Imaging device and method for radiation protection of an electronic component in an imaging device

Abstract

Imaging device (1) comprising a radiation source (40) for generating X-ray radiation (42) and an electronics encapsulation unit (E), - wherein the electronic encapsulation unit (E) comprises an electronic component (C1) and a encapsulation compound (A), - wherein the electronic component (C1) is embedded in the potting compound (A), - wherein the potting compound (A) comprises an X-ray protection material and is designed to shield the electronic component (C1) against scattered X-ray radiation (42) directed onto the electronic component (C1), - wherein the electronic encapsulation unit (E) comprises a printed circuit board (B), wherein the electronic component (C1) is mechanically and electrically connected to the printed circuit board (B), - wherein the electronic component (C1) is embedded in the potting compound (A) in such a way that a first region (A1) of the potting compound (A) extends flatly parallel to the printed circuit board (B), wherein the electronic component (C1) is located between the first region (A1) of the potting compound (A) and the printed circuit board (B).

Description

[0001] The invention relates to an imaging device and a method for radiation protection of an electronic component in an imaging device.

[0002] In imaging devices that rely on X-rays, such as medical imaging devices, there are electronic components that, by design, are directed at X-rays. To prevent damage, the electronic components must be shielded from X-rays. For example, the electronic component can be installed in a shielding housing, particularly one made of metal. This requires additional design and assembly effort and increases the space required, weight, and cost.

[0003] DE 38 81 822 T2 and DE 10 2009 053 965 A1 are considered to be state of the art.

[0004] The invention aims to provide an alternative to conventional radiation protection for an electronic component in an imaging device.

[0005] Each subject matter of an independent claim solves this problem. Further advantageous aspects of the invention are considered in the dependent claims.

[0006] The invention relates to an imaging device comprising a radiation source for generating X-ray radiation and an electronic encapsulation unit, - wherein the electronic encapsulation unit comprises an electronic component and a encapsulation compound, - the electronic component is embedded in the potting compound, - wherein the potting compound comprises an X-ray protection material and is configured to shield the electronic component against scattered X-ray radiation directed at the electronic component.

[0007] The electronic component can, for example, be a microcontroller and / or have radiation-sensitive electronic structures. The photon energy of the X-ray radiation can, in particular, be greater than 20 keV and / or less than 200 keV.

[0008] One embodiment provides that the potting compound contains the X-ray protection material in the form of lead fibers. One embodiment provides that the X-ray protection material is lead-free.

[0009] One embodiment provides for the potting compound to be a composite material comprising a plastic component and the X-ray protection material. The plastic component can be, for example, a polymer, particularly in the form of an elastomer. The plastic component can be made, for example, from a polyurethane base and / or an epoxy resin base. The polyurethane base can impart increased heat dissipation capacity to the potting compound. The epoxy resin base can impart increased impact resistance to the potting compound. The X-ray protection material can, in particular, consist of nanoparticles, each of which has atoms with a high atomic number, for example, lead atoms.

[0010] One embodiment provides that the potting compound is a polymer nanocomposite material composed of a polymer matrix and the X-ray protection material in the form of a nanofiller, and / or that the X-ray protection material is dispersed in the polymer matrix in the form of the nanofiller. The nanofiller can, in particular, consist of nanoparticles, each of which has atoms with a high atomic number, for example, lead atoms.

[0011] One embodiment provides that the electronics encapsulation unit has an insulating layer arranged between the electronic component and the encapsulating compound, electrically insulating the electronic component from the encapsulating compound. The insulating layer can be acrylic-based, for example.

[0012] According to the invention, the electronics encapsulation unit comprises a printed circuit board, wherein the electronic component is mechanically and electrically connected to the printed circuit board. The electronic component is embedded in the encapsulation compound such that a first region of the encapsulation compound extends planarly parallel to the printed circuit board, with the electronic component located between the first region of the encapsulation compound and the printed circuit board. In this way, radiation-sensitive areas on the printed circuit board can be selectively shielded against scattered X-rays.

[0013] One embodiment provides that the circuit board is embedded in the potting compound in such a way that a second region of the potting compound extends flatly parallel to the circuit board, wherein the circuit board and the electronic component are located between the first region of the potting compound and the second region of the potting compound.

