PROCESSING DEVICE THAT REMOVES A RING-SHAPED REINFORCEMENT PART WITH A PROPOSE FROM A WAFER

Abstract

A processing device (2) that removes an annular reinforcement part (24) with a projection shape from a wafer (4), wherein the annular reinforcement part (24) is configured in the projection shape on a rear surface (4b) corresponding to an outer circumferential excess area (20), the processing device (2) comprising: a wafer cassette table (8) on which a wafer cassette (6) containing several wafers (4) is placed; a wafer ejection unit (10) that ejects the wafer (4) from the wafer cassette (6) placed on the wafer cassette table (8); a wafer table (12) that supports one side of a front surface (4a) of the wafer (4) ejected by the wafer ejection unit (10); a frame housing unit (66) that houses several ring frames (64) in which an opening part (64a) is trained to place the wafer (4);a frame ejection unit (68) that ejects the ring frame (64) from the frame holding unit (66); a frame table (70) that supports the ring frame (64) ejected by the frame ejection unit (68); a tape adhesion unit (98) arranged above the frame table (70) that adheres a tape to the ring frame (64); a transport unit (100) for a frame (64') with attached tape that transports the ring frame (64), to which the tape (96) is attached, to the wafer table (12) and positions the opening part (64a) of the ring frame (64) on the rear surface (4b) of the wafer (4) supported by the wafer table (12) and places a frame (64') with attached tape on the wafer table (12); a tape pressure joining unit (102) that performs pressure bonding of the tape (96) of the frame (64') with attached tape to the rear surface (4b) of the wafer (4);a frame unit ejection means (192) that conveys a frame unit (U) away from the wafer table (12), in which the band (96) of the frame (64') with attached band and the rear surface (4b) of the wafer (4) are pressure-joined by the band pressure joining unit (102); a reinforcement part removal unit (194) that cuts and removes the annular reinforcement part (24) from the wafer (4) of the frame unit (U) ejected by the frame unit ejection means (192); an annular unit ejection means (196) that conveys an annular unit (U') resulting from the removal of the annular reinforcement part (24) from the reinforcement part removal unit (194);and a frame cassette table (200) on which a frame cassette (198) is placed, which accommodates the ringless unit (U') ejected by the ejection means (196) for the ringless unit, wherein the reinforcement part removal unit (194) comprises: a distance detection unit (412) which detects whether the ring-shaped reinforcement part (24) has been removed or not.

Description

BACKGROUND OF THE INVENTIONField of the InventionThe present invention relates to a processing apparatus that removes an annular reinforcing part having a protrusion shape from a wafer, the annular reinforcing part being formed in the protrusion shape at a rear surface corresponding to an outer peripheral surplus region.DESCRIPTION OF THE RELATED ARTA wafer in which a device region in which a plurality of devices such as an integrated circuit (IC) and large scale integrations (LSI) are formed in such a manner as to be delimited by a plurality of planned dividing lines intersecting each other and an outer peripheral surplus region surrounding the device region is formed on a front surface is made to have a desired thickness by grinding a back surface. Thereafter, the wafer is divided into individual device chips by a dividing device or a laser processing device, and the respective device chips obtained by the dividing are used for electric appliances such as mobile phones and personal computers.The present applicant has proposed the following procedure. Predetermined processing is performed in such a manner that an annular reinforcing member remains on a back surface corresponding to an outer peripheral surplus region to facilitate conveyance of a ground wafer. Thereafter, a dicing tape is attached to the back surface of the wafer, and the wafer is supported by a ring frame. Then, the annular reinforcing part is removed from the wafer (see, for example, Japanese Patent Application Laid-Open JP 2010-62 375 A).SUMMARY OF THE INVENTIONHowever, there is the following problem. It is difficult to adhere the division tape to the back surface of the wafer in which the annular reinforcing part is formed in a protrusion shape on the back surface corresponding to the outer peripheral surplus region to connect the wafer to the ring frame. In addition, it is difficult to cut the annular reinforcing part and remove it from the wafer. Therefore, productivity is low.Therefore, an object of the present invention is to provide a processing apparatus with which the work of adhering a dicing tape to the back surface of a wafer, in which an annular reinforcing part is formed in a protrusion shape on the back surface corresponding to an outer peripheral surplus region to connect the wafer to a ring frame is easy, and it is easy to cut the annular reinforcing part and remove it from the wafer.According to an aspect of the present invention, there is provided a processing apparatus that removes an annular reinforcing part having a protrusion shape from a wafer, in which the annular reinforcing part in the protrusion shape is formed on a rear surface corresponding to an outer peripheral surplus region. The processing apparatus includes a wafer cassette table on which a wafer cassette in which a plurality of wafers are accommodated is placed, a wafer carry-out unit that carries out the wafer from the wafer cassette placed on the wafer cassette table, a wafer table that supports a front surface side of the wafer carried out by the wafer carry-out unit, a frame accommodation unit that accommodates a plurality of ring frames in which an opening part that accommodates the wafer is formed, and a frame carry-out unit that carries out the ring frame from the frame accommodation unit. The processing apparatus also includes a frame table supporting the ring frame conveyed out by the frame convey unit, a tape adhering unit disposed above the frame table and adhering a tape to the ring frame, a tape attached frame conveying unit conveying the ring frame to which the tape is adhered to the wafer table and positioning the opening part of the ring frame to the back surface of the wafer supported by the wafer table and placing a tape attached frame on the wafer table, and a tape pressure bonding unit performing pressure bonding of the tape of the tape attached frame to the back surface of the wafer. The processing unit also includes a frame unit carry-out means that carries away from the wafer table, a frame unit in which the tape of the tape-attached frame and the back surface of the wafer are pressure-bonded by the tape pressure-bonding unit, a reinforcing part removing unit that cuts and removes the annular reinforcing part from the wafer of the frame unit carried out by the frame unit carry-out means, a ringless unit carry-out means that carries out an annular unit resulting from the removal of the annular reinforcing part from the reinforcing part removing unit, and a frame cassette table on which a frame cassette is placed, which houses the ringless unit carried out by the ringless unit carry-out means. The reinforcement part removing unit includes a distance detecting unit that detects whether or not the ring-shaped reinforcement part has been removed.Preferably, the frame unit carry-out means includes a frame unit holding part including a wafer holding part holding the wafer and a frame holding part holding the ring frame, and a conveying part conveying the frame unit holding part to a transition placing table.Preferably, the reinforcing part removing unit includes a laser beam irradiation unit that irradiates an origin of the annular reinforcing part formed on the outer periphery of the wafer with a laser beam to form a cutting groove, a first raising / lowering table that holds and raises the frame unit temporarily placed on the temporary placing table and positions the frame unit to the laser beam irradiation unit, and a separating part that separates the annular reinforcing part from the cutting groove. Moreover, the separation part includes an ultraviolet irradiation part that irradiates the tape corresponding to the cutting groove with ultraviolet light to reduce an adhesive force of the tape, a second raising / lowering table that sucks and holds the inside of the wafer such that the annular reinforcing part is exposed from the outer periphery and supports the ring frame, a separator that acts on the outer periphery of the annular reinforcing part and separates the annular reinforcing part, and a disposal part through which the separated annular reinforcing part is disposed. Moreover, the reinforcing part removing unit is disposed adjacent to the ultraviolet irradiation part, and the reinforcing part removing unit includes a cutting groove detecting unit that detects the cutting groove. Moreover, the first raising / lowering table temporarily places the frame unit in which the cutting groove is formed on the transition placing table, the transition placing table is positioned to the separating part by a conveying part for the transition placing table, and the second raising / lowering table supports the frame unit temporarily placed on the transition placing table.According to the processing apparatus of the present invention, work of adhering the division tape to the back surface of the wafer is easy in which the annular reinforcing part is formed in the protrusion shape on the back surface corresponding to the outer peripheral surplus region to connect the wafer to the ring frame. In addition, it is easy to cut the annular reinforcing part and remove it from the wafer, and productivity becomes favorable.The above and other objects, features and advantages of the present invention, as well as the manner of realizing them, will be best understood by studying the following specification and appended claims with reference to the accompanying drawings which show a preferred embodiment of the invention, and the invention itself will be best understood thereby.BRIEF DESCRIPTION OF THE DRAWINGSFIG. 1 is a perspective view of a machining apparatus of an embodiment of the present invention; FIG. 2 is a perspective view of a wafer for which processing is performed by the processing apparatus illustrated in FIG. 1 ; FIG. 3 is a perspective view of a wafer cassette table, etc. as shown in FIG. 1; FIG. 4 is a perspective view of a hand shown in FIG. 1 ; FIG. 5 is a perspective view of a frame accommodating unit illustrated in FIG. 1, etc.; FIG. 6A is a perspective view of a tape adhering unit, etc. in the state where a frame table illustrated in FIG. 1 is positioned at a lowering position; FIG. 6B is a perspective view of the tape adhering unit, etc. in the state where the frame table illustrated in FIG. 1 is positioned at a raising position; FIG. 7 is an exploded perspective view of a band pressure connection unit illustrated in FIG. 1 ; FIG. 8 is a sectional view illustrating the state in which pressing of a tape by a pressing roller is started in a tape pressure bonding step; FIG. 9 is a sectional view illustrating the state in which the pressing of the tape by the pressing roller is finished in the tape pressure-bonding step; FIG. 10 is a perspective view of a reinforcement part removing unit illustrated in FIG. 1 ; FIG. 11 is a schematic sectional view illustrating the state in which an origin of a gain part is irradiated with a laser beam in a gain part removal step; FIG. 12A is a perspective view of a first raising / lowering table of the reinforcement part removing unit illustrated in FIG. 1 ; FIG. 12B is a perspective view of a holding part illustrated in FIG. 12A as viewed from a lower side; FIG. 12C is a schematic sectional view illustrating the state in which a cutting groove is detected; FIG. 13 is a graph illustrating an example of a relationship between a light amount received from a light receiving part of a cutting groove detection unit and a rotation angle of the wafer; FIG. 14A is a perspective view of a separating part of the reinforcing part removing unit illustrated in FIG. 1 ; FIG. 14B is a schematic diagram of a distance detection unit illustrated in FIG. 14A ; FIG. 15 is a schematic diagram illustrating the state in which the reinforcing part is separated from the wafer in the reinforcing part removing step; FIG. 16 is a perspective view of a disposal part of the reinforcement part removing unit illustrated in FIG. 1 ; FIG. 17 is a perspective view of a reversing mechanism of a ringless unit carry-out means in FIG. 1; FIG. 18 is a perspective view of a ringless unit supporting part and a pressing part of the ringless unit removing means shown in FIG. 1; and FIG. 19 is a perspective view illustrating the state in which an accommodation step of a ringless unit is performed.DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTA processing apparatus of an embodiment of the present invention will be described below with reference to the drawings.Referring to FIG. 1, a processing apparatus denoted by reference numeral 2 as a whole includes a wafer cassette table 8 on which a wafer cassette 6 in which a plurality of wafers are accommodated is placed, a wafer carry-out unit 10 that carries a wafer out of the wafer cassette 6 placed