENTSFIGS. 1, 2, 3-4 illustrate some steps of manufacturing an electronic device according to some embodiments of the disclosure. In FIG. 1, a driver circuit structure 120 is formed on a substrate 110 in advance. The substrate 110 is a sheet with some mechanical strength that can support objects, such that multiple film layers and / or multiple objects can be configured thereon. In some embodiments, a material of the substrate 110 includes glass, polymeric materials, ceramic, etc. In other embodiments, the substrate 110 may be a multilayer substrate formed by stacking multiple sub-layers. The substrate 110 has a first surface 112, a second surface 114, and a side surface 116 connecting the first surface 112 and the second surface 114. Here, a normal direction of the side surface 116 is different from the first surface 112 and the second surface 114. In some embodiments, perpendicular vectors of the first surface 112 and the second surface 114 may be parallel to each other, but are not limited thereto. For example, the first surface 112 and the second surface 114 are each parallel to an X-direction Y-direction plane, and the side surface 116 is parallel to a Y-direction Z-direction plane. In other embodiments, components disposed on the side surface 116 may be attached to other side surfaces, for example, a side surface parallel to an X-direction-Z-direction plane.The driver circuit structure 120 may include a first pad 122 and a pixel pad 124, and both the first pad 122 and the pixel pad 124 are configured on the first surface 112 of the substrate 110. In some embodiments, the driver circuit structure 120 may further include a pixel circuit (not shown in FIG. 1 ) electrically connected to the first pad 122 and the pixel pad 124. For example, the pixel circuit (not shown in FIG. 1 ) may include, but is not limited to, a signal line, an active component, a passive component, etc., where the active component is, for example, a transistor and the passive component is, for example, a capacitor structure. In some embodiments, the pixel circuit (not shown in FIG. 1 ) may be formed on the first surface 112 of the substrate 110 by film deposition in conjunction with photolithography or printing. Therefore, the above-mentioned transistor may be a thin film transistor, and the capacitor structure may be formed by stacking a conductive layer and a dielectric layer. Additionally, in some embodiments, the driver circuit structure 120 may further include a second pad (not shown in FIG. 1 ) and / or a corresponding wire configured on the second surface 114 of the substrate 110.In FIG. 1, the number of the first pad 122 is plural, and the plural first pads 122 may be arranged in an array in a Y direction. The first pad 122 is disposed on the first surface 112, and the arrangement of the first pad 122 is closer to the side surface 116 than the pixel pad 124. In some embodiments, a terminal T122 of the first pad 122 may extend to a corner 118 of the side surface 116 and the first surface 112 or even be aligned with a side surface 118. A releasable protective layer 130 is further formed on the substrate 110, the releasable protective layer 130 covering the pixel pad 124 while exposing the first pad 122. The releasable protective layer 130 may be a foil layer that is not damaged in subsequent manufacturing steps and may be removed in a manner that does not damage the pixel pad 124. A boundary B 130 of the releasable protection layer 130 and the side surface 116 are separated by a gap G 1 in an X direction, and the first pad 122 is disposed at the interval G 1.In some embodiments, the releasable protective layer 130 may be a thermally curing material. A means for forming the releasable protective layer 130 on the substrate 110 may comprise applying a curable colloid material to the substrate 110 and curing it by heating. In other embodiments, the releasable protective layer 130 may be a photo-curable material or a photo-thermally curable material. The releasable protective layer 130 is made of a material that can be removed from the substrate 110. In some embodiments, the releasable protective layer 130 may also be formed on the second surface 114 of the substrate 110 to form a film layer or element on the second surface 114 that is not damaged, such as, but not limited to, a web or similar elements.In FIG. 2, a layer 140 of conductive material is formed on the substrate 110. The layer 140 of conductive material may cover the portion of the first surface 112 of the substrate 110 that is not covered by the releasable protective layer 130. The layer 140 of conductive material may partially cover the releasable protective layer 130. The layer 140 of conductive material may extend continuously from the first surface 112 to the second surface 114 as it passes through the side surface 116. The layer 140 of conductive material may be formed on the substrate 110 by edge sputtering. The conductive material layer 140 includes copper, aluminum, molybdenum, silver, gold, nickel, titanium, ITO, IGZO, etc. The layer 140 of conductive material may be in contact with and directly cover the first pad 122. When a pad (such as a second pad, not shown) is provided on the second surface 114, the layer 140 of conductive material may be in contact with and directly cover the second pad on the second surface 114.In FIG. 3, a first protective layer 150 is formed on the substrate 110. The