[0014] In particular, it can be provided that the circuit board is located between the electronic component and the second region of the encapsulating compound. In particular, it can be provided that the insulating layer electrically insulates the circuit board from the encapsulating compound. The insulating layer can, for example, be sprayed onto the electronic component and / or onto the circuit board.

[0015] One embodiment provides that the imaging device further comprises a beam path assembly for the X-ray radiation, wherein the electronic component is configured to control the beam path assembly. The beam path assembly can, for example, comprise, in particular, a filter unit and / or a collimator unit. The scattered rays of the X-ray radiation can, in particular, originate from a region of the beam path assembly and be directed toward the electronic component.

[0016] In particular, it can be provided that the imaging device is a baggage scanner and / or an air cargo scanner.

[0017] One embodiment provides that the imaging device is a medical imaging device. The medical imaging device can, for example, be selected from the imaging modality group consisting of an X-ray device, a mammography device, a C-arm X-ray device, a computed tomography (CT) device, and combinations thereof. The medical imaging device can further comprise a combination of an imaging modality, selected, for example, from the imaging modality group, and an irradiation modality. The irradiation modality can, for example, comprise an irradiation unit for therapeutic irradiation.

[0018] One embodiment provides that the imaging device is a computed tomography device.

[0019] This further discloses an electronics encapsulation unit for an imaging device, - wherein the electronic encapsulation unit comprises an electronic component and a encapsulation compound, - the electronic component is embedded in the potting compound, - wherein the encapsulating compound comprises an X-ray protection material and is configured to shield the electronic component against X-ray radiation directed at the electronic component. The X-ray radiation can, in particular, be generated by a radiation source of the imaging device. The X-ray radiation can, in particular, be scattered radiation or radiation coming directly from the radiation source.

[0020] The invention further relates to a method for radiation protection of an electronic component in an imaging device, wherein the imaging device has a radiation source for generating X-ray radiation, the method comprising: - embedding the electronic component in a potting compound, forming an electronic potting unit comprising the electronic component and the potting compound, - arranging the electronics encapsulation unit relative to the radiation source in the imaging device such that scattered rays of the X-ray radiation are directed onto the electronic component, - wherein the potting compound comprises an X-ray protection material and is configured to shield the electronic component against the scattered X-ray radiation directed at the electronic component.

[0021] Embedding the electronic component in the potting compound may in particular comprise applying the potting compound to the electronic component and / or curing the potting compound.

[0022] One embodiment provides that before embedding the electronic component in the potting compound, in particular before applying the potting compound to the electronic component, an insulating layer is applied to the electronic component in order to electrically insulate the electronic component from the potting compound.

[0023] According to the invention, the electronics encapsulation unit comprises a printed circuit board, wherein the electronic component is mechanically and electrically connected to the printed circuit board. The electronic component is embedded in the encapsulation compound such that a first region of the encapsulation compound extends planarly parallel to the printed circuit board, wherein the electronic component is located between the first region of the encapsulation compound and the printed circuit board. Embedding the electronic component in the encapsulation compound can, in particular, comprise applying the encapsulation compound to the printed circuit board.

[0024] One embodiment provides that the circuit board is embedded in the potting compound in such a way that a second region of the potting compound extends flatly parallel to the circuit board, wherein the circuit board and the electronic component are located between the first region of the potting compound and the second region of the potting compound.

[0025] Additional structural radiation protection measures are not necessary to protect the electronic components from radiation. The electronics encapsulation unit can therefore be installed in the imaging device even where it would not be possible in combination with additional structural radiation protection measures, for example, in the form of metallic shielding and / or housings.

[0026] The design and assembly effort for radiation protection of the electronic component can thus be reduced, especially while simultaneously reducing the installation space requirement, weight and costs.

[0027] Within the scope of the invention, features that are described with reference to different embodiments of the invention and / or different claim categories (method, use, device, system, arrangement, apparatus, etc.) can be combined to form further embodiments of the invention. For example, a claim relating to a device can also be developed with features that are described or claimed in connection with a method, and vice versa. Functional features of a method can be implemented by appropriately designed physical components. The use of the indefinite article "a" or "an" does not exclude the possibility that the feature in question may also be present multiple times.