on the wafer cassette table 8, and a wafer table 12 that supports a front surface side of the wafer carried out by the wafer carry-out unit 10.FIG. 2 illustrates a wafer 4, the processing of which is carried out by the processing apparatus 2. On a front surface 4 aof the wafer 4, a device region 18 in which a plurality of devices 14 such as an IC and an LSI are divided in a lattice manner by planned dividing lines 16 and an outer peripheral surplus region 20 surrounding the device region 18 are formed. In FIG. 2, a boundary 22 between the device region 18 and the outer peripheral surplus region 20 is represented by a two-dot chain line for convenience. In fact, however, the line indicating the boundary 22 does not exist. An annular reinforcing part 24 is formed in a protrusion shape in the outer peripheral surplus region 20 on a back surface 4 bside of the wafer 4, and a thickness of the outer peripheral surplus region 20 is larger than that of the device region 18.As illustrated in FIG. 3, in the wafer cassette 6, a plurality of wafers 4 are accommodated in an up-down direction at intervals in the state in which the front surfaces 4 aare directed upward. The wafer cassette table 8 of the present embodiment has an upper plate 28 on which the wafer cassette 6 is placed, and a support plate 30 supporting the upper plate 28. The upper plate 28 could be able to raise and lower and a raising-lowering means could be arranged which raises and lowers the upper plate 28 and positions it at a desired height.The description will be continued with reference to FIG. 3. The wafer carry-out unit 10 includes a Y-axis movable component 32 capable of moving in a Y-axis direction indicated by an arrow Y in FIG. 3, and a Y-axis feeding mechanism 34 that moves the Y-axis movable component 32 in the Y-axis direction. The Y-axis feeding mechanism 34 includes a ball screw 36 coupled to a lower end of the Y-axis movable component 32 and extending in the Y-axis direction, and a motor 38 that rotates the ball screw 36. The Y-axis feed mechanism 34 converts a rotational motion of the motor 38 into a linear motion by the ball screw 36, and transmits the linear motion to the Y-axis movable component 32 to move the Y-axis movable component 32 in the Y-axis direction along a pair of guide rails 40 extending in the Y-axis direction. An X-axis direction indicated by an arrow X in FIG. 3 is a direction orthogonal to the Y-axis direction, and a Z-axis direction indicated by an arrow Z in FIG. 3 is the up-down direction orthogonal to the X-axis direction and the Y-axis direction. An XY plane defined by the X-axis direction and the Y-axis direction is substantially horizontal.As illustrated in FIG. 3, the wafer carry-out unit 10 of the present embodiment includes a conveying arm 42 and a hand 44 that is disposed at a tip of the conveying arm 42 and supports the back surface 4 bof the wafer 4 accommodated in the wafer cassette 6 and inverts the front and back sides of the wafer 4. The conveying arm 42 is disposed above an upper surface of the Y-axis movable component 32 and is driven by a suitable drive source (not shown) such as an air drive source or an electric drive source. This drive source drives the conveying arm 42 and positions the hand 44 to a selectable position in each direction of the X-axis direction, the Y-axis direction and the Z-axis direction. In addition, the drive source turns the hand 44 onto the head.Referring to FIG. 4, it is preferable that the hand 44 is a Bernoulli pad on which a negative pressure is generated by an air jet and which supports the wafer 4 in a non-contact manner. The hand 44 of the present embodiment has a C-shape as a whole, and a plurality of air discharge ports 46 connected to an air supply source (not shown) are formed in a single surface of the hand 44. A plurality of guide pins 48 are attached to the outer peripheral edge of the hand 44 at intervals in the circumferential direction. Each guide pin 48 is configured to be movable in a radial direction of the hand 44.As illustrated in FIGS. 3 and 4, after positioning the hand 44 on the back surface 4 bside (lower side) of the wafer 4 in the wafer cassette 6 placed on the wafer cassette table 8, the wafer carry-out unit 10 discharges compressed air from the air discharge ports 46 of the hand 44 to generate a negative pressure on a single surface side of the hand 44 by the Bernoulli effect, and sucks and carries the wafer 4 from the back surface 4 bside in a non-contact manner by the hand 44. Horizontal movement of the wafer 4 sucked and carried by the hand 44 is restricted by the respective guide pins 48. Then, the wafer carry-out unit 10 carries out the wafer 4 suctioned and carried by the hand 44 from the wafer cassette 6 by moving the Y-axis movable component 32 and the carrying arm 42.As illustrated in FIG. 4, the wafer carry-out unit 10 of the present embodiment includes a notch detection means 50 that detects the position of the notch 26 of the wafer 4. For example, it is sufficient that the notch detection means 50 is configured to include a light emitting element 52 and a light receiving element 54 spaced apart from each other in the up-down direction, and a drive source (not shown) that rotates at least one of the guide pins 48 of the hand 44.The light emitting element 52 and the light receiving element 54 may be attached to the Y-axis movable component 32 or a conveyance route through the intermediary of a suitable bracket (not shown). Moreover, the wafer 4 suctioned and supported by the hand 44 rotates due to the rotation of the guide pin 48 when the guide pin 48 rotates by the above-described driving source. It is preferable that the outer peripheral surface of the guide pin 48 rotated by the driving source is formed of a suitable synthetic resin to surely transmit the rotation of the guide pin 48 to the wafer 4.The notch detection means 50 can detect the position of the notch 26 by rotating the wafer 4 by the driving source via the guide pin 48 in the state where the wafer 4 is suctioned and supported by the hand 44 and the outer periphery of the wafer 4 is positioned between the light emitting element 52 and the light receiving element 54. This makes it possible to set an orientation of the wafer 4 to a selectable orientation.As illustrated in FIG. 3, the wafer stage 12 is disposed adjacent to the wafer carry-out unit 10. The wafer table 12 of the present embodiment includes an annular support part 56 that supports the outer peripheral surplus region 20 of the wafer 4 and makes the part on the inner side non-contact relative to the outer peripheral surplus region 20, and a frame support part 58 that is disposed around the outer periphery of the annular support part 56 and supports a ring frame 64 (see FIG. 5 ) to be described later. On the upper surface of the annular support member 56, a plurality of suction holes 60 are formed spaced apart in the circumferential direction, and each suction hole 60 is connected to suction means (not shown). The portion on the inner side in the radial direction relative to the annular support portion 56 in the wafer table 12 is a circular depression 62 which is hollow downward.When the hand 44 rotates 180° to turn over the front and rear sides of the wafer 4 and the wafer 4 is placed on the wafer table 12 in the state where the front surface 4 aof the wafer 4 faces downward, the outer peripheral surplus portion 20 of the wafer 4 is supported by the ring-shaped support part 56, and the device portion 18 of the wafer 4 is disposed in the recess 62. Although the wafer 4 is placed on the wafer table 12 in the state where the front surface 4 aon which the devices 14 are formed faces downward, the devices 14 do not come into contact with the wafer table 12, and therefore damage to the devices 14 is prevented. Moreover, the wafer table 12 prevents the position of the wafer 4 from deviating by operating the suction means and generating a suction force for each suction hole 60 to suck and hold the outer peripheral surplus portion 20 after the outer peripheral surplus portion 20 is supported by the annular support part 56.Referring to FIG. 5, the processing apparatus 2 further includes a frame accommodating unit 66 accommodating a plurality of annular ring frames 64 in which an opening part 64 athat accommodates the wafer 4, a frame carry-out unit 68 that carries the ring frame 64 out of the frame accommodating unit 66, and a frame table 70 that supports the ring frame 64 carried out by the frame carry-out unit 68 are formed.As illustrated in FIG. 5, the frame accommodating unit 66 of the present embodiment includes a housing 72, a raising / lowering plate 74 disposed so as to be raised and lowered in the housing 72, and a raising / lowering means (not illustrated) that raises and lowers the raising / lowering plate 74. A Z-axis guide component 78 extending in the Z-axis direction is disposed on the side surface of the housing 72 on the opposite side in the X-axis direction in FIG. 5. The raising / lowering plate 74 is supported by the Z-axis guide component 78 so as to be able to rise and lower, and the raising / lowering means that raises and lowers the raising / lowering plate 74 is disposed inside the Z-axis guide component 78. It is sufficient that the raising / lowering means is, for example, a configuration including a ball screw that is coupled to the raising / lowering plate 74 and that extends in the Z-axis direction and a motor that rotates this ball screw. On the side surface of the housing 72 on the side close in the X-axis direction in FIG. 5, a door 76 to which a handle 76 ais attached is disposed. In the frame accommodating unit 66, the ring frames 64 can be accommodated inside the housing 72 by gripping the handle 76 aand opening the door 76. Moreover, an opening part 80 is provided at an upper end of the housing 72.As shown in FIG. 5, the ring frames 64 are accommodated so as to be layered over the upper surface of the raising / lowering plate 74 inside the housing 72. The ring frame 64 at the uppermost level of the plurality of layered ring frames 64 is conveyed out from the opening part 80 of the housing 72 by the frame conveyance-out unit 68. Moreover, when the ring frame 64 is conveyed out of the opening part 80, the frame accommodating unit 66 suitably raises the raising / lowering plate 74 by the raising / lowering means, and positions the ring frame 64 at the uppermost level at the position from which the ring frame 64 can be conveyed out by the frame conveying unit 68.The description will be continued with reference to FIG. 5. The frame carry-out unit 68 includes an X-axis guide component 82 fixed to a suitable bracket (not shown) and extending in the X-axis direction, an X-axis movable component 84 supported movably in the X-axis direction by the X-axis guide component 82, an X-axis feed mechanism (not shown) that moves the X-axis movable component 84 in the X-axis direction, a Z-axis movable component 86 supported movably in the Z-axis direction by the X-axis movable component 84, and a Z-axis feed mechanism (not shown), which moves the Z-axis movable component 86 in the Z-axis direction. It is sufficient if the X-axis feeding mechanism of the frame carry-out unit 68 has such a configuration as to include a ball screw that is coupled to the X-axis movable component 84 and that extends in the X-axis direction, and a motor that rotates this ball screw. It is sufficient that the Z-axis supply means is configured to include a ball screw coupled to the Z-axis movable component 86 and extending in the Z-axis direction, and a motor that rotates this ball screw.The Z-axis movable component 86 of the frame carry-out unit 68 has a holding part 88 that holds the ring frame 64. The holding part 88 of the present embodiment includes a rectangular substrate 90 and a plurality of suction pads 92 disposed on the lower surface of the substrate 90. Each suction pad 92 is connected to a suction means (not shown).The frame carry-out unit 68 sucks and holds the ring frame 64 at the uppermost plane accommodated in the frame accommodation unit 66 through the suction pads 92 of the holding part 88, and thereafter moves the X-axis movable component 84 and the Z-axis movable component 86.As shown in FIG. 5, the frame table 70 is supported by a Z-axis guide member 94 so as to be able to rise and fall between a lowering position shown by solid lines and a raising position shown by two-dot chain lines. Connected to the Z-axis guide component 94 is a suitable drive source (for example, an air drive source or an electric drive source) that raises and lowers the frame table 70 between the lowering position and the raising position. In the frame table 70, the ring frame 64 carried out by the frame carry-out unit 68 is accommodated at the lowering position.As illustrated in FIGS. 1 and 5, the processing apparatus 2 includes a tape adhering unit 98 (see FIG. 1 ) disposed above the frame table 70 and adhering a tape 96 to the ring frame 64, a tape-attached frame conveying unit 100 (see FIG. 5 ) conveying the ring frame 64 to which the tape 96 is adhered (hereinafter, often referred to as a "tape-attached ring frame 64") to the wafer table 12 and positioning the opening part 64 aof the ring frame 64 on the back surface 4 bof the wafer 4 supported by the wafer table 12 and placing the tape-attached ring frame 64' on the wafer table 12, and a tape pressure connecting unit 102 (see FIG. 1 ), This pressure-connects the tape 96 of the tape-attached ring frame 64' to the back surface 4b of the wafer 4.Referring to FIGS. 6A and 6B, the tape adhering unit 98 of the present embodiment includes a roll tape supporting part 104 that supports a roll tape 96R in which the tape 96 is wound before use, a tape receiving part 106 that receives the used tape 96, a tape withdrawing part 108 that pulls the tape 96 out of the roll tape 96R, a pressure connecting part 110 that performs pressure connecting of the withdrawn tape 96 to the ring frame 64, and a cutting part 112 that cuts the tape 96 protruding toward the outer periphery of the ring frame 64 along the ring frame 64.As shown in FIGS. 6A and 6B, the roller belt supporting part 104 has a support roller 114 supported by a corresponding bracket (not shown) rotatably about an axis line extending in the X-axis direction. The support roller 114 supports the roll belt 96R in which the release paper 116 for protecting an adhesive surface of the belt 96 is attached to the adhesive surface of the belt 96 and wound into a circular cylindrical shape.The tape take-up part 106 includes a take-up roller 118 supported by a corresponding bracket (not shown) rotatably about an axis line extending in the X-axis direction, and a motor (not shown) that rotates the take-up roller 118. As shown in Figs. 6A and 6B, the tape receiving portion 106 receives the used tape 96 in which a circular opening portion 120 is formed corresponding to the portion adhered to the ring frame 64 by rotating the take-up roller 118 by the motor.The description will be continued with reference to FIGS. 6A and 6B. The tape draw-out part 108 includes a draw-out roller 122 disposed below the support roller 114 of the roller tape support part 104, a motor (not shown) that rotates the draw-out roller 122, and a driven roller 124 that rotates in association with the rotation of the draw-out roller 122. The tape draw-out part 108 draws the tape 96 engaged by the draw-out roller 122 and the driven roller 124 off the roller tape 96R by rotating the driven roller 124 together with the draw-out roller 122 by the motor.The release paper 116 is separated from the belt 96 which has passed between the draw-out roller 122 and the driven roller 124, and the separated release paper 116 is received by a release paper receiving part 126. The release paper receiving part 126 of the present embodiment includes a release paper receiving roller 128 disposed above the driven roller 124, and a motor (not shown) that rotates the release paper receiving roller 128. Moreover, the belt 96 from which the release paper 116 has been separated passes through a guide roller 130 spaced apart from the draw-out roller 122 in the Y-axis direction, and is guided to the take-up roller 118.The pressure connection part 110 includes a pressing roller 132 disposed movably in the Y-axis direction, and a Y-axis feeding mechanism (not illustrated) that moves the pressing roller 132 in the Y-axis direction. The Y-axis feeding mechanism of the pressure connection part 110 may be configured from a suitable drive source (for example, an air drive source or an electric drive source).As illustrated in FIGS. 6A and 6B, the cutting part 112 includes a Z-axis guide component 134 fixed to a suitable bracket (not illustrated) and extending in the Z-axis direction, a Z-axis movable component 136 supported by the Z-axis guide component 134 movably in the Z-axis direction, and a Z-axis feed mechanism (not illustrated) that moves the Z-axis movable component 136 in the Z-axis direction. It is sufficient that the Z-axis feeding mechanism of the cutter 112 has a configuration including a ball screw coupled to the Z-axis movable component 136 and extending in the Z-axis direction and a motor that rotates this ball screw.Moreover, the cutting part 112 includes a motor 138 fixed to the lower surface of the tip of the Z-axis movable component 136, and an arm piece 140 rotated by the motor 138 about an axis line extending in the Z-axis direction. On the lower surface of the arm piece 140, first and second hanging pieces 142a and 142b are attached at a distance from each other. A circular cutter 144 is supported by the first hanging piece 142 arotatably about an axis line orthogonal to the Z-axis direction. A hold-down roller 146 is supported by the second hanging piece 142 bto be rotatable about an axis line orthogonal to the Z-axis direction.The tape adhering unit 98 pulls out the tape 96 unused by the pull-out roller 122 and the driven roller 124, before the frame table 70 that has received the ring frame 64 from the frame take-out unit 68 is positioned from the lowering position (a position illustrated in FIG. 6A ) to the raising position (a position illustrated in FIG. 6B ). Then, the frame table 70 is positioned at the raising position so far that the tape 96 can be pressed against the ring frame 64 by the press roller 132 of the pressure connecting part 110, and the ring frame 64 is brought into contact with the press roller 132 with the intermediary of the tape 96. Then, the press roller 132 is rolled in the Y-axis direction while the adhesion surface of the tape 96 is pressed against the ring frame 64 by the press roller 132. Thereby, the pressure-bonding of the tape 96 peeled from the roller tape 96R by the tape peeling part 108 to the ring frame 64 can be performed.After the tape 96 is press-bonded to the ring frame 64, the tape adhering unit 98 lowers the Z-axis movable component 136 of the cutter member 112 by the Z-axis feeding mechanism to press the cutter 144 against the tape 96 on the ring frame 64 and hold down the ring frame 64 from above the tape 96 by the hold-down roller 146. Thereafter, the tape adhering unit 98 rotates the arm piece 140 by the motor 138 and causes the cutter 144 and the hold-down roller 146 to move to draw a circle along the ring frame 64. Thereby, the band 96 protruding toward the outer periphery of the ring frame 64 can be cut along the ring frame 64. Moreover, since the ring frame 64 is held down from above the band 96 by the hold-down roller 146, deviation of the position of the ring frame 64 and the band 96 is prevented when the band 96 is cut. Then, after the frame table 70 is lowered, the used tape 96 in which the circular opening part 120 corresponding to the part adhered to the ring frame 64 is formed is received by the tape receiving part 106.As shown in FIG. 5, the belt-attached frame conveying unit 100 includes a Y-axis guide component 148 fixed to a suitable bracket (not shown) and extending in the Y-axis direction, a Y-axis movable component 150 supported by the Y-axis guide component 148 movably in the Y-axis direction, a Y-axis feeding means (not shown) for moving the Y-axis movable component 150 in the Y-axis direction, a Z-axis movable component 152 supported by the Y-axis movable component 150 movably in the Z-axis direction, and a Z-axis feeding means (not shown), which moves the Z-axis movable component 152 in the Z-axis direction. It is sufficient that the Y-axis feeding mechanism of the belt-attached frame conveying unit 100 has a configuration including a ball screw coupled to the Y-axis movable component 150 and extending in the Y-axis direction and a motor that rotates this ball screw. It is sufficient that the Z-axis feeding mechanism has a configuration including a ball screw coupled to the Z-axis movable component 152 and extending in the Z-axis direction and a motor that rotates this ball screw.The Z-axis movable component 152 of the belt-attached frame conveying unit 100 has a holding part 154 that holds the belt-attached ring frame 64'. The holding part 154 of the present embodiment includes a rectangular substrate 156 and a plurality of suction pads 158 disposed on the lower surface of the substrate 156. Each suction pad 158 is connected to a suction means (not shown).The belt-attached frame conveying unit 100 sucks and holds, through the respective suction pads 158 of the holding part 154, the upper surface of the belt-attached ring frame 64' supported by the frame table 70 in the state where the holding surface of the belt 96 faces downward, and moves the Y-axis movable component 150 and the Z-axis movable component 152. Thereby, the belt-attached frame conveying unit 100 conveys the belt-attached ring frame 64' suctioned and held by the holding part 154 from the frame table 70 to the wafer table 12 and positions the opening part 64 aof the ring frame 64 on the back surface 4 bof the wafer 4 supported by the wafer table 12 and places the belt-attached ring frame 64' on the wafer table 12.The tape pressure connecting unit 102 will be described with reference to FIGS. 7 to 9. As illustrated in FIG. 7, the belt pressure connection unit 102 includes an upper chamber 160 disposed above the wafer table 12, a lower chamber 162 in which the wafer table 12 is accommodated, and a raising-lowering mechanism 164 that raises and lowers the upper chamber 160 and generates a closed state in which the upper chamber 160 is brought into contact with the lower chamber 162 and an open state in which the upper chamber 160 is separated from the lower chamber 162. The belt pressure communication unit 102 further includes a vacuum part 166 that puts the upper chamber 160 and the lower chamber 162 into a vacuum state in the closed state, and an atmospheric opening part 168 that opens the upper chamber 160 and the lower chamber 162 into the atmosphere.As shown in FIG. 7, the upper chamber 160 of the present embodiment has a circular upper plate 170 and a circular cylindrical side wall 172 depending from the peripheral edge of the upper plate 170. On the upper surface of the upper plate 170 is mounted the raising-lowering mechanism 164, which may be configured of a suitable actuator such as an air cylinder. In a space defined by the lower surface of the upper plate 170 and the inner circumferential surface of the side wall 172, a press roller 174 for pressing the belt 96 of the belt-attached ring frame 64' against the rear surface 4b of the wafer 4 supported by the wafer table 12, a support piece 176 rotatably supporting the press roller 174, and a Y-axis feeding mechanism 178 which moves the support piece 176 in the Y-axis direction are disposed.The Y-axis feed mechanism 178 includes a ball screw 180 coupled to the support piece 176 and extending in the Y-axis direction, and a motor 182 that rotates the ball screw 180. Moreover, the Y-axis feed mechanism 178 converts a rotational motion of the motor 182 into a linear motion by the ball screw 180, and transmits the linear motion to the support piece 176 to move the support piece 176 along a pair of guide rails 184 extending in the Y-axis direction.As shown in FIG. 7, the lower chamber 162 has a circular cylindrical side wall 186. The upper part of the side wall 186 is opened and the lower part of the side wall 186 is closed. A connecting opening 188 is formed in the side wall 186. The vacuum portion 166, which may be configured by a suitable vacuum pump, is connected to the connection port 188 via a flow path 190. The atmospheric opening part 168, which may be configured of a suitable valve capable of opening the flow path 190 to the atmosphere, is disposed on the flow path 190.In the state where the tape 96 of the tape-attached ring frame 64' is positioned on the rear surface 4b of the wafer 4 supported by the wafer table 12, the tape pressure connection unit 102 lowers the upper chamber 160 by the raising-lowering mechanism 164 and brings the lower end of the side wall 172 of the upper chamber 160 into contact with the upper end of the side wall 186 of the lower chamber 162 to put the upper chamber 160 and the lower chamber 162 in the closed state. In addition, the tape pressure connecting unit 102 brings the press roller 174 into contact with the tape-attached ring frame 64'.Thereafter, the belt pressure connection unit 102 operates the vacuum pump configuring the vacuum part 166 in the state where the valve configuring the atmospheric opening part 168 is closed to put the inside of the upper chamber 160 and the lower chamber 162 in a vacuum state. Thereafter, as illustrated in FIGS. 8 and 9, the tape pressure bonding unit 102 rolls the press roll 174 in the Y-axis direction by the Y-axis feeding mechanism 178, thereby performing pressure bonding of the tape 96 to the back surface 4 bof the wafer 4 and forming a frame unit U.When the tape 96 is pressure-bonded to the back surface 4 bof the wafer 4 by the pressure roller 174, a slight gap is formed between the wafer 4 and the tape 96 at the origin of the annular reinforcing member 24. However, since the pressure bonding of the wafer 4 and the belt 96 is performed in the state where the inside of the upper chamber 160 and the lower chamber 162 is placed in the vacuum state, the pressure of the slight gap between the wafer 4 and the belt 96 is lower than the atmospheric pressure. Thus, when the atmospheric opening part 168 is opened after the tape 96 is pressure-bonded, the tape 96 is pressed against the wafer 4 by the atmospheric pressure. Thereby, the gap between the wafer 4 and the belt 96 disappears at the origin of the reinforcing part 24, and the belt 96 comes into close contact with the back surface 4 bof the wafer 4 along the origin of the reinforcing part 24.As illustrated in FIGS. 1 and 10, the processing apparatus 2 further includes a frame unit carry-out mechanism 192 that