first protective layer 150 may be formed on the substrate 110 by transfer printing. The first protective layer 150 may have a striped pattern, and the first protective layer 150 may extend continuously from the first surface 112 to the second surface 114 while passing through the side surface 116. As shown in FIG. 3, a plurality of stripe-shaped first protection layers 150 may be arranged in a Y direction, and the plurality of stripe-shaped first protection layers 150 may be arranged corresponding to the first pads 122. In some embodiments, an orthographic projection of the first protective layer 150 on the first surface 112 in a Z direction may overlap an orthographic projection of the first pad 122 (and the corresponding second pad) on the first surface 112 in the Z direction. Further, the orthographic projection of the first pad 122 (and the corresponding second pad) on the first surface 112 in the Z direction may be completely within the orthographic projection of the first protective layer 150 on the first surface 112 in the Z direction. The plurality of strip-shaped first protection layers 150 are arranged corresponding to the first pads 122 in a one-to-one manner, therefore each of the first protection layers 150 overlaps only one of the first pads 122. In some embodiments, the strip-shaped first protection layer 150 has a terminal T 150, and there is a gap G 2 between the terminal T 150 and the boundary B 130 of the detachable protection layer 130. Therefore, the first protective layer 150 and the releasable protective layer 130 do not overlap each other in a thickness direction (such as the Z direction).In some embodiments, the first protective layer 150 may be formed on the substrate 110 by printing. For example, in some manufacturing processes, a protective layer material may be applied or attached to a printing tool, and then the printing tool is used to press on the side surface 116 of the substrate 110, such that the protective layer material on the printing tool is attached to the layer 140 of conductive material. After the printing tool is removed, a curing step may then be performed on the protective layer material attached to the conductive material layer to form the first protective layer 150. In other words, the first protective layer 150 may be formed on the substrate 110 by printing. In some embodiments, the printing tool may have a stripe-shaped printing pattern such that the stripe-shaped first protective layer 150 may be formed on the layer 140 of conductive material. In addition, the printing pattern may be made using an elastic material such as rubber. When the printing tool is pressed against the side surface 116 of the substrate 110, a portion of the printing pattern may be pressed against the layer 140 of conductive material on the first surface 112 and on the second surface 114, and the protective layer material is printed on the layer 140 of conductive material on the first surface 112 and the second surface 114. During the printing operation, for example, the printing tool may move in the X direction toward the substrate 110 to transfer print the protective layer material on the conductive material layer 140 on the side surface 116, the first surface 112, and the second surface 114. In other embodiments, the printing tool may also move in the X direction toward the substrate 110 to press against the side surface 116, and may then rotate further with the Y direction as an axis to transfer print the corresponding protective layer material onto the conductive material layer 140 on the first surface 112 and the second surface 114.After the formation of the first protective layers 150 in FIG. 3 is completed, a patterning step may be performed to remove the conductive material layer 140 not covered by the first protective layers 150 to form edge wires 142, as shown in FIG. 4. A method of forming a pattern of the conductive material layer 140 includes an isotropic etch process. For example, the patterning step is to allow the conductive material layer 140 not covered by the first protective layers 150 to be in contact with an etchant. Here, the etchant of the patterned conductive material layer 140 has selectivity with respect to the conductive material layer 140 and the first protection layer 150. In other words, the etchant used for the pattern forming step has, for example, a composition that does not react with the first protective layer 150, therefore, the first protective layers 150 are not damaged in general during the etching step.In FIG. 4, the edge wires 142 are configured on the substrate 110 and correspond to the first protection layers 150. The number of the edge wires 142 may be the same as the number of the first protection layers 150. Each of the edge wires 142 is sandwiched between one of the strip-shaped first protective layers 150 and the substrate 110, and extends from the first surface 112 of the substrate 110 to the second surface 114 of the substrate 110 while passing through the side surface 116 of the substrate 110.FIG. 5 is a schematic cross-sectional view of the structure in FIG. 4 taken along line I-I' used to illustrate a specific structure of one of the edge wires, but the disclosure is not limited thereto. It can be seen from FIG. 5 that the first surface 112 of the substrate 110 may be arranged with the first pad 122, the second surface 114 of the substrate 110 may be arranged with a