[0028] The invention is explained below using exemplary embodiments with reference to the accompanying figures. The representation in the figures is schematic, highly simplified, and not necessarily to scale.

[0029] The Fig. 1 shows an electronics encapsulation unit according to a first example.

[0030] The Fig. 2 shows an electronics encapsulation unit according to a second example.

[0031] The Fig. Figure 3 shows an imaging device with a radiation source and an electronics encapsulation unit.

[0032] The Fig. 4 shows a flowchart of a method for radiation protection of an electronic component in an imaging device.

[0033] The Fig. 1 shows the electronics encapsulation unit E according to a first example. The electronics encapsulation unit E comprises an electronic component C1 and a potting compound A, wherein the electronic component C1 is embedded in the potting compound A. The potting compound A comprises an X-ray protection material. The electronics encapsulation unit E comprises an insulation layer D arranged between the electronic component C1 and the potting compound A, which electrically insulates the electronic component C1 from the potting compound A.

[0034] The electronics encapsulation unit E comprises the circuit board B, wherein the electronic component C1 is mechanically and electrically connected to the circuit board B. The electronic component C1 is embedded in the encapsulation compound A in such a way that the first region A1 of the encapsulation compound A extends flatly parallel to the circuit board B, wherein the electronic component C1 is located between the first region A1 of the encapsulation compound A and the circuit board B.

[0035] The circuit board B is embedded in the potting compound A in such a way that the second region A2 of the potting compound A extends flat and parallel to the circuit board B, wherein the circuit board B and the electronic component C1 are located between the first region A1 of the potting compound A and the second region A2 of the potting compound A. In particular, it can be provided that the circuit board B is located between the electronic component C1 and the second region A2 of the potting compound A. In particular, it can be provided that the insulation layer D electrically insulates the circuit board B from the potting compound A.

[0036] The electronics encapsulation unit E has electrically conductive contact pins P, which are electrically connected to the circuit board B and protrude from the encapsulation compound A in order to be able to connect the circuit board B to a power supply interface and to a data transmission interface.

[0037] The electronics encapsulation unit E has the further electronic component C2, wherein the further electronic component C2 is mechanically and electrically connected to the circuit board B, is embedded in the encapsulation compound A and is electrically insulated from the encapsulation compound A by means of the insulation layer D.

[0038] The Fig. 2 shows the electronics encapsulation unit E according to a second example.

[0039] The Fig. Figure 3 shows the imaging device 1 in the form of a computed tomography device, comprising the radiation source 40 for generating the X-ray radiation 42 and the electronics encapsulation unit E. The imaging device 1 further comprises the gantry 20 and the beam path assembly 41 for the X-ray radiation 42. The gantry 20 has the opening 9 for receiving an examination object. The radiation source 40, the beam path assembly 41, the radiation detector 44, and the electronics encapsulation unit E are arranged rotatably about the opening 9 by means of the gantry 20.

[0040] The electronic component C1 is configured to control the beam path assembly 41. The potting compound A is configured to shield the electronic component C1 against scattered rays of the X-ray radiation 42 directed at the electronic component C1.

[0041] The Fig.4 shows a flowchart of a method for radiation protection of the electronic component C1 in the imaging device 1, wherein the imaging device 1 has the radiation source 40 for generating the X-ray radiation 42, the method comprising: - embedding S1 of the electronic component C1 in the potting compound A, whereby the electronic potting unit E is formed, which comprises the electronic component C1 and the potting compound A, - arranging S2 the electronics encapsulation unit E relative to the radiation source 40 in the imaging device 1 such that scattered rays of the X-ray radiation 42 are directed onto the electronic component C1, - wherein the potting compound A comprises an X-ray protection material and is configured to shield the electronic component C1 against the scattered rays of the X-ray radiation 42 directed onto the electronic component C1.