carries away from the wafer table 12 the frame unit U in which the belt 96 of the belt-attached ring frame 64' and the back surface 4 bof the wafer 4 are pressure-bonded by the belt pressure-bonding unit 102, and a reinforcing part removal unit 194 that cuts and removes the annular reinforcing part 24 from the wafer 4 of the frame unit U carried out by the frame unit carry-out means 192. The processing apparatus 2 also includes a ringless unit discharge means 196 (see FIG. 1 ) that discharges, from the reinforcing part removal unit 194, the ringless unit resulting from the removal of the annular reinforcing part 24, and a frame cassette table 200 on which a frame cassette 198 that houses the ringless unit discharged from the ringless unit discharge means 196 is placed.As illustrated in FIG. 10, the frame unit carry-out means 192 of the present embodiment includes a frame unit holding part 202 including a wafer holding part 202 athat holds the wafer 4 and a frame holding part 202 bthat holds the ring frame 64, and a conveying part 206 that conveys the frame unit holding part 202 to a transition placing table 204.The wafer holding part 202a of the frame unit holding part 202 comprises a circular substrate 208 and a circular suction adhering piece 210 attached to the lower surface of the substrate 208. A plurality of suction holes (not shown) are formed in the lower surface of the suction adhering piece 210, and each suction hole is connected to a suction means (not shown). The frame holding part 202 bhas a plurality of (four in the present embodiment) protruding pieces 212 protruding outward in the radial direction from the peripheral edge of the substrate 208 of the wafer holding part 202 awith intervals interposed therebetween in the circumferential direction, and suction pads 214 are attached to the lower surfaces of the protruding pieces 212. Each suction pad 214 is connected to a suction means (not shown).The conveying part 206 includes an X-axis guide component 216 that is fixed to a corresponding bracket (not illustrated) and that extends in the X-axis direction, an X-axis movable component 218 that is movably supported by the X-axis guide component 216 in the X-axis direction, and an X-axis feeding mechanism (not illustrated) that moves the X-axis movable component 218 in the X-axis direction. The conveying part 206 further includes a Z-axis movable component 220 supported by the X-axis movable component 218 movably in the Z-axis direction, a Z-axis feeding mechanism (not illustrated) that moves the Z-axis movable component 220 in the Z-axis direction, a Y-axis movable component 222 supported by the Z-axis movable component 220 movably in the Y-axis direction, and a Y-axis feeding mechanism (not illustrated) that moves the Y-axis movable component 222 in the Y-axis direction. The substrate 208 of the wafer holding part 202 ais coupled to the tip of the Y-axis movable component 222. It is sufficient that each of the X-axis, Y-axis, and Z-axis feeding mechanisms of the conveying part 206 has a configuration including a ball screw and a motor that rotates the ball screw, respectively.It is preferable that the frame unit carry-out means 192 includes a two-dimensional moving mechanism that two-dimensionally moves the frame unit holding part 202 in the horizontal direction, and an imaging part 224 that images the outer periphery of the wafer 4 of the frame unit U held by the frame unit holding part 202. In the present embodiment, the frame unit holding part 202 two-dimensionally moves in the horizontal direction in the XY plane by the X-axis feeding mechanism and the Y-axis feeding mechanism of the conveying part 206, and the two-dimensional moving mechanism is configured by the conveying part 206. Moreover, the imaging part 224 of the present embodiment is disposed between the wafer table 12 and the temporary placement table 204, and the outer periphery of the frame unit U held by the frame unit holding part 202 is imaged from the lower side of the wafer 4.The frame unit carry-out means 192 operates the conveying part 206 in the state where the wafer 4 is sucked and held from the back surface 4 bside (belt 96 side) by the suction adhering piece 210 of the wafer holding part 202 aand the ring frame 64 is sucked and held by the suction pads 214 of the frame holding part 202 b. The frame unit carry-out means 192 thereby carries the frame unit U held by the frame unit holding part 202 away from the wafer table 12.Moreover, the frame unit carry-out means 192 of the present embodiment measures the coordinates of at least three points on the outer periphery of the wafer 4 by operating the conveying part 206 configuring the two-dimensional movement mechanism and imaging by the imaging part 224 at at least three locations on the outer periphery of the wafer 4 of the frame unit U held by the frame unit holding part 202, and obtains the center coordinates of the wafer 4 based on the measured coordinates of the three points. Then, the frame unit carry-out means 192 causes the center of the wafer 4 to coincide with the center of the transition placing table 204, and temporarily places the frame unit U on the transition placing table 204.As illustrated in FIG. 10, the transition placement table 204 is disposed at a distance from the wafer table 12 in the X-axis direction. The temporary placement table 204 of the present embodiment includes an annular support part 226 that supports the outer peripheral surplus region 20 of the wafer 4 of the frame unit U and makes the part contactless on the inner side relative to the outer peripheral surplus region 20, and a frame support part 228 that is disposed around the outer periphery of the annular support part 226 and supports the ring frame 64.The part located on the inner side in the radial direction relative to the annular support part 226 is a circular depression 230 which is hollow downward. It is preferable that the frame supporting part 228 of the transition placing table 204 has a heater (not shown), and the belt 96 of the frame unit U temporarily placed on the transition placing table 204 is softened by heating the belt 96 by the heater, and the belt 96 is brought into closer contact with the origin of the annular reinforcing part 24 by the atmospheric pressure.The processing apparatus 2 of the present embodiment includes a transition placement table conveying part 232 that conveys the transition placement table 204 in the Y-axis direction. The temporary placement table conveying part 232 includes a Y-axis guide component 234 extending in the Y-axis direction, a Y-axis movable component 236 supported by the Y-axis guide component 234 movably in the Y-axis direction, and a Y-axis feeding mechanism 238 that moves the Y-axis movable component 236 in the Y-axis direction. The transition placement table 204 is fixed to the upper part of the Y-axis movable component 236. The Y-axis feed mechanism 238 includes a ball screw 240 coupled to the Y-axis movable component 236 and extending in the Y-axis direction, and a motor 242 that rotates the ball screw 240. Moreover, the transition placement table conveying part 232 converts a rotational movement of the motor 242 into a linear movement by the ball screw 240 and transmits the linear movement to the Y-axis movable component 236 to convey the transition placement table 204 together with the Y-axis movable component 236 in the Y-axis direction.As illustrated in FIGS. 1 and 10, the reinforcing part removing unit 194 includes a laser beam irradiation unit 244 that irradiates the origin of the annular reinforcing part 24 formed on the outer periphery of the wafer 4 with a laser beam to form a cutting groove, a first raising / lowering table 246 (see FIG. 1 ) that holds and raises the frame unit U temporarily placed on the temporary placing table 204 and moves in the X-axis direction to position the frame unit U to the laser beam irradiation unit 244, and a separating part 248 that separates the annular reinforcing part 24 from the cutting groove.As illustrated in FIG. 10, the laser beam irradiation unit 244 includes a housing 250 disposed adjacent to the transition placement table 204 in the X-axis direction, a laser oscillator (not illustrated) accommodated in the housing 250 and emitting a laser beam, and a light collector 252 that collects the laser beam emitted from the laser oscillator and irradiates the origin of the annular reinforcing part 24 formed on the outer periphery of the wafer 4 with the laser beam. The laser beam irradiation unit 244 further includes a suction nozzle 254 that sucks dirt particles generated when the wafer 4 is irradiated with the laser beam, and suction means (not shown) connected to the suction nozzle 254.The light collector 252 extends upward from the upper surface of the housing 250 with an inclination toward the suction nozzle 254 side. This reduces the amount of dirt particles generated when the laser beam is irradiated to fall on the light collector 252. Moreover, the suction nozzle 254 extends upward from the upper surface of the housing 250 with an inclination toward the light collector 252 side.As shown in FIG. 11, the laser beam irradiation unit 244 irradiates the origin of the annular reinforcing member 24 formed on the outer periphery of the wafer 4 with a laser beam LB while rotating the frame unit U held by the first raising / lowering table 246 to form an annular cutting groove 256 along the origin of the reinforcing member 24 by ablation processing. Moreover, the laser beam irradiation unit 244 sucks dirt particles generated due to the ablation processing with the suction nozzle 254.As illustrated in FIG. 1, the first raising / lowering table 246 is disposed above the transition placement table 204 movably in the X-axis direction and movably in the Z-axis direction. Referring to FIGS. 12A to 12C, the first elevating / lowering table 246 includes an X-axis guide component 258 which is fixed to a suitable bracket (not shown) and which extends in the X-axis direction, an X-axis movable component 260 supported by the X-axis guide component 258 movably in the X-axis direction, an X-axis feed mechanism (not shown) which moves the X-axis movable component 260 in the X-axis direction, a Z-axis movable component 262 supported by the X-axis movable component 260 movably in the Z-axis direction, and a Z-axis feed mechanism (not shown), which moves the Z-axis movable component 262 in the Z-axis direction. It is sufficient that each of the X-axis and Z-axis feeding mechanisms of the first elevating / lowering table 246 has a configuration including a ball screw and a motor that rotates the ball screw, respectively.A support shaft 264 extending downward is rotatably supported by the lower surface of the tip of the Z-axis movable component. On the upper surface of the tip of the Z-axis movable component 262, a motor 266 is mounted which rotates the support shaft 264 about an axis line extending in the Z-axis direction. A circular support member 268 is secured to the lower end of the support shaft 264.As shown in FIG. 12B, a wafer suction adhering jig 400 having a circular shape and a plurality of frame suction adhering jigs 402 arranged around the wafer suction adhering jig 400 are attached to the lower surface of the holding piece 268. A diameter of the wafer suction adhering jig 400 is slightly smaller than that of the device region 18 (a part inside the annular reinforcing part 24) of the wafer 4. Moreover, the wafer suction adhering jig 400 and the frame suction adhering jigs 402 are formed of a porous material and connected to suction means (not shown).The first raising / lowering table 246 sucks and holds, by the wafer suction adhering chuck 400, the wafer 4 of the frame unit U in which the tape 96 has been heated by the heating means of the frame supporting part 228 of the transition placing table 204 and the tape 96 is in close contact with the origin of the annular reinforcing part 24, and sucks and holds the ring frame 64 by the frame suction adhering chucks 402. Thereafter, the first raising / lowering table 246 moves the Z-axis movable component 262 and the X-axis movable component 260 to raise the frame unit U suctioned and held by the holding part 268 and move the frame unit U in the X-axis direction and position it to the laser beam irradiation unit 244.Moreover, when the wafer 4 is irradiated with the laser beam LB by the laser beam irradiation unit 244, the first raising / lowering table 246 operates the motor 266 to rotate the frame unit U suctioned and held by the holding part 268. In addition, the first raising / lowering table 246 moves the frame unit U in which the cutting groove 256 is formed at the origin of the reinforcing member 24 in the X-axis direction and the Z-axis direction, and temporarily places it on the transition placing table 204.As illustrated in FIGS. 12A to 12C, the reinforcing part removing unit 194 of the present embodiment includes a cutting groove detecting unit 404 that detects the cutting groove 256 formed by irradiating the root of the annular reinforcing part 24 formed on the outer periphery of the wafer 4 with the laser beam LB. The cutting groove detection unit 404 includes an annular illumination part 406 disposed in the lower surface of the holding part 268 of the first raising and lowering table 246, and a light receiving part 408 disposed next to the first raising and lowering table 246.As shown in FIG. 12C, the