second pad 122', the edge wire 142 extends from the first surface 112 of the substrate 110 to the second surface 114 of the substrate 110 while passing through the side surface 116 of the substrate 110, and the first protective layer 150 is arranged on a side of the edge wire 142 remote from the substrate 110.The edge wire 142 may include a first wire segment 142A, a second wire segment 142B, and a third wire segment 142C. The first wire segment 142A is disposed on the first surface 112 and extends, for example, from the corner 118 of the first surface 112 and the side surface 116 to the first pad 122 in the X direction, and even extends beyond the first pad 122. The second wire segment 142B is disposed on the second surface 114, extends, for example, from a corner 118' of the second surface 114 and the side surface 116 to the second pad 122' in the X direction, and even extends beyond the second pad 122'. The third wire segment 142C is disposed on the side surface 116 and extends in the Z direction to be connected to the first wire segment 142A and the second wire segment 142B. Therefore, the edge wire 142 is a three-dimensional wire having a three-dimensional U-shaped structure and surrounding an edge of the substrate 110.In the etching step of forming a pattern in the conductive material layer 140 in FIG. 3 into the edge wire 142, the conductive material layer 140 may be overetched to ensure that the adjacent edge wires 142 are separated from each other. Due to the overetch or excessively strong etch, for example, a contour of the edge wire 142 may be recessed relative to a contour of the first protection layer 150 and forms an undercut structure UC. In FIG. 5, the terminal T 150 of the first protection layer 150 may protrude toward the detachable protection layer 130 relative to a terminal T 142 of the edge wire 142, or the terminal T 142 of the edge wire 142 may be recessed relative to the terminal T 150 of the first protection layer 150 and form an undercut structure UC. In addition, a thickness of the first protective layer 150 may be non-uniform. For example, the thickness of the first protective layer 150 may be thinner towards the edge of the contour.FIG. 6 is a partially enlarged schematic view of an area E in FIG. 4, the enlarged view of FIG. 6 illustrating a plan view of the structure in FIG. 4 viewed in the Z direction. In FIG. 6, the edge wire 142 may protrude outward in the X direction from the side surface 116 of the substrate 110. A part of the edge wire 142 disposed on the substrate 110 is the first wire segment 142A, and a part protruding outward in the X direction from the side surface 116 of the substrate 110 is the third wire segment 142C. The first protection layer 150 completely shields the edge wire 142, therefore a part of the first protection layer 150 covering the third wire segment 142C also protrudes outward in the X direction from the side surface 116 of the substrate 110.FIG. 7 is a schematic cross-sectional view of a structure along a line II-II' in FIG. 6, and in FIGS. 6 and 7, the first wire segment 142A of the edge wire 142 is in contact with the first pad 122 on the substrate 110 and may extend entirely around the first pad 122. A side wall E 142 of the edge wire 142 may be retracted relative to a side wall E 150 of the first protection layer 150 and forms the undercut structure UC along the side wall E 142. FIGS. 6 and 7 mainly illustrate a configuration configuration configuration of the first wire segment 142A of the edge wire 142, and the construction in FIGS. 6 and 7 can also be applied to the second wire segment 142B, therefore a configuration configuration configuration of the second wire segment 142B is not repeated.FIG. 8 is a partially enlarged schematic view of a region F in FIG. 4, the enlarged view of FIG. 8 illustrating a side view of the structure in FIG. 4 viewed in the X direction, and FIG. 8 mainly illustrating a configuration configuration configuration of the third wire segment 142C of the edge wire 142. FIG. 9 is a schematic cross-sectional view of the structure taken along a line III-III' in FIG. 8, and in FIGS. 8 and 9, the third wire segment 142C of the edge wire 142 is in contact with the side surface 116 of the substrate 110 and extends to the first surface 112 and the second surface 114 in the Z direction from between. The side wall E 142 of the edge wire 142 may be recessed relative to the side wall E 150 of the first protection layer 150 and forms the undercut structure UC along the side wall E 142. The undercut structure UC along the terminal T 142 of the edge wire 142 in FIG. 5, the undercut structure UC along the side wall E 142 in FIG. 6, and the undercut structure UC along the side wall E 142 in FIG. 8 may be continuous. Therefore, the undercut structure UC is substantially a structure distributed along the contour of the edge wire 142. In addition, it can be seen from FIGS. 5, 7, and 9 that the first protective layer 150 has the thickness gradually decreasing outward.FIG. 10 illustrates some steps for manufacturing an electronic device according to some embodiments of the disclosure, and FIG. 11 is a schematic cross-sectional view taken along a line IV-IV' in FIG. 10. In FIGS. 10 and 11, the second protective layer 160 not only wraps around the first protective layer 150 but also fills the undercut structure UC, therefore the second protective layer 160 may be in contact