Claims

[1] Imaging device (1) comprising a radiation source (40) for generating X-ray radiation (42) and an electronics encapsulation unit (E), - wherein the electronic encapsulation unit (E) comprises an electronic component (C1) and a encapsulation compound (A), - wherein the electronic component (C1) is embedded in the potting compound (A), - wherein the potting compound (A) comprises an X-ray protection material and is designed to shield the electronic component (C1) against scattered X-ray radiation (42) directed onto the electronic component (C1), - wherein the electronic encapsulation unit (E) comprises a printed circuit board (B), wherein the electronic component (C1) is mechanically and electrically connected to the printed circuit board (B), - wherein the electronic component (C1) is embedded in the potting compound (A) in such a way that a first region (A1) of the potting compound (A) extends flatly parallel to the printed circuit board (B), wherein the electronic component (C1) is located between the first region (A1) of the potting compound (A) and the printed circuit board (B). [2] Imaging device (1) according to claim 1, - wherein the potting compound (A) comprises the X-ray protection material in the form of lead fibers. [3] Imaging device (1) according to claim 1, - the X-ray protection material is lead-free. [4] Imaging device (1) according to one of claims 1 to 3, - wherein the casting compound (A) is a composite material comprising a plastic component and the X-ray protection material. [5] Imaging device (1) according to one of claims 1 to 4, - wherein the potting compound (A) is a polymer nanocomposite material consisting of a polymer matrix and the X-ray protection material in the form of a nanofiller, - wherein the X-ray protection material is dispersed in the polymer matrix in the form of the nanofiller. [6] Imaging device (1) according to one of claims 1 to 5, - wherein the electronic encapsulation unit (E) has an insulation layer (D) which is arranged between the electronic component (C1) and the encapsulation compound (A) and electrically insulates the electronic component (C1) from the encapsulation compound (A). [7] Imaging device (1) according to one of claims 1 to 6, - wherein the circuit board (B) is embedded in the potting compound (A) in such a way that a second region (A2) of the potting compound (A) extends flatly parallel to the circuit board (B), wherein the circuit board (B) and the electronic component (C1) are located between the first region (A1) of the potting compound (A) and the second region (A2) of the potting compound (A). [8] Imaging device (1) according to one of claims 1 to 7, further comprising a beam path assembly (41) for the X-ray radiation (42), - wherein the electronic component (C1) is configured to control the beam path assembly (41). [9] Imaging device (1) according to one of claims 1 to 8, - wherein the imaging device (1) is a medical imaging device. [10] Imaging device (1) according to one of claims 1 to 9, - wherein the imaging device (1) is a computed tomography device. [11] Method for radiation protection of an electronic component (C1) in an imaging device (1), wherein the imaging device (1) has a radiation source (40) for generating X-ray radiation (42), the method comprising: - embedding (S1) the electronic component (C1) in a potting compound (A), whereby an electronic potting unit (E) is formed which comprises the electronic component (C1) and the potting compound (A), - arranging (S2) the electronics encapsulation unit (E) relative to the radiation source (40) in the imaging device (1) such that scattered rays of the X-ray radiation (42) are directed onto the electronic component (C1), - wherein the potting compound (A) comprises an X-ray protection material and is designed to shield the electronic component (C1) against the scattered rays of the X-ray radiation (42) directed onto the electronic component (C1), - wherein the electronic encapsulation unit (E) comprises a printed circuit board (B), wherein the electronic component (C1) is mechanically and electrically connected to the printed circuit board (B), - wherein the electronic component (C1) is embedded in the potting compound (A) in such a way that a first region (A1) of the potting compound (A) extends flatly parallel to the printed circuit board (B), wherein the electronic component (C1) is located between the first region (A1) of the potting compound (A) and the printed circuit board (B). [12] Method according to claim 11, - wherein, before embedding (S1) the electronic component (C1) in the potting compound (A), an insulating layer (D) is applied to the electronic component (C1) in order to electrically insulate the electronic component (C1) from the potting compound (A). [13] Method according to claim 11 or 12, - wherein the circuit board (B) is embedded in the potting compound (A) in such a way that a second region (A2) of the potting compound (A) extends flatly parallel to the circuit board (B), wherein the circuit board (B) and the electronic component (C1) are located between the first region (A1) of the potting compound (A) and the second region (A2) of the potting compound (A).

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