diameter of the illumination part 406 is almost the same as that of the cutting groove 256, and the illumination part 406 is disposed above the cutting groove 256 when the frame unit U is held by the holding part 268. Moreover, the light receiving part 408 is supported by the X-axis guide component 258 via a holder 410, and the light receiving part 408 is disposed below the cutting groove 256 when the frame unit U is held by the holding part 268.Moreover, in the cutting groove detection unit 404, the cutting groove 256 is detected by receiving light of the illumination element 406 by the light receiving part 408 while rotating the frame unit U held by the first raising / lowering table 246. More specifically, the cutting groove detection unit 404 detects whether or not the cutting groove 256 has reached the back surface 4 bfrom the front surface 4 aof the wafer 4, i.e., whether or not the wafer 4 has been completely cut.When the cutting groove 256 has reached the back surface 4 bfrom the front surface 4 aof the wafer 4 and the wafer 4 has been completely cut, the light of the illumination part 406 passes through the cutting groove 256 and reaches the light receiving part 408. Therefore, the amount of light received by the light receiving part 408 becomes comparatively large. The light of the illumination part 406 is transmitted through the band 96, and therefore, the amount of light received by the light receiving part 408 is not affected by the band 96. On the other hand, when the cutting groove 256 has not reached the back surface 4 bfrom the front surface 4 aof the wafer 4 and an incompletely cut portion that has not been completely cut is present in the wafer 4, the light of the illuminating part 406 is blocked by the incompletely cut portion. Therefore, the amount of light received by the light receiving portion 408 becomes comparatively small when the incompletely cut portion is located above the light receiving portion 408. Thus, the cutting groove detection unit 404 determines that the wafer 4 has been completely cut when the amount of light received by the light receiving part 408 is equal to or greater than a predetermined threshold over the entire circumference of the cutting groove 256. Conversely, the cutting groove detection unit 404 determines that the wafer 4 has not been completely cut when there is a region over which the amount of light received by the light receiving part 408 is less than the above-described threshold value.In an example illustrated in FIG. 13, the amount of light received by the light receiving part 408 is equal to or greater than a threshold T 1 in a range in which the rotation angle of the wafer 4 is 0° to θ 1 and a range in which it is θ 2 to 360°. However, the amount of light received by the light receiving part 408 is smaller than the threshold T 1 in a range in which the rotation angle of the wafer 4 is θ 1 to θ 2. Therefore, it is determined that an incompletely cut portion exists in the wafer 4.The cutting groove detection unit 404 may include, instead of the above-described light receiving part 408, a camera that images the cutting groove 256 from the lower side when the frame unit U is held by the holding part 268, and it is also possible to detect whether or not the cutting groove 256 has reached the rear surface 4 bof the front surface 4 aof the wafer 4 based on an image of the cutting groove 256 imaged by the camera.As illustrated in FIG. 1, the separation part 248 is disposed at a distance from the first raising / lowering table 246 in the Y-axis direction in the movable range of the transition placement table 204 in the Y-axis direction. Referring to FIGS. 14A and 16, the separating part 248 includes ultraviolet irradiation parts 270 (see FIG. 14A ) that irradiate the tape 96 corresponding to the cutting groove 256 with ultraviolet light to reduce the adhesive force of the tape 96, and a second raising / lowering table 272 (see FIG. 14A ) that sucks and holds the inside of the wafer 4 in such a manner that the annular reinforcing part 24 is exposed from the outer periphery and supports the annular frame 64. The separating part 248 further includes a separating device 274 (see FIG. 14A ) that acts on the outer periphery of the annular reinforcing part 24 and separates the annular reinforcing part 24, and a disposal part 276 (see FIG. 16 ) through which the separated annular reinforcing part 24 is disposed.As illustrated in FIG. 14A, the separation part 248 of the present embodiment includes a Z-axis guide component 278 fixed to a suitable bracket (not illustrated) and extending in the Z-axis direction, a Z-axis movable component 280 movably supported by the Z-axis guide component 278 in the Z-axis direction, and a Z-axis feed mechanism (not illustrated) that moves the Z-axis movable component 280 in the Z-axis direction. It is sufficient if the Z-axis feeding mechanism has a configuration including a ball screw coupled to the Z-axis movable component 280 and extending in the Z-axis direction and a motor that rotates this ball screw.A support piece 282 is supported by the lower surface of the tip of the Z-axis movable component 280, and a support shaft 286 is rotatably supported. The above-described second raising / lowering table 272 is coupled to the support shaft 286. On the upper surface of the tip of the Z-axis movable component 280, a motor 284 is mounted, which rotates the second raising / lowering table 272 together with the support shaft 286. A pair of the above-described ultraviolet irradiation parts 270 are attached to the support piece 282 of the present embodiment with a distance in the Y-axis direction.The second elevating / lowering table 272 is circular and the diameter of the second elevating / lowering table 272 is slightly smaller than that of the device area 18 (the part inside the annular reinforcing part 24) of the wafer 4. a plurality of suction holes (not shown) are formed in the lower surface of the second elevating / lowering table 272, and each suction hole is connected to a suction means.Moreover, the above-described separator 274 is attached to the support piece 282. The separator 274 has a pair of movable pieces 288 movably disposed on the lower surface of the support piece 282 with a distance in the longitudinal direction of the support piece 282, and a pair of feeding means 290 that move the pair of movable pieces 288. Each of the pair of supply means 290 may be configured from a suitable actuator such as an air cylinder or an electric cylinder.The separator 274 includes a pair of pinch rollers 292a and 292b supported by each movable piece 288 with a clearance in the up-down direction, and a Z-axis feed mechanism 294 that moves the upper pinch roller 292a in the Z-axis direction. The Z-axis feed mechanism 294 may be configured from a suitable actuator such as an air cylinder or an electric cylinder. The respective pinch rollers 292 aand 292 bare supported by the movable piece 288 rotatably about an axis line extending in the X-axis direction. A press roller 298 is mounted on the upper pinch roller 292a through a support shaft 296.Referring to FIG. 16, the disposal part 276 includes a belt conveyor 300 that conveys the separated annular reinforcement part 24, and a dust box 302 in which the annular reinforcement part 24 conveyed by the belt conveyor 300 is accommodated. The belt conveyor 300 is positioned by a suitable actuator (not shown) at a collection position (a position shown by solid lines in FIG. 16 ) at which the belt conveyor 300 extends substantially horizontally and a standby position (a position shown by two-dot chain lines in FIG. 16 ) at which the belt conveyor 300 extends substantially vertically. On the side surface of the dust box 302, on the near side in the X-axis direction in FIG. 16, a door 304 is disposed to which a handle 304 ais attached. Inside the dust box 302, a crushing device (not shown) is installed, which crushes the collected annular reinforcing part 24. In the dust box 302, by gripping the handle 304 aand opening the door 304, the broken waste of the collected annular reinforcement part 24 accommodated in the dust box 302 can be taken out.As illustrated in FIG. 15, when the temporary placement table 204 on which the frame unit U in which the cutting groove 256 is formed at the origin of the reinforcement part 24 is temporarily positioned below the separation part 248 by the temporary placement table conveying part 232, the separation part 248 sucks and holds the rear surface 4 bside of the wafer 4 of the frame unit U by the second raising / lowering table 272 and clamps the ring frame 64 by the clamping rollers 292 aand 292 bof the separator 274. Then, the separating part 248 performs irradiation with ultraviolet light from the pair of ultraviolet irradiation parts 270 and reduces the adhesion force of the tape 96 adhered to the annular reinforcing part 24. in addition, the separating part 248 rotates the frame unit U together with the support shaft 286 and the second raising / lowering table 272 relative to the separator 274 by the motor 284 while pressing down the annular reinforcing part 24 by the pressing rollers 298. The separating part 248 thereby separates the annular reinforcing part 24 from the frame unit U. The separated reinforcing part 24 is conveyed by the belt conveyor 300 to the dust box 302 and collected there. When separating the reinforcing member 24, the separating means 274 may be rotated relative to the frame unit U.As illustrated in FIGS. 14 and 15, the reinforcing part removing unit 194 of the present embodiment includes a distance detecting unit 412 that detects whether or not the ring-shaped reinforcing part 24 has been removed. The distance detection unit 412 is disposed adjacent to the ultraviolet irradiation part 270. The distance detection unit 412 includes a main body 414 supported by the support piece 282, and a light emitting part 416 and a light receiving part 418, both of which are attached to the lower surface of the main body 414. As illustrated in FIG. 15, the light emitting part 416 performs irradiation with light L 1 toward the region where the reinforcing part 24 for the holding unit U has existed, which is held by the second raising / lowering table 272 and from which the reinforcing part 24 has been removed. Moreover, the light receiving part 418 receives reflected light L 2 resulting from reflection of the light L 1 of the light emitting part 416 at the amplification part 24 that remains unremoved.Moreover, in the distance detection unit 412, the region where the amplification part 24 has existed is irradiated with the light L 1 from the light emitting part 416 while rotating the frame unit U held by the second elevating / lowering table 272 and from which the amplification part 24 has been removed, and whether or not the amplification part 24 has been completely removed is detected depending on whether or not the amount of light received by the light receiving part 418 is less than a predetermined threshold value.When the reinforcing part 24 is removed, the band 96 is irradiated with the light L 1 of the light emitting part 416. Therefore, the reflected light L2 is hardly present and the amount of light received by the light receiving part 418 becomes comparatively small. On the other hand, when at least a part of the amplification part 24 remains without being removed, the light L 1 of the light emitting part 416 is reflected by the remaining amplification part 24, and therefore, the amount of light received by the light receiving part 418 becomes comparatively large. Therefore, the distance detection unit 412 determines that the amplification part 24 has been completely removed when the amount of light received by the light receiving part 418 is less than the predetermined threshold over the entire circumference of the wafer 4.As shown in FIG. 1, the ringless unit discharge means 196 is disposed adjacent to the reinforcing member removal unit 194. Referring to FIGS. 17 and 18, the ringless unit carry-out means 196 in the present embodiment includes a reversing mechanism 308 (see FIG. 17 ) including a frame holding part 306 facing the ringless unit supported by the second raising / lowering table 272 and supporting the ring frame 64, moving toward the frame cassette table 200 and reversing the frame holding part 306, a ringless unit supporting part 310 (see FIG. 18 ) supporting the ringless unit reversed by the reversing mechanism 308 and in which the front surface 4 aof the wafer 4 faces upward, and a pressing part 312 (see FIG. 18 ) causing the ringless unit to move toward the frame cassette table 200 and rotate the frame holding part 306, the ringless unit supported by the ringless unit supporting part 310 enters and is accommodated in the frame cartridge 198 placed on the frame cartridge table 200.As shown in FIG. 17, the inverting mechanism 308 includes a Y-axis guide member 314 extending in the Y-axis direction, a Y-axis movable member 316 supported by the Y-axis guide member 314 movably in the Y-axis direction, a Y-axis feeding mechanism (not shown) that moves the Y-axis movable member 316 in the Y-axis direction, an arm 318 supported by the Y-axis movable member 316 movably in the Z-axis direction, and a Z-axis feeding mechanism (not shown) that moves the arm 318 in the Z-axis direction. It is sufficient that each of the Y-axis and Z-axis feeding mechanisms of the inverting mechanism 308 have a configuration