with the terminal T 142 of the edge wire 142. In other words, the second protective layer 160 may surround the first protective layer 150 such that the first protective layers 150 are sealed in the second protective layer 160. The second protective layer 160 may be formed on the substrate 110 by dipping, spraying, coating, or transfer printing.FIG. 12 is a partially enlarged schematic view of a region G in FIG. 10, the enlarged view of FIG. 12 illustrating a plan view of the structure in FIG. 10 viewed in the Z direction. FIG. 13 is a schematic cross-sectional view taken along a line V-V' in FIG. 12, FIG. 14 is a partially enlarged schematic view of a region H in FIG. 10, the enlarged view of FIG. 14 illustrating a side view of the structure in FIG. 10 viewed in the X direction. FIG. 15 is a schematic cross-sectional view taken along a line VI-VI' in FIG. 14, it can be seen from FIGS. 12, 13, 14, 15 to 16 that, in addition to enveloping the first protective layer 150, the second protective layer 160 also fills the undercut structure UC, therefore the second protective layer 160 may be in contact with the terminal T 142 of the edge wire 142. In some embodiments, the second protective layer 160 may be formed by printing (e.g., transfer printing) or dipping. For example, the second protective layer 160 may be formed by dipping the substrate 110 in a solution of a protective material so that the protective material adheres to the substrate 110, and then the second protective layer 160 may be formed after the protective material is cured.The materials of the first protective layer 150 and the second protective layer 160 may include polyester resins, phenol resins, alkyd resins, polycarbonate resins and polycarbonate resins, polyamide resins, polyurethane resins, silicone resins, epoxy resins, polyethylene resins, acrylic resins, polystyrene resins, polypropylene resins, or other materials having waterproof. In some embodiments, the first protective layer 150 and the second protective layer 160 may be composed of different materials or the same material.FIG. 16 is a schematic diagram of an electronic device according to some embodiments of the disclosure. An electronic device 100 in FIG. 16 includes the substrate 110, the edge wire 142, a protection pattern 170, and a light emitting element 180. In some embodiments, the electronic device 100 may be a device formed by removing the releasable protective layer 130 (marked in FIG. 10 ) from the structure in FIG. 10 and then by connecting the light emitting element 180 to the pixel pad 124. Here, the protection structure 170 may include the first protection layers 150 and the second protection layer 160. Specifically, reference is made to the description of the foregoing paragraphs regarding the structural design and configuration relationship of the substrate 110, the edge wire 142, the first protective layers 150, and the second protective layer 160, which will not be repeated here.The substrate 110 has the first surface 112, the second surface 114, and the side surface 116 connecting the first surface 112 and the second surface 114. The substrate 110 may be further provided with the driver circuit structure 120 as shown in FIG. 1, and the driver circuit structure 120 may include the first pad 122, the second pad 122', and the pixel pad 124 (refer to FIGS. 1, 5, and 11 ). The light emitting element 180 is then connected to the pixel pad 124. In some embodiments, the light emitting element 180 may include a light emitting diode, which may be, for example, a micro LED, a millimeter LED, or similar elements. In other embodiments, the substrate 110 may be further provided with elements having other functions, such as a touch sensitive element and a sensing element.In the embodiment, the edge wire 142 extends from the first surface 112 to the second surface 114 while passing through the side surface 116. The edge wire 142 may electrically connect the first pad 122 on the first surface 112 to the second pad (such as the second pad 122' shown in FIGS. 5 and 11 ) on the second surface 114. In addition, a circuit board or other external circuit structure intended for connection to the electronic device 100 may be connected to a circuit or pad on the second surface 114 without having to be connected to the first surface 112. Therefore, a periphery of the first surface 112 does not need to reserve a connection area for connection to an external circuit pattern. In other words, a larger area may be left on the first surface 112 for arranging light emitting elements 180, achieving a narrow edge construction. In some embodiments, an extension length of the edge wire 142 in the X direction on the first surface 112 is less than a connection width that needs to be reserved during connection to the circuit board. For example, an edge width W 100 of the electronic device 100 on the first surface 112 is, for example, 5 mm. Compared to a construction of connecting the circuit board to the first surface 112, the electronic device 100 may have a narrower edge width, and an edge width may not be easily recognized by a user either. Therefore, the electronic device 100 can be applied to a shared display, and when shared with other electronic devices 100, it is not easy for the user to perceive the existence of an edge. In addition, the electronic device 100 may be applied to other structures that require extremely small edge