including a ball screw and a motor that rotates the ball screw.The frame holding part 306 described above is supported by the arm 318 in such a manner that it can be vertically inverted. In addition, a motor 320 is mounted on the arm 318, which vertically rotates the frame holding part 306. The frame holding part 306 of the present embodiment includes a substrate 324 rotatably supported by the arm 318 via a pair of rotating shafts 322, and a plurality of suction pads 326 attached to a single surface of the substrate 324. Each suction nozzle 326 is connected to a suction means (not shown). In addition, a rotating shaft 322 is coupled to the motor 320.In the state where the suction pads 326 are directed upward, the inverting mechanism 308 sucks and holds the lower surface of the ring frame 64 of a ringless unit U' supported by the second raising / lowering table 272 through the suction pads 326, and receives the ringless unit U' from the second raising / lowering table 272. Moreover, the inverting mechanism 308 inverts the frame holding part 306 by the motor 320 to face the front surface 4a of the wafer 4 upward, and then moves the ringless unit U' held by the frame holding part 306 toward the frame cassette table 200 by moving the Y-axis movable component 316.As shown in FIG. 18, the ringless unit supporting part 310 of the present embodiment includes a pair of supporting plates 328 movably supported in the X-axis direction by a suitable bracket (not shown), and a distance adjusting means (not shown) that adjusts the distance between the pair of supporting plates 328 in the X-axis direction. The distance adjusting means may be formed of a suitable actuator such as an air cylinder or an electric cylinder.A heater (not shown) is mounted on the pair of support plates 328 which support the ringless unit U'. In the state where the distance between the pair of supporting plates 328 is decreased, the pair of supporting plates 328 heats the band 96 of the ringless unit U' by the heating means, thereby eliminating slack and folding of the band 96 caused by the removal of the reinforcing member 24.The description will be continued with reference to FIG. 18. The pressing part 312 of the present embodiment includes a Y-axis guide component 330 extending in the Y-axis direction, a Y-axis movable component 332 supported by the Y-axis guide component 330 movably in the Y-axis direction, and a Y-axis feeding mechanism (not illustrated) that moves the Y-axis movable component 332 in the Y-axis direction. The Y-axis movable component 332 includes a base part 334 supported by the Y-axis guide component 330, a support column 336 extending upward from the upper surface of the base part 334, and a pressing part 338 fixed to the upper end of the support column 336. It is sufficient if the Y-axis feeding mechanism of the pressing part 312 has a configuration including a ball screw coupled to the Y-axis movable component 332 and extending in the Y-axis direction and a motor that rotates this ball screw.As shown in FIG. 19, the ringless unit supporting part 310 widens the distance between the pair of supporting plates 328 by the distance adjusting means before accommodating the ringless unit U', and then accommodates the ringless unit U' held by the suction pads 326. Then, when the ringless unit supporting part 310 has received the ringless unit U', the pressing part 312 moves the Y-axis movable component 332 in the Y-axis direction by the Y-axis feeding mechanism and causes, by the pressing part 338, the ringless unit U' supported by the ringless unit supporting part 310 to enter and be accommodated in the frame cassette 198 placed on the frame cassette table 200.In the frame cassette 198 shown in Figs. 1 and 19, a plurality of ringless units U' are accommodated at intervals in the up-down direction in the state where the front surfaces 4a of the wafers 4 are directed upward. As shown in FIGS. 18 and 19, the frame cassette table 200 includes a placing part 340 on which the frame cassette 198 is placed, and a raising / lowering part 342 that raises and lowers the placing part 340 and positions it at a selectable height. It is sufficient if the raising / lowering part 342 has such a configuration that includes a ball screw coupled to the placement part 340 and extending in the Z-axis direction and a motor that rotates this ball screw.Next, a processing method will be described in which, using the above-described processing apparatus 2, the division tape 96 is adhered to the back surface 4 bof the wafer 4, the annular reinforcing part 24 is formed in a protrusion shape on the back surface 4 bcorresponding to the outer peripheral surplus region 20 to connect the wafer 4 to the ring frame 64, and the annular reinforcing part 24 is cut to be removed from the wafer 4.In the present embodiment, first, as illustrated in FIGS. 1 and 3, a wafer cassette placing step is performed in which the wafer cassette 6 in which a plurality of wafers 4 are accommodated is placed on the wafer cassette table 8. In the wafer cassette 6, a plurality of wafers 4 are accommodated at intervals in the up-down direction in the state where the front surfaces 4 aare directed upward.Moreover, as illustrated in FIGS. 1 and 5, a frame accommodating step is performed in which a plurality of annular ring frames 64 are accommodated, in which the opening part 64 athat accommodates the wafer 4 is formed in the frame accommodating unit 66. The frame accommodation step could be performed before the wafer cassette placement step or it could be performed after the wafer cassette placement step.In the frame accommodating step, after the raising / lowering plate 74 of the frame accommodating unit 66 is lowered to a selectable position, the handle 76 ais gripped and the door 76 is opened, and the plurality of ring frames 64 are layered over the upper surface of the raising / lowering plate 74 to be accommodated. Moreover, the height of the raising / lowering plate 74 is suitably adjusted, and the ring frame 64 at the uppermost level is positioned at a position from which the ring frame 64 can be carried out by the frame carry-out unit 68.After the wafer cassette placing step and the frame accommodating step are performed, a wafer carry-out step is performed in which the wafer 4 is carried out from the wafer cassette 6 placed on the wafer cassette table 8.Referring to FIG. 3, in the wafer carry-out step, first, the Y-axis feeding mechanism 34 of the wafer carry-out unit 10 is operated, and the Y-axis movable component 32 is positioned in the vicinity of the wafer cassette table 8. Thereafter, the conveying arm 42 is driven, and the hand 44 with the air discharge ports 46 facing upward is positioned to the back surface 4 bside (lower side) of the wafer 4 in the wafer cassette 6. When the hand 44 is positioned to the back surface 4 bside of the wafer 4, a gap is formed between the back surface 4 bof the wafer 4 and the hand 44, and each guide pin 48 is positioned outward in the radial direction.Next, compressed air is ejected from the air ejection ports 46 of the hand 44 to generate a negative pressure on a single surface side of the hand 44 by the Bernoulli effect, and the wafer 4 is non-contact-sucked and carried from the back surface 4 bside by the hand 44. Thereafter, each guide pin 48 is moved inward in the radial direction, and horizontal movement of the wafer 4 sucked and supported by the hand 44 is restricted by the respective guide pins 48. Then, the Y-axis movable component 32 and the conveying arm 42 of the wafer carry-out unit 10 are moved, and the wafer 4 sucked and carried by the hand 44 is carried out of the wafer cassette 6.It is preferable to perform a notch detection step in which the position of the notch 26 of the wafer 4 is detected after the wafer carry-out step is performed. In the notch detection step, as illustrated in FIG. 4, the outer periphery of the wafer 4 suctioned and carried by the hand 44 is positioned between the light emitting element 52 and the light receiving element 54 of the notch detection means 50. Next, by rotating the wafer 4 by the drive source through the guide pin 48, the position of the notch 26 of the wafer 4 is detected. This makes it possible to set the orientation of the wafer 4 to a selectable orientation.After the notch detection step is performed, a wafer supporting step of supporting the front surface 4 aside of the wafer 4 by the wafer carry-out unit 10 through the wafer table 12 is performed.Referring to FIG. 3, in the wafer carrying step, first, the hand 44 of the wafer carry-out unit 10 is turned upside down to face the front surface 4 aof the wafer 4 downward. Thereafter, the Y-axis movable component 32 and the conveying arm 42 of the wafer carry-out unit 10 are moved, and the outer peripheral surplus portion 20 of the front surface 4 aof the wafer 4 which is suctioned and supported by the hand 44 is brought into contact with the annular support part 56 of the wafer stage 12. At this time, the device region 18 of the front surface 4 aof the wafer 4 is disposed in the recess 62 of the wafer stage 12. Therefore, the devices 14 do not come into contact with the wafer stage 12, and damage to the devices 14 is prevented.Next, the outer peripheral surplus region 20 of the front surface 4 aof the wafer 4 is suctioned and held by operating the suction means of the wafer stage 12 and generating a suction force for each suction hole 60. Thereafter, the carrying of the wafer 4 is released under suction by the hand 44, and the hand 44 is separated from the wafer stage 12. In this manner, the wafer 4 is transferred from the wafer carry-out unit 10 to the wafer stage 12. Since the wafer 4 transferred to the wafer stage 12 is sucked and held by each suction hole 60, the position of the wafer 4 does not deviate.Moreover, after the wafer cassette placing step and the frame accommodating step are performed, simultaneously with the wafer carry-out step and the wafer carrying step, a frame carry-out step of carrying out the ring frame 64 from the frame accommodating unit 66 is performed.Referring to FIG. 5, in the frame carry-out step, first, the X-axis movable component 84 and the Z-axis movable component 86 of the frame carry-out unit 68 are moved, and the suction pads 92 of the holding part 88 are brought into contact with the upper surface of the ring frame 64 at the uppermost plane accommodated in the frame accommodation unit 66. Next, the ring frame 64 is suctioned and held at the uppermost level by the suction pads 92 by operating the suction means of the frame discharge unit 68 and generating a suction force for the suction pads 92. Then, the X-axis movable component 84 and the Z-axis movable component 86 of the frame carry-out unit 68 are moved, and the top-level ring frame 64 sucked and held by the suction pads 92 of the holding part 88 is carried out of the frame accommodating unit 66.After the frame carry-out step is performed, a frame carrying step of carrying the ring frame 64 carried out by the frame carry-out unit 68 by the frame table 70 is performed.The description will be continued with reference to FIG. 5. In the frame supporting step, first, the X-axis movable component 84 and the Z-axis movable component 86 of the frame carry-out unit 68 are moved, and the ring frame 64 sucked and held by the suction pads 92 is brought into contact with the upper surface of the frame table 70. At this time, the frame table 70 is positioned in advance at the lowering position (position indicated by solid lines in FIG. 5 ). Thereafter, the suction force of the suction pads 92 of the frame carry-out unit 68 is deactivated to place the ring frame 64 on the frame table 70. Then, the X-axis movable component 84 and the Z-axis movable component 86 of the frame carry-out unit 68 are moved, and the holding part 88 is separated from the upper side of the frame table 70.After the frame supporting step is performed, a tape adhering step of adhering the tape 96 to the ring frame 64 is performed.Referring to FIGS. 6A and 6B, in the tape adhering step, first, before the frame table 70 is moved from the lowering position (a position shown in FIG. 6A ) to the raising position (a position shown in FIG. 6B ), whereby the tape 96 can be attached to the ring frame 64, the tape 96 is pulled out from the roller tape 96R, and the tape 96 from which the release paper 116 has been separated is positioned above the frame table 70. The adhesive surface of the tape 96 disposed above the frame table 70 is directed downward.Next, the frame table 70 is raised to such an extent that the tape 96 can be pressed against the ring frame 64 from the upper side by the pressing roller 132 of the pressure connection part 110 of the tape adhering unit 98. Then, the press roller 132 is rolled in the Y-axis direction while the adhesion surface of the tape 96 is pressed against the ring frame 64 by the press roller 132. Thereby, the tape 96 pulled out by the tape pulling-out part 108 from the roller tape 96R can be press-connected to the ring frame 64.Thereafter, the cutter 144 and the hold-down roller 146 of the cutter member 112 of the tape adhering unit 98 are lowered to press the cutter 144 against the tape 96 on the ring frame 64 and to adhere the ring frame 64 from above the tape 96 by the hold-down roller 146. Next, the arm piece 140 is rotated by the motor 138, and the cutter 144 and the hold-down roller 146 are moved to draw a circle along the ring frame 64. Thereby, the band 96 protruding toward the outer periphery of the ring frame 64 can be cut off along the ring frame 64. Further, since the ring frame 64 is held down by the hold-down roller 146 from above the belt 96, deviation of the position of the ring frame 64 and the belt 96 is prevented when the belt 96 is cut. The used tape 96 in which the circular opening part 120 is formed is accommodated by the tape accommodating part 106.After the tape adhering step is performed, a tape attached frame conveying step is performed in which the ring frame 64 to which the tape 96 is adhered is conveyed to the wafer table 12 and the opening part 64 aof the ring frame 64 is positioned on the back surface 4 bof the wafer 4 supported by the wafer table 12 and the tape attached ring frame 64' is positioned on the wafer table 12.In the belt-attached frame conveying step, first, the frame table 70 is moved from the raising position to the lowering position. Thereafter, the Y-axis movable component 150 and the Z-axis movable component 152 of the belt-attached frame conveying unit 100 (see FIG. 5 ) are moved, and the respective suction pads 158 of the holding part 154 of the belt-attached frame conveying unit 100 are brought into contact with the upper surface of the belt-attached ring frame 64' (see FIG. 7 ) supported by the frame table 70 in the state where the adhesion surface of the belt 96 is directed downward.Next, the upper surface of the belt-attached ring frame 64' is suctioned and held by the suction pads 158 by operating the suction means of the belt-attached frame conveying unit 100 and generating a suction force for the suction pads 158. Thereafter, the Y-axis movable component 150 and the Z-axis movable component 152 of the belt-attached frame conveying unit 100 are moved, and the belt-attached ring frame 64' sucked and held by the suction pads 158 is conveyed away from the frame table 70.Next, the belt-attached ring frame 64' suctioned and held by the suction pads 158 of the conveyance unit 100 for the belt-attached ring frame 64' is conveyed to the wafer table 12. Then, as shown in FIG. 7, the opening part 64a of the ring frame 64 is positioned on the back surface 4b of the wafer 4 supported by the wafer table 12, and the tape-attached ring frame 64' is brought into contact with the frame supporting part 58 of the wafer table 12. At this time, the adhesive surface of the tape 96 of the tape-attached ring frame 64' is directed downward, and the back surface 4b of the wafer 4 is directed upward and faces the adhesive surface of the tape 96.Thereafter, the suction force of the suction pads 158 of the belt-attached frame conveying unit 100 is deactivated to place the belt-attached ring frame 64' on the frame supporting part 58 of the wafer stage 12. Then, the Y-axis movable component 150 and the Z-axis movable component 152 of the belt-attached frame conveying unit 100 are moved, and the holding part 154 is separated from the upper side of the wafer stage 12.After the attached frame conveying step is performed, a tape pressure bonding step of performing bonding of the tape 96 of the attached tape ring frame 64' to the back surface 4 bof the wafer 4 under pressure is performed.Referring to FIGS. 7 to 9, in the tape pressure connection step, first, the upper chamber 160 is lowered by the raising-lowering mechanism 164 of the tape pressure connection unit 102, and the lower end of the side wall 172 of the upper chamber 160 is brought into contact with the upper end of the side wall 186 of the lower chamber 162. Thereby, the upper chamber 160 and the lower chamber 162 are placed in the closed state. In addition, the press roller 174 is brought into contact with the band-attached ring frame 64'. Then, as shown in FIG. 8, the upper end of the annular reinforcing part 24 of the wafer 4 adheres to the adhesion surface of the tape 96 of the tape-attached ring frame 64'.Next, the vacuum part 166 of the belt pressure connection unit 102 is operated in the state where the atmospheric opening part 168 is closed, and the inside of the upper chamber 160 and the lower chamber 162 is placed in a vacuum state. Thereafter, as illustrated in FIGS. 8 and 9, pressure bonding of the tape 96 to the back surface 4 bof the wafer 4 is performed by rolling the press roller 174 of the tape pressure bonding unit 102 in the Y-axis direction. Thereby, the frame unit U in which the back surface 4 bof the wafer 4 and the tape 96 are pressure-bonded can be produced. Next, the atmospheric opening part 168 is opened, and the tape 96 is brought into close contact with the back surface 4 bof the wafer 4 by the atmospheric pressure along the origin of the annular reinforcing part 24. Then, the upper chamber 160 is raised by the raising-lowering mechanism 164. Since the inside of the upper chamber 160 and the lower chamber 162 is placed in the vacuum state, the suction force for the wafer 4 through the wafer stage 12 is lost. However, when the upper chamber 160 and the lower chamber 162 are placed in the closed state, the upper end of the annular reinforcing part 24 of the wafer 4 adheres to the adhering surface of the tape 96 of the tape-attached ring frame 64'. Thus, the position of the wafer 4 does not deviate in the tape pressure bonding step.After the tape pressure bonding step is performed, a frame unit carry-out step of carrying away the frame unit U, in which the tape 96 of the tape-attached ring frame 64' and the back surface 4b of the wafer 4 are pressure-bonded, is performed from the wafer table 12.Referring to FIG. 5, in the frame unit carry-out step, first, the conveying part 206 of the frame unit carry-out means 192 is operated, and the lower surface of the suction adhering piece 210 of the wafer holding part 202 aof the frame unit holding part 202 is brought into contact with the belt 96 on the side of the back surface 4 bof the wafer 4. In addition, the suction pads 214 of the frame holding part 202 bare brought into contact with the ring frame 64.Thereafter, a suction force is generated for the suction adhering piece 210 of the wafer holding part 202 aand the suction pads 214 of the frame holding part 202 b, and the wafer 4 is suctioned and held by the suction adhering piece 210 of the wafer holding part 202 afrom the back surface 4 bside (belt 96 side). In addition, the ring frame 64 is sucked and held by the suction pads 214 of the frame holding part 202 b. Then, holding of the wafer 4 under suction by the wafer table 12 is released. Then, the conveying part 206 is operated, and the frame unit U held by the frame unit holding part 202 is conveyed away from the wafer table 12.After the frame unit carry-out step is executed, a transition placing step is executed in which the center of the wafer 4 is made to coincide with the center of the transition placing table 204 and the frame unit U is temporarily placed on the transition placing table 204.Referring to FIG. 10, in the temporary placement step, first, the frame unit U held by the frame unit holding part 202 is positioned above the imaging part 224. Thereafter, the conveying part 206 configuring the two-dimensional moving mechanism of the frame unit carry-out means 192 is operated, and at least three locations on the outer periphery of the wafer 4 of the frame unit U held by the frame unit holding part 202 are imaged by the imaging part 224. Thereby, the coordinates of at least three points on the outer periphery of the wafer 4 are measured. Next, the center coordinates of the wafer 4 are obtained based on the measured coordinates of the three points.Thereafter, the conveying part 206 is operated and the center of the wafer 4 is positioned to the center of the annular supporting part 226 of the transfer placing table 204, and the outer peripheral surplus region 20 of the front surface 4 aof the wafer 4 is brought into contact with the upper surface of the annular supporting part 226 of the transfer placing table 204. In addition, the lower surface of the ring frame 64 is brought into contact with the upper surface of the frame supporting part 228 of the transition placing table 204. At this time, the front surface 4 aof the wafer 4 faces downward. However, since the device region 18 is disposed in the recess 230 of the transition placement table 204, the devices 14 do not come into contact with the transition placement table 204, and damage to the devices 14 is prevented.Next, the holding of the wafer 4 under suction by the wafer holding part 202a is released, and the holding of the ring frame 64 under suction by the frame holding part 202b is released to transfer the frame unit U from the frame unit carry-out means 192 to the temporary placing table 204. Thereafter, the heater of the frame support member 228 is operated to heat, by the heater, the belt 96 of the frame unit U temporarily placed on the temporary placing table 204. This causes the belt 96 to soften and be brought into close contact with the origin of the annular reinforcing part 24 of the wafer 4.After the transition placing step is performed, a reinforcing member removing step is performed in which the annular reinforcing member 24 is cut and removed from the wafer 4 of the frame unit U conveyed out by the frame unit convey means 192.Referring to FIGS. 1, 10, and 12A to 12C, in the reinforcement part removing step, first, the X-axis movable component 260 and the Z-axis movable component 262 of the first raising / lowering table 246 of the reinforcement part removing unit 194 are moved. Thereby, the lower surface of the wafer suction adhering jig 400 is brought into contact with the side of the back surface 4 bof the wafer 4 (belt 96 side) of the frame unit U temporarily placed on the temporary placing table 204, and the lower surfaces of the frame suction adhering jigs 402 are brought into contact with the upper surface of the ring frame 64. Next, an adhesive force is generated for the wafer suction adhering jig 400 and the frame suction adhering jigs 402. Thereby, the wafer unit 4 of the frame unit U is suctioned and held by the wafer suction adhering jig 400, and the ring frame 64 is suctioned and held by the frame suction adhering jigs 402.Thereafter, the X-axis movable component 260 and the Z-axis movable component 262 of the first elevating / lowering table 246 are operated, and as shown in FIG. 11, the frame unit U sucked and held by the holding part 268 is positioned above the laser beam irradiation unit 244. Next, the focal point of the laser beam LB is positioned at the origin of the ring-shaped amplification part 24 of the wafer 4 of the frame unit U.Thereafter, the origin of the annular reinforcing part 24 of the wafer 4 is irradiated with the laser beam LB while the holding part 268 and the frame unit U are rotated by the motor 266 of the first elevating / lowering table 246. This can perform ablation processing for the origin of the ring-shaped reinforcing part 24 of the wafer 4, and can form the ring-shaped cutting groove 256. Moreover, when the wafer 4 is irradiated with the laser beam LB, the suction means of the laser beam irradiation unit 244 is operated to generate a suction force for the suction nozzle 254, and the dirt particles generated due to the ablation processing are sucked from the suction nozzle 254.After the annular cutting groove 256 is formed at the origin of the annular reinforcing part 24 of the wafer 4, it is detected by the cutting groove detection unit 404 whether or not the cutting groove 256 has reached the back surface 4 bfrom the front surface 4 aof the wafer unit 4. The detection of the cutting groove 256 is performed by measuring the amount of light received by the light receiving part 408 while rotating the frame unit U held by the first raising / lowering table 246.When there is a region over which the amount of light received by the light receiving part 408 is less than the predetermined threshold value, it is determined that there is a region in which the cutting groove 256 has not reached the back surface 4 bfrom the front surface 4 aof the wafer 4, that is, an incompletely cut region in which the wafer 4 has not been completely cut. When it is determined that the incompletely cut portion is present, the incompletely cut portion of the wafer 4 is irradiated with the laser beam LB from the laser beam irradiation unit 244 to perform ablation processing again. On the other hand, when the amount of light received by the light receiving part 408 over the entire circumference of the cutting groove 256 is equal to or greater than the predetermined threshold, it is determined that the entire circumference of the cutting groove 256 has reached the back surface 4 bfrom the front surface 4 aof the wafer 4 and the wafer 4 has been completely cut.As described above, in the present embodiment, it is checked whether the wafer 4 has been completely cut by the cutting groove 256 after the cutting groove 256 is formed, and ablation processing is performed again when the wafer 4 has not been completely cut. Thus, conveyance of the frame unit U to the next step in the state where an incompletely cut part is present in the wafer 4 is prevented.Next, the X-axis movable component 260 and the Z-axis movable component 262 of the first raising / lowering table 246 are moved, and the outer peripheral surplus region 20 of the front surface 4 aof the wafer 4 of the frame unit U sucked and held by the holding part 268 is brought into contact