widths or even no edge.The protective structure 170 wraps around the edge wire 142. As mentioned above, the protection structure 170 includes the first protection layers 150 and the second protection layer 160. The first protection layers 150 shield the edge wires 142, and the contour of the edge wires 142 is recessed relative to the first protection layers 150. The second protection layer 160 covers the first protection layer 150 and fills the undercut structure (the undercut structure UC described in FIGS. 4, 5, 6, 7, 8, 9, 10, 11, 12, 13 to 14) formed by the first protection layers 150, the edge wire 142, and the substrate 110.FIG. 17 is a schematic cross-sectional view taken along a line VII-VII' in FIG. 16 according to some embodiments of the disclosure, and FIG. 18 is a schematic cross-sectional view taken along a line VIII-VIII' in FIG. 16. In FIGS. 17 and 18, the first protective layer 150 and the second protective layer 160 of the protective structure 170 are made of the same material, for example. As shown in FIGS. 17 and 18, a boundary between the first protective layer 150 and the second protective layer 160 as shown by the dotted line is not obvious when the first protective layer 150 and the second protective layer 160 are made of the same material. At this time, the protection structure 170 may be an integrated structure as a whole. When the second protective layer 160 is manufactured, the second protective layer 160 may not completely fill the undercut structure UC formed by the first protective layer 150, the edge wire 142, and the substrate 110, and thus form a space VD at the undercut structure UC, based on a size of the undercut structure UC and characteristics of the protective material.The space VD may be dispersed along the contour of the edge wire 142 and may be present between the protection structure 170 and the edge wire 142. The space VD may be disposed between a partial lower surface B 150 of the first protection layer 150 protruding from the edge wire 142 and the side wall E 142 of the edge wire 142. The gap VD may be disposed between the first surface 112 of the substrate 110 and the sidewall E 142 of the edge wire 142. The space VD may be a sealed space and may be sealed between the substrate 110, the edge wire 142, and the protection structure 170. In some embodiments, the gap VD may also be present between the substrate 110, the edge wire 142, and the protection pattern 170 when the first protection layer 150 and the second protection layer 160 are made of different materials. At this time, the space VD may be substantially distributed between the substrate 110, the edge wire 142, the first protection layer 150, and the second protection layer 160.FIG. 19 is a schematic cross-sectional view of the electronic device in FIG. 16 along a line of extension of the line VII-VII' according to some embodiments. In FIG. 19, the electronic device 100 includes the substrate 110, the first pad 122, the second pad 122', the edge wire 142, the first protection layers 150, and the second protection layer 160. The first protective layers 150 and the second protective layer 160 may form the protective structure 170. As shown in the embodiment of FIG. 19, the second protective layer 160 may be a flat layer having flat outer surfaces S160 and S160'. The outer surface S 160 of the second protective layer 160 is a surface of a part of the second protective layer 160 disposed on the first surface 112 remote from the substrate 110. The outer surface S160' of the second protective layer 160 is a surface of a part of the second protective layer 160 disposed on the second surface 114 remote from the substrate 110. The outer surfaces S160 and S160' may be generally parallel to the first surface 112 and the second surface 114, i.e., the outer surfaces S160 and S160' may extend generally along the plane of the X direction and the Y direction.FIG. 20 is a schematic cross-sectional view of the electronic device of FIG. 16 taken along the line of extension of line VII-VII' according to some embodiments. In FIG. 20, the electronic device 100 includes the substrate 110, the first pad 122, the second pad 122', the edge wire 142, the first protective layers 150, and the second protective layer 160. The first protective layers 150 and the second protective layer 160 may form the protective structure 170. As shown in the embodiment of FIG. 20, the second protective layer 160 may have wavy outer surfaces S160 and S160'. The outer surface S160 and the outer surface S160' fluctuate according to, for example, the distribution of the edge wires 142. That is, the outer surface S 160 is at a position corresponding to the edge wire 142 farther from the substrate 110 and is closer to the substrate 110 at a gap G 142 of the edge wire 142. In some embodiments, the second protective layer 160 may be formed by printing on the substrate 110.For example, the second protection layer 160 may include a plurality of first print patterns 162A and a plurality of second print patterns 162B. The first printing patterns 162A may be formed on the substrate 110 using the same printing tool in a same printing step. Similarly, the second printing patterns 162B are also formed on the substrate 110 by the same printing die in a same printing step. The first printing patterns 162A and the second printing patterns 162B may be formed on the substrate 110 using the same printing tool but in different printing steps. In other words, a method of forming the second protective layer 160 includes a plurality of printing steps, but the disclosure is not limited thereto. The first print patterns 162A are separated from each other by gaps, and the second print patterns 162B are also separated from each other by other gaps. The first print patterns 162A and the second print patterns 162B at least partially overlap. The first print patterns 162A and the second print patterns 162B may be alternately distributed and form the second protection layer 160 continuously distributed in the Y direction.FIG. 21 is a schematic cross-sectional view of the electronic device in FIG. 16 along the extension line of the line VII-VII' according to some embodiments. In FIG. 21, the electronic device 100 includes the substrate 110, the first pad 122, the second pad 122', the edge wire 142, the first protective layers 150, and the second protective layer 160. The first protective layers 150 and the second protective layer 160 may form the protective structure 170. As shown in the embodiment of FIG. 21, the second protective layer 160 may have wavy outer surfaces S160 and S160'. Fluctuation frequencies of the outer surface S160 and the outer surface S160' change with the distribution of the edge wires 142. In other words, the outer surface S 160 is closer to the substrate 110 at a position corresponding to the edge wire 142, and is away from the substrate 110 at the gap G 142 of the edge wire 142. Manufacturing means for the second protective layer 160 in FIG. 21 may be the same as manufacturing means for the second protective layer 160 in FIG. 20 in general, and thus description will be omitted. In other words, the second protective layer 160 may be formed on the substrate 110 by a plurality of printing means. The plurality of pressurizing means may allow the pressure patterns to partially overlap each other, which helps to determine continuity of the second protection layers 160. Therefore, the second protective layer 160 can truly wrap the edge wires 142 to provide an ideal protection and blocking function. For example, the second protection layer 160 may ensure that the edge wires 142 are not affected by moisture from the outside and are deteriorated or oxidized.FIG. 22 is a schematic cross-sectional view of the electronic device in FIG. 16 along the extension line of the line VII-VII' according to some embodiments. In FIG. 22, the electronic device 100 includes the substrate 110, the first pad 122, the second pad 122', the edge wire 142, the first protective layers 150, and the second protective layer 160. The first protective layers 150 and the second protective layer 160 may form the protective structure 170. The second protection layer 160 may include the plurality of first print patterns 162A and the plurality of second print patterns 162B, and a spacing P 160 between the first print pattern 162A and the second print pattern 162B may be greater than a spacing P 150 between the first protection layers 150. For example, the spacing P 160 in FIG. 22 may be twice as large as the spacing P 150, but is not limited thereto. Manufacturing means for the second protective layer 160 in FIG. 22 may be the same as manufacturing means for the second protective layer 160 in FIG. 20 in general, and thus description will be omitted. In other words, the second protective layer 160 may be formed on the substrate 110 by a plurality of printing means. The plurality of pressurizing means may allow the pressure patterns to partially overlap each other, which helps to determine the continuity of the second protection layer 160. Therefore, the second protective layer 160 can truly wrap the edge wires 142 to provide an ideal protection and blocking function. For example, the second protection layer 160 may ensure that the edge wires 142 are not affected by moisture from the outside and are deteriorated or oxidized.In summary, the electronic device according to the embodiments of the disclosure has edge wires disposed at the edge of the substrate, which extend from the first surface of the substrate to the second surface while passing through the side surface of the substrate. The circuit structure provided for connection to the electronic device, such as a circuit board, may be bonded to the second surface of the electronic device. In this way, the periphery of the first surface of the electronic device may not leave the bonding region for connecting an external circuit pattern, and may be capable of providing a narrow edge width, or even a construction without edge. In addition, the edge wires are covered by the protection structure to ensure reliability of the edge wires. The protection structure may seal the edge wires to prevent moisture from outside from oxidizing or degrading the edge wires. Therefore, the electronic device has good quality.LIST OF REFERENCE CHARACTERS110 Substrates 112 First surface 114 Second surface 116 Side surface 120 Driver circuit structure 122 First pad 124 Pixel pad 142 Edge wire 130 Releasable protection layer 150 First protection layer 160 Second protection layer G, H region IV-IV' line X, Y, Z direction

Claims