with the upper surface of the annular supporting part 226 of the temporary placement table 204. In addition, the lower surface of the ring frame 64 is brought into contact with the upper surface of the frame supporting part 228 of the transition placing table 204. Thereafter, the suction force of the holding part 268 of the first raising / lowering table 246 is deactivated to transfer the frame unit U from the first raising / lowering table 246 to the temporary placing table 204.Next, the transition placing table 204 that has accommodated the frame unit U is positioned under the separation part 248 of the reinforcement part removal unit 194 by the transition placing table conveying part 232 (see FIG. 10 ). At this time, the belt conveyor 300 of the disposal member 276 is positioned at the standby position. Thereafter, the second raising / lowering table 272 of the separating part 248 is lowered, and the lower surface of the second raising / lowering table 272 is brought into contact with the belt 96 of the part of the back surface 4 bof the wafer 4. Next, a suction force is generated on the lower surface of the second raising / lowering table 272, and the rear surface 4 bside of the wafer 4 of the frame unit U is suctioned and held by the second raising / lowering table 272.Thereafter, the second raising / lowering table 272 that sucks and holds the wafer 4 of the frame unit U is raised to separate the frame unit U from the temporary placing table 204. In addition, the transition placing table 204 is moved to the lower side of the first raising / lowering table 246. Next, as illustrated in FIG. 15, the pair of feeding means 290 and the Z-axis feeding mechanism 294 of the separator 274 are operated, and the ring frame 64 is clamped in the up-down direction by the upper and lower pinch rollers 292 aand 292 b. Moreover, the belt conveyor 300 of the disposal part 276 is positioned from the standby position to the collection position.Thereafter, irradiation with ultraviolet light from the pair of ultraviolet irradiation parts 270 is performed to reduce the adhesive force of the tape 96 adhered to the ring-shaped reinforcing part 24. In addition, while the annular reinforcing member 24 is pressed downward by the pressing rollers 298, the frame unit U is rotated together with the support shaft 286 and the second raising / lowering table 272 relative to the separator 274 by the motor 284. Thereby, the annular reinforcing part 24 can be separated from the frame unit U. The reinforcement part 24 fallen from the frame unit U is conveyed to the dust box 302 by the belt conveyor 300 and is collected. When the reinforcement member 24 is separated, the separator 274 may be rotated relative to the frame unit U.After the ring-shaped reinforcing part 24 is separated from the frame unit U, whether or not the reinforcing part 24 has been removed is detected by the distance detection unit 412. The removal detection of the amplification part 24 is performed by irradiating the region where the amplification part 24 has existed with the light L 1 from the light emitting part 416 and measuring the amount of light received by the light receiving part 418 while rotating the wafer 4 held by the second raising / lowering table 272 and from which the amplification part 24 has been removed.When there exists a range over which the amount of light received by the light receiving part 418 is equal to or greater than the predetermined threshold value, it is determined that at least a part of the amplification part 24 remains without being removed. In this case, a work of separating the reinforcement part 24 from the frame unit U by the separation part 248 is performed again. On the other hand, when the amount of light received by the light receiving part 418 is less than the predetermined threshold value over the entire circumference of the wafer 4, it is determined that the amplification part 24 has been completely removed.As above, in the present embodiment, it is checked whether the reinforcement part 24 has been completely removed after the reinforcement part 24 has been removed by the separation part 248, and the removal work of the reinforcement part 24 by the separation part 248 is performed again when the reinforcement part 24 has not been completely removed. Thus, conveyance of the frame unit U to the next step is prevented in the state where the reinforcing part 24 remains in the frame unit U.After the reinforcement part removing step is performed, a ringless unit carry-out step is performed, in which the ring-shaped unit U' resulting from the removal of the ring-shaped reinforcement part 24 from the reinforcement part removing unit 194 is carried out.In the ringless unit carry-out step, first, the belt conveyor 300 of the disposal part 276 of the reinforcement part removal unit 194 is positioned from the collection position to the standby position. Next, the frame holding part 306 of the inverting mechanism 308 (see FIG. 17 ) of the ringless unit carry-out means 196 is positioned below the ringless unit U' sucked and held by the second raising / lowering table 272.Thereafter, the arm 318 is raised in the state in which the suction pads 326 of the frame holding part 306 are directed upward, and the suction pads 326 of the frame holding part 306 are brought into contact with the lower surface side of the ring frame 64 of the ringless unit U' in the state in which the ringless unit U' is supported by the second raising / lowering table 272 and the front surface 4 aof the wafer 4 is directed downward.Next, a suction force is generated for the suction pads 326 of the frame holding part 306, and the ring frame 64 of the ringless unit U' is sucked and held by the suction pads 326. Thereafter, the holding of the ringless unit U' under suction is released by the second raising / lowering table 272. Thereby, the ringless unit U' is transferred from the second raising / lowering table 272 of the reinforcement part removing unit 194 to the frame holding part 306 of the ringless unit carrying-out means 196.After the ringless unit carry-out step is performed, an accommodation step of the ringless unit U' carried out by the ringless unit carry-out means 196 is performed.In the ringless unit accommodation step, first, the inverting mechanism 308 of the ringless unit discharge means 196 is placed upside down, and the ringless unit U' sucked and held by the frame holding part 306 is placed upside down. Thereby, the ringless unit U' is disposed below the frame holding part 306, and the front surface 4a of the wafer 4 is directed upward.Next, the Y-axis movable component 316 and the arm 318 of the reversing mechanism 308 are moved, and the ringless unit U' is brought into contact with the upper surfaces of the pair of supporting plates 328 of the ringless unit supporting part 310. At this time, the distance between the pair of support plates 328 is decreased by the distance adjusting means, and the pair of support plates 328 is in close contact with each other. Thereafter, the holding of the ringless unit U' under suction by the frame holding part 306 is released to place the ringless unit U' on the pair of supporting plates 328. Next, slack and wrinkles of the band 96 caused due to the removal of the reinforcing member 24 are eliminated by operating the heater attached to each supporting plate 328 and heating the band 96 of the ringless unit U'. Then, the ringless unit U' is sucked and held and raised again by the frame holding part 306.Next, after the distance between the pair of support plates 328 is increased by the distance adjusting means, the ringless unit U' is placed on the upper surfaces of the support plates 328. Then, as shown in Fig. 19, the ringless unit U' supported by the ringless unit supporting part 310 is pressed by the pressing part 338 of the pressing part 312, and the ringless unit U' is caused to enter the frame cassette 198 placed on the frame cassette table 200 and is accommodated therein.The configuration of the embodiment is as described above. In the processing apparatus 2 of the present embodiment, work for adhering the division tape 96 to the back surface 4 bof the wafer 4 in which the annular reinforcing part 24 is formed in a protrusion shape on the back surface 4 bcorresponding to the outer peripheral surplus region 20 is easy to integrate the wafer 4 with the ring frame 64. In addition, it is easy to cut the annular reinforcing part 24 and remove it from the wafer 4, and productivity becomes favorable.

Claims

A processing apparatus (2) that removes an annular reinforcing part (24) having a protrusion shape from a wafer (4), wherein the annular reinforcing part (24) is formed in the protrusion shape on a back surface (4b) corresponding to an outer peripheral surplus region (20), the processing apparatus (2) comprising: a wafer cassette table (8) on which a wafer cassette (6) in which a plurality of wafers (4) are accommodated is placed; a wafer conveyance-out unit (10) that conveys the wafer (4) out of the wafer cassette (6) placed on the wafer cassette table (8); a wafer table (12) that supports a front surface (4a) side of the wafer (4) conveyed out of the wafer conveyance-out unit (10); a frame accommodating unit (66) accommodating a plurality of ring frames (64) in which an opening part (64a) accommodating the wafer (4) is formed; a frame carry-out unit (68) that carries out the ring frame (64) from the frame accommodating unit (66); a frame table (70) that supports the ring frame (64) carried out by the frame carry-out unit (68); a tape adhering unit (98) that is disposed above the frame table (70) and adheres a tape to the ring frame (64); a belt-attached frame (64') conveying unit (100) that conveys the ring frame (64) to which the belt (96) is adhered to the wafer table (12) and positions the opening part (64a) of the ring frame (64) on the back surface (4b) of the wafer (4) supported by the wafer table (12) and places a belt-attached frame (64') on the wafer table (12); a belt pressure-bonding unit (102) that performs pressure-bonding of the belt (96) of the belt-attached frame (64') to the back surface (4b) of the wafer (4); a frame unit carry-out means (192) that carries away from the wafer table (12) a frame unit (U) in which the belt (96) of the belt-attached frame (64') and the back surface (4b) of the wafer (4) are pressure-connected by the belt pressure connection unit (102); a reinforcing part removing unit (194) that cuts and removes the annular reinforcing part (24) from the wafer (4) of the frame unit (U) carried out by the frame unit carry-out means (192); an annular unit carry-out means (196) that carries out an annular unit (U') resulting from the removal of the annular reinforcing part (24) from the reinforcing part removing unit (194); and a frame cassette table (200) on which a frame cassette (198) accommodating the ringless unit (U') carried out by the ringless unit carry-out means (196) is placed, wherein the reinforcing part removing unit (194) comprises: a removal detecting unit (412) that detects whether or not the ring-shaped reinforcing part (24) has been removed.The processing apparatus (2) according to claim 1, wherein the frame unit carry-out means (192) includes: a frame unit holding part (202) including a wafer holding part (202a) holding the wafer (4) and a frame holding part holding the ring frame (64); and a conveying part (206) conveying the frame unit holding part (202) to a temporary placement table (204).The processing apparatus (2) according to claim 2, wherein the reinforcing part removing unit (194) includes: a laser beam irradiation unit (244) that irradiates an origin of the annular reinforcing part (24) formed on the outer periphery of the wafer (4) with a laser beam (LB) to form a cutting groove (256); a first raising / lowering table (246) that holds and raises the frame unit (U) temporarily placed on the temporary placing table (204) and positions the frame unit (U) to the laser beam irradiation unit (244); and a separating part (248) that separates the annular reinforcing part (24) from the cutting groove (256), wherein the separating part (248) includes: an ultraviolet irradiation part (270), irradiating the tape (96) corresponding to the cutting groove (256) with ultraviolet light to reduce an adhesive force of the tape (96), a second elevating / lowering table (272) that sucks and holds the inside of the wafer (4) such that the annular reinforcing part (24) is exposed from the outer periphery and supports the ring frame (64), a separator (274) that acts on an outer periphery of the annular reinforcing part (24) and separates the annular reinforcing part (24), and a disposal part (276) through which the separated annular reinforcing part (24) is disposed, wherein the reinforcing part removing unit (194) is disposed adjacent to the ultraviolet irradiation part (270), the reinforcing part removing unit (194) includes a cutting groove detecting unit (404) that detects the cutting groove (256), and the first raising / lowering table (246) temporarily places the frame unit (U) in which the cutting groove (256) is formed on the transition placing table (204), the transition placing table (204) is positioned to the separating part (248) by a conveying part for the transition placing table (204), and the second raising / lowering table (272) supports the frame unit (U) temporarily placed on the transition placing table (204).

Images