An electronic device characterized by comprising: a substrate (110) having a first surface (112), a second surface (114), and a side surface (116) connecting the first surface (112) and the second surface (114), wherein a perpendicular vector of the side surface (116) is different from the first surface (112) and the second surface (114); an edge wire (142) configured on the substrate (110) and extending from the first surface (112) to the second surface (114) while passing through the side surface (116); a first protective layer (150) configured on the edge wire (142), the edge wire (142) being sandwiched between the substrate (110) and the first protective layer (150), and the edge wire (142) and the first protective layer (150) forming an undercut structure; and a second protective layer (160) configured on the substrate (110) and filling the undercut structure.The electronic device of claim 1, wherein the edge wire (142) is recessed relative to the second protective layer (160).The electronic device of claim 1, wherein the second protective layer (160) surrounds the first protective layer (150).The electronic device of claim 1, wherein the undercut structure is distributed along a perimeter of the edge wire (142).The electronic device according to claim 1, wherein the first protective layer (150) has a thickness that gradually decreases outward.The electronic device of claim 1, further comprising: a driver circuit structure (120) configured on the substrate (110), wherein the driver circuit structure (120) is electrically connected to the edge wire (142).The electronic device of claim 6, further comprising: a light emitting element configured on the substrate (110) and electrically connected to the driver circuit structure (120).The electronic device of claim 6, wherein the driver circuit structure (120) comprises a first pad (122) configured on the first surface (112) and a second pad configured on the second surface (114), and that the edge wire (142) is connected to the first pad (122) and the second pad.An electronic device characterized by comprising: a substrate (110) having a first surface (112), a second surface (114), and a side surface (116) connecting the first surface (112) and the second surface (114), wherein a normal vector of the side surface (116) is different from the first surface (112) and the second surface (114); an edge wire (142) configured on the substrate (110) and extending from the first surface (112) to the second surface (114) while passing through the side surface (116); and a protection structure configured on the substrate (110); wherein the protection structure wraps the edge wire (142) and that there is a space between the protection structure and the edge wire (142); and further wherein the space is a closed space.The electronic device of claim 9, wherein the gap is distributed along a perimeter of the edge wire (142).The electronic device of claim 9, further comprising: a driver circuit structure (120) configured on the substrate (110), wherein the driver circuit structure (120) is electrically connected to the edge wire (142).A manufacturing method of an electronic device, comprising: forming a layer (140) of conductive material on a substrate (110), the layer (140) of conductive material continuously extending from a first surface (112) of the substrate (110) to a second surface (114) while passing through a side surface (116), the side surface (116) connecting the first surface (112) and the second surface (114); forming a first protective layer (150) on the layer (140) of conductive material and forming a pattern of the layer (140) of conductive material using the first protective layer (150) as a mask to form an edge wire (142), the edge wire (142) being recessed relative to the first protective layer (150) and forming an undercut structure; and forming a second protective layer (160) on the substrate (110), wherein the second protective layer (160) fills the undercut structure.The manufacturing method for the electronic device according to claim 12, wherein the first protective layer (150) is formed on the conductive material layer (140) by transfer printing.The manufacturing method for the electronic device of claim 12, further comprising: forming a driver circuit structure (120) on the substrate (110); and covering at least a part of the driver circuit structure (120) with a releasable protective layer (130) before forming the conductive material layer (140).The manufacturing method of the electronic device according to claim 14, further comprising: removing the releasable protective layer (130) after the second protective layer (160) is formed.The manufacturing method for the electronic device according to claim 12, wherein the second protective layer (160) is formed on the substrate (110) by dipping, spraying, coating, or transfer printing.The manufacturing method for the electronic device according to claim 12, wherein the forming of the second protective layer (160) comprises performing a plurality of printing steps, and wherein a plurality of transfer printing patterns of the plurality of printing steps at least partially overlap.The manufacturing method of the electronic device according to claim 12, wherein forming the pattern of the conductive material layer (140) comprises an isotropic etching method.The manufacturing method of the electronic device according to claim 12, wherein an etchant for forming a pattern of the conductive material layer (140) has selectivity with respect to the conductive material layer (140) and the first protective layer (150).

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